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What Is Through Hole PCB Assembly
What Is Through Hole PCB Assembly
Through hole technology has been used since the inception of the printed circuit
board (PCB) industry over 60 years ago. It involves the insertion and soldering of
component leads into plated holes on the circuit board to form electrical connections
and mount parts. While surpassed in many applications by surface mount techniques,
through hole assembly remains an essential process, especially for high reliability,
high power, and cost-sensitive electronics.
1950s – Introduction of the first automated insertion machines. Manual soldering with
irons.
1960s – Wave soldering adopted for large production runs. Plated through hole (PTH)
boards introduced.
1990s – SMT begins displacing through hole components for miniaturized designs.
2000s – Highly precise chip shooters able to assemble boards with 01005
components.
While revolutionary for its time, through hole assembly offers much lower component
density than SMT. However, it still excels for large connector interfaces, high
power components, and legacy compatibility.
Process Overview
The core through hole assembly process consists of three main steps:
Additional steps like adhesive curing, conformal coating, and testing complete the
board assembly process. Through hole components may be assembled alone or mixed
with SMT parts.<img src=”https://i.imgur.com/NRXJX0F.png” width=”500″
alt=”Through hole assembly process”/>
Component Insertion
Manual Insertion
Manual insertion using hand tools was standard in the early days of circuit assembly.
While tedious for large volumes, it is still useful for prototyping or low
volume production.
Advantages:
Disadvantages:
Mechanical/Pneumatic Insertion
For medium and high production runs, mechanical insertion provides increased
throughput and reduced labor compared to manual methods. Machines can
accommodate a range of component packages and lead forms.
Advantages:
Disadvantages:
Specialized mechanisms like lead forming, taping, and custom tooling allow the
insertion of more challenging components:
Taping – Sticks bottom termination components like QFPs onto carrier tape
for pickup and insertion.
Custom heads – Pick-and-place tools for unique component shapes and lead
configurations.
Despite added time and cost, odd form insertion expands the range of insertable
component types.
Wave Soldering
Wave soldering is the predominant technique for high volume through hole assembly.
The underside of the populated PCB passes over a pumped wave of molten solder
which wets the leads and pads. Parameters like conveyor speed, preheat temperature,
and wave shape are tightly controlled.
Advantages:
Disadvantages:
Selective Soldering
Selective soldering uses a precision solder nozzle to dispense molten solder only at
joints requiring wetting. All others are masked from solder. Useful for rework or
mixed through hole and SMT.
Advantages:
Disadvantages:
Hand Soldering
Manual soldering remains an option for prototypes, low volumes, or rework. Requires
operator skill for quality solder joints. Fume extraction is recommended.
Advantages:
Disadvantages:
Through hole components encompass a vast range of package styles and lead
configurations:
Connectors
New through hole package development has declined in favor of SMT. However,
many traditional axial, radial, and DIP components remain in wide use today.
Through hole assembly imposes certain PCB layout constraints and best practices:
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Component Spacing
Lead Spacing
Minimum hole spacing of 0.1” required for most wave soldering applications.
Annular Rings
Solderable Surfaces
Test Points
Common Defects
Like all assembly techniques, through hole manufacturing can experience a range of
quality defects if not properly controlled:
Tombstoning
Solder Skipping
Solder Bridging
Overheated Joints
Burnt flux residues indicate excess heat exposure which can weaken solder or
damage components.
However, excessive rework can damage boards through pad lifting, track damage, or
overheating.
Process Control
Consistent quality through hole assembly requires process control of key parameters:
Solderability Testing
Thermal Profiling
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** destructive Testing**
** AOI Inspection**
Controlling these factors is essential to minimize defects and avoid costly rework.
Statistical process control provides added oversight.
For many products, the ideal solution is assembling through hole and SMT
components on the same PCB:<img src=”https://i.imgur.com/NRXJX0F.png”
width=”500″ alt=”Mixed technology PCB”/>
Through Hole
SMT
Ultra-compact packaging
Extremely high density assembly
Lower assembly costs at high volumes
Improved signal integrity at high frequencies
Integrating SMT assembly into existing through hole production typically follows a
gradual transition plan. New SMT designs may be introduced via drop-in
replacements for equivalent through hole parts. Other boards can function as hybrids,
with SMT used only for the most space and weight critical functions.
Over successive product generations, SMT content increases until reaching high
density SMT assembly with just the necessary minimum of through hole components
remaining. This evolution allows a smooth upgrade path while leveraging investments
in existing through hole production.
Conclusion
While the influence of through hole technology has decreased relative to SMT, it
remains a viable production technique for many applications. Combining the
economy, flexibility, and process maturity of through hole assembly with the space
savings of SMT delivers an optimized manufacturing solution. With careful process
control and discipline, through hole manufacturing continues to deliver quality and
reliability for current and legacy product designs.
A: Dense through hole assembly requires managing challenges like sufficient hole
spacing, complex insertion, tombstoning, solder bridging, rework difficulties, and
testing access. Careful process control is essential.
A: Inspection checks for correct assembly, orientation, clinched leads, solder fill, fillet
shapes, markings, spacing, and the absence of defects like solder bridges. Automated
optical inspection is commonly employed.
A: With proper process controls, through hole assembly processes can routinely
achieve defect rates lower than 10 parts per million. Continuous improvement further
reduces defect occurrence.
A: Yes, with a properly configured wave soldering system 0.4mm pitch is achievable.
Higher density down to 0.3mm pitch is possible with mini-wave or specialized
soldering equipment.
Related Posts:
https://www.raypcb.com/through-hole-assembly-process/