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10cl080yu484i7g A Cyclone 10 LP Fpga Device
10cl080yu484i7g A Cyclone 10 LP Fpga Device
Intel, one of the manufacturers of Field Programmable Gate Arrays (FPGAs) and an
array of other programmable devices, is in the news again with the
10CL080YU484I7G. This is one of the FPGAs by the manufacturer, optimized for the
low-power and low-cost devices.
It is not out of place for manufacturing companies to name their devices according to
the performances. The 10CL080YU484I7G takes the same path, fulfilling the
expectations of the devices categorized under the Intel Cyclone 10 LP family.
According to the manufacturer (Intel), this device family is meant to fill the gaps
created by the absence of low-cost and low-static power for the cost-sensitive
applications. Thus, 10CL080YU484I7G is an FPGA device manufactured for use
with the cost-centric electronic devices or applications requiring a fair balance of
static power and cost-optimization.
Outstanding
Below are some of the properties we have identified in this Field Programmable Gate
Array (FPGA) device:
Properties Description
Mounting Style Surface Mount Technology (SMT)
Type of Packaging Tray
Total Numbers of RAM Bits 2810880
Number of Input & Output (I/O) Pins 289
Total Number of Logic Array Blocks (LABs) 5,079
Operating Temperature Range Between -40˚C and 100˚C
Number of Logic Cells/Elements 81,264
Supply Voltage (maximum) 1.2 volts
Moisture Sensitivity Yes
Type of Package/Case 484-FBGA
10CL080YU484I7G’s Package
The package or the case covering a Field Programmable Gate Array (FPGA)
influences the protection of the internal circuit components.
10CL080YU484I7G uses the 484-FBGA package or case. Here are the things you
need to know about it:
Fine Ball Gate Array (FBGA), for that is the full name of the 10CL080YU484I7G’s
case, is a type of chip carrier or surface-mount packaging, specifically used
for Integrated Circuits (ICs). It is a part of the broader Ball Grid Array (BGA)
package, which offers improved performance and a flexible pin interconnection for
ICs.
On its part, the Fine Ball Gate Array (FBGA) is majorly used when working on the
System-on-a-Chip (SOIC) designs. It is also used when working on Integrated
Circuits (ICs), that require thinner contacts or pin connections.
Now, we are going to talk about the major case for the 10CL080YU484I7G. It is
called the 484-FBGA.
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The case is primarily used with Integrated Circuits (ICs) that are based on
general-purpose microprocessors, and which operate at extremely high speeds.
Package/Case
Besides the improved speed, the package also has several other benefits to offer. Here
are some of them:
Signals are to be transmitted through the Integrated Circuits (ICs) and being the case
protecting the ICs, the case needs to be out of the way for the signals to transmit
effectively.
Not all IC cases or packages can guarantee that, but the 484-FBGA does. It is able to
process signals effectively because of the low-inductance leads. These leads aid in
giving the target consumer electronic circuits a higher electrical performance.
Generally, the varieties of Ball Grid Array (BGA) cases/packages tend to have a
lower inductance leads. These leads are primarily designed to lower the inductance,
which is a property that potentially affects electronic signal transmissions in consumer
electronic devices.
Now that the 484-FBGA package uses a low-inductance lead, the chances of
electronic signal distortion are reduced to the barest minimum.
We want to delve into more details about how the FPGAs under this family are
programmed.
Besides the effectiveness of the architecture, one of the additional factors to consider
when choosing an FPGA platform is the software’s versatility.
Input and Output (I/O) ports form a part of the core attributes of a Field
Programmable Gate Array’s property.
4. SEU Mitigation
Although Field Programmable Gate Arrays (FPGAs) can be easily placed beneath the
surfaces of the target consumer electronics, they are not entirely easy to configure.
Design iterations and challenges like SEU may crop up, thus, reducing the chances of
making the most out of the design.
That informs the reason for the SEU mitigation properties of the Intel Cyclone 10 LP
FPGAs. These Field Programmable Gate Arrays (FPGAs) mitigate the SEU design
challenge by detecting the same both during the operation and configuration of the
consumer electronics.
5. High-Density Area
Depending on the application and the Integrated Circuits’ (ICs) specifications, the size
or space of the board may vary. If you are working on a consumer electronic
device with high-density requirements, it makes sense to use a corresponding
architecture.
Conclusion
Related Posts:
https://www.raypcb.com/10cl080yu484i7g/