MediaTek’s New Dimensity 8300 Chipset Redefines Premium Experiences in 5G Smartphones

High performance, super power-efficient chipset will usher in new wave of generative AI innovation on
premium smartphones

HSINCHU, Taiwan – Nov. 21, 2023 – MediaTek today announced the Dimensity 8300, a power-efficient
chipset designed for premium 5G smartphones. As the newest SoC in the Dimensity 8000 lineup, this
chipset combines generative AI capabilities, low-power savings, adaptive gaming technology, and fast
connectivity to bring flagship-level experiences to the premium 5G smartphone segment.

Based on TSMC’s 2nd generation 4nm process, the Dimensity 8300 has an octa-core CPU with four Arm
Cortex-A715 cores and four Cortex-A510 cores built on Arm’s latest v9 CPU architecture. With this
powerful core configuration, the Dimensity 8300 boasts 20% faster CPU performance and 30% peak
gains in power efficiency compared to the previous generation chipset. Additionally, the Dimensity
8300’s Mali-G615 MC6 GPU upgrade provides up to 60% greater performance and 55% better power
efficiency. Plus, the chipset’s impressive memory and storage speeds ensure users can enjoy smooth and
dynamic experiences in gaming, lifestyle applications, photography, and more.

“With MediaTek’s optimized Dimensity 8000 series, consumers don’t have to pick and choose between
accessibility and premier experiences like flagship-grade memory or accelerated AI capabilities—they
can have it all,” said Dr. Yenchi Lee, Deputy General Manager of MediaTek's Wireless Communications
Business Unit. “The Dimensity 8300 unlocks new possibilities for the premium smartphone segment,
offering users in-hand AI, hyper-realistic entertainment opportunities, and seamless connectivity
without sacrificing efficiency.”

The MediaTek Dimensity 8300 is the first premium-tier SoC to come with full generative AI support,
thanks to the APU 780 AI processor integrated into the chipset. This enables the Dimensity 8300 to
provide support to developers to build innovative applications that leverage large language models
(LLMs) up to 10B, as well as stable diffusion. The APU 780 features the same architecture as the flagship
Dimensity 9300 SoC, resulting in 2x improvement in INT and FP16 computation and a 3.3x boost in AI
performance over the Dimensity 8200.These AI capabilities, combined with MediaTek’s 14-bit HDR-ISP
Imagiq 980, will take premium smartphone photography and video capturing to new heights. Users will
be able to capture sharper, clearer videos at 4K60 HDR, and record for longer thanks to the Dimensity
8300’s extremely power efficient design.

To further optimize battery life, MediaTek’s next generation of HyperEngine adaptive game technology
offers advanced power savings enhancements. Leveraging exclusive performance algorithms, the
Dimensity 8300 intelligently adapts to computing demands and monitors device temperature, keeping
devices cool while optimizing gameplay so users can enjoy full FPS, low lag, and seamless rendering.

The Dimensity 8300 supports ultra-fast speeds with a built-in 3GPP Release-16 standard 5G modem
which utilizes scenario-specific optimizations to provide improved connectivity in environments that
have weaker connections. These optimizations amplify sub-6GHz performance and range for a more
reliable connectivity experience. The modem supports 3CC carrier aggregation, with up to 5.17Gbps
downlink speeds.
Other key features of the MediaTek Dimensity 8300 include:
 LP5x 8533Mbps and uFS4.0 MCQ memory provides a 33% speed boost on LPDDR and up to
100% faster R/W to flash compared to Dimensity 8300’s predecessor.
 MediaTek 5G UltraSave 3.0+ improves 5G power efficiency up to 20% in daily usage scenarios
compared to the previous generation.
 Upgraded Wi-Fi 6E performance with 160 MHz bandwidth, plus Wi-Fi/Bluetooth hybrid
coexistence technology so earbuds, wireless gamepads, and other peripherals work together
seamlessly.
 Dimensity 5G Open Resource Architecture (DORA), allowing device makers to create unmatched
smartphones that stand out in unique ways amongst competitors.

Dimensity 8300 will power 5G devices launching in the global market before the end of 2023. To learn
more about MediaTek's Dimensity portfolio, please visit: https://i.mediatek.com/mediatek-5g.

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About MediaTek Inc.

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2
billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC)
for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation has
positioned us as a driving market force in several key technology areas, including highly power-efficient
mobile technologies, automotive solutions and a broad range of advanced multimedia products such as
smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek
empowers and inspires people to expand their horizons and achieve their goals through smart
technology, more easily and efficiently than ever before. We work with the brands you love to make
great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for
more information.

MediaTek Press Office:

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Kevin Keating, MediaTek
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