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Full-automatic solder paste printing machine adopts the stencil which has been made, and makes the stencil contact with the printing board,
and makes the solder paste roll evenly on the stencil by certain way, injecting into the mesh hole. When the stencil board is demolded, the solder
paste is dislodged from the mesh hole to the pads according to the shape of the mesh holes, so as to complete the process of one time printing of
the solder paste.
The automatic solder paste printing machine adopts mechanical positioning and optical alignment system, which can automatically align the
position of stencil and PCB pads. Squeegee speed and pressure can be set during solder paste printing. The stencil can be cleaned automatically to
ensure the quality of subsequent printing. Stable quality of solder paste printing. It is an automatic solder paste printing equipment that can work
offline single machine or online inline.
Composition
including conveyor rail, motor, drive wheel, belt, stop sensing device, track width adjustment device.
Function
the PCB printing process into the board, out of the board and stop the position of the board, the width of the carrier board to adjust to different
sizes of PCB printing.
Composition
Function
clamp the stencil, move the alignment stencil, fix the stencil.
Composition
including vacuum platform, magnetic thimble and flexible PCB board clamping device.
Function
vacuum adsorption and magnetic thimble (movable) device, can ensure that the PCB board is flat and not warped; flexible PCB board clamping
device, can clamp different sizes and thickness of the PCB board.
Composition
including cameras, light source control system, display system and vision control software.
Function
upward and downward vision functions to ensure fast and accurate identification and alignment of stencil and PCB.
Composition
Function
control the squeegee's strength and speed to achieve the pressure on the stencil, so that the stencil and PCB are in close contact, and make the
solder paste roll evenly to ensure that the solder paste into the mold.
Composition
including vacuum cleaning device, cleaning fluid spraying device, cleaning paper rolling device and cleaning operation lift control device.
Function
to complete the dry, wet and vacuum three cleaning functions, can thoroughly clean the stencil mesh residual solder paste, to ensure the
subsequent printing quality.
(1) At least three of the largest diameter of the tin ball can be arranged vertically in the thickness direction of the stencil hole.
(2) at least three of the largest diameter of the tin ball can be arranged horizontally in the direction of the width of the smallest hole in the stencil.
Four way light source is adjustable, light intensity is adjustable, light is uniform, and image acquisition is more perfect
Soft wear-resistant rubber wiping plate, cleaning methods of dry, wet and vacuum
Intelligent programmable setting, two independent direct motors driven squeegee, built- in precise pressure control system
The platform height is automatically calibrated according to PCB thickness setting, which is intelligent, fast, simple and reliable in structure.
2D function can quickly detect the printing defects, the detection points can be increased arbitrarily
Improve accuracy grade, provide good printing control platform, operational stability, extend the service life
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