Professional Documents
Culture Documents
P4SMA11C
P4SMA11C
Description
Features
Bi-directional
• 600W peak pulse power • High temperature to reflow
capability at 10/1000μs soldering guaranteed:
waveform, repetition rate 260°C/30sec
(duty cycles):0.01% • VBR @ TJ= VBR@25°C
Agency Approvals • Excellent clamping x (1+αT x (TJ - 25))
capability (αT:Temperature
Agency Agency File Number • Low incremental surge Coefficient, typical value is
resistance 0.1%)
E230531
• Typical IR less than 1μA • UL Recognized compound
when VBR min>12V meeting flammability
• Optimized surface mount classification V-0
Maximum Ratings and Thermal Characteristics
footprint for minimal PCB • Meet MSL level1, per
(TA=25OC unless otherwise noted)
space impact J-STD-020, LF maximun
• Low profile package peak of 260°C
Parameter Symbol Value Unit
• Typical failure mode due • Matte tin lead–free plated
Peak Pulse Power Dissipation by 10/1000us
(Fig.2)
• Halogen free and RoHS
Test Waveform(Fig.4) (Note 1),(Note 2) -Single Die Parts
PPPM 600 W to exceeding maximum
Peak Pulse Power Dissipation by 10/1000us
(Fig.2) ratings is a short circuit compliant
Test Waveform(Fig.4) (Note.1, Note.2)-Stacked Die Parts PPPM 800 W condition • Pb-free E3 means 2ND level
(Note.5)
• Whisker test conducted interconnect is Pb-free
Power Dissipation on Infinite Heat Sink at
TL=50OC
PD 5.0 W based on Table 4a and 4c and the terminal finish
Peak Forward Surge Current, 8.3ms Single Half of JEDEC JESD201A material is tin(Sn) (IPC/
IFSM 100 A
Sine Wave (Note 3) • IEC 61000-4-2 ESD JEDEC J-STD-609A.01)
Maximum Instantaneous Forward Voltage at 50A
for Unidirectional Only (Note 4)
VF 3.5/5.0 V 30kV(Air), 30kV (Contact) • UL Recognized to ANSI/UL
• EFT protection of data 497B: Protectors for Data
Operating Temperature Range TJ -65 to 150 °C
lines in accordance with Communications and Fire-
Storage Temperature Range TSTG -65 to 175 °C
IEC 61000-4-4 Alarm Circuits.
Typical Thermal Resistance Junction to Lead RƟJL 20 °C/W
• Built-in strain relief
Typical Thermal Resistance Junction to Ambient RƟJA 100 °C/W
• Fast response time:
Notes:
1. Non-repetitive current pulse , per Fig. 4 and derated above TJ (initial) =25OC per Fig. 3.
typically less than 1.0ps
2. Mounted on copper pad area of 0.2x0.2” (5.0 x 5.0mm) to each terminal. from 0V to VBR min
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty
cycle=4 per minute maximum.
4. VF < 3.5V for single die parts and VF< 5.0V for stacked-die parts.
5. For stacked die component details, please refer to part numbers labeled by * in Electrical Characteristics. Applications
Bi-directional
Datasheet Resources Samples
Cathode Anode
Uni-directional
© 2021 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: BA.06/28/21
TVS Diodes
Surface Mount – 600W > P6SMB series
Uni-directional Bi-directional
Ipp
IT
Vc VBR VR IR
Vc VBR VR V
V IR VR VBR Vc
IR VF
IT IT
Ipp
Ipp
PPPM Peak Pulse Power Dissipation -- Max power dissipation (VC * IPP)
VR Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation
VBR Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT)
VC Clamping Voltage -- Peak voltage measured across the TVS at a specified Ippm (peak impulse current)
IR Reverse Leakage Current -- Current measured at VR
VF Forward Voltage Drop for Uni-directional
Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating
Voltage Transients
100
TJ initial = TAMB
PPPM-Peak Pulse Power (kW)
1 Single die,600W
at 10/1000µs, 25°C
0.1
0.001 0.01 0.1 1 10
100
150
Peak Pulse Power (PPP) or Current (I PP)
tr=10µsec TJ=25°C
40
IPPM IPPM ( )
2
50 10/1000µsec. Waveform
as defined by R.E.A
20
td
0 0
0 25 50 75 100 125 150 175 0 1.0 2.0 3.0 4.0
t-Time (ms)
TJ - Initial Junction Temperature (ºC)
1000
10000.00
Transient Thermal Impedance (°C/W)
100.00 10
Uni-dire onal
Bi-direc nal
V=VR
10.00 1
1.00 0.1
1.00 10.00 100.00 1000.00 0.001 0.01 0.1 1 10 100 1000
V BR—Reverse Breakdown Voltage(V)
TP - Pulse Duration (s)
Figure 7 - Maximum Non-Repetitive Peak Forward Figure 8 - Peak Forward Voltage Drop vs Peak Forward
Surge Current Uni-Directional Only Current (Typical Values)
120 100.0
Single die
IFSM - Peak Forward Surge Current (A)
100
IF - Peak Forward Current(A)
80 10.0 Stacked-die
60
40
1.0
20
0
0.1
1 10 100
0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0
Number of Cycles at 60 Hz VF - Peak Forward Voltage(V)
Soldering Parameters
Temperature (T)
Ts(max)
TS(max) to TL - Ramp-up Rate 3°C/second max
Ramp-down
- Temperature (TL) (Liquidus) 217°C Ts(min)
Reflow ts
- Time (min to max) (tL) 60 – 150 seconds Preheat
Dimensions
J K L
Solder Pads
(all dimensions in mm)
P6SMB XXX C A
Cathode Band
(for uni-directional products only)
F
Littelfuse Logo
Bi-Directional XX
YMXXX
Marking Code
Packaging
Component
Part number Quantity Packaging Option Packaging Specification
Package
P6SMBxxxXX DO-214AA 3000 Tape & Reel - 12mm tape/13” reel EIA STD RS-481
0.157
(4.0)
Cathode
0.47
(12.0)
13.0 (330)
Dimensions are in inches
0.80 (20.2) (and millimeters).
Arbor Hole Dia.
Direction of Feed
0.49
(12.5)
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are
not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
© 2021 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: BA.06/28/21