POSTER TITLE

Name SurnameA 1, Name SurnameB 2, … (underline presenting author)

1 Affiliation 1
2 Affiliation 2
Context and motivation Scanning thermal Microscopy
Photo-Detector
Nanowires Laser
MEMS/NEMS (650nm)
2D Materials
Nanostructured materials
Investigation of heat Thermal conductivity
transfer at micro- and measurements with Heated by Joule
nano-scales SThM technique effect Thermal
control unit

Energy
Electronic components
Reference Sample
Transport
z Piezo-electric *BBv = Bridge Balance Voltage
y *BBk = Level of graduation for the rotary knob
displacement which allows manual adjustment of the resistance Ra
x
system
Why developing a 3D FEM model with COMSOL ? Feedback
PC
loop
 Analytical heat transfer model not adapted for nanoprobes. Curvature radius ≈ 50 nm
 KNT probe complex geometry.
 Different materials (Pd, Au, NiCr, Si3N4). 𝑠𝑎𝑚𝑝𝑙𝑒 𝑠𝑎𝑚𝑝𝑙𝑒 𝑝𝑟𝑜𝑏𝑒 𝑝𝑟𝑜𝑏𝑒
 For the establishment of the uncertainty budget associated to thermal conductivity measurements ∆𝑅𝑠𝑎𝑚𝑝𝑙𝑒 ∆𝑅𝑠𝑎𝑚𝑝𝑙𝑒 𝑅𝑤𝑐 − 𝑅𝑖𝑐 𝑅𝑇 = 𝑅0 . 1 + 𝛼. (𝑇 − 𝑇0 )
𝑴𝒆𝒔𝒖𝒓𝒂𝒏𝒅: 𝑦0 = = = 𝐴𝑙 𝑂 𝐴𝑙 𝑂
∆𝑅𝑟𝑒𝑓 ∆𝑅𝐴𝑙2𝑂3 𝑅𝑤𝑐2 3 − 𝑅𝑖𝑐 2 3

3D FEM electro-thermal modeling Thermal resistances

Boundary conditions SiN cantilever
Thermal resistances network model
𝑉=0 3D FEM modeling
for the probe-sample contact Probe-sample-contact of the contact
Pd resistance
𝑇 = 𝑇𝑟𝑜𝑜𝑚
sensor
Thermal boundary conditions [2]
𝐼𝑝𝑟𝑜𝑏𝑒 Electrical boundary conditions Thermal contact resistance Probe
𝐽𝑛 =
𝑆𝑛 = [5.10−9 ; 5.10−7 ] (𝑚2 . 𝐾. 𝑊 −1 )

𝑇𝑎𝑝𝑒𝑥
[3] [4]
Ballistic heat transfer
Heat generation Heat generation 𝑅𝐵 + 𝑅𝑐
Au electrical track 4. Λ
in Pd in Au ∆𝑇 = (𝐾. 𝑊 −1 )
3. 𝜋. 𝐾𝑠. 𝑏𝑥 ² 2𝑏𝑥

Thermal gradient at the apex 𝑅𝑠𝑝 𝑄𝑙𝑎𝑡 = 0

Spreading resistance
[1] 𝑇𝑟𝑜𝑜𝑚
1
= (𝐾. 𝑊 −1 )
4𝑏𝑥𝐾𝑠

 𝑏𝑥 radius of contact ( = 𝑏𝑚𝑒𝑐ℎ𝑎 = 50 nm in vacuum)[5]

 𝛬 the mean free path of the sample energy carrier (1nm, 30nm and 200nm)

In contact results
Probe electrical resistance as a function of the sample thermal conductivity in vacuum Determination of the thermal radius 𝑏𝑥
The thermal radius 𝑏𝑥 as a function of the sample thermal conductivity
Influence of the thermal
boundary resistance

1 2𝑏𝑥
𝑇
𝑒 2 𝑚𝑎𝑥
 Increasing of the
thermal contact
resistance
decreases the
sensitivity.
 Different
responses for the
same thermal ՜
𝑥
conductivity
depending on the
energy carrier
𝑺𝒄𝒐𝒏𝒕𝒂𝒄𝒕 = 𝑺𝒃𝒙 =𝟓𝟎 𝒏𝒎
mean free path.
k  The thermal radius depends on the sample thermal conductivity.
Influence of the ballistic Heat flow lines and temperature gradient for a probe-sample contact in air conditions
heat transfer for different
mean free path values

𝑘 = 0.05 𝑊. 𝑚−1 . 𝐾 −1 𝑘 = 12.2 𝑊. 𝑚−1 . 𝐾 −1

Conclusion and perspectives

Conclusion Perspectives
[6]
 Modeling of the total probe is more realistic.  Simulation of the probe in the air (Conduction through air + ballistic
 The thermal contact resistance reduces considerably the sensitivity. transfer).
 In contact, ballistic transfer should also be considered.
 Considering a 𝑏𝑥 depending on the material thermal conductivity (k).  Penetration depth dependency on thermal conductivity (k).
 Taking into account that 𝑏𝑥 in air ≠ 𝑏𝑥 in vacuum.

References:
[1] Fischer, H. (2005). Quantitative determination of heat conductivities by scanning thermal microscopy. Thermochimica Acta, 425(1-2), 69-74.
[2] S. Gomès et al., “Scanning thermal microscopy: A review,” Phys. Status Solidi Appl. Mater. Sci., vol. 212, no. 3, pp. 477–494, 2015
[3] Prasher, R. (2006). Thermal conductivity of composites of aligned nanoscale and microscale wires and pores. Journal of Applied Physics, 100(3), 034307.
[4] Wexler, G. (1967). The non-local Boltzmann transport equation in orifice and disk geometry: II. The absorbing disk. Proceedings of the Physical Society (1958-1967), 92(1), 165. Acknowledgement: ANRT
[5] G. Yunfei Quantitative measurement using scanning thermal microscopy. PhD thesis, University of Glasgow, 2016
[6] Guen, E. (2020). Microscopie thermique à sonde locale : Etalonnages, protocoles de mesure et applications quantitatives sur des matériaux nanostructurés (Doctoral dissertation, Université de Lyon).