1.

Title: Influence of pulsed arc on the metal droplet deposited by projected transfer mode in wire
arc additives manufacturing.
2. Authors: Luo Yi, Li Jinglong, Xu Jie , Zhu Liang , Han Jingtao, Zhang Chengyang
3. Journal details: Journal of Materials Processing Technology
4. Problems involved – The effect of pulsed arc and non pulsed arc on the droplet transfer and its
effect on the deposited layers. Also, the forces acting on the droplet size is considered and its
deposition rate.
5. Introduction of the present work – In projected transfer mode, in addition to gravity, arc force
(electromagnetic force, plasma force, evaporating coil force, charged particle impact force). The
feature detected in the experiment is used as variable to develop computational models. Arc
current, voltage and acoustic emission (AE) signal during process are used to identify droplet
transfer.
6. Novelty of the present work- Higher melting efficiency, high droplet transfer frequency, and good
mechanical properties can be achieved with pulse arc as compared to non pulse arc at similar power
condition. By increasing inter-pass temperature can facilitate phase transformation and produce
desired microstructure with improves mechanical properties.
7. Experimental details – Automatic arc processing system, filler wire- (AA4043, d=1.2mm),
substrate (AA6061, thickness=8mm), shielding gas Ar gas (15L/mm), current - DCEP, travel velocity
=10 mm/s. Experimental parameter used for pulsed and non-pulsed arc are given in table (2&3). For
pulsed arc, (I) current varies between=164 to200 A and voltage V=22.8 to24.8 volts,
frequency=240to300 Hz. For non pulsed arc, frequency=0 and (current and voltage are slight greater
than pulsed arc) I=178to230 A, V=22.6to27.0 volts. Piezoelectric sensor mounted on the base plate
to measure impact frequency of droplet in terms of AE Signal in case of non-pulsed arc. Arc power
calculated by P=V(t)×I(t)

8. Results and discussion -

Result and calculation: Pulse Arc- In case of pulsed arc (on experimental condition), arc current and
arc voltage in form of wave (1 cycle =1 pulsed) and it takes 1millisecond for one droplet transfer
(0.005s) that means 1 pulse=1 droplet, as shown in fig(6.a&b). Fig6b is magnified form of time
T1=0.02 sec (7.00 to 7.02sec, fig6a). The droplet transfer frequency defined for the total number of
metal droplet transfer from filler wire to substrate per sec. Consider the case of T1=0.02 sec time
interval, the number of pulse or complete cycle=5 with time 0.005sec between successive pulse, and
if it defined for 1sec, it is called as Transfer frequency. The droplet size is smaller, and the transfer
frequency (droplet/sec), arc force on droplet and the deposition rate (V f mm3 /s) is higher in the
pulse arc than that of the non- pulsed arc under the identical power condition and vice-versa.
Furthermore, high arc force in pulse arc on the metal droplet, increases the transfer frequency as
results the deposition rate and manufacturing efficiency would be high.
Non-Pulsed Arc-In case of non pulsed arc, frequency of I &V=0 and the metal droplet transfer is
designed on the time domain basis between two successive impact on the substrate, as pizeoelectric
sensor is used on the surface of substrate to measure the AE signal(Acoustic Emission) that defined
the droplet transfer frequency in case of non-pulsed arc. It is observed that for non- pulsed arc, the
size of droplet is bigger than pulsed arc, and transfer frequency, deposition rate is also low.
Due to surface tension, size of droplet is approx sphere.Radius of sphere is given by
R = [3.(mt-mo)/4π.n.ρ]1/3 … eq1 ; where m t= total mass of deposit and substrate, m o=mass of
substrate, n=no of AE signal , ρ=density of 4043 AA in molten state=2.38 g/cm 3.
Vf = f.(mt-mo)/n.ρ mm3/s …used to calculate deposition rate layer eq2 , f=droplet transfer
frequency.
av F = (8π.ρ.s.f2.R3)/3 …used to calculate average force.eq3; where s=height of droplet =arc length

DISCUSSION-
 At similar arc power condition, transfer frequency in case of pulsed arc is more than non
pulsed arc.
 Current with respect to time - output wave current of pulsed arc is much higher than non
pulsed current in time domain.
 Radius of droplet vs transfer frequency-at similar transfer frequency radius of droplet is
greater in non pulsed arc than pulsed arc.
R=0.406+9.54×f-2.029×f2 pulsed arc
R=0.822-0.002×f +2.396×10-6×f2 non pulsed arc
 Deposition rate (Vf) vs Arc power- at similar arc power, deposition rate is high in case of
pulsed arc.
Vf = -189.328 + 134.055×p - 12.427×p2 pulsed arc
 Vf = -104.694 + 85.351×p – 5.821×p2 non pulsed arc
These two models can be used to calculate manufacturing efficiency. Increase in arc power
will increase heat input but thermal deformation will take place.
 Arc force vs arc power -at similar arc power arc force is high in pulsed arc than non pulsed
arc.
F = -0.207 + 0.021×P + 0.010×P2 pulsed arc
2
F = 0.334 – 0.164×P + 0.036×P non pulsed arc

9. Conclusions -

 Due to pulse effect, the size of the droplet in pulsed arc is smaller than non-pulsed at similar
droplet transfer frequency in projected transfer mode. Pulsed arc can achieve higher droplet
transfer frequency than non pulsed arc.
 The manufacturing efficiency in pulsed arc is higher than non pulsed arc at similar arc power.
 In view of manufacturing efficiency and heat input controlling, pulsed arc is more suitable for
WAAM of aluminum alloy than non pulsed arc. Under the effect of pulsed arc, greater arc
force will act on the droplet during the transfer process in projected transfer mode, which is
not conducive to the deposition forming of aluminum alloy. The arc force increases with the
increase of the arc power. Therefore, as long as the arc power meets the requirement of
manufacturing efficiency, it is necessary to use a smaller pulsed arc power.
10. Direction of my work –Since, pulse arc produces less heat input between two metal junction, So
that I want to use pulsing in decreasing manner as the subsequent passes is given.ie means
controlled heat input, controlled arc force, controlled solidification rate that reduces defect like
porosity, dendrite morphology, secondary phase distribution etc. that will leads to first development
towards isotropic properties. In general sense, each and every process variable is required in
controlled manner in WAAM process for high quality finished product, because heat transfer rate
through the substrate decreases as the number of deposited layers increases with subsequent passes
that will enhance solidification rate. In my way, solidification rate is one of the important steps in
WAAM process that has direct correlation with physical propetries of the deposited metal parts.