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Panasonic HEPER R-1755M: High Heat Resistance Multilayer

Material for Automotive Components
Whatever material you use for your PCB fabrication plays a huge role in determining
its performance. Back then, the FR4 material was a well-known and common
one. However, with high performance designs, it is very crucial to use the
appropriate laminate. This is why it is now necessary to make use of a material that
features great properties. This will not only ensure great performance, but it will also
enhance functionality in applications

A material’s environmental stability is a very important factor to consider when

choosing a material. For the purpose of this article, we will be focusing on the
Panasonic HEPER R-1755M and what it offers. Stay on this page and you’ll surely
learn a lot.

Table of Contents

What is the Panasonic HEPER R-1755M Circuit

Board Material?

The Panasonic HEPER R-1755M is a great material for multilayer circuit boards. This
is because it has high reliability and heat resistance.

Furthermore, this material is great for environments of high usage with great CAF
resistance, laminate processability, and through-hole reliability. In addition, this
material is halogen-free. This means that there are no halogen components in this
material. This is good because halogens like bromine and fluorine could be harmful.

This material due to its great properties and features is highly useful in automotive
components. Let’s continue with this article by discussing the main properties of this
material.

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What are the Properties of the Panasonic HEPER

R-1755M?

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The following are the properties of the Panasonic HEPER R-1755M.

Glass Transition Temperature

Using the DSC test method, the Panasonic HEPER R-1755M has a glass transition
temperature of 153 degrees Celsius. Glass transition temperature has to do with the
temperature where the material turns amorphous when laminating under pressure and
at a high temperature. This temperature isn’t the maximum at which this pcb
material operates, but the maximum at which it can endure within a short period
before deteriorating.

Thermal decomposition

Using the TG/DTA test method, the thermal decomposition of the Panasonic HEPER
R-1755M is 355 degrees Celsius. Thermal decomposition reveals that temperature
whereby the Panasonic HEPER R-1755M chemically decomposes. Here, this material
loses about 5% of its mass weight. Furthermore, thermal decomposition requires an
endothermic reaction, because there is a need for heat in order to break the chemical
bonds of the material.

Coefficient of Thermal Expansion

At the X and Y axis at α1, the Panasonic HEPER R-1755M has a CTE value of 11 –
13 ppm/℃ and 13 – 15 ppm/℃ respectively. Furthermore, at the Z-axis and α1, it has
a CTE value of 40 ppm/℃, while at α2, its CTE is 240 degrees Celsius. The
coefficient of thermal expansion indicates how much a material can expand when it is
heated.

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Dielectric Constant

The Panasonic HEPER R-1755M has a dielectric constant of 4.6 at 1 GHz. This
property measures a material’s ability to store some electrical energy in a given
electric field.

Dissipation Factor

The dissipation factor of the Panasonic HEPER R-1755M PCB material is 0.014 at 1
GHz. This value indicates the Panasonic HEPER R-1755M PCB material’s efficiency
to act like an insulator. Furthermore, the Panasonic HEPER R-1755M PCB material

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has a low dissipation factor, which means that it is very efficient as an insulating
material.

Water Absorption

The water absorption of the Panasonic HEPER R-1755M is 0.11%. This value is great
being that when a PCB material absorbs water and moisture, it can lead to different
failure mechanisms. When used in printed circuit boards it means it has the ability to
prevent water or moisture from finding its way in, thereby causing the device to stop
working.

Flexural Modulus

The flexural modulus of the Panasonic HEPER R-1755M is 22 GPa. Flexural

modulus is a well-known physical property that denotes the ability for the Panasonic
HEPER R-1755M to bend. Mechanically, we can explain further by saying it is the
ratio of the stress to the strain when bending or flexural deformation is going on. This
is equivalent to a material’s elastic modulus.

Peel Strength

The peel strength of the Panasonic HEPER R-1755M is 1.5 kN/m. A material’s peel
strength has to do with the material’s bond strength. To know the peel strength, a peel
test is conducted. Here you pull the materials apart at a constant speed. Now, this
average force necessary to pull this material apart is then used with the bond’s width
measurement which determines the peel strength.

Delamination Time

The Panasonic HEPER R-1755M has a delamination time of 18 minutes. This is the
time whereby the copper and resin, or reinforcement and resin separates or
delaminates.

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What Benefits Does the Panasonic HEPER R-1755M

Offer?

Before are the benefits of the Panasonic HEPER R-1755M.

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Low loss material

One well known issue of high frequency PCB application is loss of signal. This is one
good reason why it is very important to use materials like the Panasonic HEPER
R-1755M having low transmission loss. Another great benefit here is that it ensures
high data transmission. Also, the Panasonic HEPER R-1755M is ideal for use in the
communication industry.

Environmentally safe

As mentioned earlier, halogen is a toxic material and it is very harmful to humans and
the environment. The Panasonic HEPER R-1755M is free of halogen
constituents. Therefore, it is environmentally safe.

High heat-resistance

Panasonic HEPER R-1755M material resists high heat. With this, you’ll achieve a
reliable operation. Also, this multilayer PCB material ensures high reliability in
environments of high temperature. The thermal properties of this material contribute
to this feature.

Great performance

This is another benefit of using the Panasonic HEPER R-1755M laminate for PCB
fabrication. This material performs well both electrically and thermally. Also, this
material is electrically stable over a wide frequency range.

Conclusion

The Panasonic HEPER R-1755M material is one with a lot of great properties. It is a
great material for multilayer circuit boards. This is because it has high reliability and
heat resistance. Furthermore, this material is great for environments of high usage
with great CAF resistance, laminate processability, and through-hole reliability. If you
have any questions, please ask us here.

Related Posts:

1. What Is Panasonic HEPER R-1755D: The High Heat Resistance (High-Tg)

Multi-Layer Circuit Board Material?

2. Panasonic HEPER R-1755E – High Heat Resistant PCB Material for

Multilayer Boards

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3. High Thermal Conductivity PCB Material Will Solve The Heat

Dissipation Problem

4. Why is the Panasonic R-F705S Useful for Mobile and Automotive

Products?

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