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DYCONEX Materials en 2020 Screen
DYCONEX Materials en 2020 Screen
Materials
Category Description
Standard Alternative On
Material Name Producer Remark Materials Materials Request
HL832NS
BT epoxy Mitsubishi packaging substrates
Rigid
HL832NSF
X, W, H-Type Thinflex
74% Ni
Resistive Foil Inconel Schlenk 16% Cr
8% Fe
ENIG
ENEPIG
OSP
Surface Finishing Electroplated Ni/Au
Immersion silver
DIG
Biocompatible plated Au
10/2020 All data given in this document are for information purposes only and are not binding. The data are subject to change without notice.
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