Lenovo BLACKJACK

Service Manual

LENOVO

1
 Contents
1. Main Board/Sub Board placement............................................................................................3
1.1 Main Board Top............................................................................................................3
1.2 Main Board Bottom......................................................................................................4
1.3 Sub board top................................................................................................................4
1.4 Sub board bottom..........................................................................................................4
2. System block diagram...............................................................................................................6
2.1 SDM632 Platform Description.....................................................................................7
2.2 SDM632 Power-on Sequence.......................................................................................7
3. Flow charts for common failures analysis and troubleshooting................................................8
3.1 Boot-up Problem...........................................................................................................9
3.2 Touch screens are insensitive or useless......................................................................11
3.3 Charging problem.......................................................................................................12
3.4 Acceptance voice quality is poor................................................................................14
3.5 No ringtone.................................................................................................................15
3.6 No screen display........................................................................................................16
3.7 System crashed............................................................................................................18
3.8 Key failure..................................................................................................................19
3.9 Signal unusual.............................................................................................................20
3.10 RCV has no sound.......................................................................................................21
3.11 MIC has no sound.......................................................................................................22
3.12 Blurred screen.............................................................................................................23
3.13 Ring tone distortion.....................................................................................................24
3.14 The ring tone is low....................................................................................................25
3.15 Cannot be charged.......................................................................................................27
3.16 Can't take pictures.......................................................................................................29
3.17 Automatic shutdown...................................................................................................33
3.18 SIM Card Unrecognizable..........................................................................................34
3.19 Power leakage.............................................................................................................35
3.20 Flash doesn't work......................................................................................................36
3.21 WIFI cannot connect...................................................................................................37
3.22 BT cannot connect......................................................................................................39
3.23 GPS can't fix position..................................................................................................40
3.24 FM cannot search radio stations..................................................................................42
3.25 Earphone Silence........................................................................................................43
3.26 Psensor does not work................................................................................................45
3.27 The compass is useless................................................................................................46
3.28 Acceleration/gyroscope does not work.......................................................................47
3.29 T Card Not Recognized...............................................................................................48
3.30 Dual-color Lamp can’t work.......................................................................................49
3.31 Finger printer can't work.............................................................................................50

2
1.Main Board/Sub Board placement
1.1 Main Board Top

3
1.2 Main Board Bottom

4
1.3 Sub board top

1.4 Sub board bottom

5
2.System block diagram
Project : MT6762 LPDDR3
REF_SCH TOP LEVEL
LPDDR3 EMI BPI, APC

RXD ANT
eMMC MSDC0 / eMMC RXD
RF IQ
RxD FEM

micro SD MSDC 4-bit

MSDC1
BSI ctrl MT6177
+ hot-plug RX

Main 1 ANT
ABB
Connectivity ANT
TX FEM

CONN IQ 26M_BB
I/Q 26M_RF

26M_WBG
TCXO
MT6631 CONN ctrl
CONN IF

LCD LCD IF LCD

module (MIPI DSI)

Camera IF Camera
Camera (MIPI CSI)
Modules I2C
I2C_2 / I2C_4

I2C 26M_RF
MT6357
CTP I2C_0
controller 26M_BB

MT6765
26M_WBG
I2C 26M_NFC
DCXO / TMS
MEMs & ALS/PS I2C_1 26M
32K_BB

I2C_6
(SBS) LDOs LDOs RTC
I2C I2C_3
26M_NFC ST21NFCD Vibrator VIB
Bucks
GPIOs Headset
SPI Bucks (HPL,HPR,AU_VIN1)

Receiver
AUD I/F
Audio I/F AU_VIN0
Audio
SIM1 SPI Speech
SIM1 PWRAP I/F
SIM1
BC1.1
SIM2 BC 1.1 AU_LO
SIM2 SPK Driver
SIM2
VSYS
GPIOs / EINTs
EINT

PERI. Device LCM_AVDD/AVEE

PERIPHERAL_EN LCM Gate
I2C Driver
I2C_5
Keypad Keypad
FLASH
JTAG WLED Flash
Debug MSDC1/SPI Pin-MUX BST
port
UART JTAG

Charger/ Battery
SW

USB2.0
USB 2.0 Micro USB

USB 2.0

BLACKJACK is an 8-core, dual-card mobile phone that supports TDD LTE/FDD

LTE/WCDMA/GSM. The mobile phone uses MTK 4-core A53 1.8GHz + 4-core A53 2.3GHz
MT6765 platform, and the operating system is Android P.
The mobile phone has a 6.517 inch large screen with a resolution of HD+
(1600*720) and screen color of 16.7 million; Touch Window capacitive touch
screen with multi-touch; 64GB eMMC memory + 4 GB LPDDR3 memory chip; 16M pixel
auto zoom rear camera + 2M pixel rear camera +2M pixel rear camera + 8M pixel
front camera. Supports acceleration sensors, gyroscopes, distance sensors,
optical sensors, compasses, fingerprints, with three material keys: UP/Down and
Onkey; External T_card can be extended to 256G; Support GPS (AGPS); Support
802.11 a/b/g/n/ac (2.4 GHz & 5GHz); Support Bluetooth 5.0; Support wireless
applications such as FM.
BLACKJACK has 5000mAh capacity battery, standby time more than 1000 hours,
call time more than 5 hours, video call time more than 3 hours. Equipped with
motor, 3.5 inch headset, dual MIC, speaker and other devices, Micro USB 2.0
interface supports positive and negative interpolation, OTG perfect support.

6
2.1 MT6765 Platform Description

MT6765 processor: MT6765 is A highly integrated baseband

platform with integrated bluetooth, FM, wlan and GPS modules,
including A modem and application processing subsystem to support
LTE/ lte-a and C2K smartphone applications.The chip is integrated
with the 4-core ARM cortex-A53@1.8GHz and 4-core ARM cortex-
A53@2.3GHz , and is integrated with a powerful multi-standard video
codec.In addition, an extensive set of interfaces connect peripherals
including interfaces to cameras, touch screen displays, and MMC /sd
CARDS.
MT 6357 is a power management system chip optimized for 2G/3G/4G
mobile phones and smartphones, consisting of 5 converters and 29
ldos, optimized for specific 2G/3G/4G smartphone subsystems.Advanced
controls are available for PowerUp, battery charging and RTC alarm.MT
6357 USES SPI interface and two SRCLKEN control pins to control Buck
converter, LDO and various drivers.It provides enhanced security
controls and protocols for shaking hands with bb.The MT 6357 can be
encapsulated in 209 pin VFBGA.The operating temperature is -30~85°C.

2.2 MT6765 Power-on Sequence

The power-on sequence is shown in Figure：

7
3.Flow charts for common failures
analysis and trouble shooting

8
3.1 Boot-up Problem

Unable to
boot

Y Reassemble. If OK is replaced
Check whether the FPC assembly
by a new boot key FPC, the
of power key is good?
boot key FPC is not good.

Is it a high current to supply power to Y mainboard is

the mainboard? breakdown ， replace
mainboard
N

Connect to computer check whether Y

the device manager find a device Download software

N
N
Whether the 26MHz is OK ？ Resoldering crystal

Y
N
Check the battery connector
is welded properly? Resoldering

Y
N
Check whether the main power supply of PMIC is OK? Resoldering or
CPU&PMU&EMMC power supply 。 replace PMIC

Replace CPU

Replace Memory

Power on faults generally include: high current unable power on, high current power on,

9
unable power on, automatic power on, shutdown and other faults;
 High current unable power on

When the mobile phone is powered on, the voltage of VBAT network is obviously lowered.

This is caused by short circuit between VBAT network and ground. VBAT related idevices on

mobile phone main board are: CN801 (battery connector), D800, D801 (TVS), C800,

C801,C806,C807,, U3443 (Charge IC), U300 (PMU),U200(CPU),U601(AUDIO PA), U3206

(PA), U3202 (PA). It is necessary to check the welding status of these devices and the

effectiveness of the devices.

 Turn-on high current fault:

The high current of mobile phone after boot-up is mainly caused by the short-circuit phenomenon
of one or several power sources often supplied by PMU to the ground or other networks. The
common power supply of PMU is DVDD_CORE, DVDD_DVFS, VDRAM_PMU,
DVDD_SRAM_DVFS,VSRAM_OTHERS_PMU,DVDD_MODEM,VVA12_PMU,AVDD18_SO
C, EMI_VDD1, VIO18_PMU, VEFUSE_PMU,VMC_PMU, VUSB_PMU.It is necessary to
actually measure the voltage of these power sources. If the results are found to be beyond the
corresponding spec range, the welding status of the components connected by the power supply
and the validity of the devices needs to check.
 Turn-on failure:

There may be several states when the mobile phone can't start: the current stabilizes at about

200mA after booting, and the mobile phone stays in the boot screen, which indicates that the basic

initialization of the mobile phone PMU is good, and it needs to check the welding state of the

CPU and the validity of the device; the current is less than 100mA after booting, and the LCD is

not bright, indicating that the initialization of the mobile phone's hardware system is not good.

Normally, it is necessary to check the welding status of PMU (U301, U401), CPU (U101),

19.2MHz (X301) clocks and the effectiveness of the devices.

 Automatic start-up failure:

When the mobile phone is powered on, it starts automatically, which indicates that the PMU

receives the interruption of the hardware boot during the initialization process. It is necessary to

check whether the boot network PWRKEY is short circuit to the ground.

 System crashed

When the phone is turned on, it can't work properly and remains in the state of freezing
screen. If the PWRKEY button is used properly, it needs to check whether the volume button is
kept in the normal press state. At this time, the phone will block all other button functions.

10
3.2 Touch screens are insensitive or useless

CTP Useless

CTP failure
Change a front case to see if it's Y
a touch screen problem or a Replace front case
main board problem?

Y Welding Connectors
Is there any problem with LCM connector or Replacing ESD
and ESD device? Devices

check the CTP SPI control signal use

oscilloscope 。

Replace CPU

CTP communicates with CPU through I2C. It is necessary to measure whether VIO_18 1.8V
power supply is normal, whether I2C communication is normal, and whether EINT_CTP is
interrupted by touch screen.

11
3.3 Charging problem

3.3.1 Charger insertion, no

charge indication

Charger insertion, no
charge indication

Measure USB_VBUS net from N

subboard to mainboard is Reassembly
connective

Y
Is the charge normal after
replace chargers or data Replace charger
cables?

N
Y
Is the battery OK after Replace battery
replacement? Measure whether
the battery voltage is less than 3V

Check that Charge IC, USB Y

connectors and peripheral OK
devices are well welded? Is it
normal after re-welding

N
Y
Replace Charge IC
OK

Because the USB interface of BLACK JACK is located in the lower part of the mobile
phone, USB_VBUS needs to reach PMU and Charge IC through the small board, main FPC and
main board. It needs to ensure the good connection between them; whether the welding of

12
CN2203,D2204,D2203,D2212,D2211,U3443,U400 is good or not, and whether the device is
damaged.

3.3.2 Insert a USB cable and you

can't find a port on your computer.

Similar to inserting a charger without reacting

13
 Charger insertion, no
charge indication

Measure USB_VBUS net from N

subboard to mainboard is Reassembly
connective

Y
Is the charge normal after
replace chargers or data Replace charger
cables?

N
Y
Is the battery OK after Replace battery
replacement? Measure whether
the battery voltage is less than 3V

Check that Charge IC, USB Y

connectors and peripheral OK
devices are well welded? Is it
normal after re-welding

N
Y
Replace Charge IC
OK

Because the USB interface of BLACK JACK is located in the lower part of the mobile
phone, USB_VBUS needs to reach PMU and Charge IC through the small board, main FPC and
main board, which needs to ensure good connection between them; whether the welding of
N2203,D2204,D2203,D2212,D2211,U3443,U400 is good or not, and whether the device is
damaged, especially whether D2203,D2212 are damaged or not.

14
3.4 Acceptance voice quality is poor

Acceptance voice
quality is poor

N
Test whether the resistance of the Change the
receiver is about 28ohm receiver
Y

Check whether the shrapnel of the receiver is in Y

good contact with the contact point. Reassemble Y OK
the test to see if it's normal.

Check whether the LB606/LB607/C633/C634 Y

OK
welding on the receiver circuit is normal.
Rewelding, testing

Change U400

15
3.5 No ringtone

No ringtone

Check whether SPK contact shrapnel is Y

normal?Is it normal to replace SPK and OK
try again?

N
Y
Check whether the resistance and
OK
connector on Speraker circuit are
virtual welded.
N

Check whether the resistance

capacitance beads on the audio power Y
amplifier and circuit are welded or OK
damaged, whether the repair welding
or replacement is normal or not.

Change PMU 、CPU

For SPK silence, it is necessary to check whether the connection between the main FPC and

16
the main board is OK, whether the resistance-capacitance welding on the main board's audio
power amplifier U601 and audio channel is good, and whether the control reset signals
WSA_R_EN and I2C of the CPU for U601 are normal.

17
3.6 No screen display

3.6.1 No screen display after

boot-up

White screen or black

screen, bright backlight

Check whether the LCD FPC Y

connection is good and the OK
reassembly the LCD FPC
N

Replace the LCD to show if it is Y

normal. OK

Check the welding condition of EMI

Y
of LCD on the main board. The
OK
power supply and weld EMI filter
whether is normal.

Check whether the other components Y Rewelding

around the LCD are false welding, component
and check whether the LCD
connector is false welding.

N
Change CPU

18
3.6.2 Backlight is not work

LCD bright less

Check whether the FPC of the LCD

module is well connected to the Y
connector on the main board and OK
reconnect it properly.

Replace the LCD to verify whether Y

the LCD backlight is on again. OK

The voltage from the LED A to the Backlight Circuit is OK,

LED K whether exceeds 19V when Y
LCD Problem
the LCD backlight is on.

N
N
Check welding condition of backlight drive U806 Rewelding
and peripheral devices

Change U806

19
20
3.7 System crashed

System crashed

Connect the computer through the Y

USB cable to check whether the Download software
device manager has a device pop-up.

Check whether the 26MHz crystal N

oscillation is normal? Is there a 26MHz Repair welding
signal?

Check whether the power supply of N Rewelding

memory and CPU is normal. CPU/PMIC

Check the memory related circuit Y

Ok
and replace memory to see if it is
normal?

Change CPU

21
3.8 Key failure

Key failure

Y
Check key assembly or shrapnel OK
welding, re-welding or re-assembly

N
Press the button to check whether the Change Key
signal line is OK

Change CPU 、PMU

For power key, it is necessary to confirm the welding status of R1300/C1300 and whether the
device is damaged.
For volume keys, it is necessary to confirm the welding status of R1302/
R1301/D1304/D1302 and whether the device is damaged.

22
3.9 Signal unusual

Signal
unusual

N
Start up and enter the engineering Rewrite SN/IMEI Number
mode to see if the SN/IMEI
number is written
Y
N Reassemble RF
Check whether the RF Cable connector is
Cable
well assembled

Y
N
Verify whether the antenna and Replace antenna and
shrapnel connection is OK shrapnel

Connect to CMW500, Verify whether

the RF parameter is OK

Replace RF IC and recalibration

BLACK JACK uses the main board and sub board structure. The main board and the main
antenna are connected by RF Cable. First of all, it is necessary to confirm whether the RF Cable
connection and the antenna are in good condition. Signal anomaly usually appears as weak signal
or no network. Abnormal RF reception performance will lead to weak signal problem, and
abnormal RF transmission performance will lead to no network problem.
Receiving abnormalities, it is necessary to confirm whether the device on the receiving
channel is welded OK or not, and whether the component is damaged.
Abnormal launching, it is necessary to confirm whether the device on the launching channel
is welded OK and whether the component is damaged.

23
3.10 RCV has no sound

RCV has no
sound

N
Test whether the resistance of the Change the
receiver is about 28ohm receiver
Y

Check whether the shrapnel of the receiver is in Y

good contact with the contact point. Reassemble Y OK
the test to see if it's normal.

Check whether the LB606/ LB607/C633/C634 Y

OK
welding on the receiver circuit is normal.
Rewelding, testing

Change U301

24
3.11 MIC has no sound

RCV has no sound

Check the welding condition Y

of MIC and peripheral devices Rewelding

N
Y
Is it OK to change the OK
microphone?

N
Y
Check whether the connection of
the sub board connector is OK, OK
False welding or not. Re-test the
function after repair.

Welding
PMU

25
 Firstly, it is necessary to confirm whether the bias circuit of MIC is welded properly and
whether there are leakage devices; secondly, the connection between the main board, the sub
board and the main FPC is good.

26
3.12 Blurred screen

Blurred screen

Check whether the LCD FPC Y

connection is good. Is it normal to OK
reassemble the FPC?

N
Y
Replace the LCD to show if it is LCD fault
normal?

Check the welding condition of EMI

devices of LCD on the main board N
Welding False
and whether the power supply is Welding Devices
normal, and weld EMI filter.

Welding or replacing CPU

27
3.13 Ring tone distortion

Ring tone
distortion

N 扬声器有问
Test whether Sperker impedance is around
题，更换扬声
7 ohm
器

Check whether the speaker shrapnel is in good Y

contact with the contact point. Reassemble the OK
test to see if it's normal.

Check the audio power amplifier on Y

loudspeaker circuit and whether the bead OK
welding is normal. Rewelding, testing

Change PMU

For SPK distortion, it is necessary to check whether the connection between the main FPC
and the main board is OK, whether the U601 welding on the main board is OK, and whether the
output of U601 is short-circuit with the power supply VDD or ground.

28
3.14 The ring tone is low

The ring tone is

low

Re-download the software to see Y OK

if the audio parameters are lost
or replaced

N There is something
Test whether Speaker impedance is 7 wrong with the
ohm SPK. Change SPK

Check whether the speaker shrapnel is in good Y

OK
contact with the contact point. Reassemble and
test if it's normal.

N
Y
Check whether the audio power amplifier and OK
magnetic bead welding are normal on the
loudspeaker circuit. Rewelding, testing

N
Change PMU

For the ring tone is low, it is necessary to check whether the connection between the main
FPC and the main board is OK, whether the U601 welding on the main board is OK, whether the
LB610/ LB611 welding on the small board and whether the resistor is OK.

29
3.15 Cannot be charged

Charger insertion, no
charge indication

Measure USB_VBUS net from N

sub board to main board is Reassembly
connective

Y
Is the charge normal after
replace chargers or data Replace charger
cables?

N
Y
Is the battery OK after Replace battery
replacement? Measure whether
the battery voltage is less than 3V

Check that Charge IC, USB Y

connectors and peripheral OK
devices are well welded? Is it
normal after re-welding

N
Y
Replace Charge IC
OK

This problem is related to the fact that there is no charge indication after the charger is
inserted.
Because the USB interface of BLACK JACK is located in the lower part of the mobile
phone, USB_VBUS needs to pass through the small board, main FPC and main board to PMU
(Charge IC), which needs to ensure a good connection between them; check whether the welding
of CN1400、U1400、U3443、U400 is good or not, and whether the device is damaged.

30
31
3.16 Can't take pictures

3.16.1 Main camera can't take

pictures

Can't take
pictures

Disassemble the phone to check Y

whether the Camera module is OK
assembled properly

Replace Camera Y
Module and check OK
OK or not

Check whether the Camera module Y

connector is well welded and whether OK
the repaired connector is OK?

Check whether the EMI device N

is in good condition, welding is Rewelding
good, and power supply is
normal?

Y
Check whether CPU welding is
normal?

Rewelding or
Replacing CPU

The circuit diagram of the rear camera is shown below.

32
33
 3.16.2 Front Camera Can't Take

Photos

Can't Take Photos

Disassemble the phone to check Y

whether the Camera module is
OK
false welding, and re-weld the
module whether OK or not.
N

Replace Camera Y
Module and check OK
OK or not

Re weld or Replacing
CPU

The circuit diagram of the front camera is shown below.

34
35
3.17 Automatic shutdown

Automatic
shutdown

N Replace battery, replace

Check whether the battery is OK, battery
temperature, pin and battery connector battery connector CN801
are in good condition

Y
N
Turn on with programmable power Check whether the device has
supply to see if the current is normal been damaged and whether the
26MHz crystal is OK
Y

N
Reload the program to see if
download can complete Change CPU

Check whether the software N

Is CPU Welding Good?
version, SN, IMEI information
can be read out

N Check whether the welding of

Is Charging Normal U3443 、 U400 （ Charge
IC/PMU ） is good or not.
Y

Check whether the CPU is in

good condition

36
3.18 SIM Card Unrecognizable

SIM Card
Unrecognizable

Y
Replace new SIM card, check whether SIM card has problem,
the card can be identified replace a new SIM card

Y
Check whether SIM card
connector is fake welded Rewelding SIM Card
Connector

Y
Check whether SIM card power supply and OK
CLK/DATA/RST are normal

Change CPU/PMU

37
38
3.19 Power leakage

Power leakage

Y The leakage can be determined

Turn on the power and see if on VBAT
there is a large leakage current.

Remove all peripherals connected Y

by connectors or FPC, LCD,
camera and so on, and see if the Removal of PMU
leakage disappears. U3443 directly
This peripheral supplied by Vbat to
module leakage, determine leakage
replacement module
N

Turn on the power and touch all parts of

Y Finding power supply for devices
the PCB board with your hands. Whether
with higher temperature rise and
there is a serious temperature rise in the
determining short-circuit power
device or not, determine the approximate
supply network
location of the leakage device.
N

Detecting the grounding resistance of each

module with a multimeter to find out the
network with small resistance value

Whether the leakage will Y

disappear after replacing This module leaks OK
the relevant module IC and
the power filter capacitor

Change PMIC

39
3.20 Flash doesn't work

Flash doesn't
work

N
Check whether the flash disc welding is Re-welding flash
OK or not shrapnel

Whether the output of Y

Replace flash
FLASH_LED is OK or not

Change U505

40
3.21 WIFI cannot connect

WIFI cannot connect

Y
Check whether BT works Rewelding U2101
properly

N
N
Detect Y1801 48MHz Clock and Rewelding
Power Supply whether OK

Whether
ANT2101/ANT2102/U3430/U2102 N
and its matching circuit are OK Rewelding
welded or not, whether the antenna
shrapnel is OK or not

Y
Y
Change U2101 OK

Change CPU

41
3.22 BT cannot connect

42
 BT cannot connect

Y
Check whether WiFi works Rewelding U1805
properly
N
N
Detect 26 MHz Clock and Power
Rewelding
Supply Input

Whether N
ANT2101/ANT2102/U3430/U2104
Rewelding
and its matching circuit are OK
welded or not, whether the antenna
shrapnel is OK or not
Y
Y
Change U2101 OK

Change CPU

43
44
3.23 GPS can't fix position

GPS can't fix

position

N Check whether U2101 and

Check whether WIFI/BT is matching device are welded OK
working properly or not and whether the antenna
shrapnel is OK or not.
Y
N
Check whether the welding of Rewelding
U3430 、U2104 is normal and whether
the corresponding matching device is
OK-welded.
Y
Y
N
Check whether U2103 and the
peripheral devices are welded OK, and Rewelding
whether U2103 power supply is
positive.
Y

Replace U2103 OK

Replace CPU

45
46
3.24 FM cannot search radio stations

FM cannot search
radio stations

N
Check whether WIFI/BT is working Rewelding U2101
properly

Y
Check whether the main FPC
connected to the main board and the Y
sub board is properly and whether OK
the connector is well welded. Re-test
function after repair N

Disassemble the phone to check N

whether the components on FM Rewelding
antenna path are welded to OK
Y

Change
U2101

47
48
3.25 Earphone Silence

Earphone Silence

Y
Change earphone OK

Check whether the main FPC is

connected to the main board and the Y
sub board properly and whether the OK
connector is well welded. Re-test
function after repair

Disassemble to check whether the N

device on the headphone path is OK- Rewelding
welded
Y

Change
PMU

耳机无声

Y
更换耳机 OK

拆机检查耳机通路上的器件是 N
重新焊接
否焊接 OK

更换 PMU

49
50
3.26 Psensor does not work

Psensor does not work

Check whether the components of N

CN701 and surrounding circuit are Rewelding
well welded and assembled.

Y
Y
Change PSensor OK ， FPC NG
FPC

Change CPU

51
3.27 Acceleration/gyroscope does not work

Acceleration/gyroscope
does not work

Check whether the components of N

U1101 and surrounding circuits are Rewelding
well welded and assembled.

Y
Y
Change U1101 OK ， U701 NG

Change CPU

52
3.28 T Card Not Recognized

T Card Not
Recognized

Y
Replace a new T-card, whether the card T-card NG ， change T-card
can be identified

N
Y
Check whether the T-card Rewelding T-card connector
connector is fake welded

Check T-card power supply and whether Y

OK
CLK/DATA/CMD/SD_CARD_DET_N signal is OK

Change CPU

53
3.29 Dual-color Lamp can’t work

Dual-color Lamp can’t

work

Check whether the components of N

CN701 and surrounding circuit are Rewelding
well welded and assembled.

Y
Y
Change PSensor FPC
OK ， FPC NG

Change U401

54
3.30 Finger printer can't work

Finger printer can't

work

Y
Check that the finger
printer connector is well OK
connected and reassemble
FPC to check

N
Y
Is it OK to replace OK
fingerprint module?

Check whether the components of N

J701 and surrounding circuit are Rewelding
well welded and assembled, and
whether the power supply is
normal.
Y

Change CPU

55
56