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What You Need to Know About Shengyi Autolad1 PCB

Shengyi has been producing PCB laminates for a while now. This company has
produced several kinds of laminates. The Autolad1 is one of Shengyi’s products. In
this article, we will shed more light on Shengyi Autolad1 PCB material

Table of Contents

What is Shengyi Autolad1?

Autolad1 is a mid-Tg lead-free laminate specifically designed for high-performance

applications. This PCB material is environmentally friendly since it contains no lead.
Also, Shengyi Autolad1 is a PCB material widely used in the automotive industry.

In addition, this PCB material features great ant-CAF performance. This PCB
material is specifically designed for automotive electronics like ECU and junction
box.

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Properties of Shengyi Autolad1

Low water absorption rate

Shengyi Autolad1 has a water absorption rate of 0.09%. This is very low. Therefore,
this PCB material can withstand moisture conditions.

Moderate glass transition temperature (Tg)

The glass transition temperature of Autolad1 is 165 degrees Celsius at DMA. Also,
the Tg at DSC is 156 degrees Celsius. Therefore, the Tg of this PCB material is
moderate. This means that this PCB material can’t operate beyond 165 degrees
Celsius.

High Decomposition temperature (Td)

The Td of Shengyi Autolad1 is 353 degrees Celsius at 5% weight loss. The

decomposition temperature of a PCB material specifies the temperature at which
Autolad1 chemically decomposes. Autolad1 features a high decomposition
temperature which is ideal for PCB fabrication.

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Low coefficient of thermal expansion (CTE)

The coefficient of thermal expansion on the Z axis is 37ppm/℃. Therefore, this CTE
value is very low. CTE measures the rate at which a PCB material expands as heat
increases. Also, as the temperature of a material increases beyond Tg, the CTE value
will increase. The CTE of Autolad1 after Tg is 210ppm/℃.

Thermal stress

The thermal stress of Autolad1 is >100 at 288 degrees Celsius. Basically, thermal
stress specifies mechanical stress as a result of change in a material’s temperature.

Low loss tangent

The loss tangent of Autolad1 is 0.0145. This is very low. Also, the loss tangent
measures the power or signal loss of Autolad1. It measures signal los as a result of
electromagnetic energy dissipation in the PCB.

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Advantages of Shengyi Autolad1

Shengyi Autolad1 features several benefits which include:

RoHS compliant

Autolad1 is RoHS compliant since it is lead free. Therefore, this PCB material is ideal
for fabricating different kinds of circuit boards.

Anti-CAF performance

Conductive Anodic Filament (CAF) is a major concern in electronic production. Also,

CAF is a metallic filament created from an electrochemical movement process.
Therefore, Shengyi Autolad1 PCB material is resistant to CAF.

Great thermal performance

Shengyi Autolad1 features excellent thermal properties like moderate Tg and low
CTE. Also, it features a high decomposition temperature. All of these properties
contribute to the thermal performance of Shengyi Autolad1.

Ideal for lead free reflow process

Shengyi Autolad1 is suitable for the lead free reflow process.

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The Impact of Glass Transition Temperature on

Shengyi Autolad1

Shengyi Autolad1 PCB material features a glass transition temperature of 165 degrees
Celsius. This value is close to the high Tg group. Therefore, if the temperature rises
beyond this point, the material becomes runner-like. Also, materials featuring high Tg
can’t burn. Autolad1 features greater stability due to its moderate Tg.

Also, Shengyi Autolad1 is ideal for multilayer PCB. This is because of its moderate
Tg. Autolad1 provides great heat dissipation due to its moderate Tg. Also, this
material can prevent electric currents leakage. In addition, this PCB material is easier
to process. This is as a result of its Tg value.

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Guidelines for Shengyi Autolad1 Processing

The processing of Autolad1 involves several steps. Here are guidelines to help you
carry out the Autolad1 processing successfully.

Panel cutting

Here, the manufacturer uses shearing and sewing methods. Avoid possible edge
cracks when utilizing roller cutters.

Thin core baking

This depends on specific needs. It is advisable to rinse cutting panels. This helps to
get rid of the resin powder caused by cutting. Also, it helps to prevent etching issues.
The baking condition should be around 150 degrees Celsius/4-8h.

Lay-up

You need to be certain of the prepreg direction of warp. Also, avoid any prepreg
overturn or reversal in case of multilayer PCB distortion after press.

Press process

It is ideal to maintain a heat up rate at 1.0-2.5 degree Celsius per min when material
temperature ranges from 80 to 140 degrees Celsius. Set full pressure between 300-420
PSI. Also, apply full pressure only when the top layer temperature is between 80-100
degrees Celsius.

Drilling

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As Autolad1 becomes a bit harder, drilling efficiency is important. Also, this helps to
ensure hole quality. Reduce the hit count and chip load.

Desmear

Autolad1 is a filled resin system. Therefore, it is harder to desmear than traditional

FR4. It is advisable to strengthen the desmear and utilize ultrasonic rinse. Baking after
drilling can enhance the effect of desmear.

Soldermask

Avoid warpage or panel distortion due to improper stack-up at the baking process.

HAL

Autolad1 is ideal for lead free HAL process. If there is any measling, bake at
150°C/2-4h.

Packaging

Before packaging, bake finish boards at 125°C/4-6h. Therefore, this will prevent the
effect of moisture on the heat resistance of Autolad1. Warp the material by
an aluminum pack if stored for a while.

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Storage and Packaging Guidelines for Shengyi

Autolad1

 It is important to store the Shengyi Autolad1 in a good condition. Keep this

PCB material in a proper pallet. Also, avoid heavy pressure.
 Keep Autolad1 at ambient and ventilated conditions. Also, avoid exposing the
material to the elements.
 The shelf life of single sided laminate is one year. For double sided, it is two
years when kept in proper storage conditions.
 Slippage and collision can damage the cladding copper. Therefore, wear clean
gloves when handling Autolad1. Also, naked hand can contaminate the
cladding copper surface.
 Place prepreg horizontally. Also, use a plastic film to reseal any
remaining prepreg.
 Store all prepreg at below conditions after receiving packaging. Watch out for
relative humidity since it has a negative impact on prepreg properties.

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Conclusion

Shengyi Autolad1 PCB material is specifically designed to meet the demands of the
automotive industry. This PCB material has great properties and advantages. This
article has provided in-depth information about Shengyi Autolad1 PCB material.

Related Posts:

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3. All you Need to Know About Shengyi S1151G PCB

4. What is Shengyi SAR10S PCB ?

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