DR Documents - Rev 7 Updated

DR / PPAP DOCUMENT -- Document submission Check Sheet MODEL :
(Completion at Pilot Stage except points related to RAR, negative list of pilot, RAR)
VENDOR NAME : DATE:
PART NUMBER : DOC. TYPE
PART DESC: REV No: 08 / 16.06.2023
Following In case the document is not enclosed

Sr.no Documents reqd (Mandatory) Documents Materials Q.A. / CD Engr. (BAL)
give valid reasons (To be filled by
enclosed remarks
supplier)
Y/N
1 BAL Approved dwg .
Drawing( A3 size) with numbered CTQ Characteristics with colour code for function (RED) ,
Fitment (Orange) & Appearance (Blue /Green)
2 List of major revisions, changes in part during development (with details and reason for changes)
3 DIDS sign off copy
4 VTS sign off copy
5 DRBFM / PRBFM
6 Electronic BOM sign off
7 Design Failure Mode and Effects Analysis
8 Process Flow Diagram
9 Process Failure Mode and Effects Analysis
10 IPO /Control Plan
11 Q -Defect mapping check sheet (past trouble database) & cognizence of all points for the subject
part
12 Distinct changes from existing parts - list and details
13 List of Manufacturability Issues and actions taken
14 Performance test results as per DVP / VTS & drawing requirements
15 Confirmation of Statuatory requirement ( CMVR )
16 QA /QM Matrix
17 CTQ Parameters
18 Process capability- Cp / CpK reports for CTQ parameters like solder paste height, solder tip
temprature, reflow temperature or any other equivalent CTQ parameters.
19 Stage Inspection Check sheets
(To be made on separate sheet for each stage operation)
20 Test bench, Gauge, fixtures & instruments list with identification nos.,Calibration status(done
date,due date etc)
21 Poka - Yoke list & its horizontal deployment
22 Child Part matrix & source list
23 Raw Matl TC of child parts from manufacturers

(Chemical, Physical & Metallurgical properties)
24 Raw Matl TC of child parts by 3rd party inspection/ vendor inhouse lab
(Chemical, Physical & Metallurgical properties)
25 Child Parts Inspection check sheets / PDI .

26 Special process Test Reports : From Processor ( In case done from extn agency )
( PLATING / POWDER COATING / HT / ETC) as per BAL ABS STD
27 Special process Test Reports : Self Inspected
( PLATING / POWDER COATING / HT / ETC) as per BAL ABS STD
28 Measurement results of part weight (min 10 components)
29 ESD & Soldering check sheet
30 Dimensional layout report of 5 to 10 components with balloon drawing
31 Component Identification Mark ( V.code , Part number, part traceability ,Date etc )
32 Action completed for negative issues/ improvement points during Proto/PP/P/Cuft etc…
33 Packaging Standards & material handling
34 Inspection Agreement (34 a to 34d)
35 PDI report of SOP batch
36 BAL SIR Report
37 Capacity & Final toolings readiness
38 Vendor Self Assesment Report for production readiness
39 RAR Audit - Improvement points & their corrective action sheet & SOP ckearance ( (39a to 39c)
Documents verified and submitted.

Date Name Sign
QA Head(Supplier)
Plant head(Supplier)
BAL R &D CD :
BAL R & D QM:

Remarks - One copy of these documents to be retained at Suppliers end till part is in production + 1 year and to be shown on request
BAL Approved dwg .
Drawing( A3 size) with numbered CTQ Characteristics with colour code for function (RED)
e for function (RED) , Fitment (Orange) & Appearance (Blue /Green)
Step NEW PART DEVELOPMENT PROCESS
Inputs Activities Out puts
Comp. Dev. List at Proto stage 1 Comp. development master

1.Component allocation
Comp. development master Identification of development

agency - V&CD,R&D(CD),ME,PPC
Targets for Volume, 2 Allocation list
quality,cost,dev lead time, plant
Development Review 1 ( by PM) 3 DR 1 Report ( allocation list

frozen)
Part drawing,Model , BAS Study of Specifications 4 Mod of spec as appropriate for

standard based on DFMEA manufacturability
Critical dimn on drg,Field Identify critical 5 List of critical

complaint,warranty,QSR,PPM,aes dimensions/performance dimn/performance parameters
2. Component study
thetics,assembly issues, Fitting parameters

and functional requirements
Vendor identification and
involvement, case by case
Identification of special processes 6 Critical Technology

for above development plan
Development Review 2 7 DR 2 Report ( frozen drg.,

updated check sheet for 4 to 6
& shortlisted vendors)
Facilities,Past PPM/dev Record, Vendor Evaluation 8 Vendor Finalization with

3.Vendor selection
capacity, Investment capability, customer PPC Feedbck

target cost adherance capability,
SOB
DR 3 9 DR 3 Report ( Final vendor list)
Detailed plans for Process, 10 Process Flow chart

methods, equipment, material 11 Floor plan layout
handling 12 Machines./toolg dev plan
13 Child part-Subvendor matrix
4. Preliminary Process Planning
approval( cap. Evaluation)

14 Special skill mapping
15 Inspection instruments plan
16 Material handling plan
17 Development schedule and
cost estimate
PFMEA 18 Process control plan based on

PFMEA
DR 4 19 DR 4 report ( exceptions to be
approved)
Prepilot Production (10)

Step
Input Activities Out puts
4. Preliminary Process Planning( cont.)
Evaluation of quality 20 Component Inspection for all

dimns.
21 Part Perf. Report
Assly. At BAL
Evaluation of performance 22 Negative issues

of,assly,appearance,performan
ce
23 Corrective Action Plan
Corrective actions on -ve issues 24 DR 5 Report ( Final approval

identified in 21 for tooling)
Single cavity Pilot batch production (50

component) - Tooled up
Delivery to BAL with PO
Evaluation of quality 25 I dimn./ Performance report

26 SIR by BAL
CUFT production
5. Production Preparation
Evaluation of performance 27 Negative list ( Inhouse+Field)
Corrective actions on -ve issues of 28 DR 6 Report (Clearance for run

pilot batch at rate )
Run at rate ( 300 or 1 shift prodn) 29 Cycle time evaluation/ output

per shift
30 Process capability evaluation
31 Consumption norms study
Corrective actions on 29 to 31 32 Corrections in 10 to 16
Establishment for Sustenance 33 QM matrix

JH / PM Std. Updation
Development Review 7 34 DR7 Clearance for mass prod.

PO finalisation
Cost Review 35 Finlised PO based on - 5000

for Sc & 3 WH, 10000 - For
motorcycle
2.List of ECN/ Drawing Revisions
Part Name-
Part No.-
S No Rev No. Rev Date Revision Details
Prepared By
ECN/ Drawing Revisions
Model-
Date-
Reason for Revision Implementation Status
Approved By (QA Head)

DIDS Duly Signed off copy from both side design teams
*Sign off copy for drawing revision (if any) at the time of SOP required
VTS/DVP Duly Signed off copy from both side design teams
*Sign off copy for drawing revision (if any) at the time of SOP required
VENDOR NAME
DRBFM - PRBFM
Applicability-
Customer's complaint- Physical Potograph - physical Design Ser-
S.N. Product Source Root cause Before condition After condition Impl.on Mfg. RM Part Name / Remarks Part Name / Model Name Image After design chnges Image
Failure mode U/W phenomenon phenomenon issues PM
Model Name
1 Model name EFR
2 Model name EFR
3 Model name EFR
4 Model name Warranty
24
52 QSR
7 Model name
8 Model name Development
26
9 Model name Development
30
10 Model name Potential
Supplier LOGO
Supplier Name & address
PART NAME :
APPLICATION :
SR.
PART VALUE.
NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
Remarks : .
BAL CFT APPROVAL
SR.No D.epartment
1 R&D
2 CD
3 Purchase
4 4 Purchase QA
Proto Sample:
STATUS: Tooled Up/ Pilot Lot :
Production:
CUSTOMER: BAJAJ AUTO LTD.
PART NO.:
ITEM DESCRIPTION PRODUCT CATEGORY

Name of Person Sign
J AUTO LTD.
MOD. NO: 00
SUPPLIER
Package
MAKE
Date BAL APPROVAL STAMP
BILL OF M
SUPPLIER DRG. NO.:
SUPPLIER DRG. MOD.:
SUPPLIER DRG. DATE.:
SUPPLIER
PART NO.
BAL APPROVAL STAMP
BILL OF MATERIA
DRG. APPROVAL DATE
PART LIST REF. NO.:
PART LIST REV. NO.:
PART LIST REV. DATE:
DISTRUBUTOR NAME PPM UNIT
VENDOR CFT APPROVAL
Designation/
Department Name of Person
Design - R&D Head / Manager
Marketting Head / Manager

Purchase Head / Manager
Project Head / Manager

TERIAL
RG. APPROVAL DATE.:
ART LIST REF. NO.:
ART LIST REV. NO.:
ART LIST REV. DATE:
LEGEND /
NORMS
DESIGNATOR
Sign Date
FORMAT NO.:
FORMAT REV.:
FORMAT REV. DT.:
Page 1 of 1
REMARK
VENDOR STAMP
DFMEA to be attached
Process Flow Diagram to be attached
PFMEA to be attached
10. INPUT - PROCESS - OUTPUT CONTROL PLAN
Model:
Component Name/ No. : Mod. :
Process Stage :
Input Conditions Process Conditions
Parameter Specificati Measurement Frequen Parameter Specificati Measurement Frequen

on Method cy on Method cy
Development Engineer ( Vendor ) Development Engine

L PLAN
DATE: / / .
Output Conditions
Parameter Specificati Measurement Frequen

on Method cy
Development Engineer ( BAL )

10 Control Plan
Pre Pilot CUFT Productio Key Contact Date : Rev. Rev.Date:
n Person / No.
Control Plan No. Phone
Core Team : Customer Engineering Approval /
Date (if reqd.)
Part No./ Part Name. Supplier / Plant Approval Date. Customer Quality Approval (if Reqd.)
Supplier / Plant : Supplier Code Other approval Date (if reqd.) Other Approval Date. Customer :
Part / Process M/c,Device Charectrestics Customer Methods Control Resp Reaction Correcti
Process Name Jig,Tools Specific Product Evaluation / Error Sample Method Plan ve
No. /Operation for Mfg. Product Process Reqmt. /Process Measurement Proofing Size Freq. Action.
Desc. Specification. Technique
Development Engineer ( Vendor ) Development Engineer ( BAL )

11. DEFECT MAPPING OF EARLIER COMPONENTS

Model:
History in earlier components Plan for present c
Warranty Applica
Model Defect / Root cause Countermeasure taken bility
Inhouse (Y/N)
Note: Consider all failures indicated in PRBFM for External Customer Complaints and QSR for Internal Customer Complaint
Development Engineer ( Vendor )
FECT MAPPING OF EARLIER COMPONENTS
DATE: / / .
Plan for present component
Countermeasure plan Status
Customer Complaints and QSR for Internal Customer Complaint

12. DISTINCT CHANGES (List major changes in new component wrt most similar exi
Component Name : Component No. :

Model: Drawing Mod. No.:
Base Specifications /
model & Description of Specifications / Parameters Parameters- Existing
part no. Product
Prepared by
omponent wrt most similar existing component)
Changed Specifications /
Parameters - new model Remarks
component
Approved by
13. MANUFACTURABILITY STUDY
Model :
Component Name/ No. : Mod. : DATE : / / .
Sr Problem areas in Production Processes Proposed Counter measures BAL CD/R&D Response
No (Hard to make, Problems with
Equipment,Standardisation,Process
capability)
Note: Consider all the areas mentioned in categorywise list ( Format . )

Validation test reports as per VTS/DVP to be attached in vendor formats
ndor formats
Attach CMVR if applicable
16. QA MATRIX

Model: DATE: / / .
Process Stage
Product parameter
(CTQ)
Strong possibility possibility Remote possibility

14. QM Matrix
Model :
Component Name/ No. : Mod. : DATE: / / .
4M & T
condition
Cause of Criteria/ Checking
Process Characteristics Control Item Abnormality Freq. Action Resp
Machine
Method
abnormality specification method
Tool
Matl
Man
lopment Engineer ( Vendor ) Development Engineer ( BAL )

17. CTQ (Critical To Quality
Part Name.:
Part No.:
Class of Characteristics
Critical (I) Safety (S)
Sr Q Requirements Characteristics
Regulatory(R)
Major(M)
Performance / Functional
Fitment
Appearance
17. CTQ (Critical To Quality Requirements - Critical dimension/parameter matrix)
Rev.
Checking Method
Specifications
matrix)
Vendor :
Sheet : 1 of 1
Frequency
Remarks
Cp, Cpk, Xbar R Chart, HISTOGRAM for CTQ parameters like solder paste hei
reflow temperature or any other equivalent CTQ parameters to be attached
e solder paste height, solder tip temperature,
to be attached
Stage Inspection Check sheets (first /middle /last piece inspection reports)
(To be made on separate sheet for each stage operation)
ection reports)
Vendor format can be used.
Should cover-
1.Test Benches
2.Gauges
3.Instruments
4.Fixtures
Should contain name, identification number, Calibration done date, Calibration du

ne date, Calibration due date etc
21. POKA-YO
Applicability
S.No. Process POKAYOKE Details
(Y/N)
Prepared by
21. POKA-YOKE & KAIZEN List
POKAYOKE
Type- Verification
POKAYOKE verification Method PM plan
Preventive/ Frequency
Detective
Approved By (QA Head)

Contingency plan
(in case of POKAYOKE malfunctioning/breakdown)
22. Child Part - Sub vendor /Source Matrix.
Model :
Vendor: DATE: / / .
No. Child part No. Child part name Subvendor Name Subvendor location Contact Details
Note : Include details of raw material ( Steel, Alluminium, Plastic, Rubber ) and Paint, thinner, plating chemicals.
Include details of Special process Vendors if outsorced ( HT, Painting, Plating )

Raw Material TC reports from Subvendors
Raw Material TC reports (Vendor inhouse OR NABL certified third party Lab) contain
of all brought out child parts
arty Lab) containing Chemical, Physical & metallurgical properties
Inward Inspection checksheets to be attached for all brought of c
all brought of child parts
Special process Test report from Processor/s to be attached (in case d
(plating, powder coating, painting, welding etc)

ached (in case done from external agency)
Special process report to be attached (in case done @ vendor inh
(plating, powder coating, painting, welding etc)

done @ vendor inhouse)
28. Measurement results of part weight
Model: DATE: / / .
Specification/ target
Actual part Weight
Weight
S.No. (in Kg upto min. 3
(in Kg upto min. 3
decimals)
decimals)
10
Avg. actual weight

Prepared by Approved by
Page 82
ESD & Soldering Audit Checksheet

Audit Date(s): Vendor Name: Vendor location:
Auditor (s):
Rev no / Date: 00 / 12.02.2019 Vendor Code: Contact Person:
Auditee (s):
Sr. Exp. GYR
Characteristic Expectation Requirements Observation details Action Plan Responsibility Target Date Actual Date
no No. Status
1 Supplier Shall have ESD critical / Component list.
HBM (Human body model) and CDM (Charged device model) has to be
2
identified and based upon the same ESD spec for floor has to be decided.
3 ESD conductive flooring/mats, wrist and heel/foot straps.
Equipment, magazine trolley, electrical screw drivers, soldering gun, work

4
tables, chairs etc... are grounded for ESD improvement.
Supplier has documented electro static
discharge (ESD) controls throughout
Electro Static facility (incoming quality, production ESD line audits per supplier internal requirements (Detailed check sheet &
1 Discharge 5 line, packaging) plan v/s actual) documented in control plan. Recommend monthly audits as
Control per ANSI-ESD S20:20.
Supplier must conform to
ANSI-ESD S20:20 or IEC 61340
ESD compliance for employees and visitors and it is computerized and/or
6
documented on log sheet.
Parts are stored, transferred, and packaged in ESD bins, racks, magazine
7
trolley, trays bags, etc...
8 Fixture make of Delrin martial, Metal fixtures are grounded.
9 Dehumidifier, De ionizer exhaust are to be used effectively.
No dust, dirt, metal shavings, leaded pencils,metalic paint markers at work

1
stations on PCBs.
No food / drinks / water bottles allowed at workstations. Work stations / areas

2
are organized and cleaned as required - daily / end of each shift / 5S Audits.
3 Vacuum system in areas where potential/high contamination generated.

Supplier has appropriate contamination
controls throughout plant
Recommend to eliminate card board based boxes on the manufacturing floor.
2 Clean Room 4
Transfer parts to bins before deliver to line.
VDA 19 or ISO 14644-5
Dust level measurements (different levels of dust measurement in PPM, actual
5
v/s target) - 3 Months Min.
Mechanical and electrical noise are not allowed in clean room, Check points
6
are to be monitored periodically - 3 months min.
7 Room temp should be 22-28 ° C, Humidity should be 40-60 %.
Handling & Storage
1 Temperature and humidity controlled storage area / chambers has to be used.
Components must be used within stated shelf life dates with no signs of
2
oxidation on component / board solderable surface.
HIC (Humidity Indicator Cards) verification before handover of the part to

3
Supplier has proper storage methods for production - MSD sensitive.
environmentally sensitive components
(Integrated Circuits (ICs), other) and
material (solder paste , glue) Shop returned part must be in same pack (Zipper ) and sealed with HIC card.
3 Handling & Storage 4
MBB (Moisture barrier bag).
Supplier must conform to IPC/JEDEC J-
STD-033 and
IPC 1601
5 Access Control, Clean room controls are requirements of stores.
6 List of MSD sensitive parts.
Industrial refrigerator, dehumidifier, AC, Backing oven & windows are needs
7
of the clean room and stores.
Production Line Mfg. & Quality Systems
Comprehensive soldering training program and certification in place for all

1
operators, inspectors and technicians.
Supplier has comprehensive soldering Operators are trained and certified for each job requirement and identified for
2 training program type of job assignment through badge or other methods.
Operator Training
3 IPC A 610G and IPC 7711/7721 Supplier has to demonstrate multi skilling strategy for critical stations.
IPC A610G, Zero defect soldering should be known to Printer, ICT, AOI,
4
Soldering & rework operators.
Confirm to IPC J-STD-005. Measure surface insulation resistance (SIR) with

5 Solder Paste test methode as per IPC TM-650.
Confirm to IPC J-STD-004. Measure surface insulation resistance (SIR) with

6 Flux ( NO Clean Flux ) test methode as per IPC TM-650.
Supplier to use solder paste ROL0 or REL0.
7 Solder Bar Confirm to IPC J-STD-006.
Assembly Materials
Meet requirements for material selection, Final finish, Surface plating and
8 PCB
Coating thickness as per IPC 6012 and PCB warpage as per TM-650.
4 9 Components Confirm to IPC 7095 and IEC 60068-2-54 .
10 Adhesive Self life monitoring must confirm.
11 2D / 1D Barcode scanning for components and final product.
PCBs marked with bar code labels or serial numbers or 2D data matrix or
12
Supplier has appropriate traceability tracked by lot numbers.
Traceability system for PCBs, components and final
product Electronic identification (flash memory, bit writing) for tracking pass/fail
13
criteria as applicable.
14 Laser barcode is preferred.
Manual handling requires appropriate gloves or finger cots – no direct operator

15
contact is allowed.
Supplier has appropriate handling Boards in storage racks are nested / separated with no contact to populated
Handling 16
methods for PCB assemblies areas.
No possibility of component damages in magazine trolley, bins, bubble sheets,

17
stackers etc..
PCB Loader
1 Teknek or equivalent auto cleaning for 100% bare PCBs, Set up?
PCBs cleaning station with ionized air (blow off and vacuum system) or other
5 PCB Loadling 2 PCBs are clean prior to screen print
cleaning methods like antistatic brush or antistatic tape.
3 Top- Bottom priority is decided / displayed / Followed.
Solder Paste Screen Print
1 Note: Describe solder paste types used in production in CP, WI
2 Solder paste is in sealed containers.

Appropriate controls for solder paste
storage.
Solder paste containers stored and handled as per manufacturer's
3 recommended specification. (Controlled Environment - Industrial
Refrigerators with controlled Temp & Humidity)
Solder paste containers are labeled to track date and time for storage, usage
4
and expiration.
Supplier uses automated solder paste Automated process required - manual process not recommended
5
application Automated fudicial check is recommended.
Automated cleaning equipment/Vacuum cleaning / Ultrasonic /

6
/Stencil cleaning machine/Manual cleaning with alcohol based wipes.
Cleanliness frequency established by supplier to demonstrate high quality

7
printing capability. Minimum once/shift and every changeover.
Page 83

Auditor (s):
Auditee (s):
Sr. Exp. GYR
no No. Status
8 No dents, damages, scratches at soldering area are allowed.
Supplier has appropriate methods for Visual inspection of stencil apertures for solder paste residue after cleaning
9
stencil cleanliness (Illuminating table with air gun is recommended for inspection)
Nano coating ( Teflon coating ) is preferred / highly recommended for stencil.

10
Magnetic stencils are recommended.
11 Stencil life, replacement mechanism
12 Stencil cleaning frequency should be max & PQS should be available.
Solder paste must have uniform appearance (roller) with no signs of separation
13
(while squeezy up ) and must be at room temperature for each print.
14 Automated alarm for solder paste top-ups.
Supplier has appropriate controls for Measure or visually inspect solder paste height, registration, % pad coverage,
15
required solder paste coverage bridging and voids (Min coverage should be 75% of the pad)
Supplier to use 2-D inspection , 3-D inspection (Automatic Optical

16 Inspection), trend tracking capability or any industry accepted method to
verify consistent paste quality printability
17 Auto fudicial checks for PCB and stencil both.
Supplier has appropriate

Support Pins /Template/Fixture/Holder shall be used to avoid component
18 Template/holder to hold the PCB during
damage
Printing (Top& bottom)
Solder Paste Please state the solder paste's designation

6
Printing and the supplier's name.
19 And what is the solder paste type in the Halide (a salt of halogen like Chlorine , bromine and iodine) free is preferred
IPC flux classification (ex:
ROL0，ROL1，REL0，REL1...) ?
Stencil storage racks should be available, minimum dust accumulation to be

20
considered, stencil should be kept horizontally.
21 No IPA residue allowed on stencil.
22 All the apertures are to be covered with shrink rap from both the sides.
Tension on all four ends of the stencil should be checked at end of the shift /
23
Supplier is maintaining stencil with change over.
proper care
Cleaning of the stencil before stacking should be done at every end of the shift
24
/ change over
Verification of the stencil should be done for all the apertures before stacking
25 at end of the shift / change over (Illuminating table with inclined surface is
required)
Stencil to be developed and compliant with IPC 7525 Stencil Design

26
Guidelines.
As per Data sheet Recommendation has to be followed (By general practice -

27
3~4 Hours in shop floor condition). Lock and key with timer
Solder paste has to be left at room
temperature before opening
28 Poka yoke is preferred for ensuring proper mixing.
29 Solder paste preparation (Extraction) Manual stirring is preferred to ensure proper solderability
Time the solder paste can be used after

30 Poka Yoke required for after Extraction control method
extraction
31 Squeezy condition to be verified after every shift.
32 No solder paste should be left over during wipe.
Squeezy condition monitoring
33 Replacement frequency should be defined.
34 Squeeze should be metallic.
35 Dust entry after paste printing No open section between printer and pick and place machine conveyor
36 Air pressure down pokayoke In case air pressure reduces machine should stop
37 Nozzel calibration NXT machine like facility of self suction and calibration
Concerning the solder paste printing

38 misalignments and insufficient fillings Procedure and Process has to defined and followed
inspection, please state
The inspection method (2D auto, 3D

39 Automatic 3D preferred
auto, human, etc...)
The inspection rate (frequency or % of

7 Solder paste Inspection 40 100% preferred
boards)
3) The inspection coverage (all lands or

41 100%
samples)
42 4) The inspection item and criteria AS per IPC 7527
Placement (SMT Components)
Recommend spool, feeder & loading location on mounter barcode scanning

1
method.
Supplier has controls for changing and If not, 200% inspection during reel loading/tray change-over (Splicing)
2
placing component reels documented on log sheet with two signatures required.
Next generation Pick and place machines are preferred in which splicing can
3
be eliminated.
Critical placement components (smallest SMD and fine pitch ICs) meet initial
4
Ppk> 1.67 and on-going production Cpk > 1.33
Supplier has a capable component
placement process
5 Equipment placement capability verified prior to run@rate.
100% High speed camera for proper component alignment and identification if
6
possible.
Supplier has appropriate controls for

Supplier to use 2-D inspection (3X magnifying light), 3-D inspection
correct component placement (No
7 (Automatic Optical Inspection), trend tracking capability or industry accepted
components missing, skewed, reversed,
method to verify correct components placement.
etc..)
Support Pins /Template/Fixture/Holder shall be used to avoid component

8
damage
9
possible.
Does the mounting machine have the
ability to inspect for QFPs lead
coplanarity before mounting ? Supplier to use 2-D inspection (3X magnifying light), 3-D inspection
11
If BGAs used , does the mounting possible.
8 Pick & Place machine have the ability to inspect the
balls before mounting, and what do you
Page 84

Auditor (s):
Auditee (s):
Sr. Exp. If BGAs used , does the mounting GYR
Characteristic machine have Expectation
the ability to inspect the Requirements Observation details Action Plan Responsibility Target Date Actual Date
no
8 Pick & Place No. Status
balls before mounting, and what do you
inspect ?
If use support pins , how do you check

13 Start of and End of Shift and Model change over
the location of pins is correct ?
How frequently are the sucking and

14 blowing nozzles cleaned up and Daily Once, check sheet ?
serviced?
Error proofness of the new component

15 Procedure and Process.
supply operation.
How do you prevent the mistake of

16 setting direction(polarity) of components System for handling with PWD.
when components are supplied?
Please state the handling of the

remaining unpacked ICs (QFPs, BGAs)
17 MSD level for each E- comp has to be studied.
when production stops for more than 24
hours.
How do you check for mounting failures

(ex: wrong components, missing, wrong
18 Daily review & action review.
loading misalignments, lifting, polarity,
component cracks) ?
Who MQA confirms component

placement height vs part library, weight , To be cross checked at the time of stencil PM.
19
pad size is cross checked with PCB pad Max freq is 6 months
size.
What is the control on dump box

20 Daily dump box audit is to be done, CAPA is to recorded
rejection
Reflow
Equipment controls and maintenance are in place. Set up verification

1
procedure is defined
Thermal Profile meets component and material temperature-time specification

2
from suppliers.
Thermal profile frequency is minimum once per shift or supplier demonstrates

3
capability of consistent performance up to once per month frequency.
Methods are in place to control reflow

Thermal profile to be completed after repair or product change-over with
process.
4 parameter changes. PM, brake down, repair check sheet should have profile
Thermal profile must confirm to IPC
check.
7530.
Current oven temperature profile to be posted on the line or on-file and

5
available for customer review as per IPC-7530.
9 Reflow Equipment has alarm system for out of control conditions, UPS ?
6
(Power cut, conveyer width variation, etc..).
If no automation in conveyor width variation, template, model wise list to be

7
made.

Supplier has appropriate inspection (Automatic Optical Inspection), trend tracking capability or industry accepted
8
methods for soldered PCBs method to contain solder defects ( solder bridge, solder balls, tomb stoning,
etc...).
Is nitrogen gas atmosphere provided in

9 Preferred to use Nitrogen gas.
the reflow soldering machine?
Are there standards about the way of

fixing the thermocouples and the fixing Reflow-Component study has to be studied as
10
materials on the profile measuring board per Part data sheet and display in in WI or set up check sheet.
used during the setup of the oven ?
AOI
1 3D inspection is preferred / recommended.
2 False call rate to be monitored.
Supplier has appropriate control over

3 Rework handling to be ensured properly in the process automatically.
AOI for proper functioning
4 AOI inspector should be trained by certifying body like IPC.
Automatic Optical Re- teaching/Part alarm should come if continue 3 parts failed for more than
10 5
Inspection either 5 or 5 % of the parts failing in AOI.
Critical component list should be available with supplier which is not

6 recommended for rework (E.g. Micro controller & other high sensitive
components).
If to be reworked IC remover is to be used, dummy stencil, re baller is to be

7
used for IC , BGA assembly.
Rework / Rejection of the PCB failed in
AOI should have proper automated
control
8 Rework person should be trained by certifying body like IPC.
9 Part should be again passed through AOI for re-verification.
Manual Insertion
Confirmation of parts inserted and with correct polarity using the following
method (100% visual inspection, template, error proofing ).
1
Appropriate controls are in place for Auditee has to demonstrate best clinching practices, tools.
missing, wrong, raised components Prebending of the parts are preferred. As per IPC A-610G.
11 Manual insertion
Supplier must confirm minimum 1000
Lux at stage. Fixture and tools are used to hold down large components (e.g. bulk
2
connectors) prior to wave solder as applicable.
Wave Soldering

1
procedure is defined.
2 Nitrogen atmosphere is strongly recommended.
Appropriate controls are in place for

3 Solder wetting verified with optimizer or glass plate at set-up.
solder coverage and joint integrity.
4 100% Flux Coverage verified with glass plate at set-up.
Ramp rates and temperature zones verified by thermal profile.

5
(Documentation requirements are same as reflow)
Oxygen level must be below threshold limit of 50 PPM in solder area. Use
6
Oxygen analyzer to measure.
Inert Solder Pot Oxygen level
7 Maintain solder pot contamination level as per IPC-JST-001.
Wave has a stable wetting force on the PCB. Tools include glass plate or
8
optimizer.
Wave Stability and Distribution
9 Wave force evenly distributed along the width of the PCB.

12 Wave Solder 10
procedure is defined
Thermal Profile meets component and material temperature-time specification

11
from suppliers.
Thermal profile frequency is minimum once per shift or supplier demonstrates

12
capability of consistent performance up to once per month frequency.
Methods are in place to control wave
solder process.
Page 85
12 Wave Solder
Auditor (s):
Auditee (s):
Sr. Exp. GYR
no No. Status
Methods are in place to control wave
solder process.
Thermal profile to be completed after repair or product change-over with
13
parameter changes
Thermal profile must confirm to IPC
7530.
Current temperature profile to be posted on the line or on-file and available for
14
customer review
Equipment has alarm system for out of control conditions.

15
(Power cut, conveyer width variation, etc..)
16 Reflow speed is how much? Is it matching with profile.
Appropriate controls are in place for Flux

17 Fluxer controls are set and monitored per known operating parameters
Spray ( If Applicable)
Appropriate controls are in place for Specific gravity of the foam flux per manufacturer's recommendation is
18
Foam Spray ( If Applicable) maintained to achieve uniform tiny bubbles for top side wetting

Appropriate controls are in place for (Automatic Optical Inspection), trend tracking capability or industry accepted
19
solder joint integrity method to contain solder defects ( solder bridge, solder balls, tomb stoning,
etc...).
Selective Soldering
Is nitrogen gas atmosphere provided in

1 Nitrogen Flow is must
the flow soldering machine?
2 How do you control the solder height ? Solder height has to controlled
Please explain how to control the

3 chemical composition of the solder in the Monthly Once
bath (criteria , frequency)
Is preheat performed, and is the preheat

4 Need Preheater
process installed after fluxing?
Are the fluxed area smaller than the PCB

5 Template has to be used to verify
Selective - solder contact area ?
13
Soldering
Concerning your Selective temperature
6 profile, please provide the following
information :
1)What is the preheating temperature

7
range (in °C) ?
2)What is temperature of the solder bath
8
(in °C) ?
Temperature Profile need to be monthly once
9 3)What is the peak temperature (in °C) ?
4)How long is the soaking time in

10
solder?
5)Is the thermal shock in the soldering
process lower than the heat-proof
11
specifications of all the components and
the PCB?
In-Circuit Tester (ICT)
Components - Equipment to detect presence, polarity and value of testable

1 components. If not 100% coverage, assure all components are covered in other
inspection areas (EOL, AOI, Visual, etc...)
Circuit board stress - strain gauge analysis completed at equipment prior to

product launch
2
Sn/Pb- 800 micrometer/mm, PB free 500 /mm
Supplier has appropriate controls for Supplier should comply IPC-9704
proper ICT functionality
Failed part should be again sent back to AOI / ICT for reverification after
3
rework.
4 Ensure zero resistance wires in ICT machine
Master samples/ defect samples are used at start of shift and every change
5
over to verify proper ICT functions.
6 Master samples are tagged and stored properly.

Supplier has a process in place to verify
In-circuit
14 ICT accuracy and proper function
Tester
Tester pins are cleaned and maintained as part of preventive maintenance
7
program.
8 No possibility of any fixture part touching component other than nails.
FTT is monitored for each tester in QOS (quality observation sheet) with
9
corrective actions.
Supplier tracks First Time Through

10 Retain historical data.
(FTT) for each ICT
Rejected PCB's are analyzed, root cause identified and corrective actions
11
developed.
Label, marking, computer printout, serial number tracking through traceability

12
system.
Supplier has identification methods for
tested PCBs (Pass/Fail)
Rejected parts are locked in fixture until parts are released by supervisor with
13
proper identifications.
PCB Separator / Router
Please state your singulation method

1 (ex : router, rotary cutter, guillotine, Router, cutter, manual cutting perforation.
manual).
What is the maximum strain allowed

2 Max 500 Strain. Strain gauge analysis as per IPC JEDEC-9704.
during singulation ?
15 Router
Please explain the procedure of renewal
3 of the cutter blade (frequency, change Cutter life monitored in machine and changed based on distance cut.
record).
4 Dust Supplier should demonstrate, no dust coming out because of the router.
End of Line Testing
100% functional coverage /or supplier specification. If not 100% functional

1 coverage, supplier must ensure all components are present through visual
and/or automated testing (AOI, ICT, Final test)
Controls are in place for 100% functional 100% functional software verification per TNL and/or supplier specification.
2
coverage Follow software assurance disciplines
EOL should be error proofed (part locked in place, locked bins, automatic
3
rejection of the part, barcode scanning, etc.)
5 Variable / Attribute Gauge study.
End of line
16
testing
Master samples are tagged and stored properly and are used at beginning of
6 Supplier has process to verify EOL tester shift and every change over to verify proper EOL functions
accuracy and proper function
7 Tester pins and hard connections are part of preventive maintenance program
Label, marking, computer printout, serial number tracking through traceability

9
system
Supplier has identification methods for
tested products (Pass/Fail)
10 Rejected parts are locked in fixture until parts are released by supervisor.
Repair / Reworks
Repaired parts with different component types (SMD, leaded, various sizes)
1 are included in Design Verification (DV) and Production Validation ( PV )
testing.
2 Repaired part to go back to station where it was rejected, PFD should include
3 Cannot repair the same part for same and/or different failures -/<2 times, SOP
4 Recommend eliminating high risk repairs during new product launch.
5 Do not rework component and critical Rework component need to be studied.

Page 86

Auditor (s):
Auditee (s):
Sr. Exp. GYR
no No. Status
6 Do not rework the parts until all the issues are identified.
Supplier has repair/rework policy,
procedures and guidelines
Photograph of common soldering failures should be displayed at visual and
7
rework stations.
Repairs must conform to
IPC-7711/7721
8 Metal wool cleaning of tip is recommended over sponge and roller.
17 Repair/Rework
9 Gun temperature to be justified. (Compliance as per component data sheet ).
10 Rework procedure should be available.
11 IPA, cleaning, usage of no clean flux is recommended.
12 IC remover should be available in case of QFP.
13 Dummy stencil for IC assembly.
Supplier has traceability system for

14 Parts are identified e.g operator initial/mark, label, dot, etc..
repaired parts
Supplier has a process for quick Follow First-in-First-Out (FIFO) system for repaired parts inventory
15
turnaround time for repaired parts. No more than 2 days backlogs.
Metrics has to be tracked to reduce repairs and drive continuous

16 Supplier tracks rework/repair data
improvement.
Conformal Coating
1 Recommend automated process (Needle, Spray, Dip).
2 100% coverage of target area on PCB.
Supplier has appropriate methods and

3 controls for applying conformal coating. Proper areas coated. Keep-out zones defined.
As per AIAG CQI-17.
4 Use ultraviolet light and 3X magnifying light for inspection.
Cure temperature and time per supplier and/or manufacturer's

5
recommendation.
Please state the coating application

6 Spray is recommended.
method (spray, dipping or manual)
Conformal
18
Coating
Please state the coating agent designation
7 Approved supplier.
and the supplier's name.
Please state the main ingredient of the

Data sheet of supplier need to be studied and
8 coating agent (ex : acrylics, epoxies,
documented.
urethanes,
Are silicones) of the material
the characteristic
controlled? (ex: chemical composition,
viscosity, pot life , etc...)
9 And if you use dipping machine , how do Documented Procedure and process.
you control the cleanliness of coating
liquid ?
What is the coating application tool in
10 For manual Hand Spray.
use ? (ex : brush, hand spray, etc...)
Coating Gauge and thickness as per IPC A610

11 How do you inspect the coating quality ?
& IPC-HDBK-830 Standards.
Manual Soldering
1 Tip temp 220 to 400 degree Celsius, tip temp measuring equipment.
2 Appropriate soldering bit make and model
3 Cleaning of bit, metal wool.
4 Flux is in built or external, make, type.

Soldering gun
5 Solder bit at end of the shift day should be covered with solder.
6 Use IPA at every station for tip cleaning.
7 ESD soldering gun should be used.

19 Manual Soldering
8 Solder wire make, composition should be included in CP, WI.
10 Defect matrix should be displayed at all appropriate locations.
11 Nose masking and exhaust should be available.
12 ESD Brush should be available at all stations.

Station and facilities.
13 Magnifier are to be used 10X ideally.
14 Duct below matt for solder ball.
15 Twiser should be available.
Robotic Soldering
1 Japan unix make robot are preferred on local make.
2 Minimum play in the Solder gun arm.
3 Minimum rotations in the programs.
4 Jerks are not allowed.
5 Fixtures are to be fixed and FCB should have locating dowel pin.
6 Feeder should have original Japan Unix hose.

20 Robotic Soldering FTG
7 Special care should be taken in case of thin solder wires.
8 No duplicate programs are allowed.
9 Teaching should be certified by QA in charge.
10 Programs should be password protected.
11 Bit should not touch any unintended component.
12 Stress stain analysis should be done.
Dip soldering
1 Detailed set up verification sheet should be available
2 Capacity of pot should be optimum
3 Cleaning of pot freq and record should be available
Horizontal straightness of the pot is to be checked with tubular spirit leveler or

4
bulls eye spirit leveler
Process controls on dip soldering
5 Supplier has to demonstrate strong cleaning process.
21 Dip soldering
Supplier should send solder samples to solder paste manufacturer to ensure
6
chemistry, certificate should be available
Minimal drauss should be present and cleaning freq vs actual to be tracked

7
with QA verification
8 Soldering time , Temp , should be in WI, CP, to be proved with no deviation.
9 Fixture condition / design should help correct orientation of solder fountain
Maintenance controls on dip soldering.
10 Detailed PM plan should be available

Layout inpsection reports of min 5 parts as per BAL approved dr
Attach balloon drawing
AL approved drawing mod while SOP/RAR
Photo of actual part indicating Vendor code, Part code, part num
For Example-
code, part number , date etc
SAMPLE FORMAT
31. Corrective Action Plan.
{ After Proto, Pre-Pilot, Pilot, Productoin, Cuft etc..}
Model :
Issue related to Problem Defect Root cause Countermeasures Planned Resp.
FUNCTION
FITMENT
AESTHETICS

31. Corrective Action Plan.
oto, Pre-Pilot, Pilot, Productoin, Cuft etc..}
DATE: / / .
Target Date
32. Material Handling Plan & Packaging Standards
Model :
Vendor Name :
VENDOR ---------->TO BAL
VENDOR <---------> SUBVENDOR

FROM TO CONVEYANCE MODE QUANTITY FREQUENCY
1. Add photographs of despatch mode to BAL

2. Show identification scheme in component photograph
Component photo Primary packing photo Secondary Packing photo

Primary Secondary
Quantity of Parts/Pack
Returnable/Non-Returnable
Packing Material
Packing Material Specification
Outside Dimensions L X W X H (mm)
Total Loaded Weight (kg-full)
Label (Yes/No)
Other details if any -

erial Handling Plan & Packaging Standards
DATE: / / .
PACKING/ HANDLING DETAILS
Final Bin/ Trolley photo

PPC Engineer ( Plant)
Inspection Agreement Between M/s. Bajaj Auto Ltd. And M/s.
Contents Of This Agreement
Sr.No. Discription
1 BAL Approved Drawing
2 Process Flow Diagram
3 Quality Agreement Sheet
4 Inspection Agreement Sheet
5 Asthestic Standard
6 List of gauges
7 List of poka yoke / Kaizen
8 Eye sequence chart
9 P.D.I.Report
nd M/s.
Attached
Y/N
Ref DR/PPAP S.No.1
Ref DR/PPAP S.No.6
To be attached
To be attached
To be attached
Ref DR/PPAP S.No.18
Ref DR/PPAP S.No.19
To be attached
Ref DR/PPAP S.No.34

Quality Agreement Sp
between
M/s. Bajaj Auto Ltd

and
Supplier - M/s.
Component name: Component
Implementation date: Rev.No.:
1. This Inspection agreement is prepared and to be followed to ensure defect free supply of parts to BAL in order to
Customer complaints and field failures due to detectable component / part characteristics.
2. This Inspection agreement aims at having common understanding between Bajaj Auto and the Vendor on Inspec
methods and acceptance criteria.
3. The Supplier team confirms that the quality requirements & inspection requirements mentioned in the documents
ambiguity on any point.
4. The Supplier team agrees to maintain the calibration records of all the tooling like inspection equipments (gauge
process), Jigs, Fixtures etc.
5. The Supplier team agrees to implement inspection agreement on similar lines with all concerned Sub vendors f
adequate inspection facilities.
6. The Supplier team agrees to submit PDI report alongwith every Lot of supplies of all parts & follow the correspon
this agreement.
7. The Supplier team agrees that this document will be reviewed and updated as and when felt necessary (i.e. Draw
action resulting out of investigations/ analysis , changes in capacity, any changes in sub vendors, any changes insp
in the scope of the agreement etc.)
8. The Supplier team agrees & confirm adherence to the systems in Development documents (Ref: DR/PPAP file).
9. The Supplier team agrees & confirm Prior Approvals from BAL QA authorities in case of 4M changes ( QA will int
QA )
· Deviating from / by-passing the agreed process, method etc.
· Changing any 2nd level source for special processes ( like surface treatment source / HT etc.)
· Change of Raw material or Raw Material Source
· Change in Source of Bought out parts,
For M/s. BAJAJ Auto Ltd- For M/s.
1 R & D CD 1
2 R & D QM 2
3 Plant QA 3
Space for Supplier logo
Component no.:
No.:
parts to BAL in order to achieve Zero - QSR, EFR,

s.
nd the Vendor on Inspection Parameters, Inspection
tioned in the documents are understood & there is no
ion equipments (gauges, instruments for the parts /
oncerned Sub vendors for Bought out parts ensuring
s & follow the corresponding PDI Format, which is a part of
felt necessary (i.e. Drawing modification, any corrective

dors, any changes inspection procedures/ facilities, change
s (Ref: DR/PPAP file).
M changes ( QA will internally coordinate with CQA & Plant
etc.)
Plant Head
QA Head
INSPECTION AGREEMENT
Vendor
Vendor Name Part Name Part No
Location
PART PHOTO
Class of
Characteristics
Critical (I) Safety
Sr. No. Requirement Inspection parameters Criteria OR Specification
(S)
Regulatory(R)
Major(M)
FUNCTIONAL
FITTMENT
AESTHETIC
AESTHETIC
Performance
Test Specification Inpsection Methodology
Requirement
Material As per BOM/drawing Inhouse /3rd party TC
Plating / painting /
As per drawing/ BAL ABS Std Salt spray equipment
powder coating
Testing & validation

As per drawing/ VTS As per procedure
requirements
Layout Inspection As per drawing As per procedure
DOCUMENT SIGN OFF

Vendor BAL - CD
Sign 1
Sign 2
Sign 3
REEMENT
Part Mod/
Revision Model Date Requirement-
number
FUNCTION
FITMENT
AESTHETIC
eria OR Specification Insp. Method Insp. Freq. Remark

Submission
ection Methodology Frequency
Method
As & when
house /3rd party TC Once in month
required
As & when
alt spray equipment Once in six months
required
Yearly with layout

As per procedure Once in a year
inspection report
Yearly with layout

As per procedure Once in a year
inspection report
N OFF
BAL - CD BAL - CDQM DATE
Model Part No.
Sr. No. Dimensions / Characteristics
Black spot / Black dust on lens

1
and housing
2 Silver streak on lens
3 Scratches on housing
4 Scratches on lens
5 Parting line on housing
Mismatching between lens and

6
housing
7 Short mould
8 Burn mark
9 Crack
10 Flashes
11 Parting line flashes
12 Shrinkage of housing
13 Water strain / Oil mark
14 Weld line of lens
15 Yellowness metallizing
16 Rainbow on reflector
17 Black shade of metalizing
18 Colour of screw plating
19 Texture of Lens
20 Coupler and wire colour
21
22
23
24
25
26
27
LEGENDS :
A ZONE
M/S BAJAJ AUTO LTD.
Plant QA
Pur QA
CD
Part Name
Specification
Zone A
Aest
Part Name
Specification
Zone B
Aesthetic standard
Part Mod. No.
Performance /
Fitment / Aesthetic
Zone C P F
B ZONE
M/s
QA HEAD
PROD.HEAD
ME HEAD
ard
Mod. No.
mance /
/ Aesthetics
General Guideline :
Part Visual Inspection criteria -Distance 60
cm ,Duration 5~15 sec, Light -800 TO
1200LX ,View- Vehicle mounting
A Zone
Front View
Material
Illustration
a -Distance 60
-800 TO
ting
Front View
Side View
Zone
iew
Company Name
Illustration
Top View
Front View
Side View
Top View
C Zone A Zone
Side View
C Zone
C ZONE
EYE SEQUENCE /VISUAL INSPECTION
PART NAME :-
Fitment CD 14
1
12
2
3 13
4
5
Under Bkt
7 Assembly
Direction of Inspection
(Blue Arrow )
11
10 Bottom
Case
Bottom Case
Sr. No Inspection Points Critcality Criteria
No dent,damage & Plating

1 Fork bolt Appearance
peel off
Appearance & No dent,damage & Plating

2 Fork Pipe
Function peel off
3 M-_ _ Thread Fittment No dent & damage
No dent, damage & coating

4 Under Bracket Appearance
peel off
No dent, damage & coating
5 Blinker bracket Appearance
peel off, No powder in M6 Nut
6 Hex Bolt Appearance Passivation Finish
No Gap between Ball Race &

7 Ball Race Appearance
U/B & No Crack
8 Bellow clamp Appearance No loose
must seat in bottom case

9 Bellow Appearance
groove , no cut /damage
No dent, damage , coating

10 Bottom Case Appearance peel off, Powder uncover and
casting defect
11 Fendor Hole ID Fittment No Blockage in ID
12 M-_ _ Thread Fittment 100% inspection by T.R.G.
13 Centre Pipe Ø _ _ Fittment 100% inspection by PRG
Under bracket 100% inspection by

14 Fittment
Alignment Qualification of C.D. Gauge
Identification mark
Must availabel as per
15 (Batch code, Date , Traceability
requirement
V. code etc)
Prepared by
NSPECTION CHECK POINTS
MODEL :-
Function Important
Fitment Important
Aesthetic Important
Under Bkt
Assembly 6
8
SAMPLE F
Bellow
clamp
Bottom Case
9
Bellow
Inspection
Inspection Method Inspection tool Freq.
Conf. mark
Visual, Touch 100% N
Visual 100% N

Visual, Touch 100% Y
Visual 100% Y
Visual 100% N
GAUGE 100% Y
GAUGE 100% Y
GAUGE 100% N
Visual 100% N
Approved by
AMPLE FORMAT
34. PDI CHECK SHEET
DATE: / / .
PART NAME DATE Qty
PART NO VENDOR
Sr no Parameter Spec Checking Method 1 2 3 4 5 Remarks
(A) Function
(B) Fitment
(C) Aesthetics
Remarks
Checked By
Note: Vendors format can be used. Ensure that all above parameters are included

Attach BAL SIR copy (received from BAL CD Manager )
36. Capacity & Final Tooling Readiness
Customer- Bajaj Auto Ltd
BAL part Name BAL Part No. Vendor Part No.
*In case capacity / final tooling readiness NOT OK-
Problem Areas in Production Processes (Hard

to make,Problems with
S.No. Countermeasures planned
Equipment,Tools,Standardisation,process
stability/capability issues,Bottleneck operations etc)
Vendor QA Head
Final Tooling Readiness
Capacity Staus Final Tooling status

Requirement /month
(OK/NOT OK) (OK/NOT OK)
untermeasures planned Responsibility Target date & status
Vendor Plant Head

Vendor Self Assesment Audit Check Sheet
Model :
Sr. Check parameters

Inward Inspection Control :
1 Are the raw matl T.C's available for every lot/batch ? (TC's of mill /raw matl manufacturer etc.)
2 Is the matl being cross checked from out side lab with decided frequency?
3 Is the identification is there for ok /not ok matl ?
4 Is the Insp of all loose brought out parts /sub-asslys are being carried out & reports available ?
Document Control :
5 Is the copy of DR Document is available at actual manufacturing plant /place ?
6 Is the copy of latest BAL drg / approved drg is available?
Are the test certificates of special processes are available
7 (i.e.plating,painting,powder coating & heat treatment etc.)
8 Are the R&D Approvals are available for any deviations /Nc's wrt to drawing (if any) ?
9 Is the BAL SIR approved & copy available with vendor /sub-vendor's end ?
10 Is the IPO / 20 Basic systems followed for newly developed parts.?

11 Are the Stage wise audit check sheet ready – For transferring to regular process audit.
12 Is provision made for traceability of parts ?
Process Control
13 Is the manufacturing process being followed is same as given in DR ?
14 Are the stage wise SOP (established process parameters) are displayed at work stations ?
Is the in-process material handling is free from metal to metal contact (plastic bins,trollies,chute,tables etc.)?
15
16 Are the Inspection /process poka-yoke's are available as per the list and working properly ?
17 Is the component /assly being manufactured by using final tooling / fixtures ?
18 Are the gauges available to check stage wise important /critical parameters ( if any as per CTQ).
19 Is single piece flow followed?
Requirement of SMT Processes
Are Electronics components packaging & storage condition meeting as per manufacturer recommendation.
20
21 Is PCB Baking followed ?

22 Is there any PCB cleaning either through antistatic paper/air are being followed.
23 Is there clear instruction of PCB handling/loading in the magzine with clear direction of PCB.
24 is there any cleaning frequency of stencil & criterias for frequency of cleaning.
Is there any procedure defined for solder paste storage/throwing & meeting as per Solder paste
25 manufacturer.
26 Is Solder paste inspection through 3D SPI machine & followed as per IPC guidelines.
27 Is there any wrong loading detection facility available in Pick & place machine during setup & splicing
process.
28 Is there any mechanism for PCB support pins/block throughout the line from Solder paste to Reflow oven.
Is there any profile measurement of reflow oven online/through profiler with actual running board or frequency
29 of measurement in case of offline.
30 Is nitrogen gas atmosphere provided in the reflow machine?

31 Is soldering inspection through 3D AOI & operates by IPC trained operator?
Requirement of Post SMT Processes
32 PCB de-panneling process through router & bit changing shall be defined & interlocked.
Is there any SOP for parts handling from AOI to post SMT processes & there should not be any damages to
33 the PCB components.
Is there any lead forming process & parts shall be ensured for any stress on PCB leads during forming & lead
34
cutting process.
Leaded component soldering process shall be through robo/wave /selective soldering & PCB component
35 shall be masked to avoid any soldering spatter on PCB component.
36 There should not be any stress on PCB component during ICT testing ICT fixture shall be validated.
For screwing process: Troque should be controllled, Screw counter should be available & PCBA components
37 should be masked.
Common
Electronic components storage:

38 Temp.: 18～28℃
Humidity:30% - 70% RH
Shop floor Environment condition for PCB Assembly:
Dust Level: ISO Class 8 or better should be followed.
39 Temp.: 22～25℃
Humidity: 40% - 60% RH
Stage wise rework procedure shall be defined with action/disposal details with rework traceability shall be
40
followed.
ESD Compliance shall be followed throughout the processes.
41
42 Are the guidelines defined not to use dropped components/parts?

Requirement of finish component (machining)
Are components being washed in water /coolant before transferring to next operation.?
43
Is chip and coolant accumulate on machining fixtures/jigs? (if yes, is suitable draining
44 arrangement available ?)
Generic Requirement of finish component (Painting , powder coating , anodising etc)
45 Are components cleaned by Tag O Rag after buffing and before surface treatment
Are the special test facilities available(Leak test, Hardness tests, Adhesion test for painting /plating,as
46 applicable given on respective drawing)
Are the Q-points/Q-Alerts are identified & displayed on resp machine /test rig etc.
47 (i.e. key points for insp method / job loading-unloading methods /leak test method etc.)
48 Are the operators /supervisor's are aware @ important CTQ parameters ?

Inspection Control
Is the dedicated area / identification is provided to store finish goods to avoid mix-up issues etc.?
49
Is the final insp table is made available ?.
50 ( min 1000 lux light at insp area, final Inspection gauges, Relation gauges & other test facilities are available)
51 Are Snap gauges , plug gauges, treading gauges forced in to component?

52 Are limit / ref samples displayed at each stage for visula insp.?(with ABC zones)
53 Are photographs of defects printed and displayed in color ?
Is Inspection status marked on each component ?
54 (i.e. OK, Reject, inspector identification)
Is dfective component arrested at manufcaturing stage only & not passes to further stages ?
55
Is the Inspection report is made for minimum 30 components to ensure dimensional consistency (for all “I”
56 Dimensions & important parameters identified in CTQ) ?
Are cp/cpk parameters like solder paste height, solder tip temperature, reflow temperature or any other
57 equivalent CTQ parameters identified and followed
Material Handling & packing

58 Is the packing /transportation modes of finish goods is ok ?
Are components touching to each other or to any metallic surface during handling specifically in “A” class
surface.
59 (i.e. Surface critical for appearance, during all manufacturing process and during material handling including
dispatch?
Is preventive maintenance schedule (cleaning, repairing, replacing) made and followed for component
60 handling trolleys and bins? (Appropriate labels indicating status of preventive maintenance shall be fixed on
trolleys and bins.)
Component handling trolleys- Are components are not touching to each other and located, oriented firmly to
61 avoid contact with each other?
Are at each work station/stage separate bins for input component and output component available? (Red bin
62 shall be available for non conforming components.)& bin cleaning frequency shall be defined.
Corrective & Preventive actions

Are the actions are taken on all field /QSR issues reported so far are horizontally deployed (if any on similar
63
comp) ?
Are the PRBFM/DRBFM check points considered – No of points and details.?
64
Housekeeping and storage of material, tools, dies
65 Is finish material being stored on Proper duck boards, platforms ( not on floor directly)
66 Is disposal of un necessary items done ? ( 3S - Good arrangement & cleaning shall be followed)
67 Is FIFO implemented / Maintained ?
3 SMT processess check point added

2 KHI - Generic requirements check point added
1 Check Pont No. 23 "cpk for characteristics having tol <50 microns " added.
Rev Change Details
For BAL
1)
2)
3)
Vendor Self Assesment Audit Check Sheet
BAL PART NO. : Rev. No.: Vendor :
Part Name : Audit Date :
meters Y/N
on Control :
tl T.C's available for every lot/batch ? (TC's of mill /raw matl manufacturer etc.)
g cross checked from out side lab with decided frequency?
tion is there for ok /not ok matl ?
ll loose brought out parts /sub-asslys are being carried out & reports available ?
ol :
DR Document is available at actual manufacturing plant /place ?
atest BAL drg / approved drg is available?
tificates of special processes are available
ting,powder coating & heat treatment etc.)
pprovals are available for any deviations /Nc's wrt to drawing (if any) ?
approved & copy available with vendor /sub-vendor's end ?
0 Basic systems followed for newly developed parts.?
wise audit check sheet ready – For transferring to regular process audit.
de for traceability of parts ?
turing process being followed is same as given in DR ?

wise SOP (established process parameters) are displayed at work stations ?
ss material handling is free from metal to metal contact (plastic bins,trollies,chute,tables etc.)?
ion /process poka-yoke's are available as per the list and working properly ?
ent /assly being manufactured by using final tooling / fixtures ?
s available to check stage wise important /critical parameters ( if any as per CTQ).
flow followed?
Processes
components packaging & storage condition meeting as per manufacturer recommendation.
followed ?
CB cleaning either through antistatic paper/air are being followed.
nstruction of PCB handling/loading in the magzine with clear direction of PCB.
aning frequency of stencil & criterias for frequency of cleaning.
ocedure defined for solder paste storage/throwing & meeting as per Solder paste
inspection through 3D SPI machine & followed as per IPC guidelines.

ong loading detection facility available in Pick & place machine during setup & splicing
echanism for PCB support pins/block throughout the line from Solder paste to Reflow oven.
ofile measurement of reflow oven online/through profiler with actual running board or frequency
nt in case of offline.
atmosphere provided in the reflow machine?
pection through 3D AOI & operates by IPC trained operator?
SMT Processes
ling process through router & bit changing shall be defined & interlocked.
OP for parts handling from AOI to post SMT processes & there should not be any damages to
onents.
ad forming process & parts shall be ensured for any stress on PCB leads during forming & lead
.
nent soldering process shall be through robo/wave /selective soldering & PCB component
d to avoid any soldering spatter on PCB component.
ot be any stress on PCB component during ICT testing ICT fixture shall be validated.
rocess: Troque should be controllled, Screw counter should be available & PCBA components
ked.
ponents storage:
℃
70% RH
ronment condition for PCB Assembly:
O Class 8 or better should be followed.
℃
- 60% RH
ork procedure shall be defined with action/disposal details with rework traceability shall be
ce shall be followed throughout the processes.
nes defined not to use dropped components/parts?

h component (machining)
s being washed in water /coolant before transferring to next operation.?
lant accumulate on machining fixtures/jigs? (if yes, is suitable draining

vailable ?)
t of finish component (Painting , powder coating , anodising etc)
s cleaned by Tag O Rag after buffing and before surface treatment
test facilities available(Leak test, Hardness tests, Adhesion test for painting /plating,as
n on respective drawing)
s/Q-Alerts are identified & displayed on resp machine /test rig etc.
for insp method / job loading-unloading methods /leak test method etc.)
ors /supervisor's are aware @ important CTQ parameters ?
rol
d area / identification is provided to store finish goods to avoid mix-up issues etc.?
table is made available ?.
ight at insp area, final Inspection gauges, Relation gauges & other test facilities are available)
es , plug gauges, treading gauges forced in to component?

amples displayed at each stage for visula insp.?(with ABC zones)
hs of defects printed and displayed in color ?

atus marked on each component ?
, inspector identification)
ponent arrested at manufcaturing stage only & not passes to further stages ?
n report is made for minimum 30 components to ensure dimensional consistency (for all “I”
mportant parameters identified in CTQ) ?
ameters like solder paste height, solder tip temperature, reflow temperature or any other
Q parameters identified and followed
g & packing
transportation modes of finish goods is ok ?
s touching to each other or to any metallic surface during handling specifically in “A” class
tical for appearance, during all manufacturing process and during material handling including
aintenance schedule (cleaning, repairing, replacing) made and followed for component
s and bins? (Appropriate labels indicating status of preventive maintenance shall be fixed on
s.)
ndling trolleys- Are components are not touching to each other and located, oriented firmly to
with each other?
rk station/stage separate bins for input component and output component available? (Red bin
ble for non conforming components.)& bin cleaning frequency shall be defined.
ventive actions
are taken on all field /QSR issues reported so far are horizontally deployed (if any on similar
M/DRBFM check points considered – No of points and details.?
nd storage of material, tools, dies

al being stored on Proper duck boards, platforms ( not on floor directly)
n necessary items done ? ( 3S - Good arrangement & cleaning shall be followed)
mented / Maintained ?
check point added 16.06.23

quirements check point added 17.02.13
23 "cpk for characteristics having tol <50 microns " added. 12.08.10
Change Details Date
For M/s.
1)
2)
3)
Vendor :
Audit Date :
Remarks
16.06.23
17.02.13
12.08.10
Date
RAR (Run @ Rate) Audit Check Sheet REV. NO. 3
Model :
Sr. Check parameters

Inward Inspection Control :
1 Are the raw matl T.C's available for every lot/batch ? (TC's of mill /raw matl manufacturer etc.)
2 Is the matl being cross checked from out side lab with decided frequency?
3 Is the identification is there for ok /not ok matl ?
4 Is the Insp of all loose brought out parts /sub-asslys are being carried out & reports available ?
Document Control :
5 Is the copy of DR Document is available at actual manufacturing plant /place ?
6 Is the copy of latest BAL drg / approved drg is available?
Are the test certificates of special processes are available
7 (i.e.plating,painting,powder coating & heat treatment etc.)
8 Are the R&D Approvals are available for any deviations /Nc's wrt to drawing (if any) ?
9 Is the BAL SIR approved & copy available with vendor /sub-vendor's end ?
10 Is the IPO / 20 Basic systems followed for newly developed parts.?

11 Are the Stage wise audit check sheet ready – For transferring to regular process audit.
12 Is provision made for traceability of parts ?
Process Control
13 Is the manufacturing process being followed is same as given in DR ?
14 Are the stage wise SOP (established process parameters) are displayed at work stations ?
Is the in-process material handling is free from metal to metal contact (plastic bins,trollies,chute,tables etc.)?
15
16 Are the Inspection /process poka-yoke's are available as per the list and working properly ?
17 Is the component /assly being manufactured by using final tooling / fixtures ?
18 Are the gauges available to check stage wise important /critical parameters ( if any as per CTQ).
19 Is single piece flow followed?
Requirement of SMT Processes
Are Electronics components packaging & storage condition meeting as per manufacturer recommendation.
20
21 Is PCB Baking followed ?

22 Is there any PCB cleaning either through antistatic paper/air are being followed.
23 Is there clear instruction of PCB handling/loading in the magzine with clear direction of PCB.
24 is there any cleaning frequency of stencil & criterias for frequency of cleaning.
Is there any procedure defined for solder paste storage/throwing & meeting as per Solder paste
25 manufacturer.
26 Is Solder paste inspection through 3D SPI machine & followed as per IPC guidelines.
27 Is there any wrong loading detection facility available in Pick & place machine during setup & splicing
process.
28 Is there any mechanism for PCB support pins/block throughout the line from Solder paste to Reflow oven.
Is there any profile measurement of reflow oven online/through profiler with actual running board or frequency
29 of measurement in case of offline.
30 Is nitrogen gas atmosphere provided in the reflow machine?

31 Is soldering inspection through 3D AOI & operates by IPC trained operator?
Requirement of Post SMT Processes
32 PCB de-panneling process through router & bit changing shall be defined & interlocked.
Is there any SOP for parts handling from AOI to post SMT processes & there should not be any damages to
33 the PCB components.
Is there any lead forming process & parts shall be ensured for any stress on PCB leads during forming & lead
34
cutting process.
Leaded component soldering process shall be through robo/wave /selective soldering & PCB component
35 shall be masked to avoid any soldering spatter on PCB component.
36 There should not be any stress on PCB component during ICT testing ICT fixture shall be validated.
For screwing process: Troque should be controllled, Screw counter should be available & PCBA components
37 should be masked.
Common
Electronic components storage:

38 Temp.: 18～28℃
Humidity:30% - 70% RH
Shop floor Environment condition for PCB Assembly:
Dust Level: ISO Class 8 or better should be followed.
39 Temp.: 22～25℃
Humidity: 40% - 60% RH
Stage wise rework procedure shall be defined with action/disposal details with rework traceability shall be
40
followed.
ESD Compliance shall be followed throughout the processes.
41
42 Are the guidelines defined not to use dropped components/parts?

Requirement of finish component (machining)
Are components being washed in water /coolant before transferring to next operation.?
43
Is chip and coolant accumulate on machining fixtures/jigs? (if yes, is suitable draining
44 arrangement available ?)
Generic Requirement of finish component (Painting , powder coating , anodising etc)
45 Are components cleaned by Tag O Rag after buffing and before surface treatment
Are the special test facilities available(Leak test, Hardness tests, Adhesion test for painting /plating,as
46 applicable given on respective drawing)
Are the Q-points/Q-Alerts are identified & displayed on resp machine /test rig etc.
47 (i.e. key points for insp method / job loading-unloading methods /leak test method etc.)
48 Are the operators /supervisor's are aware @ important CTQ parameters ?

Inspection Control
Is the dedicated area / identification is provided to store finish goods to avoid mix-up issues etc.?
49
Is the final insp table is made available ?.
50 ( min 1000 lux light at insp area, final Inspection gauges, Relation gauges & other test facilities are available)
51 Are Snap gauges , plug gauges, treading gauges forced in to component?

52 Are limit / ref samples displayed at each stage for visula insp.?(with ABC zones)
53 Are photographs of defects printed and displayed in color ?
Is Inspection status marked on each component ?
54 (i.e. OK, Reject, inspector identification)
Is dfective component arrested at manufcaturing stage only & not passes to further stages ?
55
Is the Inspection report is made for minimum 30 components to ensure dimensional consistency (for all “I”
56 Dimensions & important parameters identified in CTQ) ?
Are cp/cpk parameters like solder paste height, solder tip temperature, reflow temperature or any other
57 equivalent CTQ parameters identified and followed
Material Handling & packing

58 Is the packing /transportation modes of finish goods is ok ?
Are components touching to each other or to any metallic surface during handling specifically in “A” class
surface.
59 (i.e. Surface critical for appearance, during all manufacturing process and during material handling including
dispatch?
Is preventive maintenance schedule (cleaning, repairing, replacing) made and followed for component
60 handling trolleys and bins? (Appropriate labels indicating status of preventive maintenance shall be fixed on
trolleys and bins.)
Component handling trolleys- Are components are not touching to each other and located, oriented firmly to
61 avoid contact with each other?
Are at each work station/stage separate bins for input component and output component available? (Red bin
62 shall be available for non conforming components.)& bin cleaning frequency shall be defined.
Corrective & Preventive actions

Are the actions are taken on all field /QSR issues reported so far are horizontally deployed (if any on similar
63
comp) ?
Are the PRBFM/DRBFM check points considered – No of points and details.?
64
Housekeeping and storage of material, tools, dies
65 Is finish material being stored on Proper duck boards, platforms ( not on floor directly)
66 Is disposal of un necessary items done ? ( 3S - Good arrangement & cleaning shall be followed)
67 Is FIFO implemented / Maintained ?
3 SMT processess check point added

2 KHI - Generic requirements check point added
1 Check Pont No. 23 "cpk for characteristics having tol <50 microns " added.
Rev Change Details
For BAL
1)
2)
3)
RAR (Run @ Rate) Audit Check Sheet REV. NO. 3
BAL PART NO. : Rev. No.: Vendor :
Part Name : Audit Date :
meters Y/N
on Control :
tl T.C's available for every lot/batch ? (TC's of mill /raw matl manufacturer etc.)
g cross checked from out side lab with decided frequency?
tion is there for ok /not ok matl ?
ll loose brought out parts /sub-asslys are being carried out & reports available ?
ol :
DR Document is available at actual manufacturing plant /place ?
atest BAL drg / approved drg is available?
tificates of special processes are available
ting,powder coating & heat treatment etc.)
pprovals are available for any deviations /Nc's wrt to drawing (if any) ?
approved & copy available with vendor /sub-vendor's end ?
0 Basic systems followed for newly developed parts.?
wise audit check sheet ready – For transferring to regular process audit.
de for traceability of parts ?
turing process being followed is same as given in DR ?

wise SOP (established process parameters) are displayed at work stations ?
ss material handling is free from metal to metal contact (plastic bins,trollies,chute,tables etc.)?
ion /process poka-yoke's are available as per the list and working properly ?
ent /assly being manufactured by using final tooling / fixtures ?
s available to check stage wise important /critical parameters ( if any as per CTQ).
flow followed?
Processes
components packaging & storage condition meeting as per manufacturer recommendation.
followed ?
CB cleaning either through antistatic paper/air are being followed.
nstruction of PCB handling/loading in the magzine with clear direction of PCB.
aning frequency of stencil & criterias for frequency of cleaning.
ocedure defined for solder paste storage/throwing & meeting as per Solder paste
inspection through 3D SPI machine & followed as per IPC guidelines.

ong loading detection facility available in Pick & place machine during setup & splicing
echanism for PCB support pins/block throughout the line from Solder paste to Reflow oven.
ofile measurement of reflow oven online/through profiler with actual running board or frequency
nt in case of offline.
atmosphere provided in the reflow machine?
pection through 3D AOI & operates by IPC trained operator?
SMT Processes
ling process through router & bit changing shall be defined & interlocked.
OP for parts handling from AOI to post SMT processes & there should not be any damages to
onents.
ad forming process & parts shall be ensured for any stress on PCB leads during forming & lead
.
nent soldering process shall be through robo/wave /selective soldering & PCB component
d to avoid any soldering spatter on PCB component.
ot be any stress on PCB component during ICT testing ICT fixture shall be validated.
rocess: Troque should be controllled, Screw counter should be available & PCBA components
ked.
ponents storage:
℃
70% RH
ronment condition for PCB Assembly:
O Class 8 or better should be followed.
℃
- 60% RH
ork procedure shall be defined with action/disposal details with rework traceability shall be
ce shall be followed throughout the processes.
nes defined not to use dropped components/parts?

h component (machining)
s being washed in water /coolant before transferring to next operation.?
lant accumulate on machining fixtures/jigs? (if yes, is suitable draining

vailable ?)
t of finish component (Painting , powder coating , anodising etc)
s cleaned by Tag O Rag after buffing and before surface treatment
test facilities available(Leak test, Hardness tests, Adhesion test for painting /plating,as
n on respective drawing)
s/Q-Alerts are identified & displayed on resp machine /test rig etc.
for insp method / job loading-unloading methods /leak test method etc.)
ors /supervisor's are aware @ important CTQ parameters ?
rol
d area / identification is provided to store finish goods to avoid mix-up issues etc.?
table is made available ?.
ight at insp area, final Inspection gauges, Relation gauges & other test facilities are available)
es , plug gauges, treading gauges forced in to component?

amples displayed at each stage for visula insp.?(with ABC zones)
hs of defects printed and displayed in color ?

atus marked on each component ?
, inspector identification)
ponent arrested at manufcaturing stage only & not passes to further stages ?
n report is made for minimum 30 components to ensure dimensional consistency (for all “I”
mportant parameters identified in CTQ) ?
ameters like solder paste height, solder tip temperature, reflow temperature or any other
Q parameters identified and followed
g & packing
transportation modes of finish goods is ok ?
s touching to each other or to any metallic surface during handling specifically in “A” class
tical for appearance, during all manufacturing process and during material handling including
aintenance schedule (cleaning, repairing, replacing) made and followed for component
s and bins? (Appropriate labels indicating status of preventive maintenance shall be fixed on
s.)
ndling trolleys- Are components are not touching to each other and located, oriented firmly to
with each other?
rk station/stage separate bins for input component and output component available? (Red bin
ble for non conforming components.)& bin cleaning frequency shall be defined.
ventive actions
are taken on all field /QSR issues reported so far are horizontally deployed (if any on similar
M/DRBFM check points considered – No of points and details.?
nd storage of material, tools, dies

al being stored on Proper duck boards, platforms ( not on floor directly)
n necessary items done ? ( 3S - Good arrangement & cleaning shall be followed)
mented / Maintained ?
check point added 16.06.23

quirements check point added 17.02.13
23 "cpk for characteristics having tol <50 microns " added. 12.08.10
Change Details Date
For M/s.
1)
2)
3)
. NO. 3
Vendor :
Audit Date :
Remarks
16.06.23
17.02.13
12.08.10
Date
Minutes of Meeting with - M/s.
RAR Audit-
Part Name- Part Number- Rev No.- Date-
S.No. Observation/Improvement points Action Plan Responsibilty Target Date Status
BAL- M/s.
1 1
2 2
3 3
PART LEVEL -SOP CLEARANCE
Corporate QA
Model : Date of Au
Vendor Part name
Auditor : BAL Auditee :
Verification for adequacy / complian

A PRE - RAR BAL person
1 Documents availablity
IPO
PQS
2 Audit as per IPO - stage wise
Kaizen / Pokayoke/interlock adequacy/compliance
Mix up possibility / error possibility study & countermeasure plan
3 Readiness as per RAR checksheet ( Enclosed in the next sheet )
Verification for adequacy / complian

RAR & SOP clearance
B BAL person
1 Pre - RAR -ve points closure
2 RAR-ve points closure
3 Inspection agreement/ limit accepatance sample - sign off .
4 Final stage inspection plan / checksheet available
5 Final stage inspection facility /gauges/ detectability - adequacy /
6 complaince
Stage wise IPO are available , JH PM points for sustenance are
identified & being monitored
7 All identified Kaizen Pokayoke are put in place.
8 Process is in place with all final tooling
9 PDI report system is finalized.
10 Despatch mode is approved to ensure zero defect supplies
11 Special test/periodic test / sampling test - plan / procedure /
acceptance criteria are clear & toolings provided for
12 Deviation - if any , in any above parameter should be attached
separately with all details & a back up plan to close the deviation.
13 (additional points if any.)
14 (additional points if any.)
Final comments for SOP clearance :
Vendor Plant head Vendor QA head

Format no.: CQA / SOP / 18
Revision no.: 00
CLEARANCE Issue date : 07 July 2016
Approved by: GM CQA
Date of Audit :
Part name / no.
rification for adequacy / compliance by

BAL person
Remarks
rification for adequacy / compliance by

BAL person
Remarks
ad BAL CFT team

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DR / PPAP DOCUMENT -- Document submission Check Sheet MODEL :

Following In case the document is not enclosed

3 DIDS sign off copy

4 VTS sign off copy

6 Electronic BOM sign off

7 Design Failure Mode and Effects Analysis

8 Process Flow Diagram

9 Process Failure Mode and Effects Analysis

10 IPO /Control Plan

13 List of Manufacturability Issues and actions taken

14 Performance test results as per DVP / VTS & drawing requirements

15 Confirmation of Statuatory requirement ( CMVR )

22 Child Part matrix & source list

23 Raw Matl TC of child parts from manufacturers

25 Child Parts Inspection check sheets / PDI .

29 ESD & Soldering check sheet

30 Dimensional layout report of 5 to 10 components with balloon drawing

33 Packaging Standards & material handling

34 Inspection Agreement (34 a to 34d)

35 PDI report of SOP batch

36 BAL SIR Report

37 Capacity & Final toolings readiness

38 Vendor Self Assesment Report for production readiness

Documents verified and submitted.

BAL R & D QM:

Comp. Dev. List at Proto stage 1 Comp. development master

Comp. development master Identification of development

Development Review 1 ( by PM) 3 DR 1 Report ( allocation list

Part drawing,Model , BAS Study of Specifications 4 Mod of spec as appropriate for

Critical dimn on drg,Field Identify critical 5 List of critical

thetics,assembly issues, Fitting parameters

Identification of special processes 6 Critical Technology

Development Review 2 7 DR 2 Report ( frozen drg.,

Facilities,Past PPM/dev Record, Vendor Evaluation 8 Vendor Finalization with

capacity, Investment capability, customer PPC Feedbck

DR 3 9 DR 3 Report ( Final vendor list)

Detailed plans for Process, 10 Process Flow chart

approval( cap. Evaluation)

PFMEA 18 Process control plan based on

Prepilot Production (10)

Evaluation of quality 20 Component Inspection for all

Evaluation of performance 22 Negative issues

23 Corrective Action Plan

Corrective actions on -ve issues 24 DR 5 Report ( Final approval

Single cavity Pilot batch production (50

Evaluation of quality 25 I dimn./ Performance report

Evaluation of performance 27 Negative list ( Inhouse+Field)

Corrective actions on -ve issues of 28 DR 6 Report (Clearance for run

Run at rate ( 300 or 1 shift prodn) 29 Cycle time evaluation/ output

Corrective actions on 29 to 31 32 Corrections in 10 to 16

Establishment for Sustenance 33 QM matrix

Development Review 7 34 DR7 Clearance for mass prod.

Cost Review 35 Finlised PO based on - 5000

S No Rev No. Rev Date Revision Details

Reason for Revision Implementation Status

Approved By (QA Head)

1 Model name EFR

2 Model name EFR