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What Everyone Ought To Know About Rogers RTDUROID 6202PR
What Everyone Ought To Know About Rogers RTDUROID 6202PR
Table of Contents
laminate
Microwave Impedance Calculator and the Product Selector Guide include Dk values
for high-frequency applications.
features
Besides the RT DUROID 6202PR, Rogers will showcase its complete range of
high-frequency laminate materials at DMC 2010. They will showcase the latest
high-frequency XT/duroid 8000 and RT/duroid 8100 laminate materials. Both
high-frequency laminate materials are compatible with ULTRALAM 3908 bondply
and many other material systems.
Rogers RT/duroid 6202PR has outstanding dimensional stability and a low dissipation
factor. As a result, this laminate is ideal for antennas and multilayer circuits that
require a high-frequency frequency. For example, a TGOF of 1.96 at 10 GHz offers
unmatched stability with low losses and a dissipation factor of 30 ppm/degC in the
z-direction.
Application
Because it has low Tg, the 6202PR provides a cost-effective solution for microwave
applications. It is suitable for high-frequency applications that require thin laminates
and excellent thermal stability. When paired with a glass cloth dielectric, it is ideal
for power divider circuits used in radar systems.
Advantages
The RT/Duroid 6202PR has a high dielectric constant and low dissipation factor,
suitable for high-frequency applications such as multilayer circuit structures and filter
designs.
The RT/duroid 6202PR is a flexible, thin (less than 1 mm), multilayer, high-frequency
laminate that’s easy to fabricate. As a result, a circuit designer can use it
for prototype building. In addition, it is available in the form of standard off-the-shelf
sizes, which further simplify its use.
The material is well-suited for designs requiring high dielectric constant and low
dissipation factor. We also use it in narrowband filters and multilayer circuit
structures.
The Rogers Duroid 6202PR is available in 1 mm thickness and with either film or foil
adhesive. A standard circuit thickness is 1 µm (0.001 in). The standard finished size is
1016mm x 2025mm. However, we can make it in other sizes.
Disadvantages
The RT/Duroid 6202PR has a high dielectric constant and good thermal conductivity
but a low dissipation factor. As a result, it is not well-suited for passive infrared
applications because of its relatively high Tgof.
IEEE 802.11n PIF was the first IEEE 802 committee to focus on wireless local area
networks (WLANs). The IEEE 802.11n standard had significant enhancements over
the previous IEEE 802.11 standards in throughput, range, and security. The IEEE
approved the IEEE 802.11n standard in June 2008.
The RT/Duroid 8100 laminate’s close TGOF of 1.9X allows the design of complex
microwave structures, such as mobile phone base stations, scanners, and waveguide
elements, with a significant gain.
Conclusion
Related Posts:
https://www.raypcb.com/rogers-rt-duroid-6202pr/