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ESDProductsandMaterials:Marketsand Opportunities
ChapterOne
PaulMarkowitz,Ph.D. March2010

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About the Report:

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Materialsandproductsdesignedtolessentheimpactofstaticelectricityrepresentarelativelymature market,butoneinwhichnewopportunitiesarebeginningtoemerge.Onthedemandside,increased miniaturizationofPCBsandharddrivescoupledwithe versmallerdevicesoncomputerchipswill increasethethreatsofdamageandcostscausedbystaticelectricity;webelievethatthiswillprovide theESDproductsa ndcoatingsmarketwithgrowthforyearstocome. Antistaticconcernsarealsogrowingatboththemanufacturingandpackaginglevels.Atthesame time,technologicalimprovementsinESDcoatingsaretobeexpected,especiallyinthevibrantareasof nanomaterialsandconductivepolymers. Inthisreport,NanoMarketswillidentifyandquantifythenewopportunitiesinESDproductsa nd materialsthata reemergingasaresultoftheincreasedantistaticconcernsdiscussedabove.This reportisa followonreportfromthewellreceivedindustryanalysisonantistaticcoatingsthat NanoMarketscarriedoutforitsconductivecoatingsmarketstudypublishedlastyear.Inthisreport, weextendthecoverageacrosstheentireESD/antistaticproductandmaterialvaluechaintoinclude notjustbasicmaterialsbutalsolaminates,filmsandothermaterials,a swellhighervalueproducts sucha sbags,garmentsandflooring.

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Executive Summary

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Proposed Table of Contents

E.1Introduction:TheincreasingESDthreat E.2EmergingopportunitiesfornewmaterialsinESDprotection E.3NewdirectionsandopportunitiesforvalueaddedESDproducts:Furniture,clothingandpackaging E.4FirmstowatchintheESDproductsandmaterialsspace E.5SummaryofforecastsforESDproductsandmaterialsmarkets Chapter One: Introduction 1.1Backgroundtothisreport 1.2Objectivesands copeofthisreport 1.3Methodologyofthisreport 1.4Planofthisreport Chapter Two: ESD Technologies, Materials and Products 2.1OverviewandclassificationofESDmaterialsandproducts 2.1.1Antistaticagents:Internalandexternal 2.1.2TheESD/antistaticvaluechain 2.2PolymersforESDprotectionapplications 2.2.1Filleda ndunfilledpolymers 2.2.2Dissipativepolymersandapplications 2.2.3Conductivepolymersandapplications 2.3Tinoxidesandothermetaloxides 2.4MetalsandcarbonbasedmaterialsforESDprotectionapplications 2.4.1Stainlesss teel 2.4.2Carbonfiber 2.4.3Carbonblack 2.5Othermaterials(amines,amides,a mmoniums altsandesters) 2.6TheroleofnanomaterialsinESDprotection 2.7Intermediateproducts:ESDlaminates,s hieldingandfoams 2.8ESDpackaging 2.8.1Rigidpackaging 2.8.2Flexiblepackagingincludingbags 2.9ValueaddedESDproducts 2.9.1Antistaticclothing(straps,wristbands,shoes,disposableclothing,etc.) 2.9.2Antistaticfurniture 2.9.3Antistaticflooringandfloorwaxes 2.9.4Antistaticmats 2.10Antistaticionizersa ndsprays 2.11Keypointsmadeinthischapter

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Chapter Three: Markets for ESD Products and Antistatic Coatings 3.1Introduction:OverviewofmarketsrequiringESDprotection 3.2Electronicsmanufacturing 3.2.1Cleanroomrequirements 3.3Electronicspackaging 3.3.1Requirementsbytypeofproductspackaged 3.4Dataroomapplications 3.4.1Matsandmousepads 3.5Glasstreatments 3.5.1Windowtreatments 3.5.2Displaysandother 3.6Antistaticsasfirepreventatives 3.6.1Fuela dditives 3.7Keypointsmadeinthischapter Chapter Four: Market Forecasts 4.1Forecastingmethodology 4.2Alternativescenarios 4.3EightyearforecastsofESD/antistaticmaterialsbytype 4.4Eightyearforecastsofantistatic/ESDproductsbytype 4.5Eightyearforecastsofantistatic/ESDmarketsbyendusertype 4.6Summaryofforecasts Listofacronyms Abouttheauthor

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Chapter One: Introduction

1.1 Background to this Report

Electros ta ticcha rging,whileuseful insomeappli ca tions suchas theca pa citor,is veryoftena Page|5 detri menttotheprocessesandproducts tha twerel yonbothinindus tryandindail ylife.For this reason, the control of electros ta ti c cha rge buildupand i ts discha rgehas been a thri vi ngi ndus tryformanyyea rs .As i trela tes totheelectroni cs indus try,themajorgoal isto prevent the spa rks from uncontrolled electrosta ti c dis cha rge, whi ch can da mage sensi ti ve electronic equipment. Also i mporta nt is preventing the a ttra ction of pa rti cles to s tati call y cha rgedsurfa ces the reason why antis tati c coa tings a reapplied to digi tal ca mera sensors , forexample. Whilethema rketforelectrosta ti cdischa rge(ESD)coa tings,ma terials,anddevi ces isgrowing wi th the prolifera tion of electroni c devi ces and components and wi th thei r everincreasing ci rcui tdensitya ndsensiti vi tytoelectros ta ti cdischa rge,anevenmoreexci tingdevelopmentis theintroducti onofnew,hightechma terialsintotheESDma rketpla ce.Inaddi tiontotheold gua rdofantis tati cma terialsmetals ,ITOandothermetal oxides ,ca rbonbla ckandca rbon fi berfilled composi tes, and organi c ma terials such as a mines, ami des, and es terswe can now add more adva nced ma terials like nanopa rti cles of metals and metal oxides , ca rbon nanotubes and graphene,and conducti vepol ymerslike PEDOT:PSS. These newer ma terials introduce new capabilities for improvedperformance, reduced ma terial usage,and grea ter easeofESDprotectiontha twillbringnewli feintoa ma turei ndus try.Thesea rethenewfa ce ofESDma terialsandwilla ccountfora rapidl ygrowingsha reofthisma rket.
1.1.1 ESD Applications and Products

There is a di verse range of ESD products but many of them can be ca tegori zed by thei r function. Theseinclude: pa ckagi ngproducts ,includingba gs , totes,andshi pping containers tha tprotectsensiti vedevi ces containedwi thinthem;products designedtocrea tea s ta ticfree local envi ronment, such as flooring, ma ts, furni ture, and cl othing; and coatings and other shieldingdesignedtoprovi depermanentprotecti onofanenclosedorcovereddevi ce.There a re also addi ti ves for fuels and other fluids , ionizing devi ces desi gned to neutralize s ta ti c cha rges ondemand,devi ces formoni toring ESD protection,andmoremundanedevi ces like groundingca bles. Wi thin these functions, ESD protection can be di vi ded into two differentbut often complementa rygoals.Onegoal is toelimina tes ta ti ccha rges whentheyoccur.Thiscanbe donesimpl ybyrapidl yconductingthemtogroundoroftenmoreeffecti vel ybydissipating

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the cha rges ,or ineffi cientl y conducting them to ground, converting much of theelectri cal energytohea tintheprocess .Theothergoal istopreventthegenera tionofsta ti ccha rges in the fi rs t pla ce. Sta ti c cha rges a re often genera ted by the tri boelectri c effect, simpl y by rubbing or sepa ra ting s urfaces , whi ch ca uses the trans fer of electrons . This tri boelectri c genera tion is common wi th typi cal plasti cs , glass, and other insula ting ma terials; antista ti c Page|6 ma terialsa redesignedtobelesspronetoi t. Generall y,themostsensi ti veESDappli ca tions a rethoseinvol vi ngdi rectconta ctwi thsensi ti ve electronic components, and these a re typi call y in electroni cs manufa cturi ng and assembl y opera tions . ESD protectionis anintegralpa rt of the designofevery pieceofequipment or otherpa rtofa wa ferfab, forins tance,andisofpa ramountimportancein ci rcui tboa rdand devi ce assembl y and in the handling of electroni c components . The ESD products used in these envi ronments add up qui ckl y. At the wafer fab level, millions of squa re feet of fab fl ooringa reusedinaddi tiontothecontainers forthewa fers,thetoolshandlingthem,andthe ga rments fortheworkers.Anda ttheassembl ylevel ,theESDproducts addupsimila rl y,but nowinclude ESDba gsand otherpa ckagingma terials for components andboa rds. Even the smallestPCupgradeoutlets mustuseanESDs ys temincludinganESDprotectedworka rea , ESDba gs,andgroundingoftheworkers tominimi zecomponenta nddevi cedamagedueto ESD. As the mos t sensi ti ve devi ces shri nk to smaller ci rcui t di mensions and l ower opera ting vol tages , theyalsobecomeincreasingl ysensiti ve to ESD. Combined wi th the growthin the number ofdevi cesespeciall y handhelddevi ceslikemobilephones and musicpla yers ESD requi rements willgrowalongwi th the volume of theseproducts , yet fa ceincreasingl ymore demandingperformancerequi rements andrisingcos tsensiti vi ty. Beyondtheseproducts ,whi cha redesignedtoprotectelectroni ccomponents ,therea realso others,manyusedoutsidetheelectroni cs industry.Groundinganda ntista ti cs ys tems forfuel pumpsandai rline fuel deliverys ys tems ,incl udingantis ta ticaddi ti ves widel yusedinjet fuel , a reanotheri mportantapplica tiona rea,themainfocus ofwhi chis onpreventingfi res ra ther than on dama ging electroni c components. Here, volumes of ESD products a re likel y to be impactedmorebycha nges inregula toryrequi rementsthanbythecompeting,gradualtrends ofincreasingnumbers offuelburningvehi clesandincreasingfuel effi ciency.
1.1.2 ESD Materials

There is something of a changing of the gua rd beginning in the field of ESD ma terials. Conventionall ythema terialsusedforESDapplica tions ha vebeenmetalsa metallics tripeor wi re i ncluded wi thin a nonconducti ve bulk material , forming a networkor ca rbonfilled
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ma terials such as plasti cs containing ca rbon black or ca rbon fibers . There ha ve also been metal oxidesITO a nd tin oxide, mos tl yused where transpa rency is important, and somewha t conducti ve organi c compounds including qua terna ry a mmonium salts , amines , amides , and es ters . But the newer conducti ve ma terialsna noma terials and some conducti vepol ymers tha ta refindingthei rwa yintomanys ophis ti catedappli cationsa realso Page|7 fi ndingni chesinthelessglamorousapplica tions includingESDmaterials . Theseincludema terialslike metal nanopa rti cles,ei therappliedas the mainingredienti na coa tingoras a conducti vefillerina bul kma terial likea plasti c tha tis otherwisei nsulating. The s mall size of nanopa rti cles combined wi th the low conducti vi ty requi rements of ESD ma terials offers the potential to usesuchs mall amounts of metals that even anexpensi ve metallikesilveris not cos tprohibi ti ve. (This potential hasnot yet been realizedbecauseof the s till high cos t of nanoma terial manufa cturing.) Nanosil ver has recei ved mos t of the a ttention for themore conducti veapplica tions becausei tis somuchmore conducti ve than any of the other nanometals under a ctual use condi tions la rgel y because sil vers oxide, unlike those of other metals, is conducti vebut for ESD ma terials other metals ma y also comeintopla y.ESDma terials,a ndespeciallydissipati veones,permi tandevenrequi rehigher resisti vi tythanmos tothera ppli cationsandthepresenceofsomeinsula tingoxidema ynotbe abigproblem. Alsopromisingisca rboni ntheformofca rbonnanotubes ,whi chca nbeusedinevensmaller quantities andwhi cha re noti nherentl y expensive; thei r high cos tis due to thei r newness . Ca rbon nanotubessome of them anywa ya re more conducti ve than any metal and a re easilymadeintodiffusel ydispersedsuspensions .Ca rbonnanotubecoatingsorfilledpol ymers can offer a modern take on the oldfashioned wi re networks that ha ve been used for so longbutwi thwi rediameters 1000times thinnerandwiththewi res randoml ydis tributed ra ther than forminga grid. And graphene,as itbecomes easier toproduce, toowill findi ts wa y into a pplica tions tha t take advantage of i ts electri cal conducti vi ty, and perhaps appli ca tions usinggrapheneasanESDma terialwillbea mongthose. Conducti vepol ymers likePEDOT:PSSha vebeenunabletoa chieveconducti vi tycompa rableto tha tofmetals,li mitingtheirutilityforthehi ghes tvaluea ppli cations likeITOsubs ti tutes .But they a ppea r to be wellsui ted to less conducti ve applica tions . These ma terials a re not inherentl yexpensi ve but ha ve not come downi npri ce as rapidl yas hoped. Still, they a re flexi bleandoftentra nspa rentespeciallyinverythinla yersas requi redforthehighresisti vi ty ofESDapplica tions andofferthelikelihoodoflowcos twi thinthenextseveral yea rs .

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1.2 Objectives and Scope of this Report

The pri ma ry objecti ve of this report is to anal yze the ma rkets for ESD ma terials and products coa tings and bulk ma terials, ga rments and fabri cs, furni ture, flooring, ba gs and other pa ckaging, lamina tes, a nd filmsa nd to translate these anal yses into a thorough Page|8 exa minationoftheopportuni tiesforthesema terialsandproducts andthefi rmsthatproduce them. This anal ysis includes techni cal issues such as relati ve performance and fea tures of di fferentsolutions and how these cha ra cteris tics relate toa pplica tions, as well as business ones such as how growth in the applica tions for these products and ma terials will affect volumes and cos ts . Wi thsomeof thenewer ESD ma terialss till verys teep on thelea rning curveand thepri ce/volume curvetherea re uncertainties in the futuredevelopments of thesema terials,whi chareaddressedanddis cussed. A sepa ra te but rela ted goal of this report is to provi de detailed forecasts of the ma rkets anal yzed, both in volume terms and in moneta ry terms broken out by ma terial type and producttype,wi thinthefra meworkoftheappli ca tions forwhi chtheya reuseda ndthetypes of end users . Such an anal ysis is di ffi cult in the current envi ronment, wi th uncertainty in vi rtuallyeveryrelevantaspectoftheeconomy.Loss ofdemandduetotherecessionhas led toovercapa ci tyandevenovers uppl yinseveral segmentsoftheelectroni csindustry,andsince the ESD ma terials and products industry is la rgel y a complement to electronics , the ESD ma rkethasbeenexperiencingunusual pressures . Itis nowwidel ybelievedtha ttheworldwideeconomyis inthebeginnings ofa recovery.But thena tureofa recoveryfollowingsucha deeprecessionis hi ghl yuncertaina ndi tis fa rfrom certain tha t theeconomy will growa tanythinglikea normal pa ce from here on out. The combina tion of economi c fa ctors and uncertainties as to wha t the future holds makes i t di ffi culttoreliabl yquanti fythema rkets forthema terialsandproductscoveredinthis report, buttha tis wha tweha vea ttemptedtodo.Thisdiffi cul tyis mos tpronouncedinthema rkets forthenewestva rieties ofESDma terialsnanoma terialsa ndsomeoftheconducti veorgani c ma terialsbecauseof thei rnewnessand the fact tha t theya reemergingin otherindus tries aswell. This reportis interna tionalins cope. The forecas ts hereina reworldwide forecas ts and we ha ve notbeen geographi call yselecti vein the fi rms tha t we ha ve coveredin this report or interviewedinordertocollectinforma tion.

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1.3 Methodology of this Report

To thoroughl y assess the ma rkets for ESD materials and products , we use a twopronged anal ysis. The ma terials and products themsel ves mus t be evalua ted for sui tability, performance,likel yi mprovements,andlikel y cos tdevelopments, while theappli cati onsand Page|9 ma rkets a realsoanal yzedforthei rneeds,vol umegrowth,andwha ttheycangainfromnew ma teriala ndproductdevel opments.SinceESDprotectionandespeciallyESDma terialsisa dynami cfield,a suppl ysideanal ysismus tconsiderespeciallyhowthematerials will change andhowthosechanges will influencethedevelopmentofproducts andapplica tions overthe next several yea rs. From the demand side, shifting needs and devi ces especially with rega rd to thelevelof ESDsensi ti vi tyof future devi cesmus tbe consideredin termsofhow theywillaffectthedevelopmentofESDproducts andma terials. In the courseof ouranalysis weassessthe tradi tional ESDma terialsand the currents tateof the ESD products ma rket as well as the s ta te of development of the more advanced ESD ma terials and trends in the types of ESD products in production and use. We also assess anti cipa ted growthand trends in theappli cati ons for whi ch the ESD productsa re used,and howthematerials,products,andappli ca tions relatetoandinfluenceoneanother. Theinforma tionforthis workis deri vedfroma va rietyofsources ,butprincipall ycomes from pri ma ry sources, incl uding NanoMa rkets ongoi ng interview program of technologists , business devel opment mana gers , and a cademics invol ved wi th emerging electroni cs of all ki nds ,incl uding thinfilmandpri ntableelectroni cs. Wealsodrewonanextensi vesea rchof the techni calli tera ture, releva nt company Websi tes, tra dejournals,government resources , and va ri ous collaterali tems from tradeshows and conferences . This reportisla rgel ya new endea vor; while i t builds on the ESDrela ted content of NanoMa rkets report, Conducti ve Coa ti ngs Ma rkets,2009a ndBeyond,i tiscusomi zedtofocuscompletel yonESDma rketsand as suchis notanupda teoftha treport.Byna tureofthecoverageofoverlappinga ppli cation a reas, some of the da ta for this report has also been used in other reports published by Na noMa rkets. In cases where informa tion has been used in an ea rlier report, i t has been reinvesti gated, reanal yzed,a nd reconsideredinli ght of currentdevelopments and upda ted a ccordingl y. Theforecastingapproa chta keninthis reportis explainedinmoredetail inChapterFour,but the basic approa ch ta ken is to look a t the underl yi ng needs and ma rkets , as well as the technologiesand types of materialsand productsa vailable orunder development, toassess sui tabilityandlikel yvolumeoverthenexteightyea rs .Thes ta tedplans ofthekeyfi rmsa reof

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courseofspecial interes t,al thoughNanoMa rketscri ti call yconsiders theseclaimsinlightofall a vailableda ta .

1.4 Plan of this Report

InChapterTwo,wediscussandanal yzethetechnologies forESDprotectionandthema terials Page|10 and products tha ta reused toa chieve them. In terms ofma terials, weinclude conducti ve, antis tati c,anddissipati vema terialscommonl yusedinbulk,incoa tings ,oras addi ti ves .Asfa r as ESDproducts ,we considerbothproducts tha tare made wi th ESD ma terialsandproducts tha tdonotcontainthesema terialsbuta reusedinthecontrolofESDnonetheless . In Chapter Three, we discuss theappli ca tions and ma rkets for ESDproducts and ma terials, includi ng theprotection ofsensiti ve devi ces ,preventionofelectrosta ti ca ttra ction,a nd fi re prevention. Cha pter Four containsourei ghtyea rforecasts of the ma rkets for ESD ma terials andproducts byma terialtype,byproducttype,a ndbyendusertype.

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RelatedReportsfromNanoMarkets:
ConductiveCoatingsMarkets,2009andBeyond Nano078 ElectromagneticCompatibility(EMC)MaterialsandComponentsMarketsandOpportunities Nano181

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