RAYMING PCB & ASSEMBLY

Taconic EZ-IO-F: The Next Generation Spread Weave Laminate

As a printed circuit board designer, you must think ahead to stay ahead of the
competition. You do not want to develop a PCB that becomes obsolete shortly after
production, considering the heavy investment involved. An excellent way of ensuring
this not only entails producing an excellent design or contracting a top-tier
manufacturer but using quality materials.

So, have you heard of Taconic EZ-IO-F? This excellent printed circuit board laminate
represents the next frontier for PCB materials. It fuses top-level technology with
advanced materials to ensure an unprecedented quality of PCBs for diverse
applications. Want to know more? Continue reading as we delve deeper to help you
understand.

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Table of Contents

What is Taconic EZ-IO-F PCB?

In most cases, the technology and materials involved in fabricating printed circuit
boards inform their names. The situation is no different with Taconic EZ-IO-F PCB.
It is a type of printed circuit board that uses the thermally stable (EZ-IO-F) composite
that derives its existence from nanotechnology, PTFE, and spread weave.

So what makes EZ-IO-F unique? It has nanoparticle silica, ensuring an incredible drill
quality that matches the FR4 material. The laminate has a low fiberglass content with
a consistent impedance and dielectric constant – all suggested through skew testing.

EZ-IO-F primarily arose for next-gen digital circuitry. However, it also got developed
for microwave applications that operate at an ever-increasing frequency (high). Such
higher frequencies need a combination of microwave and digital circuitry onto a
single printed wiring board (PWB). By design, the EZ-IO-F challenges the finest FR4
material or laminate during fabrication

EZ-IO-F primarily arose for next-gen digital circuitry. However, it also got developed
for microwave applications that operate at an ever-increasing frequency (high).
Such higher frequencies need a combination of microwave and digital circuitry onto
a single printed wiring board (PWB). By design, the EZ-IO-F challenges the
finest FR4 material or laminate during fabrication, especially for the more complex
30 plus layer for digital applications.

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Benefits of Taconic-IO-F Laminates

You can always benefit from the numerous advantages of Taconic-IO-F material. It
not only confines you to enjoying very low skew and nanotech-based PTFE laminate
but others as well. It encompasses an incredible drill quality akin to FR4 (a thousand
hits/bits). Fr4 registration, low fiberglass content of less than 10%, and a less than
0.18% dielectric constant variation also come as benefits.

Others include:

 A stable dielectric constant regarding temperature

 Ability to make forty plus layers, primarily on large format printed wiring
boards
 It is also resistant to CAF

Application

 Testing of semiconductors at or above 25 Gbps

 Measurement and tests
 Backplane routers and optical data transport
 Hybrid FR4-based printed wiring boards – combining digital and microwave
signals.
 Defense and space

What about the Skew Testing?

You mostly find skew testing proposing an utmost skew of 0.3 picoseconds per inch
besides a skew average of less than 0.1ps/inch devoid of artwork rotation. A
15-degree artwork rotation demonstrates a maximum skew of 0.05 ps/inch plus a
skew average of almost zero. However, the skew proves flat over a 1-20 GHz
frequency.

Taconic EZ-IO-F Manufacture

EZ-IO-F mostly gets manufactured on top of no-profile copper. However, please note
that the most recent ULP copper performs better than rolled copper and consequently
acts as the new standard when it comes to high-performance laminates. You can
achieve a lot more with rolled copper or ULP copper vs. HVLP.

If you want to achieve a strip-line channel possessing a 5 wt% fiberglass, you must
combine EZ-IO-F with AGC FR-28-0040-50S with a DF of 0.0018 at 10 GHz. The

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AGC contains a non-reinforced prepreg that makes the strip-line properties possible.
AGC prepregs (fastRise) come as the lowest commercially available prepregs, which
you can then laminate at a 420-degree Fahrenheit, like FR-4.

The EZ-IO-F’s low insertion loss only compares to the PTFE

laminate’s fusion bonding – a costly process that results in excessive movement. An
excellent example includes operating it at 77 GHz, which compares and competes
with every fusion bonding laminate favorably. What’s more, it lacks the challenges
and costs common with fusion bonding.

You can obtain EZ-IO-F with a remarkably low-profile resistor foil. Further, the
design of the nanoparticle, besides the absence of surface porosity, allows
the etching of fine lines (a range of 2-4 mils and spaces)

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A Case in Point – EZ-IO-F 0050

Do you want to know about the EZ-IO-F specifications? Let us use this excellent
model – EZ-IO-F 0050 as our model.

Typical values of EZ-IO-F 0050

Property Test Method Unit Value Unit Unit

Dielectric Thickness Mil 5, 3.5 mm 0.09, 0.
Df @ 10 GHz Modified IPC-650 2.5.5.5.1 0.0014, 0.0014,
0.0015 0.0015
DK @ 10 GHz Modified IPC-650 2.5.5.5.1 2.8, 2.85 2.8, 2.8
Dielectric Breakdown IPC-650 2.5.6.2/ASTM 299-13 kV 39.8 kV 39.8
Dielectric Breakdown IPC-650 2.5.6.2/ASTM D149-09 kV 23.8 kV 23.8
Dielectric IPC-650 2.5.6.2/ASTM D149-09 V/Mil 628 V/mm 24724
Potency/Strength
Compressive Modulus ASTM D695-15 psi 507,000 N/mm2 3496
Peel Strength (0.5 oz. IPC-650 2.4.8 sec. 5.2.2 lbs/in 6 N/mm 1.05
ULP)
Peel Strength (1 oz. IPC-650 2.4.8 sec. 5.2.2 lbs/in 6 N/mm 1.05
ULP- MD)
Peel Strength (1 oz. IPC-650 2.4.8 sec. 5.2.2 lbs/in 6 N/mm 1.05
ULP- CD)
Peel Strength (1 oz. IPC-650 2.4.8 sec. 5.2.2 lbs/in 6 N/mm 1.05
ULP- MD) (Thermal Stress)
Peel Strength (1 oz. IPC-650 2.4.8 sec. 5.2.2 lbs/in 6 N/mm 1.05
ULP- CD) (Thermal Stress.)

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Peel Strength (1 oz. IPC-650 2.4.8 sec. 5.2.2 lbs/in 6 N/mm 1.05
ULP- MD) (Chemical Exp.)
Peel Strength (1 oz. IPC-650 2.4.8 sec. 5.2.2 lbs/in 6 N/mm 1.05
ULP- CD) (Chemical Exp.)
Arc Resistance ASTM D495-14 Seconds 248 Seconds 2.48
Dimensional Stability IPC-650 2.4.39A (Thermal mils/in 0.45 mm/M 0.45
(MD) etch)
Dimensional Stability IPC-650 2.4.39A (Thermal mils/in 0.44 mm/M 0.44
(CD) etch)
Dimensional Stability IPC-650 2.4.39A (Thermal mils/in 0.42 mm/M 0.42
(MD stress)
Dimensional Stability IPC-650 2.4.39A (Thermal mils/in 0.33 mm/M 0.33
(CD) stress)
Surface Resistivity IPC-650 2.5.17.1A (Elevated Mohms/cm 1.67 x Mohms 1.67 x
temperature) 106 106
Surface Resistivity IPC-650 2.5.17.1A Mohms/cm 2.29 x Mohms 2.29 x
(Humidity) 10 4 104
Volume Resistivity IPC-650 2.5.17.1A (Elevated Mohms/cm 3.58 x Mohms/cm 3.58 x
temperature) 107 107
Volume Resistivity IPC-650 2.5.17.1A (Humidity) Mohms/cm 3.94 x 1010 Mohms/cm 3.94 x10
1010
CAF IPC-650 2.6.25 Pass Pass
IST, HATS Customer-specific Pass Pass
CTE (X) 45 – 125°C IPC-650 2.4.42/ASTM D3386 ppm/°C 19 ppm/°C 19
CTE (Y) 45 – 125°C IPC-650 2.4.42/ASTM D3386 ppm/°C 25 ppm/°C 25
CTE (Z) 45 – 125°C IPC-650 2.4.42/ASTM D3386 ppm/°C 49 ppm/°C 49
Thermal Conductivity ASTM E1461 W/M*K 0.49 W/M*K 0.49
Thermal Conductivity ASTM E1461 W/M*K 0.53 W/M*K 0.53
Specific Heat ASTM E1461 J/gK 1.18 J/gK 1.18
Diffusivity ASTM E1461 mm2 /s 0.214 mm2 /s 0.214
Density ASTM D792-13 )Method A) g/cm3 2.12 g/cm3 2.12
Hardness ASTM D2240-15 77.3 77.3
You need to note that all the values illustrated are typical and not specific for
distinctive purposes. Additionally, the values need to get used for single-ply
construction.

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Where can You Get Taconic EZ-IO-F PCB Laminates?

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If you want to design or make a Taconic EZ-IO-F printed circuit board, picking
a manufacturer that can source for the specific Taconic EZ-IO-F laminate becomes
important. What better place to turn to than RayMing PCB for your Taconic EZ-IO-F
laminate or materials? The company will take care of your material sourcing needs
and your fabrication and assembly needs. But any other top PCB manufacturer with a
demonstrated PCB fabrication history can also source for Taconic EZ-IO-F laminates.

Benefits of Picking the Right PCB Material – EZ-IO-F Laminate

PCB substrates, of which Taconic EZ-IO-F laminates belong, need a careful selection
to ensure the PCB designs come off. Because of this, you must consider performance
during your PCB design phase for your specific application. Key performance aspects
include mechanical and electrical attributes, mainly when your application areas
include complicated microwave areas. Therefore, it becomes crucial to ensure
mechanical and electrical reliability.

A low thermal coefficient of Dk offers electrical stability, which most engineers or

designers who deal with oscillators, delay lines, and filters desire. However, the good
news encompasses the fact that Taconic, Rogers, and ISOLA materials prove reliable
for high-speed and high-performance applications.

Crucial Aspects to Consider in Picking a Taconic

EZ-IO-F Laminate

 A very low Z-axis CTE (coefficient of thermal expansion) becomes necessary

if you want to get superior reliability, especially for the plated through-hole.
 It is also imperative to realize a narrow positional tolerance range to match
the Y and X CTE (coefficient of expansion) of the Taconic EZ-IO-F material.
 Enhancing the reliability of the surface mount can be realized by limiting the
solder joint stress and allowing the PCB laminate to expand. As a result, it will
expand to a minimum CTE, which proves beneficial due to the low tensile
modulus.
 The stable dissipation factor makes it possible for you to understand how and
why losses occur. It also helps in understanding their distribution across the
operating frequency bandwidth.
 Low (Df) dissipation factor
 Thermal performance
 Skew mitigation attributes
 Jitter reduction
 Attributes to enhance rise times
 Low Z-axis CTE
 Conductor loss cutback

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How Taconic EZ-IO-F Compares to RF-30A and

TSM-DS3M

Taconic has plenty of parts and products valuable in designing and manufacturing
printed circuit boards. The EZ-IO-F, therefore, comes as one of the products. But how
can it compare to other trademark products or laminates from Taconic?

Part Name EZ-IO-F RF-30A TSM-DS3M

Loss factor 0.0015, 0.0014 0.0020 0.0011
Dk + Tolerance 2.80, 2.77 ± 0.05 2.97 ± 0.05 2.94 ± 0.05

Final Thoughts

If you want excellent PCB material for your printed circuit board design, you need to
get a Taconic EZ-IO-F laminate. While picking a Taconic EZ-IO-F material can
prove difficult, the insights provided will go a long way in picking your EZ-IO-F
material.

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