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Additive Manufacturing by Digital Light Processing
Additive Manufacturing by Digital Light Processing
Additive Manufacturing by Digital Light Processing
https://doi.org/10.1007/s40964-022-00336-0
REVIEW ARTICLE
Received: 9 March 2022 / Accepted: 30 July 2022 / Published online: 25 August 2022
© The Author(s) 2022
Abstract
Additive manufacturing is a layer-by-layer strategy enabling the advanced design and fabrication of complex 3D objects
and structures, overcoming geometry limitations and reducing waste production compared to conventional technologies.
Among various additive manufacturing technologies, digital light processing (DLP), is an additive manufacturing
technology used to print photopolymer parts, using a projected light source to cure an entire layer at once. Initially
developed for pure resins, recent advances have demonstrated the potential of DLP in the polymerization of ceramic and
metal-loaded suspensions, enabling the fabrication of ceramic and metal components after proper debinding and sintering.
Such flexibility increases the potential of DLP for different applications, ranging from dental implants and bone scaffolds
to smart biomaterials for soft robotics, smart wearables, and microfluidic devices. The review provides an overview of
DLP technology and its recent advances; specifically, the review covers the photopolymer properties, the ceramic and
metallic feedstock preparation, and the light-matter interaction mechanism underpinning the printing and post-processing
steps. Finally, a description of the current application is provided and complemented with future perspectives.
Keywords Digital light processing · Stereolithography · Vat polymerization · Dynamic mask stereolithography ·
Suspensions
1 Introduction
(3D) object from stacking of two-dimensional (2D) layers.
Additive manufacturing, rapid prototyping, rapid manufac- Within the framework of the fourth industrial revolution,
turing, layer-oriented manufacturing, digital fabrication, also referred to as Industry 4.0 [3], AM is a part of the
3D printing [1], and many more terms have been larger plan to integrate digital technology and Internet of
introduced after the patent filed by Chuck Hull in 1984 [2] Things (IoT) with conventional technologies [4]. This
before stand- ardization in ISO/ASTM 52900: 2015 integra- tion leads to the reduction of space needed for
(Additive manufac- turing—General Principles— production, irrespective of the output mass, and can help to
Terminology). At present, the term additive manufacturing reduce the efforts into setting up a conventional
(AM) is more common in the scientific and technical manufacturing unit by facilitating customization. One of
communities, whereas 3D printing is usually preferred in the most significant advantages of AM is the almost
communications to the general pub- lic. In a nutshell, AM constant manufacturing cost, which is independent of the
reverses the conventional approach of subtractive production scale and, to some extent, the product shape
fabrication techniques: it is based on layer- upon-layer complexity [5] (Fig. 1a). Minimal production of wastes
fabrication of an object, starting with liquid or solid makes this technology environmental- friendly [6] and
powder as a raw material to form a three-dimensional provides an advantage towards sustainable manufacturing
compared to traditional manufacturing meth- ods. These
features have attracted various manufacturing sectors [7],
Carlo Antonini such as biomedical/dental [8–10], automobile [11],
carlo.antonini@unimib.it
aviation [12], and construction [13], from the early stages
1
Department of Materials Science, University of Milano- of AM development. Many more sectors are adopt- ing
Bicocca, Milan, Italy AM, making the manufacturing process economically
2
Laboratorio Tecnologia Dei Materiali Di Faenza, affordable and environmentally sustainable (Fig. 1b). As a
ENEA, Faenza, Italy result, AM technology has gained remarkable popularity in
13
Content courtesy of Springer Nature, terms of use apply. Rights
Progress in Additive Manufacturing (2023) 8:331–351 3
3 Digital light processing
LENS Direct energy deposition Laser Metal powder Poor surface quality Cleaning Biomedical: bone [30, 31]
implants and scaffolds
3DP Binder jetting Chemical reaction of the Liquid binder, starch- Low z-resolution No chemical post-pro- Prototypes, casting [32, 33]
binder based powder, ceramic cessing, polishing for
smooth surface
LOM Sheet lamination Laser or blade Paper, plastic, metal, Less dimensional accu- Polishing, Painting Prototypes, non-func- [34, 35]
ceramic, fiber racy, delamination is tional parts
common
FDM Material extrusion Heating element for Plastic, ceramics, com- Low z-resolution Finishing for surface Modeling, prototyping [36–38]
filament posites smoothness
general, the steps for polymerization are the same for all
either of the three causes, recombination, disproportion,
the photopolymers while interacting with the radiation,
or occlusion [69].
but the mechanism is different based on the photoinitiating
Free radicals can crosslink acrylate, styrene, and thiol-
system which is detailed in the next sections.
ene-based monomers, to form a long chain responsible
for free radical polymerization. This process is fast and
terminates in the absence of radiation [70]. Differently,
4.1 Photoinitiating (PI) systems
ionic species induce ionic polymerization of another cat-
egory of monomers such as ketones, aldehydes, heterocy-
Photopolymers are categorized based on photoinitiating
clics, etc., which are not polymerized by free radicals [71].
reactions: (i) free radical and (ii) ionic-based [66]. These
Cationic polymerization is more widely used in the latter
systems differ by the produced reactive species by PI,
polymerization system, while it needs more exposure time
radicals, and reactive ions, as they are exposed to a light
than radical polymerization and continues even after the
source, starting chain reactions leading to photopolymeri-
removal of the light source.
zation. Both free radical and ionic-based processes consist
of three steps, schematically represented in Fig. 7: (i) ini-
4.1.1 Free radical system
tiation, (ii) propagation, and (iii) termination. Initiation
starts with the absorption of UV radiation by PI generating
In these photoinitiating systems, free radicals are generated
the reactive species. These species react with oligomers
from the photoinitiator after exposure to light radiation
and monomers, promoting the formation of long chains
[70]. Acrylates (di- or multifunctional) (highly reactive)
during the propagation step. The reaction terminates
are the main choice for these kinds of formulations.
Unimolecular
Fig. 7 Schematic of the polymerization process of a photosensitive sitive resin is irradiated by UV light. The reactive species react with
resin. The photoinitiator (black star) generates reactive species (star
in a red circle) during the initiation process, as soon as the photosen-
Fig. 8 Photopolymerization process of radical and cationic-based photoinitiating system. Both systems follow the three main steps: initiation,
propagation, and termination, but different reaction mechanisms
Table 2 Physical properties of Product Density η (mPa s) Specific area d50 (μm) Refractive
the reactants and fillers used at 2 −1
(data from Ref. [83]) 25 °C (m g ) index n (365 nm)
d50 is the value of the particle diameter at 50% in the cumulative distribution
6 Theoretical consideration of
light-matter interaction
l = −(1∕sc)ln Il ∕I
(3
7 Post-processing
Or, )
As briefly discussed in Sect. 2, post-processing is the last
Il = I exp (−lsc) step in AM to produce a desired 3D object. One or more
(4
)
The corresponding dose of radiation D (l, t) at time t is: of the following steps may be required to: (i) clean off the
residue liquid polymer from the surface, (ii) remove the sup-
D = tI exp (−lsc) (5 port structure, (iii) polish the green body to obtain a smooth
)
The critical dose at which the polymer starts to surface, and (iv) thermally treat the green body for produc-
polymer- ize is: ing dense solid object. Several finishing methods, such as
vibratory finishing [123], hot cutter machining, optical pol-
Dc = tpI exp −lpsc (6
ishing, micromachining process, etc., have been developed
to obtain the required surface finishing [124]. Hereafter the
)
Thus, corresponding to the critical time: most common post-processing phases used in DLP or
Tc = Dc ∕I SLA- based manufacturing are presented.
(7
)
Considering the critical radiation dose for polymeriza- 7.1 Cleaning of the green body
tion, the thickness of the polymerized layer can be
expressed as: In both geometries, bottom-up and top-down, used in the
DLP process, the printed object emerges from the unpo-
7.4 Debinding
7.2 Removal of the support structure
During debinding, the polymerized resin (also referred to
In the manufacturing of complex 3D objects from liquid as binder), which provides the matrix to the solid powder
or powder materials, support structures are often required after polymerization, is decomposed and evaporated at
[126]. Changes in the printing orientation may mitigate high temperatures in controlled atmospheric conditions.
the necessity of support structures [127]. However, for Thermo- gravimetric analysis (TGA) and Fourier transform
structures such as overhangs or horizontal bridges, the use infrared (FT-IR) spectroscopy are utilized to determine the
of supporting structures is almost inevitable. The slicing optimum heat cycle for debinding. Previous studies
software enables automatic or manual generation of sup- reported that mass loss typically starts at around 200 °C,
ports. Printed supports are removed from the green body and nearly complete organic material decomposition occurs
before UV curing. Incomplete polymerization of the resin before ~ 600 °C [129, 130]. Physical properties such as
during printing makes removal steps easier. At present, powder size distribution and amount of filler material also
multiple slicers allow different parameters for support affect the debinding pro- cess. Wang et al. reported that
structures and 3D objects, making the removal process debinding is a two-stage pro- cess: low-temperature
easier. In general, most of the resins are fragile after the debinding (200–300 °C) and high- temperature debinding
polymerization, thus it is easy to break off thin support (300–600 °C). In low-temperature debinding, the binder
from the bulk object. starts to melt, and decomposed gas flows from inside to
outside via formed interconnected pores [131]. In high-
temperature debinding, carbon is oxi- dized after binder
7.3 UV curing decomposition, followed by a release of expanded CO2,
forming cracks. Slow ramps and long temperature hold
For polymerization of the liquid polymer layer with UV may thus be required, resulting in a long debinding process
radiation, the exposure time is carefully chosen. In case (of the order of 100 h), to optimize the process and avoid
the exposure is too short, photopolymer remains under cracks, especially for ceramics. In a study by Liu et al., a
cured, potentially leading to dissolution in solvents dur- fast debinding process has been reported for producing
ing cleaning. On the opposite, if the exposure to UV is too silica glass [132]. Penetration tunnel formed by early-stage
long, the photopolymer tends to achieve complete polym- evaporation led material out of green part rap- idly while
erization, leading to high adhesion between the resin and reducing debinding time by factor three. Removal of the
the vat base: over time, this may damage the vat base. organic resin causes shrinkage and porosity in the debinded
Therefore, an ideal exposure time is needed for optimal object. This porous, fragile 3D structure with loosely
polymerization of layers to prevent under- or complete bonded solid particles needs further treatment for
polymerization. Indeed, post-curing of polymerized parts manufacturing dense solid objects, i.e., sintering (Fig. 9).
is done in a UV oven to ensure complete polymerization to
achieve better mechanical properties [128]. However, there
d50 is the value of the particle diameter at 50% in the cumulative distribution
Sintering is the final stage of post-processing, where solid AM has been significantly developed from prototyping
particles are compacted at high temperatures, producing non-functional parts since it was introduced in the early
a denser solid structure to improve mechanical properties 1980s. In the last decade, all manufacturing technologies
and product quality. However, incomplete healing from the have reached a significant landmark due to the develop-
defects generated during debinding step may hinder reach- ment of innovative materials [23, 138] for manufacturing
ing higher densities. Sintering time, temperature ramp, and (Fig. 10). From micro-structures to macro fabrication, AM
hold time at constant temperature affect the intergranular is taking the place of conventional manufacturing tech-
bonding between particles. Low heating rates produce high nologies in many sectors owing to the ability to generate
relative density at a given temperature. Sintering is complex, lightweight structures with high strength [139].
normally divided into three stages: (i) an early stage where Aerospace, automobile, and medical sector [140] were
no shrink- age is observed due to the merge and some of the early adopters of AM because for these rea-
recrystallization of crystallites; (ii) an intermediate stage, sons. At present, a distinct AM technology [19] is chosen
during which particles start to adhere and grain growth is for a specific application based on the choice of the raw
observed; (iii) a final stage, during which micropores close material. Within this framework, DLP technology is used
and densification fin- ish [133]. to produce functional and non-functional parts in various
Various studies on the ceramic parts sintering produced application parts with unforeseen resolution in AM.
by DLP, such as zirconia ZrO 2 [134, 135], alumina Al2O3 In 1995, during the early development of stereolithog-
[136], titania TiO2 [137], silica SiO2 [132] have been con- raphy-based techniques, Dickens et al. reported 100 µm
ducted (Table 3). Metal sintering still needs to be system- of minimum layer thickness with 50 µm accuracy for
atically explored in the context of the DLP process, as only rapid prototyping [148]. Kim and Hwang et al. reported
a few examples are available, e.g. stainless steel [56] and a resolution of 76 ± 14 µm in dental prototypes using a
copper [119, 120]. DLP printer with 70 µm of XY resolution and 75 µm
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