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Clevios Etch-Technical Guide March 2013
Clevios Etch-Technical Guide March 2013
* Etching time based on Clevios™ F ET coating. Etching time for other formulations can be different .
** 355 mesh/inch; 31 µm Polyester yellow
Viscosity
Clevios SET S3
3,00
2,50
2,00
η in Pas
1,50
GNU 1676
1,00
0,50
0,00
0,00 200,00 400,00 600,00 800,00 1000,00 1200,00 1400,00 1600,00 1800,00 2000,00
1/s
Troubleshooting Bubbles
Flash-off time before drying 2 minutes – don´t dry immediately after printing
Material Polyester
Snap off 5 mm
Drying 80°C/1-2min
Crosslinking
Highly solvent resistant coatings may need longer etching time. Use test samples to find
the right balance.
Film preparation
Print the Clevios™ SET S3 material with approx. 6-10µm wet film thickness
Etching
Dip the film in a 10% solution of Clevios™ Etch (pH 5.7-7 @20°C) for 1-2 minutes @ 27°C with circulation
Wash the film under rinsing water and dry @ 100°C for 2 minutes
Removal
Dip the film in a 1.25% ammonia solution (pH 9-11 @20°C) for 2 minutes at RT or for 30-60 sec @ 40°C
Alternative solution: remove the Clevios™ SET S3 with rinsing MEK-Ethanol or Acetone for 30-60 Seconds
Wash with water again and dry the film for 2 minutes @ 100°C
O O O O O O O O O O O O
O O Cl
O
S S S H S Cl S S
O H H H
S S S S S S
Cl
O O O O O O O O O O O O
n
1,00E+09
1,00E+08
1,00E+07
1,00E+06
30 sec
60 sec
Ohm/sq.
1,00E+05
90 sec
1,00E+04 120 sec
150 sec
1,00E+03
180 sec
210 sec
1,00E+02
1,00E+01
1,00E+00
0 after 24h after 48h
Storage time of 10% Solution
1,00E+09
1,00E+08
1,00E+07
1,00E+06
30 sec
60 sec
Ohm/sq.
1,00E+05
90 sec
1,00E+04 120 sec
150 sec
1,00E+03
180 sec
210 sec
1,00E+02
1,00E+01
1,00E+00
0 after 24h after 48h
Storage time of 10% Solution
1,00E+09
1,00E+08
1,00E+07
1,00E+06
30 sec
60 sec
Ohm/sq.
1,00E+05
90 sec
1,00E+04 120 sec
150 sec
1,00E+03
180 sec
210 sec
1,00E+02
1,00E+01
1,00E+00
0 after 24h after 48h
Storage time of 10% Solution
0,9
0,8
0,7
Storage temperature: < 23°C
0,6
dm³
0,5
0,4
0,3
0,2
0,1
0
0 10 20 30 40 50 60 70 80
hours
1,6
1,4
1,2
1
Storage temperature: 27 °C
dm³
0,8
0,6
0,4
0,2
0
0 2 3 4 5 6 7 8 25 26 27 28 32 48 72 96 168
hours
• Add the thiosulfate solution to the etching solution slowly under stirring (temp.
control) exothermic reaction !
• The pH of the solution will change from 6.5 to 0.12.
• Slowly add a 26% solution of sodium hydroxide (NaOH) until the pH exceeds a
value of 11.
• No further smell of chlorine should be observed.