REN DA16600MOD Series Datasheet 3v3 DST 20231006

DA16600MOD Series
Ultra-Low Power Wi-Fi + Bluetooth® LE Combo Module
General Description
The DA16600 series is a highly integrated ultra-low-power Wi-Fi + Bluetooth® Low Energy Combo
Module solution. This module includes the DA16200 that has an 802.11b/g/n radio (PHY), a baseband
processor, a media access controller (MAC), on-chip memory, and a host networking application
processor. DA16600 also has a DA14531 that has a 2.4 GHz transceiver and an Arm® Cortex-M0+®
microcontroller with a RAM of 48 kB and a One-Time Programmable (OTP) memory of 32 kB. The radio
transceiver, the baseband processor, and the qualified Bluetooth ® low energy stack is fully compliant
with the Bluetooth Low Energy 5.1 standard.
The DA16600 is a synthesis of breakthrough ultra-low-power technologies, which enables an extremely
low power operation in the module. The DA16200 and DA14531 shut down every micro element of the
chip that is not in use, which creates a power consumption that is near zero when not actively
transmitting or receiving data. Such low power operation can extend the battery life up to a year or
more depending on the application. The DA16600 also enables ultra-low power transmission and
reception modes when the SoC needs to be awake to exchange information with other devices.
Advanced algorithms enable sleep mode until the exact moment when wake up is required to transmit
or receive data.
Module Features
■ Module Variants
□ DA16600MOD-AAC4WA32 (Chip Antenna)
□ DA16600MOD-AAE4WA32 (u.FL Connector)
■ Dimensions
□ 14.3 mm × 24.3 mm × 3.0 mm, 51-Pins
■ Operating temperature range
□ -40 °C to 85 °C
■ Regulatory certifications:
□ FCC
□ IC
□ CE
□ TELEC
□ KCC
□ IMDA
Wi-Fi Features
■ Highly integrated ultra-low power Wi-Fi® system ■ Wi-Fi processor
on a chip □ IEEE 802.11b/g/n, 1x1, 20 MHz channel
■ RF performance bandwidth, 2.4 GHz
□ Tx Power: +18 dBm, 1 Mbps DSSS □ Wi-Fi security: WPA/WPA2-
□ Rx Sensitivity: -97.5 dBm, 1 Mbps DSSS Enterprise/Personal, WPA2 SI, WPA3 SAE,
and OWE
■ Full offload: SoC runs full networking OS and
TCP/IP stack □ Vendor EAP types: EAP-TTLS/MSCHAPv2,
PEAPv0/EAP-MSCHAPv2, PEAPv1, EAP-
■ Hardware accelerators FAST, and EAP-TLS
□ General HW CRC engine □ Operating modes: Station, Soft AP
□ HW zeroing function for fast booting □ WPS-PIN/PBC for easy Wi-Fi provisioning
□ Pseudo random number generator (PRNG) □ Fast Wi-Fi connections
■ SPI flash memory
Datasheet Revision 3.3 Oct. 06, 2023
CFR0011-120-00 1 of 30 © 2023 Renesas Electronics

DA16600MOD Series
□ 32-Mbit/4-Mbyte ■ Supports various interfaces

■ Complete software stack □ Two UARTs
□ Comprehensive networking software stack □ SPI Master/Slave interface
□ Provides TCP/IP stack in the form of □ I2C Master/Slave interface
network socket APIs □ I2S for digital audio streaming
■ CPU core subsystem □ 4-channel PWM
□ Arm® Cortex®-M4F core with clock □ Individually programmable, multiplexed
frequency of 30~160 MHz GPIO pins
□ ROM: 256 KB, SRAM: 512 KB, OTP: 8 KB, □ JTAG and SWD
Retention Memory: 48 KB
■ Built-in 2-channel auxiliary ADC for sensor
■ Advanced security interfaces
□ Secure booting □ 12-bit SAR ADC: single-ended two
□ Secure debugging using JTAG/SWD and channels
UART ports ■ Supply
□ Secure asset storage □ Operating voltage: 2.1 V to 3.6 V (typical:
■ Built-in hardware crypto engines for advanced 3.3 V)
security □ 2 Digital I/O Supply Voltage: 1.8 V/3.3 V
□ TLS/DTLS security protocol functions □ Black-out and brown-out detector
□ Crypto engine for key deliberate generic ■ Power management unit
security functions: AES (128,192,256),
DES/3DES, SHA1/224/256, RSA, DH, □ On-Chip RTC
ECC, CHACHA, and TRNG □ Wake-up control of fast booting or full
booting with minimal initialization time
□ Supports three ultra-low power sleep
modes
Bluetooth Features
■ Bluetooth ■ Radio
□ Compatible with Bluetooth® v5.1, □ Programmable RF transmit power
ETSI EN 300 328 and EN 300 440 Class 2 □ -93 dBm receiver sensitivity
(Europe), FCC CFR47 Part 15 (US) and
ARIB STD-T66 (Japan) core ■ Interfaces
□ Supports up to 3 connections □ 2 channel 11-bit ENOB ADC
■ Processing and memories □ 2 general purpose timers with PWM
□ 16 MHz 32-bit Arm®Cortex-M0+ with SWD □ 5 GPIOs
interface □ SPI
□ 48 Kbytes RAM □ 2x UART, 1-wire UART support
□ 144 Kbytes ROM □ I2C
□ 32 Kbytes OTP ■ Power management
■ Current consumption □ Operating range (1.8 V - 3.3 V)
□ 2 mA RX at VBAT = 3 V □ Inrush current control
□ 4 mA TX at VBAT = 3 V and 0 dBm ■ Others
□ 1.8 uA at sleep with all RAM retained □ Real Time Clock
□ Trimmed 32 MHz Crystal

DA16600MOD Series
Contents
General Description ............................................................................................................................ 1
Module Features .................................................................................................................................. 1
Wi-Fi Features ...................................................................................................................................... 1
Bluetooth Features .............................................................................................................................. 2
Contents ............................................................................................................................................... 3
Figures .................................................................................................................................................. 4
Tables ................................................................................................................................................... 4
1 Terms and Definitions .................................................................................................................. 5
2 References ..................................................................................................................................... 5
3 Block Diagram ............................................................................................................................... 6
4 Pinout ............................................................................................................................................. 7
5 Electrical Specification ............................................................................................................... 11
5.1 Absolute Maximum Ratings ................................................................................................ 11
5.2 Recommended Operating Conditions ................................................................................. 11
5.3 Electrical Characteristics ..................................................................................................... 11
5.3.1 DC Parameters, 1.8 V IO ..................................................................................... 11
5.3.2 DC Parameters, 3.3 V IO ..................................................................................... 12
5.3.3 DC Parameters for RTC Block ............................................................................ 12
5.4 Radio Characteristics .......................................................................................................... 13
5.4.1 Wi-Fi Characteristics ........................................................................................... 13
5.4.2 Bluetooth® LE Characteristics ............................................................................. 14
5.5 Current Consumption .......................................................................................................... 14
5.5.1 Wi-Fi Characteristics ........................................................................................... 14
5.5.2 Bluetooth® LE Characteristics ............................................................................. 15
5.6 Radiation Performance ....................................................................................................... 16
5.7 ESD Ratings........................................................................................................................ 16
6 Power-on Sequence .................................................................................................................... 17
7 Application Schematic ................................................................................................................ 18
8 Mechanical Specifications ......................................................................................................... 19
8.1 Dimension: DA16600MOD-AAC ......................................................................................... 19
8.2 Dimension: DA16600MOD-AAE ......................................................................................... 19
8.3 Marking ............................................................................................................................... 20
9 Design Guidelines ....................................................................................................................... 21
9.1 PCB Land Pattern ............................................................................................................... 21
9.2 4-Layer PCB Example ........................................................................................................ 22
10 Soldering ...................................................................................................................................... 23
11 Package Information ................................................................................................................... 24
11.1 Tape and Reel .................................................................................................................... 24
11.2 Labeling............................................................................................................................... 25
12 Ordering Information .................................................................................................................. 26
Appendix A Regulatory Approval .................................................................................................... 27
Revision History ................................................................................................................................ 28

DA16600MOD Series
Figures
Figure 1: DA16600MOD Block Diagram ................................................................................................... 6
Figure 2: DA16600MOD 51 Pinout Diagram (Top View) .......................................................................... 7
Figure 3: TIS 3D ...................................................................................................................................... 16
Figure 4: TRP 3D..................................................................................................................................... 16
Figure 5: Power On Sequence ................................................................................................................ 17
Figure 6: Application Schematic .............................................................................................................. 18
Figure 7: AAC Module Dimension ........................................................................................................... 19
Figure 8: AAE Module Dimension ........................................................................................................... 19
Figure 9: Module Shield Marking............................................................................................................. 20
Figure 10: PCB Land Pattern (Top View) ................................................................................................ 21
Figure 11: PCB Land Pattern (Bottom View) .......................................................................................... 21
Figure 12: 4-Layer PCB Example............................................................................................................ 22
Figure 13: Reflow Condition .................................................................................................................... 23
Figure 14: Tape and Reel ........................................................................................................................ 24
Figure 15: Component Direction ............................................................................................................. 24
Figure 16: Reel Labeling ......................................................................................................................... 25
Tables
Table 1: Pin Description ............................................................................................................................ 8
Table 2: Absolute Maximum Ratings....................................................................................................... 11
Table 3: Recommended Operating Conditions ....................................................................................... 11
Table 4: DC Parameters, 1.8 V IO .......................................................................................................... 11
Table 5: DC Parameters, 3.3 V IO .......................................................................................................... 12
Table 6: DC Parameters for RTC block, 3.3 V VBAT.............................................................................. 12
Table 7: DC Parameters for RTC block, 2.1 V VBAT.............................................................................. 12
Table 8: Wi-Fi Receiver Characteristics .................................................................................................. 13
Table 9: Wi-Fi Transmitter Characteristics .............................................................................................. 13
Table 10: Radio 1 Mb/s – AC Characteristics ......................................................................................... 14
Table 11: Current Consumption in Active State ...................................................................................... 14
Table 12: Current Consumption in Low Power Operation ...................................................................... 14
Table 13: DC Characteristics .................................................................................................................. 15
Table 14: ESD Performance ................................................................................................................... 16
Table 15: Power On Sequence Timing Requirements ............................................................................ 17
Table 16: Coexistence Connection ......................................................................................................... 18
Table 17: Component Value .................................................................................................................... 18
Table 18: Typical Reflow Profile (Lead Free): J-STD-020C .................................................................... 23
Table 19: Reel Specification .................................................................................................................... 25
Table 20: Ordering Information (Samples) .............................................................................................. 26
Table 21: Ordering Information (Production) ........................................................................................... 26

DA16600MOD Series
1 Terms and Definitions

API Application Programming Interface
CRC Cyclic Redundancy Check
DMA Direct Memory Access
GPIO General Purpose Input/Output
HW Hardware
I2C Inter-Integrated Circuit
I2S Inter-IC Sound
IoT Internet of Things
JTAG Joint Test Action Group
LDO Low-dropout Regulator
PLL Phase-locked Loop
PRNG Pseudo Random Number Generator
PWM Pulse Width Modulation
QSPI Quad-lane SPI
RTC Real-time Clock
SAR ADC Successive Approximation Analog-to-Digital Converter
SPI Serial Peripheral Interface
SW Software
SWD Serial Wire Debug
UART Universal Asynchronous Receivers and Transmitter
2 References
DA16600MOD consists of a DA16200 and a DA14531 chipset. Please see the respective chipset and
module datasheets for details.
[1] DA16200 Datasheet, Renesas Electronics
[2] DA16200MOD Datasheet, Renesas Electronics
[3] DA14531 Datasheet, Renesas Electronics
[4] DA14531MOD Datasheet, Renesas Electronics

DA16600MOD Series
3 Block Diagram
The DA16600 provides a high level of integration for a battery used wireless system, with integrated
IEEE 802.11 b/g/n and Bluetooth V5.1. The DA16600 is designed to address the needs of battery used
devices that require minimal power consumption and reliable operation.
Figure 1 shows the interconnection of all the physical blocks in DA16600MOD.
32 MHz
Crystal
DA14531
Matchin g
GPIO Multiplexing
Circuit
Low power
BLE SoC
U.FL
connector SPDT for
or antenn a UART
Chip switching
antenn a
GPIO Multiplexing
DA16200
2.4 GHz
BPF &
RTC co ntr ol
Matchin g
Low power
Circuit
Wi-Fi SoC UART for d ebug
4 MByte 32.768
40 MHz
Ser ial kHz
Crystal
Flash Crystal
Figure 1: DA16600MOD Block Diagram

DA16600MOD Series
4 Pinout
VBAT_BLE 51
DA16600 P0_10 50
MOD Series P0_11 49
P0_5 48
1 NC P0_7 47
2 P0_2 P0_8 46
3 P0_6 P0_9 45
4 GND TP 44
5 TEST or NC TP 43
6 GND GPIOA2 42
7 RTC_PWR_KEY GPIOA3 41
8 TP VDD_DIO1 40
9 RTC_GPO TP 39
10 TMS GND TP 38
11 TCLK GPIOA6 37
12 GPIOC_8 GPIOA7 36
15 UART0_TXD GPIOA10 33
26 RTC_WAKE_UP2
16 UART0_RXD GPIOA11 32
28 VBAT_3V3
17 VDD_DIO2 GND 31
21 GND
22 GND
27 GND
18 TP GND 30
23 TP
24 TP
25 TP
20 TP
19 TP GND 29
Figure 2: DA16600MOD 51 Pinout Diagram (Top View)

DA16600MOD Series
Table 1: Pin Description

#Pin Pin Name Type Drive (mA) Reset Related Description
State Device
1 NC AI DA14531 Not Connected
2 P0_2 DIO DA14531 General Purpose I/O,
JTAG I/F, SWCLK
3 P0_6 DIO DA14531 Internally connected to RF
switch
(Note 1)
4 GND GND Common Ground
5 TEST or NC AI Common Chip antenna type:
RF_Test
u.FL connector type: NC
7 RTC_PWR_KEY DI DA16200 RTC block enable signal
8 TP DNC DA16200 RTC block wake up signal
is internally connected
(Note 1)
9 RTC_GPO DO DA16200 Sensor control signal
10 TMS DIO 2/4/8/12 I-PU DA16200 JTAG I/F, SWDIO
11 TCLK DIO 2/4/8/12 I-PD DA16200 JTAG I/F, SWCLK,
General Purpose I/O
12 GPIOC_8 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O
15 UART0_TXD DO 2/4/8/12 O DA16200 UART transmit data
16 UART0_RXD DI 2/4/8/12 I DA16200 UART receive data
17 VDD_DIO2 VDD DA16200 Supply power for digital
I/O
GPIOC6~GPIOC8,
TMS/TCLK, TXD/RXD
18 TP DNC DA16200 F_IO0 is internally
connected to Flash
Memory
19 TP DNC DA16200 F_CLK is internally
connected to Flash
Memory
connected to Flash
Memory
connected to Flash
Memory
24 TP DNC DA16200 F_CSN is internally
connected to Flash
Memory

DA16600MOD Series

State Device
connected to Flash
Memory
26 RTC_WAKE_UP2 DI DA16200 RTC block wake-up signal
28 VBAT_3V3 VDD DA16200 Supply power for internal
DC-DC, DIO_LDO, and
Analog IP of DA16200
32 GPIOA11 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O
38 TP DNC 2/4/8/12 I-PD Common GPIOA5 of DA16200 is
internally connected to
P0_3 of DA14531 (Note 1)
P0_4 of DA14531 (Note 1)
40 VDD_DIO1 VDD DA16200 Supply power for digital
I/O
GPIOA0~GPIOA11
41 GPIOA3 AI/DIO 2/4/8/12 I-PD DA16200 Aux. ADC input/General
Purpose I/O
42 GPIOA2 AI/DIO 2/4/8/12 I-PD DA16200 Aux. ADC input/General
Purpose I/O
P0_0 of DA14531 (Note 1
and Note 2)
P0_1 of DA14531 (Note 1)
45 P0_9 DIO 3.5 / 0.3 I-PD DA14531 General Purpose I/O,
UART Debug TXD
46 P0_8 DIO 3.5 / 0.3 I-PD DA14531 General Purpose I/O,
UART Debug RXD
47 P0_7 DIO 3.5 / 0.3 I-PD DA14531 General Purpose I/O

DA16600MOD Series

State Device
51 VBAT_BLE VDD DA14531 Supply power for
DA14531
Note 1 Pin3, Pin8, Pin 38, Pin 39, Pin 43, and Pin 44 are connected internally so these pins cannot be used as
GPIO or as wake up input in application system.
Note 2 P0_0 has a reset function, but it is shared with GTL. It is recommended to connect the remaining GPIO
as an additional reset function when P0_0 is not available for reset in abnormal situations.
Within the DA16600 module, 4 pins of the DA16200 and the DA14531 are internally connected and
therefore cannot be used as GPIOs and are marked as TP (test points) on the DA16600MOD package.
The GPIOs which are not available are:
● DA16200: GPIOA0, GPIOA1, GPIOA4, GPIOA5

● DA14531: P0_0, P0_1, P0_3, P0_4, P0_6
Due to these internal connections, the SDIO, SDeMMC, and UART1 interfaces of the DA16200 are not
available.
To support Bluetooth Coexistence, P06 of the DA14531 (which is internally connected to the RF switch)
must be connected to a DA16200 GPIO pin as follows:
● For 1 pin Bluetooth Coexistence, connect P0_6 to GPIOA10

● For 3 pin Bluetooth Coexistence, connect P0_6 to GPIOA9
If GPIOA9 or GPIOA10 is used for Bluetooth Coexistence, then it cannot be used as a GPIO.

DA16600MOD Series
5 Electrical Specification
5.1 Absolute Maximum Ratings

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the
device. These are stress ratings only, so functional operation of the device at these or any other
conditions beyond those indicated in the operational sections of the specification are not implied.
Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Table 2: Absolute Maximum Ratings

Parameter #Pins Min Max Units
VBAT_3V3 28 -0.2 3.7 V
VDD_DIO1 40 -0.2 3.7 V
VDD_DIO2 17 -0.2 3.7 V
VBAT_BLE 51 -0.1 3.6 V
Storage temperature range -40 +125 °C
5.2 Recommended Operating Conditions

Table 3: Recommended Operating Conditions
Parameter #Pins Min Typ Max Units
VBAT_3V3 28 2.1 3.6 V
VDD_DIO1 40 1.62 3.6 V
VDD_DIO2 17 1.62 3.6 V
VBAT_BLE 51 1.8 3.3 V
Operating temperature range (TA) -40 +85 °C
5.3 Electrical Characteristics
5.3.1 DC Parameters, 1.8 V IO
Table 4: DC Parameters, 1.8 V IO

Symbol Parameter Condition Min Typ Max Units
Guaranteed logic Low
level 0.3 ×
VIL Input Low Voltage VSS V
DVDD
(Note 1)
Guaranteed logic High 0.7 ×
VIH Input High Voltage DVDD V
level DVDD
0.2 ×
VOL Output Low Voltage DVDD=Min. VSS V
DVDD
0.8 ×
VOH Output High Voltage DVDD=Min. DVDD V
DVDD
RPU Pull-up Resistor VPAD=VIH, DIO=Min. 32.4

kΩ
RPD Pull-down Resistor VPAD=VIL, DIO=Min. 32.4
Note 1 DVDD = 1.8 V, VDD_DIO1, VDD_DIO2 Logic Level.

DA16600MOD Series
5.3.2 DC Parameters, 3.3 V IO
Table 5: DC Parameters, 3.3 V IO

VIL Input Low Voltage level VSS 0.8 V
(Note 1)
Guaranteed logic High
VIH Input High Voltage 2.0 DVDD V
level
VOL Output Low Voltage DVDD=Min. VSS 0.4 V
VOH Output High Voltage DVDD=Min. 2.4 DVDD V
RPU Pull-up Resistor VPAD=VIH, DIO=Min. 19.4

kΩ
RPD Pull-down Resistor VPAD=VIL, DIO=Min. 16.0
Note 1 DVDD= 3.3 V, VDD_DIO1, VDD_DIO2 Logic Level.
5.3.3 DC Parameters for RTC Block

There are several control pins in RTC block.
Table 6: DC Parameters for RTC block, 3.3 V VBAT

VIL Input Low Voltage VSS 0.6 V
level
VIH Input High Voltage 2.2 VBAT V
level
(RTC block: RTC_PWR_KEY, RTC_WAKE_UP2)
Table 7: DC Parameters for RTC block, 2.1 V VBAT

VIL Input Low Voltage VSS 0.3 V
level
VIH Input High Voltage 1.6 VBAT V
level
(RTC block: RTC_PWR_KEY, RTC_WAKE_UP2)

DA16600MOD Series
5.4 Radio Characteristics
5.4.1 Wi-Fi Characteristics

● TA = +25 °C, VBAT = 3.3 V, CH1 (2412 MHz)
Table 8: Wi-Fi Receiver Characteristics

Parameter Condition Min Typ Max Units
1 Mbps DSSS -98.5 -97.5 -95.5
2 Mbps DSSS -94 -93 -91
11 Mbps CCK -89 -88 -86
6 Mbps OFDM -90 -89 -87
Sensitivity 9 Mbps OFDM -90 -89 -87
(8 % PER for 11b rates, 10 %
PER for 11g/11n rates) 18 Mbps OFDM -88 -87 -85
dBm
36 Mbps OFDM -81 -80 -78
54 Mbps OFDM -75 -74 -72
MCS0(GF) -90 -89 -87
MCS7(GF) -72 -71 -69
Maximum input level 802.11b -4 0 0
(8 % PER for 11b rates, 10 %
PER for 11g/11n rates) 802.11g -10 -4 -3
Table 9: Wi-Fi Transmitter Characteristics

1 Mbps DSSS 15 18 19
2 Mbps DSSS 15 18 19
5.5 Mbps CCK 15 18 19
11 Mbps CCK 15 18 19
6 Mbps OFDM 14 17 18
9 Mbps OFDM 14 17 18
Maximum Output Power 12 Mbps OFDM 14 17 18
measured form IEEE spectral dBm
mask and EVM 18 Mbps OFDM 14 17 18
24 Mbps OFDM 13 16 17
36 Mbps OFDM 13 16 17
48 Mbps OFDM 11.5 14.5 15.5
54 Mbps OFDM 10.5 13.5 14.5
MCS0 OFDM 14 17 18
MCS7 OFDM 10.5 13.5 14.5
Transmit center frequency
-25 +25 ppm
accuracy

DA16600MOD Series
5.4.2 Bluetooth® LE Characteristics
Table 10: Radio 1 Mb/s – AC Characteristics

Parameter Description Condition Min Typ Max Unit
Dirty Transmitter disabled;
DC-DC converter
PSENS_CLEAN sensitivity level disabled; PER = 30.8 %; -93 dBm
(Note 1)
Extended packet size
PSENS_EPKT sensitivity level (255 octets) -90 dBm
(Note 1)
Note 1 Measured according to Bluetooth® Low Energy Test Specification RF-PHY.TS/5.1.0
5.5 Current Consumption
5.5.1 Wi-Fi Characteristics

TA = +25 °C, VBAT = 3.3 V, w/ CPU clock is 80 MHz.
Table 11: Current Consumption in Active State

1 Mbps DSSS @ 18.0 dBm 260 280 320
6 Mbps OFDM @ 17.0 dBm 240 260 300
TX
54 Mbps OFDM @ 13.5 dBm 180 200 240
MCS7 @ 13.5 dBm 180 200 240
ACTIVE No signal (Note 1) 25 29 51 mA
1 Mbps DSSS (Note 1) 26.5 30.5 53
RX 1 Mbps DSSS 27 37.5 54
54 Mbps OFDM 29 38.5 54
MCS7 29 38.5 54
Note 1 Low Power Mode and CPU clock is 30 MHz.
TA = +25 °C, VBAT = 3.3 V
Table 12: Current Consumption in Low Power Operation

5.2
Sleep 1
(Note 1)
6.8
Low Power Operation Sleep 2 µA
(Note 1)
8.5
Sleep 3
(Note 1)
Note 1 RF switch current consumption is included. VDD of RF switch is connected to VBAT_3V3 for DA16200
and typical current consumption of RF switch is 5 µA.

DA16600MOD Series
5.5.2 Bluetooth® LE Characteristics
Table 13: DC Characteristics

Parameter Description Conditions Min Typ Max Units
IBAT_ACTIVE Battery supply current 0.4 mA
Average battery supply
current with system in
Advertising state (3
IBAT_BLE_ADV_100ms 80 µA
channels) every 100ms
and extended sleep with
all RAM retained.
Average battery supply
current with system in a
connection state with
IBAT_BLE_CONN_30ms 92 µA
30ms connection interval
and extended sleep with
all RAM retained.
Battery supply current with
IBAT_HIBERN 0.6 µA
system shut down
IBAT_RF_RX Battery supply current Continuous Rx 2.3 mA
Continuous Tx;
Output power at 2
IBAT_RF_TX_+2 Battery supply current dBm 4.3 mA
(Note 1)
Continuous Tx;
Output power at -1
IBAT_RF_TX_-1 Battery supply current dBm 3.6 mA
(Note 2)
Continuous Tx;
IBAT_RF_TX_-4 Battery supply current Output power at -4 2.8 mA
dBm
Note 1 All Bluetooth applications run on DA16200, so DA16200 should be active to handle Bluetooth data (for
example, Bluetooth Connection Request coming from a Bluetooth peer), in which case, Rx active current
of DA16200 is added to the total current consumption.
Note 2 The actual Tx output power is slightly different than the one indicated in the parameter name.

DA16600MOD Series
5.6 Radiation Performance
Figure 3: TIS 3D
Figure 4: TRP 3D
5.7 ESD Ratings

Table 14: ESD Performance
Reliability Test Standards Test Conditions Result
Human Body Model (HBM) ANSI/ESDA/JEDEC JS-001-2017 ± 2,000 V Pass
Charge Device Mode (CDM) ANSI/ESDA/JEDEC JS-002-2018 ± 500 V Pass

DA16600MOD Series
6 Power-on Sequence
The sequence after the initial switching from power-off to power-on of DA16200 is shown in Figure 5.
The RTC_PWR_KEY is a pin that enables the RTC block of DA16200. Once RTC_PWR_KEY is
enabled after VBAT power is supplied, all the internal regulators are switched on automatically in the
sequence pre-defined by the RTC block.
Once RTC_PWR_KEY is switched on, LDOs for both XTAL and digital I/O are switched on shortly and
then the DC-DC regulator is switched on according to the pre-defined interval. The enabling intervals
can also be modified in the register settings after initial power-up.
VBAT 50% VBAT
T0
IO Voltage 50% IO
POWER_KEY 50% VBAT
CLK_32K
T1 T2 T3
Figure 5: Power On Sequence
Table 15: Power On Sequence Timing Requirements

Name Description Min Typ Max Unit
T0 VBAT power-on time from 10 % to 90 % of VBAT ms
T1 IO voltage and VCC supply 0 ms
T2 RTC_PWR_KEY turn-on time from 50 % VBAT to 5*T0 ms
50 % POWER_KEY * (Note 1)
T3 Internal RC oscillator wake-up time 217 µs
Note 1 If the T0 = 10 ms to switch on VBAT, the recommended T2 is 50 ms for the safe booting operation. It
would be externally controlled by MCU or it would be implemented using RC filter at the input of
RTC_PWR_KEY. The recommended C is 470 nF or 1 uF (not to exceed 1 uF) and R value is chosen to
have T2 delay. For example, R and C values will be 82 kΩ and 1uF when T0 = 10 ms.

DA16600MOD Series
7 Application Schematic
10uF
*Note: DA16600 VBAT_BLE 51 VBAT_BLE

P0_10
MOD Series P0_11
Remove R1 and C1 when MCU controls P0_10 50
'RTC_PWR_KEY' 49 P0_11
If not controlled by MCU, keep R1 and C1 and P0_5 48 P0_5
connect to VBAT. 1 NC P0_7 47 P0_7
P0_2 2 P0_2 P0_8 46 BLE_Debug /GPIO
0
P0_6 3 P0_6 P0_9 45 Interface
4 GND TP 44
5 TEST or NC TP 43
6 GND GPIOA_2 42
R1 GPIO Interface
External Power Control 7 RTC_PWR_KEY GPIOA_3 41
C1 8 TP VDD_DIO1 40 VDD_DIO1
9 RTC_GPO TP 39
1uF
10 TMS GND TP 38
JTAG Interface
11 TCLK GPIOA_6 37
12 GPIOA_7 36
GPIO Interface
GPIOC_8
GPIO Interface
13 GPIOC_7 GPIOA_8 35 GPIOA_8
14 GPIOC_6 GPIOA_9 34 GPIOA_9
RTC_WAKE_UP2
UART Interface for debug
15 UART0_TX GPIOA_10 33 GPIOA_10
16 UART0_RX GPIOA_11 32 GPIO Interface
VDD_DIO2 17 VDD_DIO2 31
18 30
1uF 19 29
20
21
22
23
24
25
26
27
28
4.7K
10uF
VBAT_3V3
External Wake-
up Control
Figure 6: Application Schematic
Table 16: Coexistence Connection

DA14531 part DA16200 part Function
P0_5 GPIOA_8 Wi-Fi_ACT
P0_6 GPIOA_9 BT_ACT
P0_7 GPIOA_10 BT_PRIO
Table 17: Component Value

Part Reference Value Description
Remove R1 when MCU control ‘RTC_PWR_KEY’.
R1 470 kΩ This value should be chosen by customer application to achieve
the enough delay time depending on the power-on time of VBAT.
Remove C1 when MCU control ‘RTC_PWR_KEY’.
C1 1 uF This value should be chosen by customer application to achieve
the enough delay time depending on the power-on time of VBAT.
Not to exceed 1 uF.

DA16600MOD Series
8 Mechanical Specifications
8.1 Dimension: DA16600MOD-AAC

Unit: millimeter (mm)
Tolerance: 14.3 (±0.2) x 24.3 (±0.2) x 3.0 (±0.1)
Figure 7: AAC Module Dimension
8.2 Dimension: DA16600MOD-AAE

Tolerance: 14.3 (±0.2) x 24.3 (±0.2) x 3.0 (±0.1)
Figure 8: AAE Module Dimension

DA16600MOD Series
8.3 Marking
Figure 9: Module Shield Marking

DA16600MOD Series
9 Design Guidelines
9.1 PCB Land Pattern

Figure 10: PCB Land Pattern (Top View)
Figure 11: PCB Land Pattern (Bottom View)

DA16600MOD Series
9.2 4-Layer PCB Example

Ant GND is only needed on the bottom of the PCB. GND must be removed for all layers including the
inner layer except the bottom.
Top Layer Layer 2
Layer 3 Bottom Layer
Figure 12: 4-Layer PCB Example

DA16600MOD Series
10 Soldering
The reflow profile depends on the solder paste being used and the recommendations from the paste
manufacturer should be followed to determine the proper reflow profile.
Figure 13: Reflow Condition
Table 18: Typical Reflow Profile (Lead Free): J-STD-020C

Profile Feature Lead Free SMD
Average ramp up rate (Tsmax to Tp) 3 °C/s Max.
Preheat
● Temperature Min (Tsmin) ● 150 °C

● Temperature Max (Tsmax) ● 200 °C
● Time (Tsmax to Tsmin) ● 60 to 180 seconds
Time maintained above
● Temperature (TL) ● 217 °C
● Time (tL) ● 60 to 150 seconds
Peak/Classification temperature (Tp) 260 °C
Time within 5 °C of peak temperature (tp) 20 to 40 seconds
Ramp down rate 6 °C/s Max.
Time from 25 °C to peak temperature 8 minutes Max.

DA16600MOD Series
11 Package Information
11.1 Tape and Reel
Figure 14: Tape and Reel
Figure 15: Component Direction

DA16600MOD Series
The actual reel specifications are presented in the following table:
Table 19: Reel Specification

Item Description
Diameter 13 inches
Reel tape width 44 mm
Tape material Antistatic
Qty/Reel 500
Leader Min. 500 mm
Trailer Min. 500 mm
11.2 Labeling
Figure 16: Reel Labeling

DA16600MOD Series
12 Ordering Information
The order number consists of the part number followed by a suffix that indicates the packing method.
For details and availability, please visit the Renesas website
(https://www.renesas.com/kr/en/products/wireless-connectivity/wi-fi/low-power-wi-fi) or contact your
local sales representative.
Table 20: Ordering Information (Samples)

Part Number Pins Size (mm) Shipment Form Pack Quantity
DA16600MOD-AAC4WA32 51 14.3 x 24.3 x 3.0 Reel
DA16600MOD-AAE4WA32 51 14.3 x 24.3 x 3.0 Reel
Table 21: Ordering Information (Production)

Part Number Pins Size (mm) Shipment Form Pack Quantity
DA16600MOD-AAC4WA32 51 14.3 x 24.3 x 3.0 Reel 500
DA16600MOD-AAE4WA32 51 14.3 x 24.3 x 3.0 Reel 500
Part Number Legend:

DA16600MOD-AAC4WA32
AA: Module revision number
C: Select module type
[C] Chip antenna, [E] u.FL connector
4: Flash memory
[4] 4-Mbyte, [2] 2-Mbyte
W: Voltage range
[W] 3.3 V, [L] 1.8 V
A3: Package No.
2: T&R packing

DA16600MOD Series
Appendix A Regulatory Approval

DA16600MOD-AAC and DA16600MOD-AAE modules have received regulatory approval for the
following countries:
● FCC / United States

○ DA16600MOD-AAC4WA32 FCC ID: 2AU49-DA16600MC
○ DA16600MOD-AAE4WA32 FCC ID: 2AU49-DA16600ME
● IC / Canada
○ DA16600MOD-AAC4WA32 IC ID: 25650-DA16600MC
○ DA16600MOD-AAE4WA32 IC ID: 25650-DA16600ME
● KCC / Korea
○ DA16600MOD-AAC4WA32 KCC ID: R-C-fci-DA16600AAC
○ DA16600MOD-AAE4WA32 KCC ID: R-C-fci-DA16600AAE
● TELEC / Japan
○ DA16600MOD-AAC4WA32 TELEC ID:
○ DA16600MOD-AAE4WA32 TELEC ID:
● CE / Europe
○ DA16600MOD-AAC4WA32 CE ID: LCS200907037AE
○ DA16600MOD-AAE4WA32 CE ID: LCS200907033AE
● IMDA/ Singapore
○ DA16600MOD-AAC4WA32 IMDA ID: N4512-23

DA16600MOD Series
Revision History
Revision Date Description
● Removed redundant sections
3.3 Oct. 06, 2023 ● Added Appendix A
● Added Tape and Reel Information
● Section 3.1 updated coexistence description
3.2 Jan. 04, 2023 ● Updated Table 3 to add storage temperature range and adjusted
min max voltages
● Updated logo, disclaimer, and copyright
● Section 3.1 updated Pin Multiplexing Table 2
3.1 June 14, 2022
● Section 6 updated application Schematic Figure 6
● Updated Pin description Table 1
3.0 Feb. 23, 2021 Official release
1.4 Oct. 26, 2020 Modified application schematic
1.3 July 15, 2020 Modified application schematic
1.2 May 22, 2020 Added ESD performance, Table 15
1.1 Apr. 29, 2020 Preliminary datasheet

DA16600MOD Series
Status Definitions
Revision Datasheet Status Product Status Definition
This datasheet contains the design specifications for product development.

1.<n> Target Development
Specifications may be changed in any manner without notice.
This datasheet contains the specifications and preliminary characterization
2.<n> Preliminary Qualification data for products in pre-production. Specifications may be changed at any
time without notice in order to improve the design.
This datasheet contains the final specifications for products in volume
production. The specifications may be changed at any time in order to
3.<n> Final Production improve the design, manufacturing, and supply. Major specification changes
are communicated via Customer Product Notifications. Datasheet changes
are communicated via www.renesas.com.
This datasheet contains the specifications for discontinued products. The
4.<n> Obsolete Archived
information is provided for reference only.
Reach and RoHS Compliance

Renesas Electronics’ suppliers certify that its products are in compliance with the requirements of REACH and Directive 2015/863/EU of the
European Parliament on the restriction of the use of certain hazardous substances in electrical and electronic equipment. RoHS certificates from our
suppliers are available on request.

DA16600MOD Series
Important Notice and Disclaimer

RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND
RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER
DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL
WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the
appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you
permission to use these resources only for development of an application that uses Renesas products. Other reproduction or use of these resources
is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property. Renesas disclaims
responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising out of
your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms
agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these
products.
© 2023 Renesas Electronics Corporation
Corporate Headquarters
TOYOSU FORESIA, 3-2-24 Toyosu Contact Information
Koto-ku, Tokyo 135-0061, Japan For further information on a product, technology, the most up-
to-date version of a document, or your nearest sales office,
www.renesas.com please visit:
https://www.renesas.com/contact/
Trademarks
Renesas and the Renesas logo are trademarks of Renesas Electronics

Corporation. All trademarks and registered trademarks are the property
of their respective owners.

REN DA16600MOD Series Datasheet 3v3 DST 20231006

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REN DA16600MOD Series Datasheet 3v3 DST 20231006

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DA16600MOD Series

Ultra-Low Power Wi-Fi + Bluetooth® LE Combo Module

Datasheet Revision 3.3 Oct. 06, 2023

CFR0011-120-00 1 of 30 © 2023 Renesas Electronics

□ 32-Mbit/4-Mbyte ■ Supports various interfaces

Datasheet Revision 3.3 Oct. 06, 2023

CFR0011-120-00 2 of 30 © 2023 Renesas Electronics

CFR0011-120-00 3 of 30 © 2023 Renesas Electronics

Datasheet Revision 3.3 Oct. 06, 2023

CFR0011-120-00 4 of 30 © 2023 Renesas Electronics

1 Terms and Definitions

Datasheet Revision 3.3 Oct. 06, 2023

CFR0011-120-00 5 of 30 © 2023 Renesas Electronics

Figure 1: DA16600MOD Block Diagram

Datasheet Revision 3.3 Oct. 06, 2023

CFR0011-120-00 6 of 30 © 2023 Renesas Electronics

Figure 2: DA16600MOD 51 Pinout Diagram (Top View)

Datasheet Revision 3.3 Oct. 06, 2023

CFR0011-120-00 7 of 30 © 2023 Renesas Electronics

Table 1: Pin Description

Datasheet Revision 3.3 Oct. 06, 2023

CFR0011-120-00 8 of 30 © 2023 Renesas Electronics

#Pin Pin Name Type Drive (mA) Reset Related Description

Datasheet Revision 3.3 Oct. 06, 2023

CFR0011-120-00 9 of 30 © 2023 Renesas Electronics

#Pin Pin Name Type Drive (mA) Reset Related Description

● DA16200: GPIOA0, GPIOA1, GPIOA4, GPIOA5

● For 1 pin Bluetooth Coexistence, connect P0_6 to GPIOA10

Datasheet Revision 3.3 Oct. 06, 2023

CFR0011-120-00 10 of 30 © 2023 Renesas Electronics

5.1 Absolute Maximum Ratings

Table 2: Absolute Maximum Ratings

Storage temperature range -40 +125 °C

5.2 Recommended Operating Conditions

Operating temperature range (TA) -40 +85 °C

5.3 Electrical Characteristics

5.3.1 DC Parameters, 1.8 V IO

Table 4: DC Parameters, 1.8 V IO

RPU Pull-up Resistor VPAD=VIH, DIO=Min. 32.4

Note 1 DVDD = 1.8 V, VDD_DIO1, VDD_DIO2 Logic Level.

Datasheet Revision 3.3 Oct. 06, 2023

CFR0011-120-00 11 of 30 © 2023 Renesas Electronics

5.3.2 DC Parameters, 3.3 V IO

Table 5: DC Parameters, 3.3 V IO

VOL Output Low Voltage DVDD=Min. VSS 0.4 V

VOH Output High Voltage DVDD=Min. 2.4 DVDD V

RPU Pull-up Resistor VPAD=VIH, DIO=Min. 19.4

Note 1 DVDD= 3.3 V, VDD_DIO1, VDD_DIO2 Logic Level.

5.3.3 DC Parameters for RTC Block

Table 6: DC Parameters for RTC block, 3.3 V VBAT

(RTC block: RTC_PWR_KEY, RTC_WAKE_UP2)

Table 7: DC Parameters for RTC block, 2.1 V VBAT

(RTC block: RTC_PWR_KEY, RTC_WAKE_UP2)

Datasheet Revision 3.3 Oct. 06, 2023

CFR0011-120-00 12 of 30 © 2023 Renesas Electronics

5.4 Radio Characteristics

5.4.1 Wi-Fi Characteristics

Table 8: Wi-Fi Receiver Characteristics

Table 9: Wi-Fi Transmitter Characteristics

Datasheet Revision 3.3 Oct. 06, 2023

CFR0011-120-00 13 of 30 © 2023 Renesas Electronics

5.4.2 Bluetooth® LE Characteristics