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SMT and Through Hole DFM Guidelines
SMT and Through Hole DFM Guidelines
MANUFACTURABILITY GUIDELINES
BY
KANTESH DOSS
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1. Purpose
The purpose of this document is to provide a single uniform design guideline for all rigid PWBs
(printed wiring boards) released at SE&A, Johnson City, thereby, providing consistency in the
PWB design and meeting the quality requirements of the printed wiring board assemblies.
2. Scope
This document defines Design for Manufacturability (DFM) guidelines for the printed wiring board
assemblies at SE&A.
3. Reference Documents :
2491751 SOP for Creating and Formatting SOPs, SOIs, & DSOPs
4. Definitions :
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4.1. Terminology and abbreviations used in this document :
DSOP Department Standard Operating Procedure
SOI Standard Operating Instruction
SOP Standard Operating Procedure
ECN Engineering Change Notice
FDR Final Design Review
PWB Printed Wiring Board
PTH Plated Through Hole. Conductive through holes of PWBs.
NPTH Non Plated Through Hole. Non conductive through holes of PWBs.
(Design) Preanalysis, Analysis performed on the PWB design prior to formal
release to manufacturing to ensure manufacturability and
compliance to the design guideline.
Raw Cards Unpopulated PWBs. Same as “bare boards”.
PWB Fabrication : Manufacturing of the bare boards or raw cards.
PWB Assembly : Populating PWB with components or PWB populated with components.
4.2. All other technical terms, definitions and abbreviations used in this document shall follow
IPC-T-50, Terms and Definitions.
5. Prerequisites :
Non required.
6. Responsibilities :
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Responsible for maintaining the list of all current manufacturing equipment and
machines and their capabilities and tolerances.
6.5 Manufacturing :
Provide timely feedback on any PWB assembly manufacaturability problems as they
are identified.
7. Procedures :
(1) PWB
FABRICATION
(BARE BOARD)
(4) ASSEMBLY
PROCESS
DESIGNING FOR
- Machine/equipment
PWB capabilities & tolerances
(2) COMPONENTS MANUFACTURABILITY - solderability/refllow/wave
- Inspectability
- Repairability
- Testability
(3) PANELIZATION
when applicable
Fig. 1
It needs to be understood that demands from each of the differing areas may have conflicting
requirements placed on the design of the PWB. These conflicts need to be addressed and
analyzed and a compromise reached for optimizing the PWB design
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7.1.2. Components :
In addition to their obvious effect on density and conductor routing, components also
impact assembly, solder joint integrity, reparability and testing. It is therefore,
important that the pwb design reflect appropriate tradeoffs that recognize
these and other significant manufacturing considerations. Mounting and attachment
of components will have the greatest impact on the lay out of the circuits
and will determine to a large extent the design of the pwb.
7.2.1. Bare boards meet the IPC’s Bare Board Design Guideline, IPC-2220.
Any conflict between the Bare Board Design Guild with design requirements of
other areas shall be reviewed by the preanalysis group for proper resolution.
7.2.2. All unique design requirements cannot be covered by this design guideline. I t should
be decided at preanalysis to determine whether a unique design requirement should be
made into a standard design guideline.
7.2.3. PWB Design shall not be used, applied, and/or adapted to compensate for
bad/faulty processes or materials.
7.2.4. Redesign or design modification has to be justified by cost analysis and feasibility
study.
Impact to other process areas has to be investigated and understood prior to redesign.
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7.3.1 Bare board / Raw card manufacturability design requirements.
All PWBs have to meet the basic “Bare board / raw card” design requirements before
meeting the design requirements of the other factors (components, panels,
assembly process). Bare board design requirements are covered under IPC-2220.
Any conflicting design requirements which may arise shall be reviewed and
resolved by the preanalysis group (Design Engr, Manufacturing, Process Development).
Fig. 2
Consult Manufactuirng for “L” & “W” outside the min, max dimensions.
7.3.2. Components :
All components used for manufacturing shall be listed in the Component Library.
Axial Components
16.5 mm
( 0.65”)
Max
Max = Max D=
0.813 mm 5 mm
(0.032”) (0.20”)
Min =
0.38 mm
(0.015”) Component body
12.7 mm
(0.500”) diameter
preferred grid
Fig. 3
Radial Components
Max 8.90 mm
Max =16.51 mm (0.350”)
(0.650”)
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5.08 mm (0.200”) Max 8.90 mm Page 7
OF to (0.350”)
7.62 mm (0.300”)
Max
10.90
(0.430”)
mm
Fig. 4
2.54
mm
grid
(0.100”)
7.62 mm (0.300)
&
15.24 mm (0.600)
Fig. 5
b) Radial components
Radial inserted parts should only be used where circuit performance
requires a radial part or where axial parts are impractical. This is
due to component cost and machine availability.
Max height = 16.5 mm (0.650”) includes preformed lead.
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Max width / diameter = 8.9 mm (0.350”)
Max body length (for rectangular body) = 10.9mm (.430”)
c) DIP / Socket
Pin count & size (2.54 mm / 0.100” grid)
7.62 mm (0.300”) pin row to pin row = 20 pins max.
15.24 mm (0600”) pin row to pin row = 40 pins max.
a) Axial components :
Min = 0.38 mm (0.015”)
Max = 0.813 mm (0.032”)
b) Radial components :
Round lead : 0.36 to 0.71 mm (0.014” to 0.028”)
Square lead : 0.28 to 0.66 mm (0.11” to 0.026”)
7.3.2.1.3. Grid / Component lead spacing / Hole to hole distance for leads ::
a) Axial :
Range can be from 7.62mm to 20.32 mm (0.300” to 0.800”)
12.7 mm (0.500”) is preferred.
b) Radial :
2 leaded radial : 5.08 mm (0.200”)
Machine inserted transistors : 2.54 mm (0.100”)
Stand off prepped resistors : 7.62 mm (0.300”)
a) Axial to axial :
Parallel to each other (side to side)
between component bodies. ≥ 0.25mm (0.010”)
Axial hole perpendicular to another component hole ≥ 2.54 mm
(0.100”) from hole center to hole center.
End to end (in serial) ≥ 2.54 mm (0.100”) between hole
centers.
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2.54
mm
(0.100”)
2.54mm
(0.100”)
Fig. 6
b) Radial to radial
3.81mm
(0.150”)
mm
(0.025”)
5.08 mm
(0.200”)
3.81mm
(0.150”)
0.635mm
(0.025”)
3.81 mm
(0.150”)
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Fig. 8
Side to side min component spacing ≥ 0.635mm (0.025”)
End to end (hole center to hole center same axis) ≥ 3.81mm (0.150”)
d) DIP to DIP : .
Parallel to each other ≥ 4.45mm (0.175”) between hole centers.
4.45mm (0.175”)
3.81mm (0.150)
2.54mm
(0.100”)
0.254mm
(0.010”) 5.08mm (0.200”)
0.254mm
(0.010”) 5.00mm (0.200”)
Fig. 9
e) DIP body end to axial body ≥ 0.254 mm (0.010”)
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2.54mm
(.100”)
2.54mm 2.54mm
(.100”) (.100”)
Fig. 10
c) via to radial hole (same axis from body end) : 3.175mm (125”) min
e) via to Dip hole same axis : 3.175mm (0.125”) (both outside & inside Dip
profile)
f) via to (on axis between Dip hole) Dip hole : 2.54mm (0.100”) (both outside &
inside Dip profile)
DIP body end to axial hole : 2.54mm (0.100”) min. See 7.3.2.1.5 d).
7.3.2.2. SMT Components
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7.3.2.2.3. SMT component / smt component spacing requirements
1.27mm (0.050”)
1.27mm
(0.050”)
Fig. 11
1.5 x H
PLCC PLCC
2.54mm PLCC
(.100”)
+ H
h COMP
x
Component X
h
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Fig. 12
0.66mm (0.026)
b
0.66mm
a
(0.26”)
Fig. 13
DIP
1.52mm
(0.060”)
+½H
SOCKET
H
2.921mm (0.115”) + ½ H
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Fig. 14
A A
A
Fig. 15
TOP VIEW
Fig. 16
Minimum distance
Radial hole to smt component on radial end :
A & B ≥ 2.80mm (0.110”)
Radial hole to smt component on radial component side.
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C & D ≥ 2.54mm (0.100”)
0.30 mm
(0.012”)
Fig. 17
Smt Component pad to via ≥ 0.30 mm (0.012”)
( = 0.009” soldermask coverage + 0.003” soldermask clearance
around via.).
Bottom (wave solder) side :
- Distance between isolated via and smt pad ≥ 0.30 mm
(0.012”)
- Vias connected to smt pads.
Vias in pads for wave soldering are acceptable.
via
Component
outline
Smt pads
Fig. 18
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Also reference component orientation for wave solder Section 7.3.4.1.6.
DIP
Radial
Axial
PWB
Tooling hole
⇒ ⇒ ⇒ Direction of Wave
Fig. 19
a) b)
Fig. 20
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7.3.3. Panels :
Panel’s input into the PWB design is mostly for the panel layout.
PWB
tooling
hole
b
Datum to edge of board :
a & b = 2.84 mm (0.112”)
Fig. 21
7.3.3.1. Tooling hole requirements :
See Section 7.3.4.1.2.
7.3.3.3. Component/circuit free zones around the edge of board/panel = 5.0 mm (0.200”)
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Minimum = 1.25 x router bit diameter or 2.54 mm (0.100”).
7.3.3.8.2. For panels with manual break aways (break off) for boards :
The object is to maximize support of the individual boards with the least
amount of board connection and making the boards easy to
break off (separate from the panel) after assembly.
The break-off residue (rough edges after break off) areas on the board
should not interfere with the subsequent higher assembly.
Outside PWB
1.84mm (0.072”)
1.27mm (0.050”)
Fig. 22
7.3.4.1.1. Component location silk screen requirements. Silk screen is not mandatory but
is preferred.
Must meet r/c design and acceptability requirements. (Controlled by silk screen
artwork).
Character height ≥ 1mm (0.040”)
Line width : 0.20 mm (0.008”)
Spacing between silk screen component character to pad ≥ 0.006”
Spacing between component outline to pad ≥ 0.010”
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7.3.4.1.2. Tooling holes :
Fig. 23
- Min of three npt (non plated through) tooling holes.
(0.200”)
Consult Manufacturing for wave soldered boards with requirement of 7.62 mm
(0.300”) component/circuit free zone on the leading edge of board.
DIPs
SOT23 Axials
:
Radials
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Smt
chips ic PWB
Top Side
Components on
bottom side
Fig. 24
7.3.4.1.7. For THT (includes npth single sided boards) & mixed boards :
PWB
Clearance area
10.16mm
(0.400”)
Fig. 25
b) Clinch clear area : 2.54 x 2.032 mm (0.100” x 0.080”) (both inward &
outward)
Component lead
pth Clinch direction
pad
2.03 mm (0.080”)
Fig. 26
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7.3.4.1.8. For smt boards
a) Fiducial location :
Tooling
hole
Component/ local
fiducial
Common
One fiducial on
fiducial
center location of
the component.
The other within
the 5.08 cm r
radius from center r
of the component r = 5.08 cm (2”)
Area for the
PWB common fiducial
Fig. 27
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(.080”)
Area to be free of
solder mask
1.52 mm
(.060”)
radius = 3.5 mm
(0.120”)
area free of exposed
circuit. 0.381 mm (.015”)
0.508 mm (0.020”)
Fig. 28
c) Solder traps : (robbers/thieves) Bottom (wave) side ICs.
Direction of Wave
Fig. 29
PWB
Tooling hole
3.18 mm (0.125”)
3.18 mm (0.125”)
Fig. 30
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particular machine/equipment will apply only to those PWB products which
are processed through that particular machine/equipment.
Because of the constant updates and enhancement to the process machines
and equipment PWB design requirements set by individual equipments
will not be included in this PWB design guide. However, it is imperative
that Product Engineers, Process Engineers, & Mfg Engineers, convey the
proper processing information (exposure to the type of process equipment/machine)
to the PWB Designers. Mfg Support Dept’s current equipments/machines list
should be referenced for proper input into PWB design.
Repair tool
4.83 mm (0.190”)
A ≥ 9.53 mm (0.375”)
A
DIP DIP
smt chip
Fig. 31
14 Pin IC Insertion
z
20 Pin DIP Tooling (Top Side)
Fig. 32
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b) DIP clearance from tooling holes, & support pins.
Support pin
6.985 mm
(0.275”) 19.5 mm
(0.750”)
19.5 mm
(0.750”)
6.985 mm
(0.275”)
3.48 cm
2.35 cm 2.35 cm (1.20”)
(0.925”) (0.925”)
3.48 cm 6.985 mm
(1.20”) (0.275”)
Tooling hole
Fig. 33
Axial component
A Side view
PWB
Smt
chip
A End view
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A ≥ 3.30 mm (0.130”)
Fig. 34
a) Smt chip to axial component lead hole :
Depends on smt component height.
Axial component lead hole to smt land/pad
Minimum = 3.30 mm (0.130”)
Preferred = 3.81 mm (0.150”)
7.3.4.2.4. THT component lead clincher. Bottom side (clinch head clearance
requirements).
Smt component
DIP
PWB
0.762 mm
(0.030”) min
Fig. 35
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A A
PWB
Clinch head
.
Fig. 36
7.3.4.3. Soldering :
Fig. 37
octagonal : preferred
round and oval : acceptable
square ; only for special cases (not acceptable for normal use).
7.3.4.3.4. Smt land / pad design for smt components :
Oval
Lands
Rectangular/square
Lands
Fig. 38
7.3.4.3.5. Thermal relief for plated through holes in large conductor area.
To prevent large conductor areas/lands from acting as heat sink, plated
through holes should not be put on large solid conductor area
without thermal reliefs. This requirement (design of thermal relief) should
be covered under the bare board/raw card design.
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7.3.4.3..6. Smt solder paste stencil design for proper solder paste deposition :
Refer to 2800432 (Solder Paste Stencil Design) & 2608032
(Specification, Stencil Fabrication).
7.3.4.3.7. Component free zone from edge of board/panel ;
Ref 7.3.4.1.4
Consult Manufacturing Engineering for special requirement of the
leading edge of board going through wave solder to meet the
0.762 mm (0.300”) component free zone.
∠ = 45° ∠ = 45°
Fig. 39
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7.3.4.5.2. Acceptability of solder mask coating.
Should have no soldermask on tabs, pads, lands and other areas where
solder mask is not wanted (fiducials). Soldermask shall not hinder
repairability / reworkability of the PWB.
Component height
Free area
mm Test pad
(0.125”)
1.27 mm (0.050”)
component Free Area
1.27 mm (0.050”)
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Fig. 40
Test pad center line to component ≥ 1.27 mm (0.050”)
Component height on probe side ≤ 3.20 mm (0.125”)
7.3.4.6.6. Preferred grid (test pad to test pad spacing) : 2.5 mm ( 0.100”)
Min : 1.27 mm (0.050”)
7.3.4.6.7. Test pads ( on probe side) to be min of 3.175 mm (.125”) from edge of
board, tooling holes, slots, and inboard openings.
7.3.4.6.9. No test pad targets within 3.175 mm ( 0.125”) around tooling holes.
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