Professional Documents
Culture Documents
1996 Erosion of Amorphous Hydrogenated Boron-Carbon Thin Films
1996 Erosion of Amorphous Hydrogenated Boron-Carbon Thin Films
Abstract
Amorphous hydrogenated boron-carbon (a-B 1 xCx:H) thin films were prepared by radio-frequency plasma-enhanced
chemical vapor deposition (RF-PECVD) using CH 4 and (B2H 6 + H 2) as precursor gases. Composition and density was
analyzed with ion beam analysis. The films were eroded by hydrogen and helium electron cyclotron resonance (ECR)
plasmas. The ion energy during erosion was varied by applying an additional rf bias to the target electrode. Erosion rates
were measured by in situ ellipsometry, a-Bt_xCx:H films with a carbon content of 15% were shown to be most resistent
against erosion with hydrogen plasmas. In contrast, pure a-B:H films exhibit the lowest erosion yield in helium plasmas.
Table I 104q~ . . . . , . , . ,
I1:::t_ +. total density C + B
Parameters of deposited a-B~ ,C,:H fihns
Parameter Value 8- ""a+
"'., + ~ . . .+. . . + , '+ . .',o-
! El",,,, --. + . . - " / /
Precursor gases B 2 H ~, ( 1()c/~) ill H , . CH
RF frequency 13.56 MHz
'~ 6i boron~'D .... carbon //
Total gas flow I 0 sccm
Total gas pressure 2 Pa
RF power density ().(~5 W / c m :
4-' hydrogen ........,;./O"
DC self-bias 235 V ,v ~k.--.---/,,-----~/H ~':',~--~-........ ZX
Substrate temperature 330 K
Film thickness 125-150 nm "~ 2 - / "'C1
O~ "L
O ",
........ 4
20 40 60 80 100
OH 4 - flux / total flux ( % )
for the boron and 1.5 MeV H ~ proton enhanced scattering
Fig. 1. Dependence of boron, carbon and hydrogen atom densities
(PES) tot the carbon content.
on tile fraction of CH 4 partial flux F c in the total precursor gas
Films were eroded by hydrogen and helium ECR plas- tlux I;,,,.
mas and erosion rates were determined in situ by ellipsom-
etry. For a detailed description of our plasma reactor and
ellipsometric setup see [7,8]. The plasma is generated by the density of crystalline boron (13 X 1022 cm ~ 2.34
microwaves at a frequency of 2.45 GHz and a magnetic g / c m 3) which is a typical value for mechanically and
field is applied to generate the resonant field of 87.5 roT. chemically stable a-B:H films [9]. The carbon content
To allow a comparison of the ero,~ion rates the plasma
increases monotonously with I"c up to a value of about
parameters were kept constant. The gas flow was 20 seem, 8.3 x 1022 cm 3, which is also typical for hard and dense
gas pressure 0.5 Pa and absorbed microwave power den- a-C:H films [10]. The hydrogen content remains constant
sity 0.01 W / c m ~. The base pressure is about 10 4 Pa. at a value of about 3.3 x 1022 cm -~ hydrogen atoms. The
The plasma is confined by a metallic cage inside the total boron plus carbon density (hydrogen atoms are not
vacuum vessel. A plasma beam is extracted through an considered here) decreases with increasing carbon content
aperture on the bottom of the cage and impinges on the
with a minimum density for I c = 80%.
sample, which is mounted on a if-driven electrode. Thus,
All fihns presented in Fig. I were eroded by hydrogen
the production of ions and radicals in the plasma is decou-
and helium ECR plasmas. The kinetic energy of the im-
pied from the sheath potential at the sample. By means of pinging ions was varied from floating potential, corre-
an additionally applied rf field the kinetic energy of the sponding to about 15 eV up to 200 eV. The dependence of
ions impinging on the films was varied from floating the erosion rate on the carbon content C / ( C + B) of the
potential to 200 V dc self-bias. At the low applied pressure
films and the self-bias UsB is shown in Fig. 2 for erosion
the sheath is considered to be collisional free, so the
with hydrogen and in Fig. 3 for erosion with helium. The
measured self-bias corresponds directly to the ion energy. erosion yield depends strongly on the carbon content as
The ion energy at floating potential is estimated to be well as on the ion energy during erosion. In all cases the
below 15 eV. The temperature of the electrode is measured
by a thermocouple in the substrate holder. To obtain good
thermal contact between the samples and the electrode. 0.3 ' '- " ' ' ' " '
colloidal carbon was used as bonding substance. The sam- -V-%=2oovl ._.~ . ~
--A--u~=~oovl ~ ............
ple temperature during the erosion process was between 0.2 --O--U~= 5ovl .5~ C
320 and 400 K depending on the additional self-bias /Jstv
0,3
potential in our experiments. Therefore, we should expect
He plasma ,~E.
for floating potential a negligible contribution of physical
0.1. /-V ~7"~',~" - "" "--~,.'--,
sputtering to the total erosion rate. This clearly indicates
,??--~, zx z~''.O'° ........... ::, the dominance of chemical erosion [8,13,14] by atomic
0.03 g.,v~ ....o o D ~ a hydrogen H ° for ion energies of less than about 50 eV,
0.01-
o oO-O U which is well known for graphitic materials [15]. Surpris-
ingly, there also exists a small, but non-negligible erosion
[]- "
S --A--
vu..
u~ =~oov rate (2.8 p m / s ) of a-B:H films with hydrogen at floating
0.003 _ 13/ /--O--L~= 50V
potential which we attribute to chemical erosion of boron
n_n u- L--D--~=,= by atomic hydrogen.
0.001.
0 20 40 60 80 100
Erosion at floating potential with helium, which was
carbon content C/(C+B) ( % )
found especially for carbon rich films, seems to be impos-
Fig. 3. Erosion rates of a-B I x C j H films in helium plasmas in sible at first sight. There can be no chemical erosion by
dependence on the carbon content C/(C + B) in the films and the helium and the threshold energy for physical erosion is
dc self-bias UsB. higher than the maximum ion energy of helium at floating
potential. Here we have to take into account plasma impu-
rities (base pressure being about 10 -4 Pa). Dominant parts
erosion rate increases monotonously with increasing ion of those impurities are H 2 0 and CO x. It is well known that
energy. The carbon content influences the erosion rate as especially carbon shows chemical erosion by oxygen,
follows: Eroding the films with hydrogen we found a forming volatile CO x molecules [16]. This was one impor-
minimum erosion rate for a carbon content of 15% which tant problem for carbonized fusion experiments in the
is clearly visible at all applied ion energies. At floating 1980s [2,17]. Since boron has a good getter effect on
potential a maximum erosion rate for hydrogen erosion is oxygen [1,2], forming non-volatile B203 [18], the erosion
observed for a carbon content of 71% while at higher ion of boron rich films by impurities can be neglected.
energies this maximum is at 100% carbon content. The
maximum at 71% also shows up at all ion energies for
erosion with helium. In general, the erosion rates of pure 4. Summary
a-C:H films exceed those of a-B:H films by a factor 2 - 4
for hydrogen and helium bombardment. The only excep- a-B=_xC ~:H films were deposited over the entire com-
tion exists for helium bombardment at floating potential, positional range from pure a-B:H ( x = 0) to pure a-C:H
which will be discussed further below. A striking differ- ( x = 1) films. The erosion of these films was investigated
ence between helium and hydrogen erosion is the mini- in hydrogen and helium ECR plasmas as a function of the
mum erosion rate found for hydrogen erosion of films with ion energy. The erosion rate depends strongly on film
a carbon content of about 15%. Those a-B0.85Cojs:H films composition and ion energy. For hydrogen erosion of
exhibit an erosion rate which is about 40% lower than for a-B i_ ~Cx:H films a minimum erosion rate occurs for films
pure a-B:H films. A similar result was observed by Veprek with a carbon content of 15% at all investigated ion
et al. [5] for the erosion of some BxC films at 630 K and energies. However, this minimum cannot be found for the
floating potential in a RF-PECVD H 2 plasma. However, erosion with helium plasmas. This result is important for
no such minimum could be observed for helium erosion. future fusion devices as ITER, because the helium ash is
Here we found a monotonous increase of the erosion rate always present in a fusion plasma. From the differences of
with carbon content up to x = 0.71. Like for floating the hydrogen and helium erosion we concluded that chemi-
potential at hydrogen erosion, those a-Bo29Co.71:H films cal erosion of a-B:H films by atomic hydrogen is, as for
- - the films of lowest film densities (see Fig. 1) - - have a carbon films, the dominant erosion mechanism at low ion
maximum erosion rate. energies.
But there are some other remarkable differences be-
tween hydrogen (Fig. 2) and helium erosion (Fig. 3). For
hydrogen the difference in the erosion rate between float-
References
ing potential and 50 V dc self-bias is in general very small;
only for pure a-C:H films a significant difference is found.
[l] J. Winter, H.G. Esser, L. K~Snen et al., J. Nucl. Mater.
For helium, however, the difference between these two
162-164 (1989) 713.
potentials is almost one order of magnitude over the entire
[2] U. Schneider, W. Poschenrieder, M. Bessenrodt-Weberpals
compositional range. We attribute this effect to the fact et al., J. Nucl. Mater. 176&177 (1990) 350.
that there exists a threshold energy Eth for physical sputter- [3] H.F. Dylla, M.G. Bell, R.J. Hawryluk et al., J. Nucl. Mater.
ing, which amounts to about 2 5 - 4 0 eV [11,12] for H + and 176&177 (1990) 337.
He + ion bombardment of carbon or boron surfaces. This [4] G.L. Jackson, J. Winter, T.S. Taylor et al., Phys. Rev. Len.
threshold energy is higher than the ion energy at floating 67 (1991) 3098.
154 A. Annen et al. / Journal ~l Nuclear Materials 231 (1996) 151-154
[5] S. Veprek, S. Rambert, M. Heintze, F. Mattenberger, M. [ 12] W. Eckstein+ C. Garcia-Rosalcs+ J. Roth and W. Ottenberger+
Jurik-Rajman, W. Portman, D. Ringer and U. Stiefel, J. Nucl. Sputtering Data, Technical Report, IPP 9 / 8 2 . Max-Planck-
Mater. 162-164 (1989) 724. lnstitut l~r Ptasmaphysik, 1993.
[6] A. Annen, R. Beckmann and W. Jacob, submitted to J. [13] J. Roth, J. Bohdansky and K.L. Wilson, J. Nucl, Mater.
Non-Cryst. Solids. 111&112(1982) 775.
[7] W. Fukarek and A. von Keudell+ Re','. Sci. lnstrum. 66 [14] J. Roth and J+ Bohdansky, J. Nucl. Mater. 128&129 (1984)
(1995) 3545. 534.
[8] A. yon Keudell and W, Jacob, J. Appl. Phys. 79 (1996) 1092. [15] E. Vietzke and V. Phillips, Fusion Technol. 15 (1989) 108.
[9] A. Annen, M. Sal3, R. Beckrnann and W. Jacob, to be [16] E. Vietzke, T. Tanabe, V. Phillips, M. Erdweg and K.
published. Flaskamp, J. Nucl. Mater. 145-147 (1987) 425.
[10] Y. Catherine, Mater. Sci. Forum 52&53 (1989) 175, [17] J. Winter. J. Nucl. Mater. 161 (1989) 265.
[11] J. Bohdansky, J. Roth and H+L. Bay, J. Appl. Phys. 51 [18] S. Veprek, Plasma Chem. Plasma Proc. 12 (1992) 219.
(1980) 2861.