Maintenance Manual

No.
AOA-NP-19458-42 2/3
1. EXPLANATION OF CONTENT OF CHANGE.
We change the glue spread on Main HD and Pre-HD (only terminals → whole).
Refer to the following figure for details.
・Main HD
Application model: Application model:

・ICT3Q8-3A2347 ・ICT1Q8-1R0347
・ICT3Q8-3A2348 ・ICT1Q8-1R0348
・Pre-HD
Application model: Application model:

・ICT1Q8-1R0347 ・ICT1Q8-1R0348
・ICT3Q8-3A2347 ・ICT3Q8-3A2348
No. AOA-NP-19458-42 3/3
2. CHANGE IN NUMBER OF VERSIONS
OUTSIDE_DRAWING, SPECIFICATION, and MAINTENANCE MANUAL revisions are changed as below.

Product revision is not changed.
OUTSIDE_DRAWING
Customer P/N Sankyo Model Revision change(Before → After)
No.
T09A524A01 445-0764436A ICT3Q8-3A2347 AE → AF
T09A634A01 445-0764437A ICT1Q8-1R0347 AE → AF
T14A530A01 445-0764438A ICT3Q8-3A2348 A4 → A5
T14A621A01 445-0764439A ICT1Q8-1R0348 A4 → A5
SPECIFICATION
No.
445-0764436A ICT3Q8-3A2347
ASR-NP-19458-01 J → K
445-0764437A ICT1Q8-1R0347
445-0764438A ICT3Q8-3A2348
ASR-NP-29052-01 D → E
445-0764439A ICT1Q8-1R0348
MAINTENANCE MANUAL
No.
445-0764436A ICT3Q8-3A2347
AMR-NP-19458-01 F → G
445-0764437A ICT1Q8-1R0347
445-0764438A ICT3Q8-3A2348
AMR-NP-29052-01 A → B
445-0764439A ICT1Q8-1R0348
--- The end of the document ---

SPECIFICATION
Type Name :
ICT1Q8-1R0347 ICT3Q8-3A2347
Spec. No. ASR-NP-19458-01
Notes :
K Change the Customer P/N P6 Y.Fujimori

J for NEMO P6, P37 EB-21847-01 Jul.14.2016 Y.Fujimori H.Takeda
I for NEMO P6 EB-20498-01 May.14.2015 Akahane H.Takeda
H New Smart Card Block + NU-MCRW P6,14 EB-17966-01 Nov.29.2013 Akahane T.Tatai
G for NEMO all EB-17771-01 Aug. 05. 2013 Akahane K.Higashi
NSGH 1 F Boot Revision Number P37 EB-16213-01 Jul.20.2012 Akahane Y.Uemura
E Main PCB P/N is updatedP6, P14 EB-16128-01 Jul.10.2012 Akahane K.Higashi
No. of sheet
D Correct Ver.C P6, P12, P25 EB-16128-01 June.4.2012 Akahane K.Higashi

Distribution
Change of R/W IC P5,6,12,14,

C
MEEI is removed 15,25,27,37 EB-15950-01 May.17.2012 Akahane T.Tatai
B Correction of a typo P14 EB-14200-01 Nov. 26 .'10 Akahane T.Tatai
Sym. Revision Page Cha. No. Date By Appr.
Reference Document
Design J.Tanaka Dec.16.2009
Custody
H.Takahashi Dec.16.2009
F.Akahane Dec.16.2009
Det-che K.Oguchi Dec.16.2009
Type Name Appro. Y.Komatsu Dec.16.2009
NIDEC SANKYO CORPORATION
No. S39Z-032-00-02F
CONFIDENTIAL No. ASR – NP – 19458 - 01 1 /37
Contents
1. Product. 5
2. Model. 6
2. Model. 6
3. Function. 6
3. Function. 7
3.1 Basic Function 7
3.1.1 Card Feed 7
3.1.2 Mag.-stripe Read/Write 7
3.1.3 Interface (Between the HOST and the NU-MCRW / NEMO) 8
3.1.4 Pre-head detect 8
3.1.5 Shutter gate 8
3.1.6 Enhanced Card Drive (ECD) 9
3.1.7 Card return Operation on power fail / card return on system escape
9
3.1.8 IC card Read/Write 11
3.1.9 Media Entry and Exit Indicator (MEEI) 12
3.1.10 Latch Fast Card Capture Bin 12
3.1.11 Magnetic Stripe Read using Digital Decoding 12
3.2 Stage-1 Function 13
3.2.1 CIM / MM 13
4. Characteristic 14
4.1 Appearance 14
4.2 Circuit 14
4.3 Mass 14
4.4 Power requirement 14
4.4.1 Main Power 14
4.4.2 MEEI Power 15
4.5 Card feed speed 15
4.6 Card feed time 15
4.7 Card eject length (ISO standard card used) 15
4.8 Dielectric strength 15
4.9 Insulation resistance 15
4.10 Mechanical noise 15
4.11 Thin card transport 15
5. Usable card 16
5.1 Magnetic card 16
5.2 IC card 16
5.3 Cleaning card 16
CONFIDENTIAL No. ASR – NP – 19458 - 01 2
6. Environmental condition 17
6.1 Normal Operating temperature / humidity 17
6.2 Card Entry Mechanism Operating temperature / humidity 17
6.3 Extreme Power-ON Range temperature / humidity 17
6.4 Storage temperature / humidity range 18
6.5 Transit Temperature/Humidity Range. 18
6.6 Barometric Pressure Range. 18
6.7 Vibration durability 18
6.8 Shock durability 18
6.9 Electro Magnetic Compatibility(EMC) 19
6.9.1 Emission 19
6.9.2 Immunity 19
7. Life 20
7.1 NU-MCRW / NEMO Unit 20
7.2 Card 20
8. Reliability 21
8.1 Mag-stripe read / write Error Rate 21
8.2 IC contact connection Error Rate 21
8.3 MTBF 21
8.4 ISO magnetic stripe cards 21
9. Power down mode(Assembled Main PCB) 22
9.1 Definition of power down(Card Return) 22
9.2 Operation (Battery Backup) 22
9.3 Backup power supply 22
10. Warped card. 23
11. Physical level 24
11.1 Explanation for signal and PIN assignments 24
11.2 Circuit of USB I/F and POWER 26
12. PCB Connector pin connections. 27
12.1 Main PCB 27
12.2.Stage1 PCB(CIM/MM) 32
12.3. IC Block PCB 33
13. Notes. 34
13.1 Note 1. Normal Conditions 34
13.2 Note 2. 34
13.3 Note 3. 34
13.4 Note 4. Care for handling the cards; 34
13.5 Note 5. 35
13.6 Note 6. Manufacturers life test results. (Reference Section 6) 36
13.7 Note 7. Boot Program and Main PCB (Electric) Revision. 37

13.8 Note 8. Boot Program Change Sheet. 37
Note: Changes/corrections in this specification are referenced to the revision

list on the front sheet of this specification by the revision letter that appears in
the triangle next to the changed /corrected text, when they occur in the
document.
CHANGE SHEET
REV. DESCRIPTION OF CHANGE

DATE APPROVAL
PAGE PARAGRAPH
B B 26/Nov/’10 P14 Appearance drawing No F.Akahane
C MEEI and its circuit are option.
C P5, 6, 12,14, F.Akahane
23/Apr/ ‘12 15, 25, 27,37
Change of the production
R.Nishikawa
Of R/W IC process
D P6, P12, P25,
D 06/Jun/’12 Remove Comments for Lower MEEI F. Akahane
P27
E P6, Sankyo Parts Number of Main PCBs are updated.
E 09/July/’12 F. Akahane
P14 Sankyo Circuit diagram number is updated.
F F 20/July/’12 P37 Upgrade of Boot revision F. Akahane

G Updated for “NEMO”
G all The mark of the change point which the comment
31/July / ’13 of NEMO was added to is omitted.
P5, P13 Hedgehog information are added. F. Akahane
P33 Smart Card Block was updated.
H H 29/Nov/2013 P6, P14 NU-MCRW with New Smart Card Block F. Akahane
I I 12/May/2015 P6 New Parts Number for NEMO F. Akahane
J NU-MCRW’S parts number were removed.
J P6
14/June/2016 Add the new parts number. F. Akahane
P37 New Electric revision was added.
K K 19/May/2017 P6 Change the Customer P/N Y.Fujimori
1. Product.
IC card and Magnetic Card Reader /Writer.
(Hereafter refers as NU-MCRW / NEMO. Customer’s main system as HOST)
NU-MCRW / NEMO is of a modular construction.
USB interface.
The software interface is held Flash PROM (F-ROM) and downloadable from the
HOST. (max 100000 times).
The NU-MCRW / NEMO has following functions for option.
▪ Connect and control CIM/MM optical sensor
▪ Attach a BIN and detect card-full condition
▪ Charge and discharge power to battery for backup
▪ Connect and control MEEI
NOTE: MEEI and its circuit are option. If you need
C MEEI functionality, you need to get this option.
G ▪ Connect and control Hedgehog (Anti Fishing) unit

2. Model.
G
Customer P/N Head Assy.

Mag-stripe
Sankyo P/N IC Resistors Note
JP1 JP2 JP3
Tk1 Tk2 Tk3 Hi-Co
(See a bottom picture)
G
J 445-0737837B
C
445-0745511 ICT3Q8-3A2347 R/W R/W R/W C C ○ ○ - +Std Shutter
K I 445-
445 - 0764436A
07 64436A
445-0737836B
J G 445-0745510 ICT1Q8-1R0347 N/A R N/A N/A C - - ○ +Std Shutter
K I 445-
445 - 0764437A
07 64437A
009-0025444
J H S36A670A01
009-0028981 R/W R/W R/W C N/A ○ ○ - 3Tk Transport with Bas e
K I S36A670A03
009-
009 - 0031368A
003 1368A
J 009-0025442
J S37A017A01
009-0028980 N/A R N/A N/A N/A - - ○ Tk2 Transport with Bas e
K S37A017A03
I 009-
009 - 0031369A
003 1369A
K J 009-0031367A S36A663A02 - - - - - - - - Standard Shutt er
E 009-0025446 S36A625A01 IC Block

- - - - - - - -
009-0028982
(W ithout SAM )
S46A961A01
009-0022328
Stag e 1 Function. PCB
SBW242901 - - - - - - - - (CIM/MM only)
J 998-0912563 S36A626A02 - - - - - - - - New Pr e-HD
C 009-0028065 S36A420C01
JH S36A420D01
G 009-0028984 S46A569D01 R/W R/W R/W C N/A - - - Main PCB (3TK)
K I 009-
009 - 0031366A
003 1366A S58A297A01
009-0028064 S36A420C02
J S36A420D02
009-0028983 S46A569D02 N/A R N/A N/A N/A - - - Main PCB (TK2)
K 009-
I 009 - 0031365A
003 1365A S58A297A02
C 009-0028186 (New) MEEI

S45A719A01 - - - - - - - -
(Option) Only Upper LED
009-0025450
D (Option) S37A018A01 - - - - - - - - (New) MEEI
009-0025447
C D (Option) MYB486201 - - - - - - - - MEEI Plastic cov er
R : Read only R/W : Read and Write ○Short circuit C : Connected

N/A : Not applicable
JP3 JP2 JP1 Sensor (LED) PCB
This picture is showing the head assembly.
C NOTE: MEEI and its circuit are option. If you need

MEEI functionality, you need to get this option.
3. Function.
3.1 Basic Function
3.1.1 Card Feed
Round trip and capture
3.1.2 Mag.-stripe Read/Write

(See 2.Model)
▪ Encoding method : FM (F2F)
▪ Encoding density : Tk1; 210BPI
: Tk2; 75BPI
: TK3; 210BPI
▪ Magnetic head : read core width; 1.2mm
: write core width; 3.1mm
: material ; Sendust
▪ Cross talk level : hi-co; 30dB (write and read)
▪ Long term average time interval deviation *1
:
+/-2%(636.6µsec. Nominal)
▪ Long term average time interval jitter *2
: +/-15%
▪ Skew : 0deg +/-20'
*1*2
Jitter test condition
Write and read jitter on the track3 shall be measured by using the same card reader
and the standard card specified by magnetic card specification.
▪ Number of first omits bit : 20bits

▪ Number of data bit : 640bits
▪ Data format : "111111.........."
▪ Long term average time interval
deviation: LTAD
: LTAD = (Aavg. - 636.6µs) / 636.6µs X100%
▪ Long term average time interval jitter: LTAJ
: LTAJ max. = (Aimax. - Aavg.) / Aavg. X100%
: LTAJ min. = (Aimin. - Aavg.) / Aavg. X100%
▪ Average time interval Aavg.
i =674
Aavg.= ∑ Ai/ 665 µs
i =10
3.1.3 Interface (Between the HOST and the NU-MCRW / NEMO)

USB interface compatible.
Interface connector(mini-B Receptacle):UB-M5BR-DMP14-4S(LF)(SN) (JST) or
equivalent.
Please refer the Programmers Manual (ASL-NP-03133-01).
3.1.4 Pre-head detect

ISO Track 2 and ISO Track 3
Magnetic head : read core width; 0.8mm
: material; Sendust
3.1.5 Shutter gate
1 piece, Normal closed
3.1.6 Enhanced Card Drive (ECD)

NU-MCRW / NEMO has three card entry and card eject modes because of the motor
on/off sequencing. One is standard entry/eject, one is "Intermediate ECD" and the
other is "maximum ECD".
Normal card entry/eject, or either ECD mode is selected by software.
1) Motor life on ECD mode

1-1) ECD permanently enabled
(One pass is one entry and eject at ECD movement)
a. Intermediate ECD : 700,000 passes
b. Maximum ECD : 500,000 passes
1-2) ECD enabled for maximum of 40% of entry

a. Intermediate ECD : 1,100,000 passes
2) The performance of card take-in.

The first roller can not take the card into NU-MCRW / NEMO without a hand push
power in maximum ECD.
1) Card Return Operation On Power Fail (CROPF) :
Timer 120sec Typical

SET(Timer Set) to BATON
Power Down Reset(Timer Reset)
BATOFF (from CPU)
NOTE: A 15ms debounce filter in software is performed before PowerFail is registered.

NOTE: CPU (Library) can control the BATOFF signal. If the BATOFF goes off, NU-MCRW /
NEMO dies when VCC is off.
This API is “Manage_Battery()”. This API should call after APIl IMCRW_DoCROSE() or API:
Clear_ucSetCrose().
2) Card Return On Disconnect Circuit diagram of Hardware:
Detect Falling Edge

V-BUS
of USB CROD(V_BUS_Trigger=1)
2ms
3) USB CROSE0(Long SE0) Mechanism
USB Interrupt
IRQ3
+D OKI CPU
60852A (H8/3048B) ( SE0 )

Mini 40ms
-D BUS Reset
Normal
Bus Reset Assert
CROSE0 (LongSE0_Trigger=1)
4) USB Card Return On Retiral Mechanism
CROR(EnumSeqFail_Trigger = 1)
If A Bus-Reset-Assert happens during Normal Operation, Enumeration should

begin again by Host. NU-MCRW / NEMO has a management function of this
Enumeration.
If Five times of BusResets happen during this Enumeration , or If this
Enumeration doesn't complete in ten-seconds, NU-MCRW / NEMO ought to make
Force Enumeration by PPON=OFF-and-ON(500ms).
This is the First Fail.
The Host should start Re-Enumeration again after PPON=OFF-and-ON. However
if this Re-Enumiration fails again, then NU-MCRW / NEMO give up Enumeration.
This is the Second Fail. And this is called "CROR".
3.1.8 IC card Read/Write

IC contact location : Just ISO/IEC 7816-2
Communication circuit : Exists on the ICB
G Vcc : DC+5V +0.3V/- 0.4V (Max 70mA)
: DC+3V +/- 0.15V (Max 70mA)
(selected by Command)
Vpp : Open
CLK : 3.58MHz (basis)
: 7.16MHz (automatically selected firmware)
I/O communication speed : Please refer the Programmers Manual
(ASL-NP-03133-01)
Memory Cards : GPM896, Siemens4442
Contact Pin assign
Pin No. Mean
1 C1 VCC
2 C2 RST
3 C3 CLK
4 C4 MEM CRD or USB
5 C5 GND
6 C6 VPP
7 C7 I/O
8 C8 MEM CRD or USB
Pin 4and8,C4andC8 USB is not supported.
3.1.9 Media Entry and Exit Indicator (MEEI)

Upper portion is by an LED board with even light distribution whereas the lower throat
D has 2 points of light, evenly spaced along the width of the lower throat.
The upper portion and lower portions of the throat is are illuminated by the ATM
control.
Also, NU-MCRW / NEMO has the capability to power and control the MEEI if required.
NU-MCRW / NEMO regulates the supply voltage from ATM 24V to 12V for MEEI.
C
LED PCB
USB-IMCRW
CN4
ATM J31
D
(53261-0571 Molex) Male (51021-0500 Molex)
55935-0210 (MOLEX)
3.1.10 Latch Fast Card Capture Bin

The NU-MCRW / NEMO has one connector for tamper indicating cassettes.
The NU-MCRW / NEMO is able to monitor that Users LFCC Bin is present or warning
information if LFCC bin is full and when bin is removed.
See section 11.1.D for Card Bin Connector details.
3.1.11 Magnetic Stripe Read using Digital Decoding

If the NU-MCRW / NEMO fails to read the magnetic stripe during the first read attempt and
subsequent retries there is an option to read and store the data using an analogue to digital
converter which then can be analysed by the NU-MCRW / NEMO processor. This technique
takes longer but allows a flexibility of waveform analysis, which just cannot be achieved using
standard amplifiers and filters.
It is important that the read verification after a write command does not use the digital decode
read option as this could mask possible card or NU-MCRW / NEMO problems. If the
standard read after write fails to read and verify the data on the card then a faulty/damaged
card or a faulty NU-MCRW / NEMO is indicated, allowing appropriate opportunities for error
recovery.
However, NEMO has added new Decode IC to PCB as ASIC which has almost the
G same performance as this Digital Decode.
3.2 Stage-1 Function

The NU-MCRW / NEMO supports CIM/MM and Hedgehog (as one of Anti Fishing) by having
G an interface board mounted underneath the main NU-MCRW / NEMO body and above the
NU-MCRW / NEMO base plate. The board provides all the interface hardware required
between the CIM/MM and the NU-MCRW / NEMO. The +/- 12 v power required for MM
support is not supplied by the reader / writer.
3.2.1 CIM / MM
The NU-MCRW / NEMO provides the facility to fit the CIM/MM optical read head. The
interface from the optical head is connected to the stage1 function board via an RS232
(CMOS+5V) port. MM/CIM Pin assignment (AMP 281281-1 or equiv.)
1Pin
16Pin 2Pin
Pin No. Signal name Pin No. Signal name

1 +5V 9 Open
2 MM sensing 10 Open
3 Reset 11 +5V
4 TXD(to CIM/MM) 12 +5V
5 RXD(from CIM/MM) 13 GND
6 GND 14 GND
7 CIM sensing 15 Open
8 GND 16 Open
TXD, RXD(RS232) +5V +/-5% current 1.0A max(max duty 20%)
Content of Stage1 CIM/MM Assembly

1) Stage-1 PCB (CIM/MM only) assembly
*One Stage-1 PCB
*One Stage-1 PCB bracket
*One Captive Pan Head M3 x 8 (Securing Stage1 PCB bracket)
*One Pan Head M2.5 x 4(Securing between Stage1 PCB bracket and Stage1 PCB)
2) Two Regulator assembly
3) Two Plastic Support Slides
4) Two Captive Pan Head M3 x 6 (Securing 2 Regulators)
5) One Captive Pan Head M3 x 5 (Securing NCR CIM/MM Bracket)
4. Characteristic
4.1 Appearance G
Appearance drawing No.:
B T09A634A01 ; ICT1Q8-1R0347 ;Tk2
T09A524A01 ; ICT3Q8-3A2347 ;3Tk (Hi-Co)
4.2 Circuit
Circuit diagram: C X00A414C01
E X00A678D01 ; Main PCB(3Tk HiCo, Tk2)
H X00A414D01(NU-MCRW)
; Main PCB(3Tr HiCo, Tk2)
YEC5301 ; Stage1 PCB CIM/MM
X00A687A01 ; ICC PCB
X00A416A01 ; Top MEEI PCB High bright
C X00A417A01 ; Bottom MEEI PCB High bright
* Information of MEEI has been moved to its Document.
YEC5359 ; Stage1 PCB CIM/MM security
4.3 Mass
Approximately : 1.8 kg ; with IC Block
4.4 Power requirement

4.4.1 Main Power
Voltage : +24V +/-10%
Ripple : Less than 240 mVp-p
Power consumption
1) Without solenoid current(Base model)
Peak current : Less than 2.4 A Less than 50mS
: Less than 4.9 A Less then 50uS(See Fig P)
Card feed(380mm/S) : Less than 2.0 A
Waiting : Less than 0.2 A(With out Battery)
2) Solenoid current
Shutter solenoid : Max 0.8 A increased when Shutter is opened.
Contact solenoid : Max 1.0 A increased when IC contact is loaded.
Connector type : 44130-0018(MOLEX)
(Power supply for logic circuit is generated within NU-MCRW / NEMO using+24V
supply)
W=max50uS
P=max4.9A
1/2P
Fig P
4.4.2 MEEI Power

Voltage : +24V +/-10%
Power consumption
Turn on the MEEI LED’s : Less than 70mA
: Average 40mA

4.5 Card feed speed

At mag-stripe Read / Write : 190mm/S +/- 3%
At card transport only : 380mm/S(typ.)
4.6 Card feed time

Approx. 1.5 S (forward and backward)
4.7 Card eject length (ISO standard card used)

More than 25mm (except warped card and operation of a ECD)
More than 20mm (with operation of a Maximum-ECD)
More than 21mm (with operation of a Standard-ECD)
4.8 Dielectric strength

DC 200V, 1 min
(Measured between PCB ground and frame)
4.9 Insulation resistance

More than 10 Mohm at DC 200V
4.10 Mechanical noise

Less than 70dBA
(Measured at distance of 150mm above any external surface except solenoid
mechanism)
4.11 Thin card transport

0.22mm thick card can be ejected or captured.
Note : Drive mechanism of NU-MCRW / NEMO does not guarantee to transport
0.178mm cards as defined in ISO/IEC 15457 part 1.
5. Usable card
5.1 Magnetic card
ISO7810, 7811 parts 1,2,6 and 8
NOTE: NU-MCRW / NEMO can update for new transparent card handling (next ISO7810) by software.
5.2 IC card
1) EMV Integrated Circuit Card Specification for Payment System
Version 3.1.1
Version 4.0
Version 4.1
Version 4.2
2) ZKA3.0 (in collaboration with the NCR SST/ATM)
3)GIECB’98 Specification D’ interface Des Cartes A Microcircuit et Terminaux CB.
4)Latest version of ISO 7816 part 3 and the standard ISO 7816 part4.
5)Memory Cards(GPM896,Siemens4442)
6)The ability to relax the constraints (eg. Timing, valid ATR’,etc) to allow support of
Non-Compliant Customer Cards.
5.3 Cleaning card

Specification #68-76-02-51-4 (Standard type) or #68-76-02-51-8 (With mag-stripe
type. DWG.No.EGCMC01881)
6. Environmental condition
6.1 Normal Operating temperature / humidity
The whole NU-MCRW / NEMO, card entry mechanism plus the rest of reader/writer
will meet all hardware/software requirements as defined within this specification over
the following temperature/humidity ranges, except for warped card handling capability
in the temperature range 0 to 5 degrees C.
Temperature range : 0 degrees C to 50 degrees C

Temperature change : 10 degrees C maximum during period of 60
minutes.
Relative humidity range : 20% to 80%
Humidity change : 10% maximum during period of 60 minutes.
Wet bulb temperature : Less than +26 degrees C Non-condensation
6.2 Card Entry Mechanism Operating temperature / humidity

Note: 6.2 only applies to the card entry mechanism.
The card entry mechanism will operate in the following temperature and humidity
(non-condensing) environment:
Temperature range : -35 degrees C to 50 degrees C

Temperature change : 10 degrees C maximum during period of
60 minutes.
Relative humidity range : 0% to 95% except for the temperature range of
-35 degrees C to ~ + 10 degrees C where humidity
is not specified.
6.3 Extreme Power-ON Range temperature / humidity

The NU-MCRW / NEMO will meet all hardware/software requirements as defined
within this specification over the temperature/humidity ranges as specified in 6.1 after
being subjected to and being allowed to return from the following extreme Power-On
Temperature/Humidity Ranges.
Temperature Range : 0 degrees C to 60 degrees C
Temperature Change : 10 degrees C in 60 minutes
Relative Humidity : 10% to 95% except for the temperature range of 0
degrees C to ~ + 10 degrees C where humidity is
not specified.
The extreme power-on range does not represent an operating range but a range in
which there should be no unrecoverable damage to the NU-MCRW / NEMO.
These limits which are likely if the heating or air conditioning plant fails and have not
yet brought the room to operating conditions.
6.4 Storage temperature / humidity range

being subjected to the following Storage Temperature/Humidity Ranges.
This test is operated by packaging condition.
Temperature Range : -10 degrees C to 50 degrees C

Relative Humidity : 10% to 90%
Period : 3 months
6.5 Transit Temperature/Humidity Range.

being subjected to the following Transit Temperature/Humidity Ranges.

Relative Humidity : 5% to 95% except for the temperature range of -
40 degrees C to ~ + 10 degrees C where humidity is
not specified.
Period : 1 week
6.6 Barometric Pressure Range.

being subjected to the following Barometric Pressure Ranges.
Operating and Transit : 105 x 10 3 to 70 x 10 3 Pa
6.7 Vibration durability

Range of frequency : 5 ~ 50Hz
Acceleration : 2 m/s2 (0.2G)
Sweep method : Logarithmic sweeps 2min/1 octave
X.Y.Z. each direction 30 minutes.
No functional error is found after vibration test.
6.8 Shock durability

294 m/s 2 (30G), 11 ms
X, Y, Z each direction one time.
No functional error is found after shock durability test.
(Direct shock to FCRWM, without packaging)
6.9 Electro Magnetic Compatibility(EMC)
6.9.1 Emission
Radiated and Conducted emission : EN 55022(2006, A1:2007) Class B
: FCC 47 CFR Part15B Class B
6.9.2 Immunity
: EN 55024(1998+A1:2001, A2:2003)
Electrostatic Discharge immunity : EN/IEC 61000-4-2

Contact discharge : +/- 5kV min
Discharge Point : Vertical Ground Plane , Horizontal Ground Plane ,
Front Frame, Front Ring
Air discharge : +/-14kV min
Discharge Point : Pre Head (Card throat)
No degradation or loss of function.
Radio-frequency electromagnetic field immunity : EN/IEC61000-4-3

3V/m, and 6V/m
80% am (1KHz) 80MHz-1GHz
Electrical Fast transient/burst immunity : EN/IEC61000-4-4

DC cable :+/-0.5kV(5kHz) and
+/-1.1kV(5kHz) (Retry)
USB cable :+/-0.5 and 1.1kV(5kHz)
Immunity to conducted disturbances,

inducted by radiofrequency fields: EN/IEC61000-4-6
DC/USB cable: 3V and 6V
0.15-80MHz, 80% am (1KHz)
Power frequency magnetic field immunity : EN/IEC61000-4-8

50Hz, 60Hz 1A/m and 3A/m
7. Life
Refer to 13.7 Note 7. for derivation of life figures.
7.1 NU-MCRW / NEMO Unit

2,000,000 card passes (indoor usage)
Condition : One time card pass is one forward and backward.
The ratio of IC contacts set and card pass are less
than 6/10.
1,000 passes/card maximum.
7.2 Card
Magnetic card 1,000 passes/card. (indoor usage)
Smart card 3,000 passes/card. (indoor usage)
8. Reliability
8.1 Mag-stripe read / write Error Rate
Less than 5 / 5,000 times
Condition : at indoor normal condition,
Card: SANACARD-T5 flat.
Card feed: 1 cycle / 10 seconds
1 cycle: one Mag-Track Write Command and one
Mag-Track Read Command function.
8.2 IC contact connection Error Rate

Condition : 1 time = 1 try + 2 retries
1 try: To carry the card to IC contacts position and
set IC contact.
8.3 MTBF
More than 220,000 hours (Circuit parts only)
8.4 ISO magnetic stripe cards

Refer to Programmers Manual: ASL-NP-03133-01
9. Power down mode(Assembled Main PCB)

CROPF circuitry is integrated in to the main PCB with a Battery attached.
This Main function is to eject a card to the customer if VCC-power-down condition happens.
But if a customer doesn't remove this card, NU-MCRW / NEMO captures it to rear after 30
seconds.
After that, NU-MCRW / NEMO disconnects Battery from itself by calling
API:ManageBattery if VCC is still OFF condition.
Note: Refer to “3.1.8 1) Card Return Operation On Power Fail (CROPF)”.
9.1 Definition of power down(Card Return)

Supply voltage : 20V DC or less
Duration time : over 15 msec.
9.2 Operation (Battery Backup)

Refer to Programmers Manual (ASL-NP-03133-01) Flow/Block Signals Diagram of
CROSE/CROPF.
9.3 Backup power supply
1) Battery : Min 0.5AH Nickel Metal Hydride cell x 18

Or Nickel Cadmium cell x 18
Charging current 30mA typ.(15~45mA)
10. Warped card.

This term refer to an evenly warped card having (from the top of the convex surface to
the base of the warped edge)
All environments: Temperature, Humidity

a) "H" </= 2.5 mm for able to Mag-stripe R/W.
b) "H" </= 2.0 mm for able to IC R/W.
c) "H" </= 4.0 mm for to card jamming H
(Include card eject in case of power down)
Normal Conditions: 20 degree C +/- 5 degree, 35% ~ 60%

d) "H" </= 3.0 mm for able to Mag-stripe R/W.
e) "H" </= 2.0 mm for able to IC R/W.
f) "H" </= 6.0 mm for to card jamming
11. Physical level

11.1 Explanation for signal and PIN assignments
a) USB Interface connector mini-B: UB-M5BR-DMP14-4S(LF)(SN)(JST)or
equivalent
Pin No. Signal name I/O Function
1 VBUS - Power
2 D- I/O USB Data(-)
Twisted signaling pair
3 D+ I/O USB Data(+)
4 ID - NC
5 SGN - Signal Ground(0V)
The shell portion of connector is connected to the frame of NU-MCRW / NEMO.
b) Power connector: 44130-0018(MOLEX)

1 +24V I +24V DC (main power supply)
2 PGN - Power Ground (0V)
SGN and PGN are connected inside NU-MCRW / NEMO.
#1 #5
#1 #2
#1
USB I/F; mini-B Type

UB-M5BR-DMP14-4S(LF)(SN) (JST) Battery Power
22-05-1022(Molex) 44130-0018 (Molex)
C) Battery connector: 22-05-1022(MOLEX)

1 BAT+ - Battery +
2 BAT- - Battery -
D) Card bin connector: 280389-2(AMP)

1 CUS I Capture Unit Sensing (looped back to GND (pin 6)
by the bin cradle harness)
2 NC -
3 NC -
4 EFS I Early full Sensing (ViL: 1.4V Max, ViH: 3.7V Min)
5 NC -
6 GND - Signal Ground
7 CBES I Capture Box Exists Sensing
(ViL: 1.4V Max, ViH: 3.7V Min)
8 +5V O +5V (LED drive, 100mA Max.)
7 5 3 1
8 6 4 2
PCB side
Card Bin
280389-2(AMP)
E) MEEI Power and Control connector: 55935-0210(MOLEX)

1 +24V Vcc I +24V Vcc
2 /MEEI I MEEI LED (“L”:ON / “Z”:OFF)
1 2 PCB side
D F) MEEI Upper MEEI and Lower MEEI: 53261-0571(MOLEX)

1 +12V Vcc O +12V Vcc
2 MEEIA I MEEI LED (ON/OFF)
3 MEEIB I MEEI LED (ON/OFF)
4 L-Back I MEEI Detection
5 SGN - Signal Ground
1 2 3 4 5 PCB side

11.2 Circuit of USB I/F and POWER
1) USB circuit
USB Interface Ver.2.0 compliant Full Speed(12Mbit/s)
ML60852A (OKI) V BUS

or equivalent voltage detect circuit
3.3V
V BUS
1.5k ohm 1
max 1 mA
D- 2
3
D+
4
ID
Shell
5
GND FG
*USB Controller switches “D+” pull up
USB Interface Voltage level

Name H L Condition
Voh:RL=15Kohm to GND
Output condition 2.8 V min 0.3 V max
Vol:RL=1.5Kohm to 3.6V
Input condition 2.0 V min 0.8 V max RL=1.5KΩ to 3.6V
Maximum length of cable : Max. 5 m
2) Power circuit
Power down detect circuit Timer 120sec TYP.

J2 Diode
+24V 1 Power
PGN 2
Diode
CPU
J11
CPU
1 Battery charge circuit
2
External battery
12. PCB Connector pin connections.

12.1 Main PCB
Connector No. Pin No. Signal name
J801(Host I/F) 1 VBUS(Power+5VDC)
UB-M5BR-DMP14-4S(JST) 2 D-(USB Data(-))
3 D+(USB Data(+))
4 ID(NC)
5 SGN(Signal ground)
J2(Main Power) 1 +24V(+24VDC)
44130-0018(Molex) 2 PGN(Power ground)
J4(Photo transistor) 1 SGN(Signal ground)

52610-0775(Molex) 2 PD3(Card sensing)
3 PD2(Card sensing)
4 PDI(Card sensing)
5 PD4(Card sensing)
6 PD1(Card sensing)
7 +5VVCC
J5(Card SENS.LED) 1 +12VVCC

52610-1075(Molex) 2 HFLT(LED half light)
3 LEDON(LED ON/OFF)
4 PHD-(Pri head -)
5 PHD+(Pri head +)
6 FG2(Frame ground)
8 HDS1(Head detect1)
J31(MEEI Power and 1 +24VVcc

Control) 2 /MEEI
55935-0210 (MOLEX)
CN4(Upper MEEI and 1 +12VVcc

D
Lower MEEI) 2 MEEIA
53261-0571(MOLEX) 3 MEEIB
4 L-Back
5 SGN

Connector No Pin No Signal name

J6(Read/Write Head) 1 FG(Frame ground)
52207-1485(Molex) 2 RTR3+(Read Tr3+)
3 WTR3+(Write Tr3+)
4 RTR3-(Read Tr3-)
5 WTR3-(Write Tr3-)
6 WTR2+
7 RTR2+
8 WTR2-
9 RTR2-
10 WTR1+
11 RTR1+
12 WTR1-
13 RTR1-
14 FG(Frame ground)
J7(Motor) 1 LED+(Motor revolution sensing)
B5B-EH (JST) 2 PTR(Motor revolution sensing)
3 GND
4 Motor+
5 Motor-
J11(Battery) 1 BAT+(Battery +)
22-05-1022(Molex) 2 BAT-(Battery -)
Connector No. Pin NO. Signal name

J101(Stage1 CON1) 1 FG
52207-1985(Molex) 2 GND
3 Reserve
4 Reserve
5 Reserve
6 Reserve
7 +24VVCC
8 Reserve
9 CIMDT(CIM detect)
10 MMDT(MM detect)
11 SMTXD(CIM / MM Transmit data)
12 SMRXD(CIM / MM Receive data)
13 +24VVCC
14 SMRST(CIM / MM Reset)
15 GND
16 Reserve
17 Reserve
18 Reserve
19 Reserve
J102(Stage1 CON2) 1
52207-0885(Molex) 2 Reserve
3
4
5 Reserve
6
7 Reserve
8 NC
J110(Card bin) 1 CUS(Capture unit sensing)
280389-2(AMP) 2 NC
3 NC
4 EFS(Early full sensing)
5 NC
6 GND
7 CBES(Capture box exist sensing)
8 +5VVCC

J301(Shutter SOL 1 +24VVCC
Card throat SW 2 Shutter SOL
S6B-EH(JST) 3 GND
4 PI1(Shutter motion sensor)
5 GND
6 SW1(Care throat SW)
CN1(TK2Readhead) 1 RTR2+
52207-0385(Molex) 2 RTR2-
3 FG(Frame ground)

J302(IC Contact block) 1 +5VVCC
52207-1985(Molex) 2 NC
3 SYSCLK(MC33560 synchronous clock IN)
4 GND
5 SHIO(MC33560 serial I/O)
6 RST(MC33560 Reset IN)
7 RDYMOD(MC33560RDYMOD IN)
8 MCINT(MC33560 MCINT OUT)
9 POWON(MC33560 POEWRON IN)
10 NC
11 FUSE(MC33560 C4 I/O)
12 PROG(MC33560 C8 I/O)
13 PDOUT(MC33560 CRDDET IN)
14 ICC(MC33560 CS IN)
15 NC
16 PI2(IC contact U/D sensing)
17 LED+(Contact U/D sensing LED)
18 +24VVCC
19 IC contact SOL
PCB out side connector PCB in side connector
J302
J11
J7
J2
J801
J301
J9
J4 J110
J5
CN4 CN1
J102 J101 J201(6pin) J6
J31
12.2.Stage1 PCB(CIM/MM)
Connector No. Pin Signal name

No.
CN51(12V Reg.) 1 Reg.IN(24V)
2 GND
3 Reg.Out(12V)

2 GND
3 Reg.Out(5V)
CN11(CIM/MM) 1 +5V
2 MMDT(MM detect)
3 Reset)
4 TXD(Transmit data)
5 RXD(Receive data)
6 GND
7 CIMDT(CIM detect)
8 GND
9 NC
10 NC
11 +5V
12 +5V
13 GND
14 GND
15 NC
16 NC
Stage1 PCB CIM/MM Only component connector layout
CN51 CN52
CN11
12.3. IC Block PCB

G No.
J3 1 ICSOL+(IC contact SOL)

2 ICSOL-(IC contact SOL)
G J2 1 +5V
2 ICE_DAT(M052ZBN IN)
3 SYNCLK (NCN8025 synchronous clock IN)
4 GND
5 IO(M052ZBN&NCN8025 serial I/O)
6 RST(M052ZBN Reset IN)
7 RDYMOD(M052ZBN RDYMOD I/O)
8 ICE_CLK(M052ZBN IN)
9 POWON(M052ZBN POEWRON IN)
10 FUSE(M052ZBN&NCN8025 C4 IN)
11 PROG(M052ZBN&NCN8025 C8 IN)
12 PDOUT(M052ZBN /RST IN)
13 ICC(M052ZBN ICS IN)
14 PIC(M052ZBN ICCEN IN)
13. Notes.
13.1 Note 1. Normal Conditions
Temperature : 20degrees C +/- 5degrees C
Humidity : 35% to 60% RH
Mounting : Horizontal
(Mounting plate on horizontal surface)
13.2 Note 2.
Details of specific evaluation method for each characteristic in this documents, and
details of quality assurance program are negotiated under separate agreement.
13.3 Note 3.
For location of the sensors, refer to the appearance drawing.
Drawing number: T00A315A01
13.4 Note 4. Care for handling the cards;

In case the cards are kept under the condition that ISO magnetic stripe on Low-Co
card and Japanese domestic JIS 2 magnetic stripe on the card (NU-MCRW / NEMO
does not support JIS 2 track read/write operation.) are laid so that those overlap each
other, there is a possibility of the demagnetization of the data on ISO stripe.
In case Low-Co card and High-Co card is kept with overlapping each other, there is a
possibility of the demagnetization of the data on Low-Co card.
13.5 Note 5.
The location of the card driving roller in NU-MCRW / NEMO and the area of IC chip are
overlapped.
The card driving mechanism gives pad roller pressure onto IC card chip.
The pad roller is located in the opposing side of the card-driving roller.
The IC cards must be endurable against the aforementioned pressure.
The pressure given onto the IC cards are as follows;
27.0mm typ.
IC chip
Emboss
IC card
φ20 Mag-stripe
Pad roller (polyacetal)

3.5mm typ.
19.6[N] typ.
13.6 Note 6. Manufacturers life test results. (Reference Section 6)

Note 6 is for information only.
In the following table;

The figures under "Specification" are those specified in Section 6 of this document.
The figures under "Test Pass" are those obtained by the manufacturer during testing
in a laboratory and are for information only.
The percentage figures under "Margin" represents the percentage figure between the
life figures specified in this document and the test results obtained by the
manufacturer and are an indication of the safety margins implemented by the vendor
in this specification.
Specification Margin Test Pass

Unit and Parts Comments Note
[passes] [%] [passes]
NU-MCRW /
2,000,000 50% 3,000,000
NEMO Unit
Magnetic Head 1,000,000 200%
Pre Head 1,000,000 200% Test stopped after 3,000,000
D.C. Motor 2,500,000 20% passes. No failures occurred.
Micro Switch 2,000,000 50%
Timing Belt 2,000,000 50%
Feed Roller 1,500,000 100%
Test stopped after 900,000
IC Contacts 600,000 50% 900,000 passes No failure occurred.
(soft landing)
100%
700,000 61% 1,125,000
Inter.
D.C. Motor 100% 500,000 64% 820,000 Estimated life calculated by
with ECD Max. remaining size of brushes.
40% Inter. 1,100,000 63% 1,790,000
40% Max 900,000 56% 1,400,000
CONFIDENTIAL No. ASR – NP – 19458 - 01 37 / 37
13.7 Note 7. Boot Program and Main PCB (Electric) Revision.
Main PCB Revision (Electric Revision)

Boot Revision 02516-
3Tr HiCo Track 2
03A 80 90
03A 81 -
C 03A 82 92
F 03B 82 92
G 03B 83 93
J 03B 84 94
13.8 Note 8. Boot Program Change Sheet.
DESCRIPTION OF CHANGE
REV DATE
PARAGRAPH
03A Newly issued
F 03B 20/July/’12 Change handling of the USB Drive IC
(memo); These items include also change of just Sankyo inside.

ＬＡＢＥＬＤＥＴＡＩＬ
ＵｐｐｅｒＭＥＩ (Option) ＭＯＤＥＬＬＡＢＥＬＤＥＴＡＩＬ

ＩＣＣｏｎｔａｃｔＢｌｏｃｋ
（ＩＳＯＯｎｌｙ）
ＴＹＰＥ
（ｆｏｒＥｘａｍｐｌｅ）
Ｐｒｏｄｕｃｔｉｏｎｃｏｕｎｔｒｙ
ＮＣＲＰＵＲＣＨＡＳＥＰＡＲＴＮｏ．

ＧｌｏｂａｌＳｕｐｐｌｉｅｒＣｏｄｅ．

Ｐ／Ｎ．ＬＡＢＥＬＤＥＴＡＩＬＮＣＲＰＡＲＴＮｏ．Ｔｈｅｍａｎｕｆａｃｔｕｒｅｄａｔｅ．
＃；ＲｅｖｉｓｉｏｎＢａｒｃｏｄｅ
＊１ＩＣＢｌｏｃｋＰａｒｔＬａｂｅｌ
００９-００２８９８２Ｂａｒｃｏｄｅ
Ｐ／ＮＳ４６Ａ９６１Ａ０１＃ＮＣＲＰＡＲＴＮｏ．
ＳＡＮＫＹＯＰＡＲＴＮｏ．ＲｏＨＳＣｏｍｐｌｉａｎｃｅ
ＹＥＡＲ ’０’ ｆｏｒｆｉｇｕｒｅａｄｊｕｓｔｍｅｎｔ．

＊２ＳｔｄＳｈｕｔｔｅｒＰａｒｔＬａｂｅｌ
ＭＯＮＴＨ
Ｂ００９－００３１３６７ＡＮＣＲＰＡＲＴＮｏ．Ｄｅｔａｉｌｓｏｆａｐｒｏｄｕｃｔ
Ｐ／ＮＳ３６Ａ６６３Ａ０２＃ＳＥＲＩＡＬＮＯ．
ＳＡＮＫＹＯＰＡＲＴＮｏ．
ＢＡＲＣＯＤＥＬＡＢＥＬＤＥＴＡＩＬ
＊３３ＴｋＴｒａｎｓｐｏｒｔｗｉｔｈＢａｓｅＰａｒｔＬａｂｅｌ
００９－００３１３６８ＡＮＣＲＰＡＲＴＮｏ．
Ｐ／ＮＳ３６Ａ６７０Ａ０３＃
＊４ＣＩＭ／ＭＭ（Ｓｔａｇｅ－１）ＰＣＢＰａｒｔＬａｂｅｌ＜Ｏｐｔｉｏｎ＞

００９－００２２３２８ＮＣＲＰＡＲＴＮｏ．
Ｐ／ＮＳＢＷ２４２９０１＃
ＳＢＰ５３１２０１＃ＳＡＮＫＹＯＰＡＲＴＮｏ．
ＭＭＳｅｎｓｏｒＢｒａｃｋｅｔ
＜Ｏｐｔｉｏｎ＞
ＢＡＲＣＯＤＥＬＡＢＥＬ＊５ＩＦＭＬａｂｅｌ
ＩＦＭＩＤ
＊６ Serial No. ＬａｂｅｌＲｏＨＳＣｏｍｐｌｉａｎｃｅ
ＰＤ３ＰＤ２Ｓ／ＮＲ－９１１００００１ＣａｒｄＤｅｔｅｃｔＳＷ

ＰＤ４ＰＤ１Ｒｅｖ．＊＊＊＊＊＊
ＲＥＶ NO．ＳＥＲＩＡＬＮＯ．

ＳｈｕｔｔｅｒＹＥＡＲＭＯＮＴＨＰａｓｔｉｎｇ＊２Ｐ／ＮＬａｂｅｌ
ＩＣＣｏｎｔａｃｔＣｅｎｔｏｒＣａｒｄＤｅｔｅｃｔＳＷ，ＰｒｅＨＤ
ＭＭＳｅｎｓｏｒＣｅｎｔｏｒ
ＣａｒｄＣｅｎｔｏｒＬｉｎｅ
ＰＤｉ
Ｐａｓｔｉｎｇ＊３Ｐ／ＮＬａｂｅｌ
ＢａｔｔｅｒｙＣｏｎｎｅｃｔｏｒ
Ｍｏｌｅｘ：２２－０５－１０２２
Ｐ／ＮＰ／Ｎ
ＰｏｗｅｒＣｏｎｎｅｃｔｏｒ
Ｍｏｌｅｘ：４４１３０－００１８
Ｉ／ＦＣｏｎｎｅｃｔｏｒ
ＣｖｉＬｕｘ；ＣＵ０４ＳＣＭ１５Ｂ０
ｏｒｅｑｕｉｖａｌｅｎｔ
ＣａｒｄＢｉｎＣｏｎｎｅｃｔｏｒ

ＡＭＰ：２８０３８９－２
Ｓ／Ｎ
Ｃ
ＭＥＩＰｏｗｅｒＣｏｎｎｅｃｔｏｒ MEI Cable

Ｍｏｌｅｘ：５５９３５－０２１０
Ｒ／ＷＨＥＡＤ
ＭＯＤＥＬＬＡＢＥＬＬｏｗｅｒＭＥＩ (Option)
Ｐ／Ｎ
Ｐａｓｔｉｎｇ＊１Ｐ／ＮＬａｂｅｌＩＣＣｏｎｔａｃｔＢｌｏｃｋ（ＩＳＯ）

Ｐａｓｔｉｎｇ＊５ＩＦＭＬａｂｅｌ
ＳＴＡＧＥ１ＰＣＢ
＜Ｏｐｔｉｏｎ＞ＰｒｅＨｅａｄＦＰＣ
Ｐａｓｔｉｎｇ＊６ Serial No． Label
Ｐａｓｔｉｎｇ＊４Ｐ／ＮＬａｂｅｌ

ＶＩＥＷＢ
ＶＩＥＷＣ
ＵｐｐｅｒＭＥＩ (Option)

ＭＯＤＥＬＬＡＢＥＬＤＥＴＡＩＬ
ＩＣＣｏｎｔａｃｔＢｌｏｃｋ
ＴＡＰＥ

ＧｌｏｂａｌＳｕｐｐｌｉｅｒＣｏｄｅ．

ＮＣＲＰＡＲＴＮｏ．Ｔｈｅｍａｎｕｆａｃｔｕｒｅｄａｔｅ．
Ｐ／Ｎ．ＬＡＢＥＬＤＥＴＡＩＬＢａｒｃｏｄｅ
＃；Ｒｅｖｉｓｉｏｎ
＊１ＩＣＢｌｏｃｋＰａｒｔＬａｂｅｌＢａｒｃｏｄｅ
００９-００２８９８２
ＲｏＨＳＣｏｍｐｌｉａｎｃｅ
ＹＥＡＲ ’０’ ｆｏｒｆｉｇｕｒｅａｄｊｕｓｔｍｅｎｔ．
ＭＯＮＴＨ
＊２ＳｔｄＳｈｕｔｔｅｒＰａｒｔＬａｂｅｌＤｅｔａｉｌｓｏｆａｐｒｏｄｕｃｔ
ＢＮＣＲＰＡＲＴＮｏ．ＳＥＲＩＡＬＮＯ．
００９－００３１３６７Ａ
Ｐ／ＮＳ３６Ａ６６３Ａ０２＃
ＢＡＲＣＯＤＥＬＡＢＥＬＤＥＴＡＩＬ
＊３Ｔｋ２ＴｒａｎｓｐｏｒｔｗｉｔｈＢａｓｅＰａｒｔＬａｂｅｌ
００９－００３１３６９ＡＮＣＲＰＡＲＴＮｏ．
Ｐ／ＮＳ３７Ａ０１７Ａ０３＃

Ｐ／ＮＳＢＷ２４２９０１＃
ＳＢＰ５３１２０１＃ＳＡＮＫＹＯＰＡＲＴＮｏ．
ＭＭＳｅｎｓｏｒＢｒａｃｋｅｔ
ＢＡＲＣＯＤＥＬＡＢＥＬ＊５ＩＦＭＬａｂｅｌ
ＩＦＭＩＤ
＊６ Serial No. ＬａｂｅｌＲｏＨＳＣｏｍｐｌｉａｎｃｅ
ＰＤ３ＰＤ２Ｓ／ＮＲ－９１１００００１ＣａｒｄＤｅｔｅｃｔＳＷ

ＰＤ４ＰＤ１Ｒｅｖ．＊＊＊＊＊＊
ＲＥＶ NO．ＳＥＲＩＡＬＮＯ．

ＳｈｕｔｔｅｒＹＥＡＲＭＯＮＴＨＰａｓｔｉｎｇ＊２Ｐ／ＮＬａｂｅｌ
ＩＣＣｏｎｔａｃｔＣｅｎｔｏｒＣａｒｄＤｅｔｅｃｔＳＷ，ＰｒｅＨＤ
ＭＭＳｅｎｓｏｒＣｅｎｔｏｒ
ＣａｒｄＣｅｎｔｏｒＬｉｎｅ
ＰＤｉ
Ｍｏｌｅｘ：２２－０５－１０２２
Ｐ／ＮＰ／Ｎ
Ｍｏｌｅｘ：４４１３０－００１８

ＡＭＰ：２８０３８９－２
Ｓ／Ｎ
Ｃ
ＭＥＩＰｏｗｅｒＣｏｎｎｅｃｔｏｒ MEI Cable

Ｍｏｌｅｘ：５５９３５－０２１０
Ｒ／ＷＨＥＡＤ
ＭＯＤＥＬＬＡＢＥＬＬｏｗｅｒＭＥＩ (Option)
Ｐ／Ｎ
Ｐａｓｔｉｎｇ＊１Ｐ／ＮＬａｂｅｌＩＣＣｏｎｔａｃｔＢｌｏｃｋ（ＩＳＯ）

ＳＴＡＧＥ１ＰＣＢ
＜Ｏｐｔｉｏｎ＞ＰｒｅＨｅａｄＦＰＣ
Ｐａｓｔｉｎｇ＊４Ｐ／ＮＬａｂｅｌ

ＶＩＥＷＢ
ＶＩＥＷＣ
SPECIFICATION
Type Name :
ICT1Q8-1R0348 ICT3Q8-3A2348
Spec. No. ASR-NP-29052-01
Notes :
NSGH 1
No. of sheet
E Change the Customer P/N 6

Distribution
Y.Fujimori
D Standardzation 6 EB-21849-01 Jul.14. 2016 Y.Fujimori H.Takeda
C Return MEEI, Protrusion length all EB-21077-01 Dec. 4. 2015 F. Akahane H.Takeda
B Writing Error P14 EB-21040-01 Nov.19.2015 H.Kuwaki H.Takeda
Reference Document
Design F.Akasu Oct.26.2015
Custody
Design H.Kuwaki Nov.17.2015
Det-che T.Watanabe Nov.18.2015

Type Name Appro. H.Takeda Nov.18.2015
No. S39Z-032-00-02F
CONFIDENTIAL No. ASR – NP – 29052 - 01 /38
1
Contents
1. Product. 5
2. Model. 6
3. Function. 6
3. Function. 7
3.1 Basic Function 7
3.1.1 Card Feed 7
3.1.2 Mag.-stripe Read/Write 7
3.1.3 Interface (Between the HOST and the NEMO(MFR) 8
3.1.4 Pre-head detect 8
3.1.5 Shutter gate 8
3.1.6 Enhanced Card Drive (ECD) 9
9
3.1.8 IC card Read/Write 11
3.1.9 Latch Fast Card Capture Bin 12
3.1.10 Magnetic Stripe Read using Digital Decoding 12
3.1.11 Media Entry and Exit Indicator (MEEI) 12
3.2 Stage-1 Function 13
3.2.1 CIM / MM 13
4. Characteristic 14
4.1 Appearance 14
4.2 Circuit 14
4.3 Mass 14
4.4 Power requirement 14
4.4.1 Main Power 14
4.4.2 MEEI Power 15
4.5 Card feed speed 15
4.6 Card feed time 15
4.7 Card eject length (ISO standard card used) 15
4.8 Dielectric strength 15
4.9 Insulation resistance 15
4.10 Mechanical noise 15
4.11 Thin card transport 15
5. Usable card 16
5.1 Magnetic card 16
5.2 IC card 16
5.3 Cleaning card 16
6. Environmental condition 17
CONFIDENTIAL No. ASR – NP – 29052 - 01
2
6.1 Normal Operating temperature / humidity 17

6.2 Card Entry Mechanism Operating temperature / humidity 17
6.3 Extreme Power-ON Range temperature / humidity 17
6.4 Storage temperature / humidity range 18
6.5 Transit Temperature/Humidity Range. 18
6.6 Barometric Pressure Range. 18
6.7 Vibration durability 18
6.8 Shock durability 18
6.9 Electro Magnetic Compatibility(EMC) 19
6.9.1 Emission 19
6.9.2 Immunity 19
7. Life 20
7.1 NEMO(MFR) Unit 20
7.2 Card 20
8. Reliability 21
8.1 Mag-stripe read / write Error Rate 21
8.2 IC contact connection Error Rate 21
8.3 MTBF 21
8.4 ISO magnetic stripe cards 21
9. Power down mode(Assembled Main PCB) 22
9.1 Definition of power down(Card Return) 22
9.2 Operation (Battery Backup) 22
9.3 Backup power supply 22
10. Warped card. 23
11. Physical level 24
11.1 Explanation for signal and PIN assignments 24
11.2 Circuit of USB I/F and POWER 27
12. PCB Connector pin connections. 28
12.1 Main PCB 28
12.2.Stage1 PCB(CIM/MM) 33
12.3. IC Block PCB 34
13. Notes. 35
13.1 Note 1. Normal Conditions 35
13.2 Note 2. 35
13.3 Note 3. 35
13.4 Note 4. Care for handling the cards; 35
13.5 Note 5. 36
13.6 Note 6. Manufacturers life test results. (Reference Section 6) 37
13.7 Note 7. Boot Program and Main PCB (Electric) Revision. 38
3
13.8 Note 8. Boot Program Change Sheet. 38
Note: Changes/corrections in this specification are referenced to the revision

list on the front sheet of this specification by the revision letter that appears in
the triangle next to the changed /corrected text, when they occur in the
document.
4
CHANGE SHEET
REV. DATE APPROVAL
PAGE PARAGRAPH
B Nov.19.2015 14 Writing Error H.Takeda
5, 6, 12, 15, 26, 28, 32 Added MEEI explanation
C Nov. 27. 2015 F. Akahane
15 Correction: Eject Length
D Jun. 23. 2016 6 Standardization Y.Fujimori
E May.19.2017 6 Change the Customer P/N Y.Fujimori
5
1. Product.
IC card and Magnetic Card Reader /Writer.
(Hereafter refers as NEMO(MFR). Customer’s main system as HOST)
NEMO(MFR) is of a modular construction.
USB interface.
The software interface is held Flash PROM (F-ROM) and downloadable from the
HOST. (max 100000 times).
The NEMO(MFR) has following functions for option.
▪ Connect and control CIM/MM optical sensor
▪ Attach a BIN and detect card-full condition
▪ Charge and discharge power to battery for backup
▪ Connect and control MEEI
▪ Connect and control Hedgehog (Anti Fishing) unit

6
2. Model.
Customer P/N Head Assy.

Mag-stripe
Sankyo P/N IC Resistors Note
JP1 JP2 JP3
Tk1 Tk2 Tk3 Hi-Co
E D 445-0764438A ICT3Q8-3A2348 R/W R/W R/W C C ○ ○ - +Short Exit
445-0764439A ICT1Q8-1R0348
E D N/A R N/A N/A C - - +Short Exit
○
E D 009-0031368A
3Tk Transport with
S36A670A03 R/W R/W R/W C N/A ○ ○ - Bas e
E D 009-0031369A
Tk2 Transport with
S37A017A03 N/A R N/A N/A N/A - - ○ Bas e
E D 009-0031370A S55A566A02 - - - - - - - - Short Exit
009-0028982
IC Block
S46A961A01 - - - - - - - - (W ithout SAM )
009-0022328
Stag e 1 Function.
SBW242901 - - - - - - - - PCB (CIM/ MM only)
D 998-0912563 S55A553A02 - - - - - - - - New Pr e-HD
009-0031366A S46A569D01
R/W R/W R/W C N/A - - - Main PCB (3TK)
E D S58A297A01
009-0031365A S46A569D02
D S58A297A02 N/A R N/A N/A N/A - - - Main PCB (TK2)
E
009-0028186 (New) MEEI
S45A719A01 - - - - - - - -
C (Option) Only Upper LED

This picture is showing the head assembly.

C
7
3. Function.
3.1 Basic Function
3.1.1 Card Feed
Round trip and capture
3.1.2 Mag.-stripe Read/Write

(See 2.Model)
▪ Encoding method : FM (F2F)
▪ Encoding density : Tk1; 210BPI
: Tk2; 75BPI
: TK3; 210BPI
▪ Magnetic head : read core width; 1.2mm
: write core width; 3.1mm
: material ; Sendust
▪ Cross talk level : hi-co; 30dB (write and read)
▪ Long term average time interval deviation *1
:
+/-2%(636.6µsec. Nominal)
▪ Long term average time interval jitter *2
: +/-15%
▪ Skew : 0deg +/-20'
*1*2
Jitter test condition
Write and read jitter on the track3 shall be measured by using the same card reader
and the standard card specified by magnetic card specification.
▪ Number of first omits bit : 20bits

▪ Number of data bit : 640bits
▪ Data format : "111111.........."
▪ Long term average time interval
deviation: LTAD
: LTAD = (Aavg. - 636.6µs) / 636.6µs X100%
▪ Long term average time interval jitter: LTAJ
: LTAJ max. = (Aimax. - Aavg.) / Aavg. X100%
: LTAJ min. = (Aimin. - Aavg.) / Aavg. X100%
▪ Average time interval Aavg.
i =674
Aavg.= ∑ Ai/ 665 µs
i =10
8
3.1.3 Interface (Between the HOST and the NEMO(MFR)

USB interface compatible.
Interface connector(mini-B Receptacle):UB-M5BR-DMP14-4S(LF)(SN) (JST) or
equivalent.
Please refer the Programmers Manual (ASL-NP-03133-01).
3.1.4 Pre-head detect

ISO Track 2 and ISO Track 3
Magnetic head : read core width; 0.8mm
: material; Sendust
3.1.5 Shutter gate
1 piece, Normal closed
9
3.1.6 Enhanced Card Drive (ECD)

NEMO(MFR) has three card entry and card eject modes because of the motor on/off
sequencing. One is standard entry/eject, one is "Intermediate ECD" and the other is
"maximum ECD".
Normal card entry/eject, or either ECD mode is selected by software.
1) Motor life on ECD mode

1-1) ECD permanently enabled
a. Intermediate ECD : 700,000 passes
1-2) ECD enabled for maximum of 40% of entry

a. Intermediate ECD : 1,100,000 passes
2) The performance of card take-in.

The first roller can not take the card into NEMO(MFR) without a hand push power in
maximum ECD.
1) Card Return Operation On Power Fail (CROPF) :
Timer 120sec Typical

SET(Timer Set) to BATON
Power Down Reset(Timer Reset)
BATOFF (from CPU)
NOTE: A 15ms debounce filter in software is performed before PowerFail is registered.

NOTE: CPU (Library) can control the BATOFF signal. If the BATOFF goes off, NEMO(MFR)
dies when VCC is off.
This API is “Manage_Battery()”. This API should call after APIl IMCRW_DoCROSE() or API:
Clear_ucSetCrose().
10
2) Card Return On Disconnect Circuit diagram of Hardware:
Detect Falling Edge

V-BUS
of USB CROD(V_BUS_Trigger=1)
2ms
3) USB CROSE0(Long SE0) Mechanism
USB Interrupt
IRQ3
+D OKI CPU
60852A (H8/3048B) ( SE0 )

Mini 40ms
-D BUS Reset
Normal
Bus Reset Assert
CROSE0 (LongSE0_Trigger=1)
4) USB Card Return On Retiral Mechanism
CROR(EnumSeqFail_Trigger = 1)
If A Bus-Reset-Assert happens during Normal Operation, Enumeration should

begin again by Host. NEMO(MFR) has a management function of this
Enumeration.
If Five times of BusResets happen during this Enumeration , or If this
Enumeration doesn't complete in ten-seconds, NEMO(MFR) ought to make Force
Enumeration by PPON=OFF-and-ON(500ms).
This is the First Fail.
The Host should start Re-Enumeration again after PPON=OFF-and-ON. However
if this Re-Enumiration fails again, then NEMO(MFR) give up Enumeration. This is
the Second Fail. And this is called "CROR".
11
3.1.8 IC card Read/Write

IC contact location : Just ISO/IEC 7816-2
Communication circuit : Exists on the ICB
Vcc : DC+5V +0.3V/- 0.4V (Max 70mA)
: DC+3V +/- 0.15V (Max 70mA)
(selected by Command)
Vpp : Open
CLK : 3.58MHz (basis)
: 7.16MHz (automatically selected firmware)
I/O communication speed : Please refer the Programmers Manual
(ASL-NP-03133-01)
Memory Cards : GPM896, Siemens4442
Contact Pin assign
Pin No. Mean
1 C1 VCC
2 C2 RST
3 C3 CLK
4 C4 MEM CRD or USB
5 C5 GND
6 C6 VPP
7 C7 I/O
8 C8 MEM CRD or USB
Pin 4and8,C4andC8 USB is not supported.
12
3.1.9 Latch Fast Card Capture Bin

The NEMO(MFR) has one connector for tamper indicating cassettes.
The NEMO(MFR) is able to monitor that Users LFCC Bin is present or warning
information if LFCC bin is full and when bin is removed.
See section 11.1.D for Card Bin Connector details.
3.1.10 Magnetic Stripe Read using Digital Decoding

If the NEMO(MFR) fails to read the magnetic stripe during the first read attempt and
subsequent retries there is an option to read and store the data using an analogue to digital
converter which then can be analysed by the NEMO(MFR) processor. This technique takes
longer but allows a flexibility of waveform analysis, which just cannot be achieved using
standard amplifiers and filters.
It is important that the read verification after a write command does not use the digital decode
read option as this could mask possible card or NEMO(MFR) problems. If the standard read
after write fails to read and verify the data on the card then a faulty/damaged card or a faulty
NEMO(MFR) is indicated, allowing appropriate opportunities for error recovery.
However, NEMO(MFR)has added new Decode IC to PCB as ASIC which has almost
the same performance as this Digital Decode.
C 3.1.11 Media Entry and Exit Indicator (MEEI)

Upper portion is by an LED board with even light, evenly spaced along the width of the
lower throat.
The upper portion of the throat is illuminated by the ATM control.
Also, NU-MCRW / NEMO has the capability to power and control the MEEI if required.
NU-MCRW / NEMO regulates the supply voltage from ATM 24V to 12V for MEEI.

LED PCB
USB-IMCRW
CN4
ATM J31
(53261-0571 Molex) Male (51021-0500 Molex)
55935-0210 (MOLEX)
13
3.2 Stage-1 Function

The NEMO(MFR) supports CIM/MM and Hedgehog (as one of Anti Fishing) by having an
interface board mounted underneath the main NEMO(MFR) body and above the
NEMO(MFR) base plate. The board provides all the interface hardware required between
the CIM/MM and the NEMO(MFR). The +/- 12 v power required for MM support is not
supplied by the reader / writer.
3.2.1 CIM / MM
The NEMO(MFR) provides the facility to fit the CIM/MM optical read head. The
interface from the optical head is connected to the stage1 function board via an RS232
(CMOS+5V) port. MM/CIM Pin assignment (AMP 281281-1 or equiv.)
1Pin
16Pin 2Pin
Pin No. Signal name Pin No. Signal name

1 +5V 9 Open
2 MM sensing 10 Open
3 Reset 11 +5V
4 TXD(to CIM/MM) 12 +5V
5 RXD(from CIM/MM) 13 GND
6 GND 14 GND
7 CIM sensing 15 Open
8 GND 16 Open
TXD, RXD(RS232) +5V +/-5% current 1.0A max(max duty 20%)
Content of Stage1 CIM/MM Assembly

1) Stage-1 PCB (CIM/MM only) assembly
*One Stage-1 PCB
*One Stage-1 PCB bracket
*One Captive Pan Head M3 x 8 (Securing Stage1 PCB bracket)
*One Pan Head M2.5 x 4(Securing between Stage1 PCB bracket and Stage1 PCB)
2) Two Regulator assembly
3) Two Plastic Support Slides
4) Two Captive Pan Head M3 x 6 (Securing 2 Regulators)
5) One Captive Pan Head M3 x 5 (Securing NCR CIM/MM Bracket)
14
4. Characteristic
4.1 Appearance
Appearance drawing No.:
T14A621A01 ; ICT1Q8-1R0348 ;Tk2
T14A530A01 ; ICT3Q8-3A2348 ;3Tk (Hi-Co)
4.2 Circuit
Circuit diagram:
B X00A678D01 ; Main PCB(3Tk HiCo, Tk2)
YEC5301 ; Stage1 PCB CIM/MM
X00A687A01 ; ICC PCB
* Information of MEEI has been moved to its Document.
YEC5359 ; Stage1 PCB CIM/MM security
4.3 Mass
Approximately : 1.8 kg ; with IC Block
4.4 Power requirement

4.4.1 Main Power
Voltage : +24V +/-10%
Power consumption
1) Without solenoid current(Base model)
Peak current : Less than 2.4 A Less than 50mS
: Less than 4.9 A Less then 50uS(See Fig P)
Waiting : Less than 0.2 A(With out Battery)
2) Solenoid current
Shutter solenoid : Max 0.8 A increased when Shutter is opened.
Contact solenoid : Max 1.0 A increased when IC contact is loaded.
(Power supply for logic circuit is generated within NEMO(MFR) using+24V supply)
W=max50uS
P=max4.9A
1/2P
Fig P
15
4.4.2 MEEI Power

C
Voltage : +24V +/-10%
Power consumption
Turn on the MEEI LED’s : Less than 70mA
: Average 40mA

4.5 Card feed speed

At mag-stripe Read / Write : 190mm/S +/- 3%
At card transport only : 380mm/S(typ.)
4.6 Card feed time

Approx. 1.5 S (forward and backward)
4.7 Card eject length (ISO standard card used)

More than 33.1mm (except warped card and operation of a ECD)
C
NOTE: We have two modes for protrusion.
i.e. Normal Protrusion mode and Long Protrusion mode.
As Normal Protrusion mode, Protrusion length is 33.1mm typically.
As Long Protrusion mode, Protrusion length is 36.1mm typically.
More than 28.1mm (with operation of a Maximum-ECD)
More than 29.1mm (with operation of a Standard-ECD)
4.8 Dielectric strength

DC 200V, 1 min
4.9 Insulation resistance

More than 10 Mohm at DC 200V
4.10 Mechanical noise

Less than 70dBA
(Measured at distance of 150mm above any external surface except solenoid
mechanism)
4.11 Thin card transport

0.22mm thick card can be ejected or captured.
Note : Drive mechanism of NEMO(MFR) does not guarantee to transport 0.178mm
cards as defined in ISO/IEC 15457 part 1.
16
5. Usable card
5.1 Magnetic card
ISO7810, 7811 parts 1,2,6 and 8
NOTE: NEMO(MFR) can update for new transparent card handling (next ISO7810) by software.
5.2 IC card
1) EMV Integrated Circuit Card Specification for Payment System
Version 3.1.1
Version 4.0
Version 4.1
Version 4.2
2) ZKA3.0 (in collaboration with the NCR SST/ATM)
3) GIECB’98 Specification D’ interface Des Cartes A Microcircuit et Terminaux CB.
4) Latest version of ISO 7816 part 3 and the standard ISO 7816 part4.
5) Memory Cards(GPM896,Siemens4442)
6) The ability to relax the constraints (eg. Timing, valid ATR’,etc) to allow support of
Non-Compliant Customer Cards.
5.3 Cleaning card

Specification #68-76-02-51-4 (Standard type) or #68-76-02-51-8 (With mag-stripe
type. DWG.No.EGCMC01881)
17
6. Environmental condition
6.1 Normal Operating temperature / humidity
The whole NEMO(MFR), card entry mechanism plus the rest of reader/writer will meet
all hardware/software requirements as defined within this specification over the
following temperature/humidity ranges, except for warped card handling capability in
the temperature range 0 to 5 degrees C.
Temperature range : 0 degrees C to 50 degrees C

Temperature change : 10 degrees C maximum during period of 60
minutes.
Relative humidity range : 20% to 80%
6.2 Card Entry Mechanism Operating temperature / humidity

Note: 6.2 only applies to the card entry mechanism.
The card entry mechanism will operate in the following temperature and humidity
(non-condensing) environment:
Temperature range : -35 degrees C to 50 degrees C

Temperature change : 10 degrees C maximum during period of
60 minutes.
Relative humidity range : 0% to 95% except for the temperature range of
-35 degrees C to ~ + 10 degrees C where humidity
is not specified.
6.3 Extreme Power-ON Range temperature / humidity

The NEMO(MFR) will meet all hardware/software requirements as defined within this
specification over the temperature/humidity ranges as specified in 6.1 after being
subjected to and being allowed to return from the following extreme Power-On
Temperature/Humidity Ranges.
Temperature Range : 0 degrees C to 60 degrees C
Temperature Change : 10 degrees C in 60 minutes
Relative Humidity : 10% to 95% except for the temperature range of 0
degrees C to ~ + 10 degrees C where humidity is
not specified.
The extreme power-on range does not represent an operating range but a range in
which there should be no unrecoverable damage to the NEMO(MFR).
These limits which are likely if the heating or air conditioning plant fails and have not
yet brought the room to operating conditions.
18
6.4 Storage temperature / humidity range

subjected to the following Storage Temperature/Humidity Ranges.

Relative Humidity : 10% to 90%
Period : 3 months
6.5 Transit Temperature/Humidity Range.

subjected to the following Transit Temperature/Humidity Ranges.

Relative Humidity : 5% to 95% except for the temperature range of -
40 degrees C to ~ + 10 degrees C where humidity is
not specified.
Period : 1 week
6.6 Barometric Pressure Range.

subjected to the following Barometric Pressure Ranges.
Operating and Transit : 105 x 10 3 to 70 x 10 3 Pa
6.7 Vibration durability

Range of frequency : 5 ~ 50Hz
Acceleration : 2 m/s 2 (0.2G)
Sweep method : Logarithmic sweeps 2min/1 octave
X.Y.Z. each direction 30 minutes.
No functional error is found after vibration test.
6.8 Shock durability

294 m/s 2 (30G), 11 ms
X, Y, Z each direction one time.
No functional error is found after shock durability test.
(Direct shock to FCRWM, without packaging)
19
6.9 Electro Magnetic Compatibility(EMC)
6.9.1 Emission
Radiated and Conducted emission : EN 55022(2006, A1:2007) Class B
: FCC 47 CFR Part15B Class B
6.9.2 Immunity
: EN 55024(1998+A1:2001, A2:2003)
Electrostatic Discharge immunity : EN/IEC 61000-4-2

Contact discharge : +/- 5kV min
Discharge Point : Vertical Ground Plane , Horizontal Ground Plane ,
Front Frame, Front Ring
Air discharge : +/-14kV min
Discharge Point : Pre Head (Card throat)
No degradation or loss of function.
Radio-frequency electromagnetic field immunity : EN/IEC61000-4-3

3V/m, and 6V/m
80% am (1KHz) 80MHz-1GHz
Electrical Fast transient/burst immunity : EN/IEC61000-4-4

DC cable :+/-0.5kV(5kHz) and
+/-1.1kV(5kHz) (Retry)
USB cable :+/-0.5 and 1.1kV(5kHz)
Immunity to conducted disturbances,

inducted by radiofrequency fields: EN/IEC61000-4-6
DC/USB cable: 3V and 6V
0.15-80MHz, 80% am (1KHz)
Power frequency magnetic field immunity : EN/IEC61000-4-8

50Hz, 60Hz 1A/m and 3A/m
20
7. Life
Refer to 13.7 Note 7. for derivation of life figures.
7.1 NEMO(MFR) Unit

2,000,000 card passes (indoor usage)
Condition : One time card pass is one forward and backward.
The ratio of IC contacts set and card pass are less
than 6/10.
1,000 passes/card maximum.
7.2 Card
Magnetic card 1,000 passes/card. (indoor usage)
Smart card 3,000 passes/card. (indoor usage)
21
8. Reliability
8.1 Mag-stripe read / write Error Rate
Condition : at indoor normal condition,
Card: SANACARD-T5 flat.
Card feed: 1 cycle / 10 seconds
1 cycle: one Mag-Track Write Command and one
Mag-Track Read Command function.
8.2 IC contact connection Error Rate

Condition : 1 time = 1 try + 2 retries
1 try: To carry the card to IC contacts position and
set IC contact.
8.3 MTBF
More than 220,000 hours (Circuit parts only)
8.4 ISO magnetic stripe cards

Refer to Programmers Manual: ASL-NP-03133-01
22
9. Power down mode(Assembled Main PCB)
CROPF circuitry is integrated in to the main PCB with a Battery attached.
This Main function is to eject a card to the customer if VCC-power-down condition happens.
But if a customer doesn't remove this card, NEMO(MFR) captures it to rear after 30
seconds.
After that, NEMO(MFR) disconnects Battery from itself by calling API:ManageBattery if
VCC is still OFF condition.
Note: Refer to “3.1.8 1) Card Return Operation On Power Fail (CROPF)”.
9.1 Definition of power down(Card Return)

Supply voltage : 20V DC or less
Duration time : over 15 msec.
9.2 Operation (Battery Backup)

Refer to Programmers Manual (ASL-NP-03133-01) Flow/Block Signals Diagram of
CROSE/CROPF.
9.3 Backup power supply
1) Battery : Min 0.5AH Nickel Metal Hydride cell x 18

Or Nickel Cadmium cell x 18
Charging current 30mA typ.(15~45mA)
23
10. Warped card.
This term refer to an evenly warped card having (from the top of the convex surface to
the base of the warped edge)
All environments: Temperature, Humidity

a) "H" </= 2.5 mm for able to Mag-stripe R/W.
b) "H" </= 2.0 mm for able to IC R/W.
c) "H" </= 4.0 mm for to card jamming H
(Include card eject in case of power down)
Normal Conditions: 20 degree C +/- 5 degree, 35% ~ 60%

d) "H" </= 3.0 mm for able to Mag-stripe R/W.
e) "H" </= 2.0 mm for able to IC R/W.
f) "H" </= 6.0 mm for to card jamming
24
11. Physical level
11.1 Explanation for signal and PIN assignments
a) USB Interface connector mini-B: UB-M5BR-DMP14-4S(LF)(SN)(JST)or
equivalent
1 VBUS - ----
2 D- I/O USB Data(-)
Twisted signaling pair
3 D+ I/O USB Data(+)
4 ID - NC
5 SGN - Signal Ground(0V)
The shell portion of connector is connected to the frame of NEMO(MFR).
b) Power connector: 44130-0018(MOLEX)

1 +24V I +24V DC (main power supply)
2 PGN - Power Ground (0V)
SGN and PGN are connected inside NEMO(MFR).
#1 #5
#1 #2
#1
USB I/F; mini-B Type

UB-M5BR-DMP14-4S(LF)(SN) (JST) Battery Power
22-05-1022(Molex) 44130-0018 (Molex)
c) Battery connector: 22-05-1022(MOLEX)

1 BAT+ - Battery +
2 BAT- - Battery -
25
d) Card bin connector: 280389-2(AMP)

1 CUS I Capture Unit Sensing (looped back to GND (pin 6)
by the bin cradle harness)
2 NC -
3 NC -
4 EFS I Early full Sensing (ViL: 1.4V Max, ViH: 3.7V Min)
5 NC -
6 GND - Signal Ground
7 CBES I Capture Box Exists Sensing
(ViL: 1.4V Max, ViH: 3.7V Min)
8 +5V O +5V (LED drive, 100mA Max.)
7 5 3 1
8 6 4 2
PCB side
Card Bin
280389-2(AMP)
e) Connector from shutter and width switches
White
GND 2 2 GND
Black
24V 1 1 24V
White
Card Reader 4 GND
3 Spare
White
Red
Shutter 1 2 Shutter
Black
Width 1 1 Width
26
f) MEEI Power and Control connector: 55935-0210(MOLEX)

C
1 +24V Vcc I +24V Vcc
2 /MEEI I MEEI LED (“L”:ON / “Z”:OFF)
1 2 PCB side
C g) MEEI: 53261-0571(MOLEX)
1 +12V Vcc O +12V Vcc
2 MEEIA I MEEI LED (ON/OFF)
3 MEEIB I MEEI LED (ON/OFF)
4 L-Back I MEEI Detection
5 SGN - Signal Ground
1 2 3 4 5 PCB side

27
11.2 Circuit of USB I/F and POWER
1) USB circuit
USB Interface Ver.2.0 compliant Full Speed(12Mbit/s)
ML60852A (OKI) V BUS

or equivalent voltage detect circuit
3.3V
V BUS
1.5k ohm 1
max 1 mA
D- 2
3
D+
4
ID
Shell
5
GND FG
*USB Controller switches “D+” pull up
USB Interface Voltage level

Name H L Condition
Voh:RL=15Kohm to GND
Output condition 2.8 V min 0.3 V max
Vol:RL=1.5Kohm to 3.6V
Input condition 2.0 V min 0.8 V max RL=1.5KΩ to 3.6V
Maximum length of cable : Max. 5 m
2) Power circuit
Power down detect circuit Timer 120sec TYP.

J2 Diode
+24V 1 Power
PGN 2
Diode
CPU
J11
1 CPU
Battery charge circuit
2
External battery
28
12. PCB Connector pin connections.
12.1 Main PCB
J801(Host I/F) 1 VBUS(+5VDC)
UB-M5BR-DMP14-4S(JST) 2 D-(USB Data(-))
3 D+(USB Data(+))
4 ID(NC)
J2(Main Power) 1 +24V(+24VDC)
44130-0018(Molex) 2 PGN(Power ground)
J4(Photo transistor) 1 SGN(Signal ground)

52610-0775(Molex) 2 PD3(Card sensing)
3 PD2(Card sensing)
4 PDI(Card sensing)
5 PD4(Card sensing)
6 PD1(Card sensing)
7 +5VVCC
J5(Card SENS.LED) 1 +12VVCC

52610-1075(Molex) 2 HFLT(LED half light)
3 LEDON(LED ON/OFF)
4 PHD-(Pri head -)
5 PHD+(Pri head +)
6 FG2(Frame ground)
J31(MEEI Power and 1 +24VVcc

C Control) 2 /MEEI
55935-0210 (MOLEX)
CN4(Upper MEEI ) 1 +12VVcc

C
53261-0571(MOLEX) 2
MEEIA
3
MEEIB
4
5 L-Back
SGN

29
Connector No Pin No Signal name

J6(Read/Write Head) 1 FG(Frame ground)
52207-1485(Molex) 2 RTR3+(Read Tr3+)
3 WTR3+(Write Tr3+)
4 RTR3-(Read Tr3-)
5 WTR3-(Write Tr3-)
6 WTR2+
7 RTR2+
8 WTR2-
9 RTR2-
10 WTR1+
11 RTR1+
12 WTR1-
13 RTR1-
14 FG(Frame ground)
J7(Motor) 1 LED+(Motor revolution sensing)
B5B-EH (JST) 2 PTR(Motor revolution sensing)
3 GND
4 Motor+
5 Motor-
J11(Battery) 1 BAT+(Battery +)
22-05-1022(Molex) 2 BAT-(Battery -)
30
Connector No. Pin NO. Signal name

J101(Stage1 CON1) 1 FG
52207-1985(Molex) 2 GND
3 Reserve
4 Reserve
5 Reserve
6 Reserve
7 +24VVCC
8 Reserve
9 CIMDT(CIM detect)
10 MMDT(MM detect)
11 SMTXD(CIM / MM Transmit data)
12 SMRXD(CIM / MM Receive data)
13 +24VVCC
14 SMRST(CIM / MM Reset)
15 GND
16 Reserve
17 Reserve
18 Reserve
19 Reserve
J102(Stage1 CON2) 1
52207-0885(Molex) 2 Reserve
3
4
5 Reserve
6
7 Reserve
8 NC
J110(Card bin) 1 CUS(Capture unit sensing)
280389-2(AMP) 2 NC
3 NC
4 EFS(Early full sensing)
5 NC
6 GND
7 CBES(Capture box exist sensing)
8 +5VVCC
31

J301(Shutter SOL 1 +24VVCC
Card throat SW 2 Shutter SOL
S6B-EH(JST) 3 GND
4 PI1(Shutter motion sensor)
5 GND
6 SW1(Care throat SW)
CN1(TK2Readhead) 1 RTR2+
52207-0385(Molex) 2 RTR2-
3 FG(Frame ground)
32

J302(IC Contact block) 1 +5VVCC
52207-1985(Molex) 2 NC
3 SYSCLK(MC33560 synchronous clock IN)
4 GND
5 SHIO(MC33560 serial I/O)
6 RST(MC33560 Reset IN)
7 RDYMOD(MC33560RDYMOD IN)
8 MCINT(MC33560 MCINT OUT)
9 POWON(MC33560 POEWRON IN)
10 NC
11 FUSE(MC33560 C4 I/O)
12 PROG(MC33560 C8 I/O)
13 PDOUT(MC33560 CRDDET IN)
14 ICC(MC33560 CS IN)
15 NC
16 PI2(IC contact U/D sensing)
17 LED+(Contact U/D sensing LED)
18 +24VVCC
19 IC contact SOL
PCB out side connector PCB in side connector
C
J302
J11
J7
J2
J801
J301
J9
J4 J110
J5
CN4 CN1
J102 J101 J201(6pin) J6
J31
33
12.2.Stage1 PCB(CIM/MM)

No.
2 GND
3 Reg.Out(12V)

2 GND
3 Reg.Out(5V)
CN11(CIM/MM) 1 +5V
2 MMDT(MM detect)
3 Reset)
4 TXD(Transmit data)
5 RXD(Receive data)
6 GND
7 CIMDT(CIM detect)
8 GND
9 NC
10 NC
11 +5V
12 +5V
13 GND
14 GND
15 NC
16 NC
Stage1 PCB CIM/MM Only component connector layout
CN51 CN52
CN11
34
12.3. IC Block PCB

No.
J3 1 ICSOL+(IC contact SOL)

2 ICSOL-(IC contact SOL)
J2 1 +5V
2 ICE_DAT(M052ZBN IN)
3 SYNCLK (NCN8025 synchronous clock IN)
4 GND
5 IO(M052ZBN&NCN8025 serial I/O)
6 RST(M052ZBN Reset IN)
7 RDYMOD(M052ZBN RDYMOD I/O)
8 ICE_CLK(M052ZBN IN)
9 POWON(M052ZBN POEWRON IN)
10 FUSE(M052ZBN&NCN8025 C4 IN)
11 PROG(M052ZBN&NCN8025 C8 IN)
12 PDOUT(M052ZBN /RST IN)
13 ICC(M052ZBN ICS IN)
14 PIC(M052ZBN ICCEN IN)
35
13. Notes.
13.1 Note 1. Normal Conditions
Temperature : 20degrees C +/- 5degrees C
Humidity : 35% to 60% RH
Mounting : Horizontal
(Mounting plate on horizontal surface)
13.2 Note 2.
Details of specific evaluation method for each characteristic in this documents, and
details of quality assurance program are negotiated under separate agreement.
13.3 Note 3.
For location of the sensors, refer to the appearance drawing.
Drawing number: T00A315A01
13.4 Note 4. Care for handling the cards;

In case the cards are kept under the condition that ISO magnetic stripe on Low-Co
card and Japanese domestic JIS 2 magnetic stripe on the card (NEMO(MFR) does not
support JIS 2 track read/write operation.) are laid so that those overlap each other,
there is a possibility of the demagnetization of the data on ISO stripe.
In case Low-Co card and High-Co card is kept with overlapping each other, there is a
possibility of the demagnetization of the data on Low-Co card.
36
13.5 Note 5.
The location of the card driving roller in NEMO(MFR) and the area of IC chip are
overlapped.
The card driving mechanism gives pad roller pressure onto IC card chip.
The pad roller is located in the opposing side of the card-driving roller.
The IC cards must be endurable against the aforementioned pressure.
The pressure given onto the IC cards are as follows;
27.0mm typ.
IC chip
Emboss
IC card
φ20 Mag-stripe
Pad roller (polyacetal)

3.5mm typ.
19.6[N] typ.
37
13.6 Note 6. Manufacturers life test results. (Reference Section 6)

Note 6 is for information only.
In the following table;

The figures under "Specification" are those specified in Section 6 of this document.
The figures under "Test Pass" are those obtained by the manufacturer during testing
in a laboratory and are for information only.
The percentage figures under "Margin" represents the percentage figure between the
life figures specified in this document and the test results obtained by the
manufacturer and are an indication of the safety margins implemented by the vendor
in this specification.
Specification Margin Test Pass

Unit and Parts Comments Note
[passes] [%] [passes]
NEMO(MFR)
2,000,000 50% 3,000,000
Unit
Magnetic Head 1,000,000 200%
Pre Head 1,000,000 200% Test stopped after 3,000,000
D.C. Motor 2,500,000 20% passes. No failures occurred.
Micro Switch 2,000,000 50%
Timing Belt 2,000,000 50%
Feed Roller 1,500,000 100%
Test stopped after 900,000
IC Contacts 600,000 50% 900,000 passes No failure occurred.
(soft landing)
100%
700,000 61% 1,125,000
Inter.
D.C. Motor 100% 500,000 64% 820,000 Estimated life calculated by
with ECD Max. remaining size of brushes.
40% Inter. 1,100,000 63% 1,790,000
40% Max 900,000 56% 1,400,000
E
CONFIDENTIAL No. ASR – NP – 29052 - 01 / 38

38
13.7 Note 7. Boot Program and Main PCB (Electric) Revision.
Main PCB Revision (Electric Revision)

Boot Revision 02516-
3Tr HiCo Track 2
03A 80 90
03A 81 -
03A 82 92
03B 82 92
03B 83 93
13.8 Note 8. Boot Program Change Sheet.
REV DATE
PARAGRAPH
03A Newly issued
03B 20/July/’12 Change handling of the USB Drive IC

ＩＣＣｏｎｔａｃｔＢｌｏｃｋＭＯＤＥＬＬＡＢＥＬＤＥＴＡＩＬ

ＴＹＰＥ

Ｐ／Ｎ．ＬＡＢＥＬＤＥＴＡＩＬＢＡＲＣＯＤＥＬＡＢＥＬＤＥＴＡＩＬ

＊１ＩＣＢｌｏｃｋＰａｒｔＬａｂｅｌＧｌｏｂａｌＳｕｐｐｌｉｅｒＣｏｄｅ．
００９-００２８９８２ＮＣＲＰＡＲＴＮｏ．Ｔｈｅｍａｎｕｆａｃｔｕｒｅｄａｔｅ．
Ｐ／ＮＳ４６Ａ９６１Ａ０１＃ＮＣＲＰＡＲＴＮｏ．Ｂａｒｃｏｄｅ
Ｂａｒｃｏｄｅ
Ｂ＊２ＮＥＭＯＳｈｏｒｔＥｘｉｔ－１ＰａｒｔＬａｂｅｌＲｏＨＳＣｏｍｐｌｉａｎｃｅ
００９－００３１３７０ＡＮＣＲＰＡＲＴＮｏ．
Ｐ／ＮＳ５５Ａ５６６Ａ０２＃
ＳＡＮＫＹＯＰＡＲＴＮｏ．ＹＥＡＲ ’０’ ｆｏｒｆｉｇｕｒｅａｄｊｕｓｔｍｅｎｔ．
ＭＯＮＴＨ
Ｄｅｔａｉｌｓｏｆａｐｒｏｄｕｃｔ
＊３３ＴｋＴｒａｎｓｐｏｒｔｗｉｔｈＢａｓｅＰａｒｔＬａｂｅｌＳＥＲＩＡＬＮＯ．
００９－００３１３６８ＡＮＣＲＰＡＲＴＮｏ．
Ｐ／ＮＳ３６Ａ６７０Ａ０３＃

Ｐ／ＮＳＢＷ２４２９０１＃
ＭＭＳｅｎｓｏｒＢｒａｃｋｅｔＳＢＰ５３１２０１＃ＳＡＮＫＹＯＰＡＲＴＮｏ．
ＢＡＲＣＯＤＥＬＡＢＥＬ
＊５ＩＦＭＬａｂｅｌ
Ｐ／Ｎ
ＩＦＭＩＤ
ＳＴＡＧＥ１ＰＣＢ＊６ Serial No. ＬａｂｅｌＲｏＨＳＣｏｍｐｌｉａｎｃｅＣａｒｄＤｅｔｅｃｔＳＷ
ＰＤ３ＰＤ２ＰＤ４ＰＤ１
Ｓ／ＮＲ－９１１００００１
Ｒｅｖ．＊＊＊＊＊＊
ＳｈｕｔｔｅｒＲＥＶ NO．ＳＥＲＩＡＬＮＯ．Ｐａｓｔｉｎｇ＊２Ｐ／ＮＬａｂｅｌ
ＰａｓｔｉｎｇＩＣＣｏｎｔａｃｔＣｅｎｔｏｒＹＥＡＲＭＯＮＴＨ
ＣａｒｄＤｅｔｅｃｔＳＷ，ＰｒｅＨＤ
＊４Ｐ／ＮＬａｂｅｌＭＭＳｅｎｓｏｒＣｅｎｔｏｒＣＥ／ＵＬＬａｂｅｌ
ＰＤｉＣａｒｄＣｅｎｔｏｒＬｉｎｅ
ＶＩＥＷＣ
Ｍｏｌｅｘ：２２－０５－１０２２Ｐ／Ｎ
Ｍｏｌｅｘ：４４１３０－００１８
ＡＭＰ：２８０３８９－２
ＭＥＩＰｏｗｅｒＣｏｎｎｅｃｔｏｒ
Ｍｏｌｅｘ：５５９３５－０２１０
Ｓｈｕｔｔｅｒ／ＷｉｄｔｈＳｅｎｓｏｒＣｏｎｎｅｃｔｏｒＳ／Ｎ

Ｃ
Ｍｏｌｅｘ：４３６４０－０４０１
Ｍｏｌｅｘ：３９－０１－２０２６
Ｒ／ＷＨＥＡＤＣａｂｌｅｂｉｎｄｉｎｇ

ＭＯＤＥＬＬＡＢＥＬ
ＰｒｅＨｅａｄＦＰＣ

ＩＣＣｏｎｔａｃｔＢｌｏｃｋ（ＩＳＯ）
Ｍｏｌｅｘ：３９－０１－２０２５Ｐａｓｔｉｎｇ＊１Ｐ／ＮＬａｂｅｌ

ＶＩＥＷＢ
ＩＣＣｏｎｔａｃｔＢｌｏｃｋＭＯＤＥＬＬＡＢＥＬＤＥＴＡＩＬ

ＴＹＰＥ

Ｐ／Ｎ．ＬＡＢＥＬＤＥＴＡＩＬＢＡＲＣＯＤＥＬＡＢＥＬＤＥＴＡＩＬ

＊１ＩＣＢｌｏｃｋＰａｒｔＬａｂｅｌＧｌｏｂａｌＳｕｐｐｌｉｅｒＣｏｄｅ．
００９-００２８９８２ＮＣＲＰＡＲＴＮｏ．Ｔｈｅｍａｎｕｆａｃｔｕｒｅｄａｔｅ．
Ｂ＊２ＮＥＭＯＳｈｏｒｔＥｘｉｔ－１ＰａｒｔＬａｂｅｌＲｏＨＳＣｏｍｐｌｉａｎｃｅ
００９－００３１３７０ＡＮＣＲＰＡＲＴＮｏ．
Ｐ／ＮＳ５５Ａ５６６Ａ０２＃
ＳＡＮＫＹＯＰＡＲＴＮｏ．ＹＥＡＲ ’０’ ｆｏｒｆｉｇｕｒｅａｄｊｕｓｔｍｅｎｔ．
ＭＯＮＴＨ
Ｄｅｔａｉｌｓｏｆａｐｒｏｄｕｃｔ
＊３Ｔｋ２ＴｒａｎｓｐｏｒｔｗｉｔｈＢａｓｅＰａｒｔＬａｂｅｌＳＥＲＩＡＬＮＯ．
００９－００３１３６９ＡＮＣＲＰＡＲＴＮｏ．
Ｐ／ＮＳ３７Ａ０１７Ａ０３＃

Ｐ／ＮＳＢＷ２４２９０１＃
ＭＭＳｅｎｓｏｒＢｒａｃｋｅｔＳＢＰ５３１２０１＃ＳＡＮＫＹＯＰＡＲＴＮｏ．
ＢＡＲＣＯＤＥＬＡＢＥＬ
＊５ＩＦＭＬａｂｅｌ
Ｐ／Ｎ
ＩＦＭＩＤ
ＳＴＡＧＥ１ＰＣＢ＊６ Serial No. ＬａｂｅｌＲｏＨＳＣｏｍｐｌｉａｎｃｅＣａｒｄＤｅｔｅｃｔＳＷ

ＰＤ３ＰＤ２ＰＤ４ＰＤ１
Ｓ／ＮＲ－９１１００００１
Ｒｅｖ．＊＊＊＊＊＊
ＳｈｕｔｔｅｒＲＥＶ NO．ＳＥＲＩＡＬＮＯ．Ｐａｓｔｉｎｇ＊２Ｐ／ＮＬａｂｅｌ
ＰａｓｔｉｎｇＩＣＣｏｎｔａｃｔＣｅｎｔｏｒＹＥＡＲＭＯＮＴＨ
ＣａｒｄＤｅｔｅｃｔＳＷ，ＰｒｅＨＤ
＊４Ｐ／ＮＬａｂｅｌＭＭＳｅｎｓｏｒＣｅｎｔｏｒＣＥ／ＵＬＬａｂｅｌ
ＰＤｉＣａｒｄＣｅｎｔｏｒＬｉｎｅ
ＶＩＥＷＣ
Ｍｏｌｅｘ：２２－０５－１０２２Ｐ／Ｎ
Ｍｏｌｅｘ：４４１３０－００１８
ＡＭＰ：２８０３８９－２
ＭＥＩＰｏｗｅｒＣｏｎｎｅｃｔｏｒ
Ｍｏｌｅｘ：５５９３５－０２１０
Ｓｈｕｔｔｅｒ／ＷｉｄｔｈＳｅｎｓｏｒＣｏｎｎｅｃｔｏｒＳ／Ｎ

Ｃ
Ｍｏｌｅｘ：４３６４０－０４０１
Ｍｏｌｅｘ：３９－０１－２０２６
ＲＥＶ．
ＬＡＢＥＬ
ＲｅａｄＨＥＡＤＣａｂｌｅｂｉｎｄｉｎｇ

ＭＯＤＥＬＬＡＢＥＬ
ＰｒｅＨｅａｄＦＰＣ

ＩＣＣｏｎｔａｃｔＢｌｏｃｋ（ＩＳＯ）
Ｍｏｌｅｘ：３９－０１－２０２５Ｐａｓｔｉｎｇ＊１Ｐ／ＮＬａｂｅｌ

ＶＩＥＷＢ
MAINTENANCE MANUAL
Type Name :
ICT1Q8-1R0347
ICT3Q8-3A2347
Spec. No. AMR-NP-19458-01
Notes :
G Change the Customer P/N P2,4,8,11,27,29,30 Y.Fujimori

F Standardization 2,4,8,11,13,14,27,29,30 EB-21847-01 Jul.14.2016 Y.Fujimori H.Takeda
No. of sheet
E Standardization 13 EB-18268-01 Mar.24.2014 H.Takeda T.Tatai

Distribution
D Change of PCB P2,4,27,28 EB-17966-01 Nov.29.2013 F.Akahane T.Tatai

C for NEMO ALL EB-17771-01 Sep.18.2013 F.Akahane K.Higashi
B Standardization 3 EB-16819-01 Dec.18.2012 K.Kubota T.Tatai
Sym. Revision Page
Cha. No. Date By Appr.
Reference Document
Design F. Akasu Aug・24・2012 EXPLODEDE DIAGRAM ： T10A084A01
Custody
H. Takeda Aug・24・2012 SPARE PARTS LIST ： AMP-NP-19458-01
Det-che F. Akahane Aug・24・2012

Type Name Appro. T.Tatai Aug・28・2012 NIDEC SANKYO CORPORATION
No. S39Z-032-00-02F
No AMR – NP – 19458 – 01 1/ 35
Table of Contents
1.Introduction....................................................................................................................................... 2
1.2.Applicable limit of this maintenance manual......................................................................... 2
2.Name of parts on NU-MCRW / NEMO ........................................................................................... 3
3.Periodical Maintenance .................................................................................................................... 3
3.1.Maintenance by user ................................................................................................................ 3
3.2.Maintenance by Field service .................................................................................................. 3
4.Replacement steps of Maintenance parts ....................................................................................... 4
4.1.R/W Amp. Board Ass'y Replacement ....................................................................................... 5
4.2.Motor Ass'y Replacement ......................................................................................................... 7
4.3.R/W Head Guide Block Ass'y Replacement ............................................................................ 8
4.4 Guide Ass'y Replacement ....................................................................................................... 10
4.5 Bezel Ass'y Replacement ........................................................................................................ 11
4.6 Pre-Head Ass'y Replacement ................................................................................................. 12
4.7 Timing Belt or Roller Replacement ....................................................................................... 13
5.Other Adjustments ......................................................................................................................... 15
5.1.SW1 Adjustment (Micro Switch for card detector) ............................................................... 15
5.2.SW2 Adjustment (Micro Switch for shutter) ........................................................................ 15
5.3.Shutter Solenoid Adjustment................................................................................................. 16
5.4.Pad-Roller Gap Adjustment ................................................................................................... 17
6.IC contact Block Ass'y Replacement ............................................................................................. 18
7.Trouble Shooting Flow Chart ........................................................................................................ 20
8.MEEI PCB Ass'y Replacement ...................................................................................................... 25
8.1.UPPER MEEI Ass'y Replacement ......................................................................................... 25
9.Stage1 PCB Ass'y Replacement ..................................................................................................... 26
10. Appendix 1: Outside view of R/W Amp. Board .......................................................................... 27
11. Appendix 2: Marking of Shutter assembly ................................................................................ 29
12. Appendix 3: Boot Program Information ..................................................................................... 29
12. Appendix 3: Boot Program Information ..................................................................................... 30
12-1 Version................................................................................................................................... 30
12-2 Boot Program Change Sheet................................................................................................ 31
13. Appendix 4 : Switch Selectable Test .......................................................................................... 32
14. Appendix 5 : Specialist Service Tools ......................................................................................... 34
The Last Page .................................................................................................................................... 35
No AMR – NP – 19458 – 01 2/
1.Introduction
1.1.Applicable models
Mag-stripe Head Assy. Resistors
Customer P/N Sankyo P/N IC JP1 JP2 JP3 Note
Tk1 Tk2 Tk3 Hi-Co
F 445-0737837B(NU)
G ICT3Q8-3A2347 R/W R/W R/W C C ○ ○ - +Std Shutter
445-0764436A
445-0737836B(NU)
F ICT1Q8-1R0347 N/A R N/A N/A C - - +Std Shutter
G 445-0764437A
○
F 009-0025444(NU) S36A670A01
G R/W R/W R/W C N/A ○ ○ - 3Tk Transport with Base
009-0031368A S36A670A03
F 009-0025442(NU) S37A017A01
G N/A R N/A N/A N/A - - ○ Tk2 Transport with Base
009-0031369A S37A017A02
G F 009-0031367A S36A663A02 - - - - - - - - Standard Shutter
IC Block
F 009-0028982 S38A912A02 - - - - - - - - (Without SAM )
Stage 1 Function. PCB
009-0022328 SBW242901 - - - - - - - - (CIM/MM only)
F 998-0912563 S36A626A02 - - - - - - - - New Pre-HD
009-0028065(NU) S36A420D01
009-0031366A S58A297A01
F
(Covered) R/W R/W R/W C N/A - - - Main PCB (3TK)
G (S46A569D01)
(NON-Covered)
009-0028064(NU) S36A420D02
009-0031365A S58A297A02
F
(Covered) N/A R N/A N/A N/A - - - Main PCB (TK2)
G (S46A569D02)
(NON-Covered)
009-0028186 (New) MEEI
(Option)
S45A719A01 - - - - - - - - Only Upper LED
009-0025447 MYB486201 - - - - - - - - MEEI Plastic cover


1.2.Applicable limit of this maintenance manual
This manual is designed only for a person who maintains the listed products at the maintenance
service center or equivalent location.
No AMR – NP – 19458 – 01 3/
2.Name of parts on NU-MCRW / NEMO

DC Motor
PCB (R/W AMP Board)
IC Contact Block
R/W Head
Top MEEI
Pre Head
Stage1 PCB (Option)
Shutter Gate
3.Periodical Maintenance Fig.2-1
3.1.Maintenance by user
R/W Head cleaning
(1) The cleaning card (Specification #68-76-02-51-8 DWG.No. EGC219101)specified by Sankyo
must be used or NCR approved cleaning card. (Sankyo Prt No EGC219101 = NCR Prt No
497-0444494)
(2) Cleaning must be done with cleaning card when R/W error happens very often.
(3) If R/W error still happens after Head cleaning, clean the rollers.
3.2.Maintenance by Field service

Rubber roller cleaning
(1) Cloth penetrated with some alcohol liquid (recommendation: dehydrated ethanol) is used for
cleaning up the roller when the cleaning card is not effective. If you can't use some alcohol liquid
(recommendation: dehydrated ethanol), you can also wipe the roller with dry cloth.
(2) Cleaning should be done at periodical check (inspect).
Cleaning point of rollers
#3 Roller #2 Roller #1 Roller
DC Motor
Fig.3-2-1
No AMR – NP – 19458 – 01 4/
4.Replacement steps of Maintenance parts

(1) All maintenance parts are listed in the spare parts list and Exploded View drawing indicated below.
Customer P/N Sankyo P/N Spare parts List No. Exploded diagram No.
445-0764436A ICT3Q8-3A2347 AMP-NP-19458-01 T10A084A01
F 445-0755000B ↑ ↑ ↑
G
445-0737837B(NU) ↑ ↑ ↑
445-0764437A ICT1Q8-1R0347 ↑ ↑
F
G 445-0754999B ↑ ↑ ↑
445-0737836B(NU) ↑ ↑ ↑
G 009-0031368A S36A670A03 - -
F
009-0031369A S37A017A03 - -
GF
009-0031367A S36A663A02 - -
G F
009-0028982 S38A912A02 - -
009-0022328 SBW242901 - -
009-0025447 MYB486201 - -
F 998-0912563 S36A626A02 - -
009-0031366A S58A297A01 - -
GF
(S46A569D01) - -
009-0028065(NU) S36A420D02 ↑ ↑
009-0031365A S58A297A02 - -
G F (S46A569D02) - -
009-0028064(NU) S36A420D02 ↑ ↑
009-0028186 S45A719A01 - -
(2) Notes for maintenance.

There are two different kinds of values indicated in this manual; one is for adjustment and the other
is for check (inspect). Adjustment value is more rigid than check value. Please be sure to
distinguish those values.
No AMR – NP – 19458 – 01 5/
4.1.R/W Amp. Board Ass'y Replacement
<Disassembling>
(1) Remove screws, "l" shown in the Fig.4-1-1 from the board.(Ref.No.112).
(2) Disconnect all connectors from the board.
(3) Replace the R/W Amp. Board Ass'y.
AMP Board Assy
Cover
Fig.4-1-1 Screw(l)
<Assembling>
(1) Assemble in the reverse order of the above disassembling.
(2) To fasten screw, "l"at 35 N⋅cm(3.5Kgf⋅cm)
A. Sensitive of the photo-detectors

First, turn off power of the NU-MCRW / NEMO. Set the DipSwitch(DSW2) that is on the main PCB to
No.7(hex). Turn on power again. The NU-MCRW / NEMO checks each sensor level and adjusts slice
level automatically. Adjusted values are stored to flash ROM. After performance of storing, the Red
LED blinks 0.5Hz cyclically, and the Green LED indicates Test ID(7 hex) number with blinking.
If it fails during adjustment and storing, error number is displayed on the Green-LED. (Please see
Appendix of following)
Note:
1) Adjustment and Check must be done without any presence of card.
2) For the detailed procedures when sensor check is fail, please refer to Page 10.
3) After check and adjustment, please turn off power of the NU-MCRW / NEMO and set to 0(hex)
the dipswitch.
No AMR – NP – 19458 – 01 6/
NOTE: Standard Card for Check Motor Speed and for Adjustment of SS Position
This card has very correct interval of each magnetic stripe on this card, plus this card has very correct
SS position. You can order this card as <<Sankyo P/N: G00A900A01>>.
Please don't attempt to write to these cards as they will then be invalid.
B. Card Speed Check

This check needs the SP-Card.
First, Turn off power of the NU-MCRW / NEMO. Set the DipSwitch(DSW2) that is on the main PCB to
No.8(hex). Turn on power. Then insert this card to the NU-MCRW / NEMO. The NU-MCRW / NEMO
accepts this card, reads magnetic data and ejects this card.
In that time, the NU-MCRW / NEMO calculates speed. After this performance, the Red LED blinks
0.5Hz cyclically, and the Green LED indicates Test ID number(8 hex) with blinking.
If this speed is out of range, error number is displayed on the Green-LED. (Please see Appendix of
following)
C. Start sentinel Position Check and Adjustment

This check needs the SS-Card.
First, Turn off power of the NU-MCRW / NEMO. Set the DipSwitch(DSW2) that is on the main PCB to
No.9(hex). Turn on power. Then insert this card to the NU-MCRW / NEMO. The NU-MCRW / NEMO
accepts this card, reads magnetic data 4 times and ejects this card.
In that time, the NU-MCRW / NEMO measures position of Start Sentinel and calculates the adjustment
value.
Adjusted values are stored to flash ROM. After performance of storing, the Red LED blinks 0.5Hz
cyclically, and the Green LED indicates Test ID(9 hex) number with blinking. If it fails during
adjustment and storing, error number is displayed on the Green-LED. (Please see Appendix of
following)
NOTE:
After check and adjustment, please turn off power of the NU-MCRW / NEMO and set to 0(hex) the
dipswitch.
No AMR – NP – 19458 – 01 7/
4.2.Motor Ass'y Replacement
<Disassembling>
(1) Remove the R/W Amp. board per the instruction of 4.1.
(2) Remove screws, "e" fixing the motor and replace the motor.
(3) Replace Motor Ass'y
Motor Assy Screw(e)
Screw (e)
δ
A
10~30gf :A≈B
Fig.4-2-1
<Assembling>
(1) Assemble in the reverse order of the above Disassembling.
<Check Points>
A. Belt Tension
(1) Loosen screws, "e" and to adjust belt tension.
At this time, the belt must have flexibility,δ by 0.6mm at the mid-point (A≈B) and its flexibility δ
requires the load ranging 10~30gf.
(2) To fasten screws, "e" at 74N⋅cm (7.5kgf⋅cm) and check if the belt has appropriate flexibility or not.
If not sufficient or excessive, readjustment must be required.
If appropriate, put any kinds of mark on those screw heads indicating adjustment has been done.
*Required tool: Scale and tension gauge
B. Card Speed Test

Please see page 6( B. Card Speed Test)
C. R/W operation
(1) Check if R/W operation has been done without any problems.
No AMR – NP – 19458 – 01 8/
4.3.R/W Head Guide Block Ass'y Replacement
<Disassembling>
(1) Remove the R/W Amp. board (Ref.No.112) per the instruction of 4.1.
(2) Remove the Bezel Ass'y (Ref.No.105).
(3) Remove 2 screws from R/W Head guide block and a screw, "m" under flexible printed cable of the
Head (see Fig.4-3-1).
(4) To replace R/W Head Guide Block Ass'y (Ref.No.4).
Screws
Screw (2)
F
F G
Bezel Assy
NCR P/N: 009-0031367A Screws(l)
Sankyo P/N:S36A663A02
R/W Head Guide Block Assy

Screw (1)
Fig.4-3-1
<Assembling>
(2) Assemble Bezel Assy in order of screw (1) and screw (2).
(3) To fasten screw, "l "at 24N･cm(2.5Kgf･cm) and "M3"at 74 N･cm(7.5Kgf･cm)
No AMR – NP – 19458 – 01 9/
<Check points>
Please refer to “Sensitive of the photo-detectors” of 4.1 R/W Amp. Board Ass’y.
B. Card Speed Test

Please see page 6( B. Card Speed Test)

Please see page 6( B. Start Sentinel Position Check and Adjustment)
D. Track Skew
(1) Check if the track skew on each magnetic data is staying within the range specified as below.
Track Midpoint of track from edge of card Skew

ISO Tr.1 7.060mm ± 0.2mm ±20'
ISO Tr.2 10.365mm ± 0.2mm ±20'
ISO Tr.3 13.920mm ± 0.2mm ±20'
Mid point of track = (A+B)/2

A
B
Fig.4-3-3
E. R/W operation
(1) Check if R/W operation has been done without any problem.
No AMR – NP – 19458 – 01 10/
4.4 Guide Ass'y Replacement
<Disassembling>
(1) Remove the board (Ref.No.112) per the instruction of 4.1.
(2) Remove the Bezel Ass'y (Ref.No.105) and R/W Head guide block Ass'y (Ref.No.4) per the
instruction of 4.3.
(3) Remove screws shown in the Fig.4-4-1 from the Guide Ass'y upper side (Ref.No.108).
(4) Replace Guide Ass'y.
Guide Block Assy
Fig.4-4-1
<Assembling>
(2) To fasten screws at 74 N⋅cm(7.5 Kgf⋅cm)
<Check points>
A. Sensitivity of the photo-detectors
(Please refer to “Sensitive of the photo-detectors” of 4.1 R/W Amp. Board Ass’y.)
B. R/W operation
(1) Check if R/W operation has been done without any problem.
No AMR – NP – 19458 – 01 11/
4.5 Bezel Ass'y Replacement

<Disassembling>
(1) Remove screws shown in the Fig.4-5-1.
(2) Remove the Bezel Ass'y.
G
Bezel Assy F
NCR P/N: 009-0031367A
Sankyo P/N: S36A663A02
Screw (2)
Screw (1)
Fig.4-5-1
<Assembling>
(1) Assemble Bezel Assy in order of screw (1) and screw (2).
(2) To fasten screw, "M3"at 74 N･cm(7.5Kgf･cm)
No AMR – NP – 19458 – 01 12/
4.6 Pre-Head Ass'y Replacement
<Disassembling>
Pre Head Assy
Screw(e)
Fig.4-6-1
<Assembling>
<Check points>
A. Head mounting
(1) Ensure Pre-Head position to be set as indicated below and fix the screw, "e".
A B
A≈B
Fig.4-6-2
B. Amplifier output
(1) Confirm if the Pre-Head is detected the card of 5% Amp.
*Required tool: card encoded on only track #2 of 5% Amp.

No AMR – NP – 19458 – 01 13/
4.7 Timing Belt or Roller Replacement

<Disassembling>
(1) Remove the R/W Amp.Board Ass’y per the instruction of 4.1(See Page.5).
(2) Lose "Screw" and decrease the tension of Belt
(3) Remove Timing Belt “7”.
(4) Remove the screw “g” fixing capture roller “2”.
(5) Remove the retaining rings “i” and “k” fixing shaft.
(6) Pull out Pulley Ass’y to the direction shown with the arrow in the figure.
(7) Remove Timing Belt “6” and Roller“2” and Roller“5”.
(8) Replace Belt or Roller, and then assemble in the reverse order of the above disassembling.
Note
(1) Pay attention to insert locking pin into Roller “5”.
(2) Fit the tooth form of Timing Belt “6” and Timing Pulley when assembling.
(3) There is the possibility of the deformation of Retaining Ring “i” and “k” by removing.
If deformed, the part(s) shall be replaced by new one.
g k i
Screw i E-Ring
CE-Ring 2
Pin
k
g
h
P/N.KYG214502 5
Timing Belt 6
F
P/N.M30A624A03
5 Rubber Roller
Pin
2
P/N.S28A731A02
Capture Roller
F
Screw
Fig.4-7-1 Timing Belt 7

P/N.KYG212912
4.8 Capture Roller #1 to #3 Replacement
<Disassembling>

(2) Remove the retaining rings “i” and “k” and Poli-Slider "h" fixing shaft.
(3) Pull out Pulley Ass’y to the direction shown with the arrow in the figure (Fig.4-8-1).
(4) Remove #1Roller“2” to #3Roller“2”.
(5) Replace Capture Roller, and then assemble in the reverse order of the above disassembling.
Note
(1) There is the possibility of the deformation of Retaining E-Ring “i” by removing.
(2) Please tighten screw "g" with 54N･cm(5.5kgf･cm) when you exchange capture roller "2" .
(P/N.S28A731A02 #1Roller to #3Roller)
F
No AMR – NP – 19458 – 01 14/
E-Ring
Screw i
Poli-Slider
Screw tightening torque：54N・cm g h
CE-Ring
k
F 2 #3 Roller
P/N.S28A731A02 g
Capture Roller
#1 to #3
2 #2 Roller
Pull out Pulley Ass’y 2 #1 Roller
Fig.4-8-1
<Adjustment>
(1) Loose Screw and add the pressure between 400 and 450 gf to the position of Tension Pulley
shown in Fig. 4-8-2.
(2) Fix Screw under the condition that the above-mentioned pressure is added.
Note) In case of no tension gage for adding the pressure, mark the fixing position before the
replacement and fix Screw to fit the position to the mark when replacement.
3.9-4.4N (400-450gf)
Screw
Fig.4-8-2
No AMR – NP – 19458 – 01 15/
5.Other Adjustments
5.1.SW1 Adjustment (Micro Switch for card detector)
(1) Insert the ST-SW card (No. EGCMC0119) into card throat slowly. When the position B of ST-SW
card contacts micro switch actuator (see Fig.5-1-1),a click sound will come from the switch. This
sound shows the SW1 detected the card (SW1 ON). At this position, fasten the adjusting screws
for SW1.
(2) Next, draw out the ST-SW card a little bit. A click sound will come from the SW1 again when
position A of the ST-SW card comes by the micro switch actuator. This sound indicates the switch
turned OFF.
(3) Confirm if the SW1 works correctly at each ST-SW card position.
*Required tool: ST-SW card (No. EGCMC0119)
Adjusting Screw for SW1
ST-SW Card
SW1 Lever DWG No.EGCMC0119
Position A (52.7mm)
Position B (53.5mm)
Fig.5-1-1
5.2.SW2 Adjustment (Micro Switch for shutter)

(1) Hold the shutter plate at the position where a shaft (φ1.5 ± 0.02) can go through the hole, X
indicated in the Fig.5-2-1.
(2) Adjusting screws for SW2 are shown below under pushing the solenoid toward the direction ‘’G’’.
(3) Adjust the SW2 at the position where SW2 turns ON (OFF→ ON) Fig.5-2-2.
(4) Confirm if SW2 turns OFF when Shutter hole agree with Bezel hole , X indicated in the Fig.5-2-1.
Bezel
Lever Detail X
ON OFF
G
φ1.5 PIN Fig.5-2-1.
Sankyo P/N;
DMJ-AD-348-16
Adjusting Screws for SW2
Fig.5-2-2.
No AMR – NP – 19458 – 01 16/
5.3.Shutter Solenoid Adjustment

When replacing shutter solenoid, the following adjustments are required.
(1) The plunger of solenoid must be at the full energised sucked in position.
(2) Fix the solenoid at the position where a shaft (φ2.1 ±0.01: DMJ-AD-348-11) can go through the
hole, Y indicated in the Fig.5-3-1.
(3) Adjusting screws for shutter solenoid are shown below under pushing the solenoid toward the
direction ‘’G’’.
(4)Then remove a shaft (DMJ-AD-348-11)
(5)Then adjust SW2 again (see 5.2 SW2 adjustment).
Detail Y
Φ2 PIN G
Adjusting Screws for
DMJ-AD-348-11
Plunge
Fig.5-3-1
(6)Confirm of Solenoid Position

At first, bezel assembly maintain upside down shown in Fig.5-3-2.
The plunger of solenoid must be at the full sucking position.
Tooling (DMJGA149) put on the lower bezel shown in Fig. 5-3-3.
The shutter plate should touch the tool to ensure that the shutter plate
is in a position to clear the card path.
Shutter Tool
DMJGA149
Shutter Plate
Fig.5-3-2 Fig.5-3-3
No AMR – NP – 19458 – 01 17/
5.4.Pad-Roller Gap Adjustment
(1) Loosen the attachment screws, "e", then fasten screws, "e" at the position where the Gap A and
the Gap C looks equal to each other.
(2) Adjust the Gap A and C with nut, "b" to be at 0.0mm~0.1mm.
(3) Confirm if a card (its thickness = 0.25mm) can transport back and forth.
Gap C Gap A
Screws(e) Nut(b)
Fig.5-4-1
No AMR – NP – 19458 – 01 18/
6.IC contact Block Ass'y Replacement
<Disassembling>
(1) Remove the board (Ref. No.112) per the instruction of 4.1. Very right side
(2)Remove screws from IC Contact Block Ass'y.
(3) Replace .IC Contact Block Ass'y.
IC Contact Block
P/N:009-0028982
emboss
Fig.6-1
<Assembling>
(2) Attach the Block very right side of positioning emboss gap.
(3) Connect Cables to connector of PCB.
(4) The Smart Card Block includes a label that has the new EMV number. Please stick a new label on
the following area.
(Please understand there is a condition that we do not need to update the number.)
CE **
EMV **
*********
*********
EMV **
*********
*********
This is the new Label
No AMR – NP – 19458 – 01 19/
<Adjustment check>
(1) IC contact position adjustment card.
IC Contact Position Adjustment Card

IC Card
Fig.6-2
(2) Turn off power of the NU-MCRW / NEMO. Set the DipSwitch(DSW2) that is on the main PCB to
No.0A(hex). Turn on power. Then insert a card to the NU-MCRW / NEMO. This card is Smart Card
and it has Magnetic data on the card. Please be careful when this test is performed, because the
NU-MCRW / NEMO writes data to Magnetic.
(3) The NU-MCRW / NEMO accepts this card, performs WriteCheck and ReadsCheck, communicates
to the SmartCard and ejects this card. If it fails, the NU-MCRW / NEMO stops check and ejects this
card and displays error number.
(4) If the SmartCard error occurs, then go to Re-adjustment.
Re-Adjustment:
i) Shift the Smart card Block assembly a little bit to the left, then attach the Block.
ii) Follow the instruction (2)~(4) again.
O.K.→ finish (Set PCB to fasten screws.)
Error → exchange the Block and readjustment
No AMR – NP – 19458 – 01 20/
7.Trouble Shooting Flow Chart

The NU-MCRW / NEMO is able to check almost own functions by Switch Test of No.0A.
Turn off power of the NU-MCRW / NEMO. Set the DipSwitch(DSW2) that is on the main PCB to No.0A(hex).
Turn on power. Then insert a card to the NU-MCRW / NEMO. This card is Smart Card and it has Magnetic
data. Please be careful when this test is performed, because the NU-MCRW / NEMO writes data to
Magnetic.
The NU-MCRW / NEMO accepts this card, performs WriteCheck and ReadCheck, communicates to the
SmartCard and then ejects this card. If it fails, the NU-MCRW / NEMO stops check and ejects this card and
displays error number on LEDs.
If this NU-MCRW / NEMO doesn't have any WriteTracks, then the NU-MCRW / NEMO doesn't do
Write test.
If this NU-MCRW / NEMO doesn't have the IC block, then the NU-MCRW / NEMO doesn't do
SmartCard test.
START the Switch Test No.0A.
Card Insertion
No
1.Shutter open? Go to Bezel Ass'y diagnosis
Yes
2.Card captured normally? No Go to card Transport diagnosis
Yes
3.Data Write normally? No Go to data Write diagnosis

Yes
4.Data Read normally? No Go to data Read diagnosis
Yes
5. SmartCard communicates normally? No Go to ICB readjustment

6. IC contact Block Ass'y Replacement
Replacement
Yes
6.Card ejected? No
Go to card Transport diagnosis
Yes
END
NOTE:
If a fail occurs and you have to check each item and repair it, then you should go to each direction.
But you don't have to check and repair it, please jump over those processes and change all of those
parts.
No AMR – NP – 19458 – 01 21/
Bezel Ass'y Diagnosis

Recovered
No NG
SW1 signal (point A) SW1 needs adjustment
Check ON/OFF or replacement
Yes (see p.15)
Recovered
Pre-Head signal (point GP) NG

Pre-Head needs
Check ON/OFF
adjustment or
Yes Replacement(see P.12)
Recovered
NG
Solenoid Sol. needs adjustment
section signal (point D) or replacement(see p.16)
Check ON/OFF
Yes Recovered
NG
SW2 signal (point C) SW2 needs adjustment
Check ON/OFF or replacement(see p.15)
Yes
Bezel Ass'y
Replacement
END
No AMR – NP – 19458 – 01 22/
Transport Diagnosis
Recovered
Sensor ON/OFF Check Sensor R/W Amp. Board Ass'y

Points: No adjustment No Replacement(see p.5)
F1 for PD1 (see p.5) and/or Guide Ass'y
F2 for PD2 Replacement
F3 for PD3 (see p.8,10)
F4 for PD4
Fi for Pdi
Yes
Recovered
Motor ON No Motor Replacement No R/W Amp. Board Ass'y

Check and adjustment(see p.7) Replacement(see p.5)
Point E
Yes
Recovered
Slipping No Cleaning roller No Roller Gap adjustment

Roller #1～ #3 (see p.3) (see p.17)
Yes
END
No AMR – NP – 19458 – 01 23/
Read Diagnosis
Amplifier Output
Point: R/W Amp. Board Ass'y
G1 for TR#1 Replacement(see p.5)
G2 for TR#2
G3 for TR#3
(mV0-p)
Tk2 3Tk(Hi-Co Card)
Yes TR#1 - 170±46%
TR#2 250±43% 190±49%
TR#3 - 170±46%
First read when it is set to three times the number of retries.
Amplifier output level Check No
Yes
Card Speed No
(Do Switch Test No.8)
Yes
END
No AMR – NP – 19458 – 01 24/
Write Diagnosis
Recovered
Write Current Check

Point: No R/W Amp. Board Ass'y
H1: for TR#1 Replacement(see p.5)
H2: for TR#2
H3: for TR#3
Yes
Recovered
Read after Write R/W Head Guide

Amplifier Output Lever Check No Block Ass'Y
Replacement
More than
(see p.10)
G1 for TR#1: 40mVo-p
Yes
Recovered
Card Speed No R/W Amp. Board Ass'y

(Do Switch Test No.8) Replacement(see p.5)
Recovered
SS Position Adjustment SS
(Do Switch Test No.9) No Adjustment No R/W Amp Board Ass'y
(see p.6) Replacement(see p.5)
END
No AMR – NP – 19458 – 01 25/
8.MEEI PCB Ass'y Replacement

8.1.UPPER MEEI Ass'y Replacement MEEI Bezel Cover
<Disassembling> P/N:009-0025447
(1) Remove the MEEI Bezel Cover(see Fig.8-1-1). Sankyo P/N: MYB486201
(2) Replace .UPPER MEEI PCB Ass'y.
UppeMEEI Assembly
P/N:009-0028186
Fig.8-1-1
<Assembling>
(2) Attach the Cover.
(3) Connect Cables to connector of MEEI Control Board. (See Fig.8-1-2)
MEEI connector
Fig.8-1-2
No AMR – NP – 19458 – 01 26/
9.Stage1 PCB Ass'y Replacement

Stage1 PCB Assy
<Disassembling> P/N: 009-0022328
(1) Remove screws from Stage1 PCB Ass'y(see Fig.9-1-1). Sankyo P/N: SBW242901
(3) Replace the Stage1 PCB Ass'y
Fig.9-1-1
<Assembling>
(2) To fasten screws at 74 cN⋅m(7.5 Kgf⋅cm)
No AMR – NP – 19458 – 01 27/
10. Appendix 1: Outside view of R/W Amp. Board
Customer P/N Sankyo P/N Parts List No.

445-0764436A ICT3Q8-3A2347 S58A297A01
GF (S46A569D01)
445-0737837B(NU) ↑ S36A420D01
445-0764437A ICT1Q8-1R0347 S58A297A02
GF (S46A569D02)
445-0737836B(NU) ↑ S36A420D02
F NEMO: 445-0764436A / 445-0764437A Point E(Forward)

G
Point E(Backward)
IC301
Point D(2pin)
J301
Point C(4pin)
Point A(6pin)
GND
TPF2F
GND TPS
TPAMP
Point GP Point F1
Point F2 Point G1
Point F3 Point G2
Point F4 Point G3
Point Fi
Outside View of R/W Amp. Board
Point H3(3pin)
Point H2(8pin)
Point H1(12pin)
1 14
J6
Inside View of R/W Amp. Board
Note: VR5AD is a volume for adjustment of critical voltage of CPU. Please don't touch it.
No AMR – NP – 19458 – 01 28/
NU-MCRW: 445-0737837B / 445-0737836B
Point E(Forward)
Point E(Backward)
IC301
Point D(2pin) TPF2F
J301
Point C(4pin)
Point A(6pin) GND
GND
TPS
TPAMP
Point F1
Point F2 Point G1
Point F3 Point G2
Point F4 Point G3
Point Fi Point GP
GND
Point H3(3pin)
Point H2(8pin)
Point H1(12pin)
1 14
J6
Inside View of R/W Amp. Board
No AMR – NP – 19458 – 01 29/
11. Appendix 2: Marking of Shutter assembly
Label of shutter assembly

MEEI Cover
Screening Throat material Note
009-0031367A without N-5UR Compliant’RoHS’
P/N S36A663A02 A
G
G F
No AMR – NP – 19458 – 01 30/
12. Appendix 3: Boot Program Information

12-1 Version
445-0764436A 445-0764437A
GF ICT3Q8-3A2347 GF ICT1Q8-1R0347
Main PCB Boot Main PCB Boot

Total Rev./. Revision Total Rev./. Revision
Revision Electric Rev 02516- Revision Electric Rev 02516-
S36A420B01 A
A 80 03A A S36A420B02 A 03A
S36A420D01 A S36A420D02 A
D 82 03B C 92 03B
S46A569D01 B S46A569D02 B
G 84 03B F 94 03B
No AMR – NP – 19458 – 01 31/
12-2 Boot Program Change Sheet
REV DATE
PARAGRAPH
03A Newly
03B 20/July/’12 Change handling of the USB Drive IC

No AMR – NP – 19458 – 01 32/
13. Appendix 4 : Switch Selectable Test
TABLE A: Illustrates the LEDs flash sequence for Switch Selected Test fail condition.
Red
Green
Start Interval
Middle Interval
End Interval
Next
Start Interval
Off Interval
On Interval
Pulse
Pulse
Start Next
Test ID Code Middle Mark Error/Pass Code
End Mark
Mark Start Mark
The above diagram details how the Green LED is to indicate Test ID and error code and test
number. The following interval times are to be used:
Interval Time (milliseconds)

Start Interval (On) 2,000
Middle Interval (Off) 1,000
End Interval (Off) 1,000
Pulse On Interval 250
Pulse Off Interval 250
Table B: Illustrates the LEDs flash sequence for a Selected test in the Pass condition.
ON
Red
OFF
Test ID
ON
Start Interval Middle & Error Code & End(Off
Green
OFF for approx 1+1+1sec)
Red LED: Flashing 0.5Hz

Green LED: Displaying Test Code and Error number
Test Description POST MODE SELECTED MODE Test Result

ID (Pass/Error Code)
hex
Motor Test: Run Test only Once. Repeat Test Cycle until
1.Motor Forward 190mm/s (approx. 1 If card is detected in Throat failure 00 = Pass
sec) or Reader 01 = CPU can’t get
2.Motor Backward 190mm/s (approx. 1 (but not in Position 7); Operator must ensure encoder pulse
sec) a) track card movement there is no card is present 02 = Card Jammed
0x01 3.Motor Stop (2 seconds) ensuring that card remains in reader. 03 = A card is in the
For POST, if a card/object is detected in in reader. reader.
Position 7 (Width Switch & Shutter b) on completion leave card This test can’t be
Open), DO NOT fail test. in Card Position 6 performed with card in the
(see note (i) in ‘Detect and Reader
Test Hardware’ )
No AMR – NP – 19458 – 01 33/
Smart Card Signal Test: IF (IC PRESENT) 00 = Pass
I/O line, Reset and Vcc of ICC are Run Test only Once Repeat Test Cycle until 01 = Short Circuit
toggled. failure 02 =
1.VCC (5V mode) ON (1 second) The CPU can only detects 03 =
0x02 2.All OFF (1 second) Excess current. 04 =
3.VCC (3V mode) ON(1 second) The CPU can detect just 05 =
4.All OFF(1 second) the excess current.
The maintenance man
should check these (I/O,
Reset and VCC) signal
SAM1 Signal Test: IF (SAM PRESENT) levels. 00 = Pass
Run Test only Once 01 = Short Circuit
I/O line, Reset and Vcc of SAM are (SAM1).
0x03 toggled. The CPU can only detects 02 = SAM2 as above
1.VCC (5V mode) ON (1 second) Excess current. 03 = SAM3 as above
2.All OFF (1 second) 04 = SAM4 as above
05 = SAM5 as above
Clear FROM (Do not clear NCR File).
Clear All Program Area NEVER Run Test Run Test only Once 00 = Pass
(0x8000~0x7FFFF) 01 = Unable to clear
On next boot the NU-MCRW / NEMO will 02 =
0x04
enter download mode. This function
makes the Flash ROM of the NU-MCRW
/ NEMO to the condition of shipping from
Sankyo.
Shutter Test: Run Test only Once Repeat Test Cycle until
This function makes shutter open and failure
close (Shutter will appear only to 00 = Pass
1.Shutter Open 2 seconds. (POST 0.1 ‘Twitch’) Ensure there is no card is 01 = Shutter Open
secs.) present in reader. 02 = Shutter Closed
0x05 2.Shutter Close 2 seconds. (POST 0.1 If Card is in Position 7 DO This test can’t be 03 = Sweep error 1
secs.) NOT run test. performed with card in the 04 = Sweep error 2
For POST, If Card is in Position 7 DO Reader 05 = Sweep error 3
NOT run test. IF (Hi-SECURITY THROAT 06 = Sweep error 4
If the Hi-Security Throat is present then PRESENT) Run Sweep 07 = Sweep error 5
a full ‘Pre-Sweep’ cycle is executed. Test Once
IC Block Solenoid and Sensor Test: Repeat Test Cycle until
Run Test only Once failure 00 = Pass
1. IC Block Down 2 seconds. (POST 0.5 () (Do not run test 02) 06 = Movement error
0x06
secs)
2. IC Block Up 2 seconds. . (POST 0.5
secs)
PD Sensor Slice Level Adjust Test. 00 = Pass
NEVER Run Test Run Test only Once 01 = Calculated value
1. The NU-MCRW / NEMO turns on all out of range for PD1
position Photo Diode (PD) sensor LED’s 02 = as above PD2
with half of power. 03 = as above PD3
0x07
2. It measures the voltage of each PD 04 = as above PD4
sensor. 05 = as above PD5/I
3. Each PD ‘Slice’ voltage is calculated 06 = Un-able to
and preserved into the flash ROM. preserve the data to
Flash ROM normally
Motor Speed Test NEVER Run Test Run adjustment only once 00 = Pass
1. The NU-MCRW / NEMO is on the 01 =
Card Enable Mode after Power On. 02 = Card Jammed
2. Insert a Standard Card for Speed Test 03 = unable to
3. The NU-MCRW / NEMO takes in this measure (Out of
0x08 card and measures Speed card range)
movement.
4. And the NU-MCRW / NEMO indicates
this result on LEDs. (190mm/s
+2%/-2%)
Adjustment Start Sentinel Position NEVER Run Test Run adjustment only once 00 = Pass
1. The NU-MCRW / NEMO is on the 01 = not Standard
Card Enable Mode after Power On. Card or Read Error
2. Insert a Standard Card for the Start occur
Sentinel Adjustment. 02 = Card Jammed
0x09 3. The NU-MCRW / NEMO takes in this 03 = unable to adjust
card and measures Start Sentinel (Out of range)
Position. 06 = Un-able to
4. And the NU-MCRW / NEMO stores preserve the data to
adjustment data to Flash ROM and Flash ROM normally
indicates this result on LEDs.
No AMR – NP – 19458 – 01 34/
Cycle Test Mode
1.Accept card entry(The card must have NEVER Run Test Repeat Test Cycle until 00 = Pass
Mag Stripes) failure 01 = Accept Fail
2.Magnetic Write data(pattern A) check 02 = Mag Read Fail
( track #1, #2, #3) 03 = IC Set Fail
3.Magnetic Write data(pattern B) check 04 = ATR Fail
0x0A ( track #1, #2, #3) 05 = Release Fail
0x0E 4.Magnetic read bit check ( track #1, #2, 06 = Eject Fail
#3) 07 = Card Jam
5.Smart Card position set 08 = Write Error
6. Smart Card Power ON and receive
ATR
7. Smart Card Power OFF and release
8.Eject Card repeat
NOT ALLOWED NOT ALLOWED RED & GREEN LED
0x0B Reserved
Flash at 3Hz
0x0C Reserved
Flash at 3Hz
0x0D Reserved
Flash at 3Hz
0x0F Not defined NOT ALLOWED NOT ALLOWED
14. Appendix 5 : Specialist Service Tools
Tool Description Sankyo Part Number

Cleaning Card #68-76-02-51-8 DWG.No. EGCMC01881
Speed Card(SP-Card)
Sankyo P/N: G00A900A01
Start Sentinel Adjustment Card(SS-Card)
Width Switch Adjustment Card Sankyo P/N : ST-SW DWG.No. EGCMC0119)
φ2.1 PIN)
Shutter Switch Alignment Tool (φ Sankyo P/N: DMJ-AD-348-11
Shutter Solenoid Alignment Tool Sankyo P/N: DMJ-GA-149
IC Contact Position Card Sankyo P/N: S06A093A01

Scale and Tension Tool (Belt Adjust) N/A (use commercially available tool)
No AMR – NP – 19458 – 01 35/
The Last Page

MAINTENANCE MANUAL
Type Name :
ICT1Q8-1R0348
ICT3Q8-3A2348
Spec. No. AMR-NP-29052-01
Notes :
NSAC 1
No. of sheet
Distribution
B Change the Customer P/N P2,4,8,11,26~28 Y.Fujimori

Reference Document
Design Y.Fujimori 2016.12.26 EXPLODEDE DIAGRAM ： T10A084A01
Custody
SPARE PARTS LIST ： AMP-NP-19458-01

Det-che T.Watanabe 2016.12.26
Type Name Appro. H.Takeda 2016.12.26

No. S39Z-032-00-02F
No AMR – NP – 29052 – 01 1/ 32
Table of Contents
1. Introduction........................................................................................................................................ 2
1.2. Applicable limit of this maintenance manual ............................................................................. 2
2. Name of parts on NEMO(MFR) ........................................................................................................ 2
3. Periodical Maintenance ..................................................................................................................... 2
3. Periodical Maintenance ..................................................................................................................... 3
3.1. Maintenance by user ................................................................................................................. 3
3.2. Maintenance by Field service.................................................................................................... 3
4. Replacement steps of Maintenance parts ........................................................................................ 4
4.1. R/W Amp. Board Ass'y Replacement ....................................................................................... 5
4.2. Motor Ass'y Replacement ......................................................................................................... 7
4.3. R/W Head Guide Block Ass'y Replacement ............................................................................. 8
4.4 Guide Ass'y Replacement ........................................................................................................ 10
4.5 Bezel Ass'y Replacement......................................................................................................... 11
4.6 Pre-Head Ass'y Replacement .................................................................................................. 12
4.7 Timing Belt or Roller Replacement .......................................................................................... 13
5. Other Adjustments .......................................................................................................................... 15
5.1. SW1 Adjustment (Micro Switch for card detector) .................................................................. 15
5.2. SW2 Adjustment (Micro Switch for shutter) ............................................................................ 15
5.3. Shutter Solenoid Adjustment................................................................................................... 16
5.4. Pad-Roller Gap Adjustment .................................................................................................... 17
6. IC contact Block Ass'y Replacement .............................................................................................. 18
7. Trouble Shooting Flow Chart .......................................................................................................... 20
8. Stage1 PCB Ass'y Replacement .................................................................................................... 25
9. Appendix 1: Outside view of R/W Amp. Board ............................................................................... 26
10. Appendix 2: Marking of Shutter assembly .................................................................................... 27
11. Appendix 3: Boot Program Information......................................................................................... 27
11. Appendix 3: Boot Program Information......................................................................................... 28
11.1. Version .................................................................................................................................. 28
11.2. Boot Program Change Sheet ................................................................................................ 29
12. Appendix 4 : Switch Selectable Test ............................................................................................ 30
13. Appendix 5 : Specialist Service Tools........................................................................................... 32
No AMR – NP – 29052 – 01 2/
1. Introduction
1.1. Applicable models
Mag-stripe Head Ass’y. Resistors
Customer P/N Sankyo P/N IC JP1 JP2 JP3 Note
Tk1 Tk2 Tk3 Hi-Co
445-0764438A
B ICT3Q8-3A2348 R/W R/W R/W C C ○ ○ - +Std Shutter
445-0764439A ICT1Q8-1R0348 N/A R N/A N/A C - - +Std Shutter

B ○
009-0031368A S36A670A03 R/W R/W R/W C N/A - 3Tk Transport with Base
B ○ ○
009-0031369A S37A017A03 N/A R N/A N/A N/A - - Tk2 Transport with Base
B ○
B 009-0031370A S55A566A02 - - - - - - - - Standard Shutter
IC Block
009-0028982 S46A961A01 - - - - - - - - (Without SAM )
Stage 1 Function. PCB
009-0022328 SBW242901 - - - - - - - - (CIM/MM only)
998-0912563 S55A553A02 - - - - - - - - New Pre-HD
009-0031366A S58A297A01
(Covered)
R/W R/W R/W C N/A - - - Main PCB (3TK)
B S46A569D01
(NON-Covered)
009-0031365A S58A297A02
(Covered)
B N/A R N/A N/A N/A - - - Main PCB (TK2)
S46A569D02
(NON-Covered)
JP3 JP2 Sensor (LED) PCB

1.2. Applicable limit of this maintenance manual JP1
This manual is designed only for a person who maintains the listed products at the maintenance
service center or equivalent location.
DC Motor
2. Name of parts on NEMO(MFR) PCB (R/W AMP Board)
IC Contact Block
R/W Head
Pre Head
Stage1 PCB (Option)
Shutter Gate
Fig.2-1
No AMR – NP – 29052 – 01 3/
3. Periodical Maintenance
3.1. Maintenance by user
R/W Head cleaning
(1) The cleaning card (Specification #68-76-02-51-8 DWG.No. EGC219101) specified by Sankyo
must be used or NCR approved cleaning card. (Sankyo Part No EGC219101 = NCR Part No
497-0444494)
(2) Cleaning must be done with cleaning card when R/W error happens very often.
(3) If R/W error still happens after Head cleaning, clean the rollers.
3.2. Maintenance by Field service

Rubber roller cleaning
(1) Cloth penetrated with some alcohol liquid (recommendation: dehydrated ethanol) is used for
cleaning up the roller when the cleaning card is not effective. If you can't use some alcohol liquid
(recommendation: dehydrated ethanol), you can also wipe the roller with dry cloth.
(2) Cleaning should be done at periodical check (inspect).
Cleaning point of rollers
#3 Roller #2 Roller #1 Roller
DC Motor
Fig.3-2-1
No AMR – NP – 29052 – 01 4/
4. Replacement steps of Maintenance parts

(1) All maintenance parts are listed in the spare parts list and Exploded View drawing indicated below.
Customer P/N Sankyo P/N Spare parts List No. Exploded diagram No.
B 445-0764438A ICT3Q8-3A2348 AMP-NP-29052-01 T10A084A01
B 445-0764439A ICT1Q8-1R0348 ↑ ↑
B 009-0031368A S36A670A03 - -
B 009-0031369A S37A017A03 - -
B 009-0031370A S55A566A02 - -
009-0028982 S46A961A01 - -
009-0022328 SBW242901 - -
998-0912563 S55A553A02 - -
B 009-0031366A S58A297A01 - -
(S46A569D01) - -
B 009-0031365A S58A297A02 - -
(S46A569D02) - -
(2) Notes for maintenance.

There are two different kinds of values indicated in this manual; one is for adjustment and the other
is for check (inspect). Adjustment value is more rigid than check value. Please be sure to
distinguish those values.
No AMR – NP – 29052 – 01 5/
4.1. R/W Amp. Board Ass'y Replacement
<Disassembling>
(1) Remove screws, "l" shown in the Fig.4-1-1 from the board. (Ref.No.112).
(3) Replace the R/W Amp. Board Ass'y.
AMP Board Ass’y
Cover
Screw (l)
Fig.4-1-1
<Assembling>
(1) Assemble in the reverse order of the above disassembling.
(2) To fasten screws, "l" at 35 N⋅cm(3.5Kgf⋅cm)

First, turn off power of the NEMO(MFR). Set the DipSwitch(DSW2) that is on the main PCB to
No.7(hex). Turn on power again. The NEMO(MFR) checks each sensor level and adjusts slice level
automatically. Adjusted values are stored to flash ROM. After performance of storing, the Red LED
blinks 0.5Hz cyclically, and the Green LED indicates Test ID(7 hex) number with blinking.
If it fails during adjustment and storing, error number is displayed on the Green-LED. (Please see
Appendix of following)
Note:
1) Adjustment and Check must be done without any presence of card.
2) For the detailed procedures when sensor check is fail, please refer to Page 10.
3) After check and adjustment, please turn off power of the NEMO(MFR) and set to 0(hex) the
dipswitch.
No AMR – NP – 29052 – 01 6/
NOTE: Standard Card for Check Motor Speed and for Adjustment of SS Position
This card has very correct interval of each magnetic stripe on this card, plus this card has very correct
SS position. You can order this card as <<Sankyo P/N: G00A900A01>>.
Please don't attempt to write to these cards as they will then be invalid.
B. Card Speed Check

This check needs the SP-Card.
No.8(hex). Turn on power. Then insert this card to the NEMO(MFR). The NEMO(MFR) accepts this
card, reads magnetic data and ejects this card.
In that time, the NEMO(MFR) calculates speed. After this performance, the Red LED blinks 0.5Hz
cyclically, and the Green LED indicates Test ID number(8 hex) with blinking.
If this speed is out of range, error number is displayed on the Green-LED. (Please see Appendix of
following)

This check needs the SS-Card.
No.9(hex). Turn on power. Then insert this card to the NEMO(MFR). The NEMO(MFR) accepts this
card, reads magnetic data 4 times and ejects this card.
In that time, the NEMO(MFR) measures position of Start Sentinel and calculates the adjustment
value.
Adjusted values are stored to flash ROM. After performance of storing, the Red LED blinks 0.5Hz
cyclically, and the Green LED indicates Test ID(9 hex) number with blinking. If it fails during
adjustment and storing, error number is displayed on the Green-LED. (Please see Appendix of
following)
NOTE:
After check and adjustment, please turn off power of the NEMO(MFR) and set to 0(hex) the
dipswitch.
No AMR – NP – 29052 – 01 7/
4.2. Motor Ass'y Replacement
<Disassembling>
(1) Remove the R/W Amp. Board per the instruction of 4.1.
(2) Remove screws, "e" fixing the motor and replace the motor.
(3) Replace Motor Ass'y
Motor Ass’y Screw (e)
Screw (e)
δ
A
10~30gf ： A ≈ B
Fig.4-2-1
<Assembling>
<Check Points>
A. Belt Tension
(1) Loosen screws, "e" and to adjust belt tension.
At this time, the belt must have flexibility, δ by 0.6mm at the mid-point (A ≈ B) and its flexibility δ
requires the load ranging 10~30gf.
(2) To fasten screws, "e" at 74N⋅cm (7.5kgf⋅cm) and check if the belt has appropriate flexibility or not.
If not sufficient or excessive, readjustment must be required.
If appropriate, put any kinds of mark on those screw heads indicating adjustment has been done.
*Required tool: Scale and tension gauge
B. Card Speed Test

Please see page 6 (B. Card Speed Check).
C. R/W operation
Check if R/W operation has been done without any problems.
No AMR – NP – 29052 – 01 8/
4.3. R/W Head Guide Block Ass'y Replacement
<Disassembling>
(1) Remove the R/W Amp. Board (Ref.No.112) per the instruction of 4.1.
(2) Remove the Bezel Ass'y (Ref.No.105).
(3) Remove 3 screws from R/W Head guide block and a screw, "l" under flexible printed cable of the
Head (see Fig.4-3-1).
(4) To replace R/W Head Guide Block Ass'y (Ref.No.4).
Screws
② Screw (f)
B
Bezel Ass’y
NCR P/N: 009-0031370A Screws (l)
R/W Head Guide Block Ass’y

① Screw (f)
Fig.4-3-1
<Assembling>
(2) Assemble Bezel Ass’y in order of ① screw (f) and ② screw (f).
(3) To fasten screws, "l " at 24N･cm(2.5Kgf･cm) and screw, "f" at 74 N･cm(7.5Kgf･cm).
No AMR – NP – 29052 – 01 9/
<Check points>
Please refer to “Sensitive of the photo-detectors” of 4.1 R/W Amp. Board Ass’y.
B. Card Speed Test

Please see page 6 (B. Card Speed Check).

Please see page 6 (C. Start Sentinel Position Check and Adjustment).
D. Track Skew
Check if the track skew on each magnetic data is staying within the range specified as below.
Track Midpoint of track from edge of card Skew

ISO Tr.1 7.060mm ± 0.2mm ±20'
ISO Tr.2 10.365mm ± 0.2mm ±20'
ISO Tr.3 13.920mm ± 0.2mm ±20'
Mid point of track = (A+B)/2

A
B
Fig.4-3-3
E. R/W operation
Check if R/W operation has been done without any problems.
No AMR – NP – 29052 – 01 10/
4.4 Guide Ass'y Replacement
<Disassembling>
(2) Remove the Bezel Ass'y (Ref.No.105) and R/W Head guide block Ass'y (Ref.No.4) per the
instruction of 4.3.
(3) Remove screws shown in the Fig.4-4-1 from the Guide Ass'y upper side (Ref.No.108).
(4) Replace Guide Ass'y.
Guide Block Ass’y
Fig.4-4-1
<Assembling>
(2) To fasten screws at 74 N⋅cm(7.5 Kgf⋅cm)
<Check points>
A. Sensitivity of the photo-detectors
(Please refer to “Sensitive of the photo-detectors” of 4.1 R/W Amp. Board Ass’y.)
B. R/W operation
(1) Check if R/W operation has been done without any problems.
No AMR – NP – 29052 – 01 11/
4.5 Bezel Ass'y Replacement

<Disassembling>
(2) Remove the Bezel Ass'y.
B
Bezel Ass’y
NCR P/N: 009-0031370A
① Screw (f)
② Screw (f)
Fig.4-5-1
<Assembling>
(1) Assemble Bezel Ass’y in order of ① screw (f) and ② screw (f).
(2) To fasten screw, "f" at 74 N･cm(7.5Kgf･cm).
No AMR – NP – 29052 – 01 12/
4.6 Pre-Head Ass'y Replacement
<Disassembling> Screw (m)

M64A724A01
(4) Remove screws shown in the Fig.4-6-1. Pre Head Ass’y
M65A360A01
Fig.4-6-1
<Assembling>
Assemble in the reverse order of the above Disassembling.
<Check points>
A. Head mounting
Ensure Pre-Head position to be set as indicated below and fix the screw, "m".
A B
A≈B
Fig.4-6-2
B. Amplifier output
Confirm if the Pre-Head is detected the card of 5% Amp.
*Required tool: card encoded on only track #2 of 5% Amp.

No AMR – NP – 29052 – 01 13/
4.7 Timing Belt or Roller Replacement

<Disassembling>
(1) Remove the R/W Amp. Board Ass’y per the instruction of 4.1(See Page.5).
(2) Lose "Screw" and decrease the tension of Belt.
(3) Remove Timing Belt “7”.
(5) Remove the retaining rings “i” and “k” fixing shaft.
(6) Pull out Pulley Ass’y to the direction shown with the arrow in the figure.
(7) Remove Timing Belt “6” and Roller“2” and Roller“5”.
(8) Replace Belt or Roller, and then assemble in the reverse order of the above disassembling.
Note
(1) Pay attention to insert locking pin into Roller “5”.
(2) Fit the tooth form of Timing Belt “6” and Timing Pulley when assembling.
(3) There is the possibility of the deformation of Retaining Ring “i” and “k” by removing.
g k i
2
i E-Ring
CE-Ring
Screw k
g
h
P/N.KYG214502 5
Timing Belt 6
P/N.M30A624A03
5 Rubber Roller
Pin
2
P/N.S28A731A02
Capture Roller
Timing Belt 7
P/N.KYG212912 Screw
Fig.4-7-1
4.8 Capture Roller #1 to #3 Replacement
<Disassembling>
(2) Remove the retaining rings “i” and “k” and Poli-Slider "h" fixing shaft.
(3) Pull out Pulley Ass’y to the direction shown with the arrow in the figure (Fig.4-8-1).
(4) Remove #1Roller“2” to #3Roller“2”.
(5) Replace Capture Roller, and then assemble in the reverse order of the above disassembling.
Note
(1) There is the possibility of the deformation of Retaining E-Ring “i” by removing.
(2) Please tighten screw "g" with 54N･cm(5.5kgf･cm) when you exchange capture roller "2".
(P/N.S28A731A02 #1Roller to #3Roller)
No AMR – NP – 29052 – 01 14/
i E-Ring
Screw
Screw tightening torque：54N・cm g h Poli-Slider
k CE-Ring
2 #3 Roller
P/N.S28A731A02 g
Capture Roller
#1 to #3
2 #2 Roller
Pull out Pulley Ass’y 2 #1 Roller
M14A957A01
Fig.4-8-1
<Adjustment>
(1) Loose Screw and add the pressure between 400 and 450 gf to the position of Tension Pulley
shown in Fig. 4-8-2.
(2) Fix Screw under the condition that the above-mentioned pressure is added.
Note) In case of no tension gage for adding the pressure, mark the fixing position before the
replacement and fix Screw to fit the position to the mark when replacement.
3.9-4.4N (400-450gf)
Screw
Fig.4-8-2
No AMR – NP – 29052 – 01 15/
5. Other Adjustments
5.1. SW1 Adjustment (Micro Switch for card detector)
(1) Insert the ST-SW card (No. EGCMC0119) into card throat slowly. When the position B of ST-SW
card contacts micro switch actuator (see Fig.5-1-1), a click sound will come from the switch. This
sound shows the SW1 detected the card (SW1 ON). At this position, fasten the adjusting screws
for SW1.
(2) Next, draw out the ST-SW card a little bit. A click sound will come from the SW1 again when
position A of the ST-SW card comes by the micro switch actuator. This sound indicates the switch
turned OFF.
(3) Confirm if the SW1 works correctly at each ST-SW card position.
*Required tool: ST-SW card (No. EGCMC0119)
Adjusting Screw for SW1
ST-SW Card
SW1 Lever DWG No.EGCMC0119
Position A (52.7mm)
Position B (53.5mm)
Fig.5-1-1
5.2. SW2 Adjustment (Micro Switch for shutter)
(1) Hold the shutter plate at the position where a shaft (φ1.5 ± 0.02) can go through the hole, X
indicated in the Fig.5-2-1.
(2) Adjusting screws for SW2 are shown below under pushing the solenoid toward the direction ‘’G’’.
(3) Adjust the SW2 at the position where SW2 turns ON (OFF→ ON) Fig.5-2-2.
(4) Confirm if SW2 turns OFF when Shutter hole agree with Bezel hole, X indicated in the Fig.5-2-1.
Bezel
X Lever Detail X
ON OFF
G
φ1.5 PIN
Sankyo P/N; Fig.5-2-1
DMJ-AD-348-16
Adjusting Screws for SW2
Fig.5-2-2
No AMR – NP – 29052 – 01 16/
5.3. Shutter Solenoid Adjustment

When replacing shutter solenoid, the following adjustments are required.
(1) The plunger of solenoid must be operated full stroke.
(2) Fix the solenoid at the position where a shaft (φ2.1 ±0.01: DMJ-AD-348-11) can go through the
hole, Y indicated in the Fig.5-3-1.
(3) Adjusting screws for shutter solenoid are shown below under pushing the solenoid toward the
direction ‘’G’’.
(4)Then remove a shaft (DMJ-AD-348-11).
(5)Then adjust SW2 again (see 5.2 SW2 adjustment).
Detail Y
Φ2 PIN
DMJ-AD-348-11 G
Adjusting Screws for Solenoid
Plunge
Fig.5-3-1
(6)Confirm of Solenoid Position

At first, bezel assembly maintain upside down shown in Fig.5-3-2.
The plunger of solenoid must be at the full sucking position.
Tooling (DMJGA149) put on the lower bezel shown in Fig. 5-3-3.
The shutter plate should touch the shutter tool when move
the plunger of solenoid full stroke.
Shutter Tool
DMJGA149
Shutter Plate
Fig.5-3-2 Fig.5-3-3
No AMR – NP – 29052 – 01 17/
5.4. Pad-Roller Gap Adjustment
(1) Loosen the attachment screws, "f", and then fasten screws, "f" at the position where the Gap A and
the Gap C looks equal to each other.
(2) Adjust the Gap A and C with nut, "b" to be at 0.0mm~0.1mm.
(3) Confirm if a card (its thickness = 0.25mm) can transport back and forth.
Gap C Gap A
Screws (f) Nut (b)

Fig.5-4-1
No AMR – NP – 29052 – 01 18/
<Disassembling> Emboss position at attachment

(1) Remove the board (Ref. No.112) per the instruction of 4.1
(2)Remove screws from IC Contact Block Ass'y.
(3) Replace IC Contact Block Ass'y.
IC Contact Block
P/N: 009-0028982
Fig.6-1
<Assembling>
(2) Attach the Block pushing to direction of A.
(4) The Smart Card Block includes a label that has the new EMV number. Please stick a new label on
the following area.
(Please understand there is a condition that we do not need to update the number.)
EMV ※※
※※※※※※
EMV ※※
Fig.6-2 ※※※※※※ This is the new Label
No AMR – NP – 29052 – 01 19/
<Adjustment check>
(1) IC contact position adjustment card.
IC Contact Position Adjustment Card

IC Card
Fig.6-3
(2) Turn off power of the NEMO(MFR). Set the DipSwitch(DSW2) that is on the main PCB to
No.0A(hex). Turn on power. Then insert a card to the NEMO(MFR). This card is Smart Card and it
has Magnetic data on the card. Please be careful when this test is performed, because the
NEMO(MFR) writes data to Magnetic.
(3) The NEMO(MFR) accepts this card, performs WriteCheck and ReadsCheck, communicates to the
SmartCard and ejects this card. If it fails, the NEMO(MFR) stops check and ejects this card and
displays error number.
(4) If the SmartCard error occurs, then go to Re-adjustment.
Re-Adjustment:
i) Shift the Smart card Block assembly a little bit to the left, then attach the Block.
ii) Follow the instruction (2) ~ (4) again.
O.K.→ finish (Set PCB to fasten screws.)
Error → exchange the Block and readjustment
No AMR – NP – 29052 – 01 20/
7. Trouble Shooting Flow Chart

The NEMO(MFR) is able to check almost own functions by Switch Test of No.0A.
Turn off power of the NEMO(MFR). Set the DipSwitch(DSW2) that is on the main PCB to No.0A(hex). Turn on
power. Then insert a card to the NEMO(MFR). This card is Smart Card and it has Magnetic data. Please be
careful when this test is performed, because the NEMO(MFR) writes data to Magnetic.
The NEMO(MFR) accepts this card, performs WriteCheck and ReadCheck, communicates to the SmartCard
and then ejects this card. If it fails, the NEMO(MFR) stops check and ejects this card and displays error
number on LEDs.
If this NEMO(MFR) doesn't have any WriteTracks, then the NEMO(MFR) doesn't do Write test.
If this NEMO(MFR) doesn't have the IC block, then the NEMO(MFR) doesn't do SmartCard test.
START the Switch Test No.0A.
Card Insertion
No
1. Shutter open? Go to Bezel Ass'y diagnosis
Yes
2. Card captured normally? No Go to card Transport diagnosis
Yes
3. Data Write normally? No Go to data Write diagnosis

Yes
4. Data Read normally? No Go to data Read diagnosis
Yes
5. SmartCard communicates normally? No Go to ICB readjustment

Yes
6. Card No
Go to card Transport diagnosis
ejected?
Yes
END
NOTE:
If a fail occurs and you have to check each item and repair it, then you should go to each direction.
But you don't have to check and repair it, please jump over those processes and change all of those
parts.
No AMR – NP – 29052 – 01 21/
Bezel Ass'y Diagnosis

Recovered
No NG
SW1 signal (point A) SW1 needs adjustment
Check ON/OFF or replacement
Yes (see p.15)
Recovered
Pre-Head signal (point GP) NG

Pre-Head needs
Check ON/OFF
adjustment or
Yes replacement(see P.12)
Recovered
NG
Solenoid Sol. needs adjustment
section signal (point D) or replacement(see p.16)
Check ON/OFF
Yes Recovered
NG
SW2 signal (point C) SW2 needs adjustment
Check ON/OFF or replacement(see p.15)
Yes
Bezel Ass'y
Replacement
END
No AMR – NP – 29052 – 01 22/
Transport Diagnosis
Recovered
Sensor ON/OFF Check Sensor R/W Amp. Board Ass'y

Points: No adjustment No Replacement(see p.5)
F1 for PD1 (see p.5) and/or Guide Ass'y
F2 for PD2 Replacement
F3 for PD3 (see p.8,10)
F4 for PD4
Fi for Pdi
Yes
Recovered
Motor ON No Motor Replacement No R/W Amp. Board Ass'y

Check and adjustment(see p.7) Replacement(see p.5)
Point E
Yes
Recovered
Slipping No Cleaning roller No Roller Gap adjustment

Roller #1～ #3 (see p.3) (see p.17)
Yes
END
No AMR – NP – 29052 – 01 23/
Read Diagnosis
Amplifier Output
Point: R/W Amp. Board Ass'y
G1 for TR#1 Replacement(see p.5)
G2 for TR#2
G3 for TR#3
(mV0-p)
Tk2 3Tk(Hi-Co Card)
Yes TR#1 - 170±46%
TR#2 250±43% 190±49%
TR#3 - 170±46%
First read when it is set to three times the number of retries.
Amplifier output level Check No
Yes
Card Speed No
(Do Switch Test No.8)
Yes
END
No AMR – NP – 29052 – 01 24/
Write Diagnosis
Recovered
Write Current Check

Point: No R/W Amp. Board Ass'y
H1: for TR#1 Replacement(see p.5)
H2: for TR#2
H3: for TR#3
Yes
Recovered
Read after Write R/W Head Guide

Amplifier Output Lever Check No Block Ass'y
Replacement
More than
(see p.10)
Yes
Recovered
Card Speed No R/W Amp. Board Ass'y

(Do Switch Test No.8) Replacement(see p.5)
Recovered
SS Position Adjustment SS
(Do Switch Test No.9) No Adjustment No R/W Amp Board Ass'y
(see p.6) Replacement(see p.5)
END
No AMR – NP – 29052 – 01 25/
8. Stage1 PCB Ass'y Replacement

Stage1 PCB Ass’y
<Disassembling> P/N: 009-0022328
(1) Remove screws from Stage1 PCB Ass’y (see Fig.8-1). Sankyo P/N: SBW242901
(3) Replace the Stage1 PCB Ass'y
Fig.8-1
<Assembling>
(2) To fasten screws at 74 cN⋅m(7.5 Kgf⋅cm)
No AMR – NP – 29052 – 01 26/
9. Appendix 1: Outside view of R/W Amp. Board
Customer P/N Sankyo P/N Parts List No.

445-0764438A ICT3Q8-3A2348 S58A297A01
B
(S46A569D01)
B 445-0764439A ICT1Q8-1R0348 S58A297A02
(S46A569D02)
Point E(Forward)
Point E(Backward)
IC301
Point D(2pin)
J301
Point C(4pin)
Point A(6pin)
GND
TPF2F
GND TPS
TPAMP
Point GP Point F1
Point F2 Point G1
Point F3 Point G2
Point F4 Point G3
Point Fi
No AMR – NP – 29052 – 01 27/
10. Appendix 2: Marking of Shutter assembly
Label of shutter assembly

B
MEEI Cover
Screening Throat material Note
009-0031370A without N-5UR Compliant’RoHS’
P/N S55A566A02 A
No AMR – NP – 29052 – 01 28/
11. Appendix 3: Boot Program Information

11.1. Version
445-0764438A 445-0764439A
ICT3Q8-3A2348 ICT1Q8-1R0348
B B
Main PCB Boot Main PCB Boot
Total Rev. /. Revision Total Rev. /. Revision
Revision Electric Rev 02516- Revision Electric Rev 02516-
S46A569D01 B S46A569D02 B
A 84 03B A 94 03B
No AMR – NP – 29052 – 01 29/
11.2. Boot Program Change Sheet
REV DATE
PARAGRAPH
03B Newly

No AMR – NP – 29052 – 01 30/
12. Appendix 4: Switch Selectable Test
TABLE A: Illustrates the LEDs flash sequence for Switch Selected Test fail condition.
Red
Green
Start Interval
Middle Interval
End Interval
Next
Start Interval
Off Interval
On Interval
Pulse
Pulse
Start Next
Test ID Code Middle Mark Error/Pass Code
End Mark
Mark Start Mark
The above diagram details how the Green LED is to indicate Test ID and error code and test
number. The following interval times are to be used:
Interval Time (milliseconds)

Start Interval (On) 2,000
Middle Interval (Off) 1,000
End Interval (Off) 1,000
Pulse On Interval 250
Pulse Off Interval 250
Table B: Illustrates the LEDs flash sequence for a Selected test in the Pass condition.
ON
Red
OFF
Test ID
ON
Start Interval Middle & Error Code & End(Off
Green
OFF for approx 1+1+1sec)
Red LED: Flashing 0.5Hz

Green LED: Displaying Test Code and Error number
Test Description POST MODE SELECTED MODE Test Result

ID (Pass/Error Code)
hex
Motor Test: Run Test only Once. Repeat Test Cycle until
1.Motor Forward 190mm/s (approx. 1 If card is detected in Throat failure 00 = Pass
sec) or Reader 01 = CPU can’t get
2.Motor Backward 190mm/s (approx. 1 (but not in Position 7); Operator must ensure encoder pulse
sec) a) track card movement there is no card is present 02 = Card Jammed
0x01 3.Motor Stop (2 seconds) ensuring that card remains in reader. 03 = A card is in the
For POST, if a card/object is detected in in reader. reader.
Position 7 (Width Switch & Shutter b) on completion leave card This test can’t be
Open), DO NOT fail test. in Card Position 6 performed with card in the
(see note (i) in ‘Detect and Reader
Test Hardware’ )
No AMR – NP – 29052 – 01 31/
Smart Card Signal Test: IF (IC PRESENT) 00 = Pass
I/O line, Reset and Vcc of ICC are Run Test only Once Repeat Test Cycle until 01 = Short Circuit
toggled. failure 02 =
1.VCC (5V mode) ON (1 second) The CPU can only detects 03 =
0x02 2.All OFF (1 second) Excess current. 04 =
3.VCC (3V mode) ON(1 second) The CPU can detect just 05 =
4.All OFF(1 second) the excess current.
The maintenance man
should check these (I/O,
Reset and VCC) signal
SAM1 Signal Test: IF (SAM PRESENT) levels. 00 = Pass
Run Test only Once 01 = Short Circuit
I/O line, Reset and Vcc of SAM are (SAM1).
0x03 toggled. The CPU can only detects 02 = SAM2 as above
1.VCC (5V mode) ON (1 second) Excess current. 03 = SAM3 as above
2.All OFF (1 second) 04 = SAM4 as above
05 = SAM5 as above
Clear FROM (Do not clear NCR File).
Clear All Program Area NEVER Run Test Run Test only Once 00 = Pass
(0x8000~0x7FFFF) 01 = Unable to clear
0x04 On next boot the NEMO(MFR) will enter 02 =
download mode. This function makes
the Flash ROM of the NEMO(MFR) to
the condition of shipping from Sankyo.
Shutter Test: Run Test only Once Repeat Test Cycle until
This function makes shutter open and failure
close (Shutter will appear only to 00 = Pass
1.Shutter Open 2 seconds. (POST 0.1 ‘Twitch’) Ensure there is no card is 01 = Shutter Open
secs.) present in reader. 02 = Shutter Closed
0x05 2.Shutter Close 2 seconds. (POST 0.1 If Card is in Position 7 DO This test can’t be 03 = Sweep error 1
secs.) NOT run test. performed with card in the 04 = Sweep error 2
For POST, If Card is in Position 7 DO Reader 05 = Sweep error 3
NOT run test. IF (Hi-SECURITY THROAT 06 = Sweep error 4
If the Hi-Security Throat is present then PRESENT) Run Sweep 07 = Sweep error 5
a full ‘Pre-Sweep’ cycle is executed. Test Once
IC Block Solenoid and Sensor Test: Repeat Test Cycle until
Run Test only Once failure 00 = Pass
1. IC Block Down 2 seconds. (POST 0.5 () (Do not run test 02) 06 = Movement error
0x06
secs)
2. IC Block Up 2 seconds. . (POST 0.5
secs)
PD Sensor Slice Level Adjust Test. 00 = Pass
NEVER Run Test Run Test only Once 01 = Calculated value
1. The NEMO(MFR) turns on all position out of range for PD1
Photo Diode (PD) sensor LED’s with half 02 = as above PD2
of power. 03 = as above PD3
0x07
2. It measures the voltage of each PD 04 = as above PD4
sensor. 05 = as above PD5/I
3. Each PD ‘Slice’ voltage is calculated 06 = Un-able to
and preserved into the flash ROM. preserve the data to
Flash ROM normally
Motor Speed Test NEVER Run Test Run adjustment only once 00 = Pass
1. The NEMO(MFR) is on the Card 01 =
Enable Mode after Power On. 02 = Card Jammed
2. Insert a Standard Card for Speed Test 03 = unable to
0x08 3. The NEMO(MFR) takes in this card measure (Out of
and measures Speed card movement. range)
4. And the NEMO(MFR) indicates this
result on LEDs. (190mm/s +2%/-2%)
Adjustment Start Sentinel Position NEVER Run Test Run adjustment only once 00 = Pass
1. The NEMO(MFR) is on the Card 01 = not Standard
Enable Mode after Power On. Card or Read Error
2. Insert a Standard Card for the Start occur
Sentinel Adjustment. 02 = Card Jammed
0x09
3. The NEMO(MFR) takes in this card 03 = unable to adjust
and measures Start Sentinel Position. (Out of range)
4. And the NEMO(MFR) stores 06 = Un-able to
adjustment data to Flash ROM and preserve the data to
indicates this result on LEDs. Flash ROM normally
No AMR – NP – 29052 – 01 32/
Cycle Test Mode
1.Accept card entry(The card must have NEVER Run Test Repeat Test Cycle until 00 = Pass
Mag Stripes) failure 01 = Accept Fail
2.Magnetic Write data(pattern A) check 02 = Mag Read Fail
( track #1, #2, #3) 03 = IC Set Fail
3.Magnetic Write data(pattern B) check 04 = ATR Fail
0x0A ( track #1, #2, #3) 05 = Release Fail
0x0E 4.Magnetic read bit check ( track #1, #2, 06 = Eject Fail
#3) 07 = Card Jam
5.Smart Card position set 08 = Write Error
6. Smart Card Power ON and receive
ATR
7. Smart Card Power OFF and release
8.Eject Card repeat
0x0B Reserved
Flash at 3Hz
0x0C Reserved
Flash at 3Hz
0x0D Reserved
Flash at 3Hz
0x0F Not defined NOT ALLOWED NOT ALLOWED
13. Appendix 5: Specialist Service Tools
Tool Description Sankyo Part Number

Cleaning Card #68-76-02-51-8 DWG.No. EGCMC01881
Speed Card(SP-Card)
Sankyo P/N: G00A900A01
Start Sentinel Adjustment Card(SS-Card)
Width Switch Adjustment Card Sankyo P/N : ST-SW DWG.No. EGCMC0119)
φ2.1 PIN)
Shutter Switch Alignment Tool (φ Sankyo P/N: DMJ-AD-348-11
Shutter Solenoid Alignment Tool Sankyo P/N: DMJ-GA-149
IC Contact Position Card Sankyo P/N: S06A093A01

Scale and Tension Tool (Belt Adjust) N/A (use commercially available tool)

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1. EXPLANATION OF CONTENT OF CHANGE.

Application model: Application model:

Application model: Application model:

2. CHANGE IN NUMBER OF VERSIONS

OUTSIDE_DRAWING, SPECIFICATION, and MAINTENANCE MANUAL revisions are changed as below.

T09A634A01 445-0764437A ICT1Q8-1R0347 AE → AF

T14A530A01 445-0764438A ICT3Q8-3A2348 A4 → A5

T14A621A01 445-0764439A ICT1Q8-1R0348 A4 → A5

--- The end of the document ---

Spec. No. ASR-NP-19458-01

K Change the Customer P/N P6 Y.Fujimori

D Correct Ver.C P6, P12, P25 EB-16128-01 June.4.2012 Akahane K.Higashi

Change of R/W IC P5,6,12,14,

13.7 Note 7. Boot Program and Main PCB (Electric) Revision. 37

Note: Changes/corrections in this specification are referenced to the revision

REV. DESCRIPTION OF CHANGE

F F 20/July/’12 P37 Upgrade of Boot revision F. Akahane

G ▪ Connect and control Hedgehog (Anti Fishing) unit

Customer P/N Head Assy.

E 009-0025446 S36A625A01 IC Block

J 998-0912563 S36A626A02 - - - - - - - - New Pr e-HD

C 009-0028186 (New) MEEI

R : Read only R/W : Read and Write ○Short circuit C : Connected

JP3 JP2 JP1 Sensor (LED) PCB

This picture is showing the head assembly.

C NOTE: MEEI and its circuit are option. If you need

3.1.2 Mag.-stripe Read/Write

▪ Number of first omits bit : 20bits

3.1.3 Interface (Between the HOST and the NU-MCRW / NEMO)

3.1.4 Pre-head detect

3.1.6 Enhanced Card Drive (ECD)

1) Motor life on ECD mode

1-2) ECD enabled for maximum of 40% of entry

2) The performance of card take-in.

1) Card Return Operation On Power Fail (CROPF) :

Timer 120sec Typical

BATOFF (from CPU)

NOTE: A 15ms debounce filter in software is performed before PowerFail is registered.

2) Card Return On Disconnect Circuit diagram of Hardware:

Detect Falling Edge

3) USB CROSE0(Long SE0) Mechanism

60852A (H8/3048B) ( SE0 )

Bus Reset Assert

4) USB Card Return On Retiral Mechanism

If A Bus-Reset-Assert happens during Normal Operation, Enumeration should

3.1.8 IC card Read/Write

3.1.9 Media Entry and Exit Indicator (MEEI)

3.1.10 Latch Fast Card Capture Bin

3.1.11 Magnetic Stripe Read using Digital Decoding

3.2 Stage-1 Function

Pin No. Signal name Pin No. Signal name

Content of Stage1 CIM/MM Assembly

4.4 Power requirement

4.4.2 MEEI Power

C NOTE: MEEI and its circuit are option. If you need

4.5 Card feed speed

4.6 Card feed time

4.7 Card eject length (ISO standard card used)

4.8 Dielectric strength

4.9 Insulation resistance

4.10 Mechanical noise