Printed Circuit Board

Cost Adders To
Know About
Top 6 PCB Factors That Drive Up Cost
 Introduction

When it comes to PCB assemblies, the raw board is always where customers
look to cut costs. Unfortunately, we often see this request after the design has
been completed and we have the Gerber files in hand to quote the printed circuit
board.

Cost-savings is more than just the raw board reduction in price. Components
are in some cases very expensive and at a fixed cost with no reduction offered.
Many components are purchased at a very high volume on reels, and that cost is
absorbed by many orders eventually but as you can imagine there is a markup.

If you allow for a crossed component in your product, there could be savings.
Then, there are assembly costs. The components are bought at the best price
they can for the quantity needed; some of that price is passed onto you. I am sure
we all look to save in all aspects of our companies, so here are some tips for you
to look for when it comes to PCB cost savings.

In this Ebook, we will touch on some items to consider prior to design and
layout. There is an advantage to having a strong relationship with your PCB
manufacturer at the pre-design layout phase to make suggestions to keep costs
to a minimum.
 Cost Adder
#1
Layer Count

Let’s first discuss layer count, one of the first items we look for when costing. The
number of copper layers in the PCB total build does not include mask or legend.
Whether you are buying a 2-layer or a 32-layer, this is the first item used to start
the pricing process.

It is the initial adder, but is it the biggest cost in your build? Keeping the layer
count to a minimum, but allowing for the technology not to be compromised can
be tricky.

The fewer layers, the less the initial cost is. For every core added to the multilayer
stack, an average of 20% is the increase you can estimate to be applied to the
part when building domestic, slightly less an adder is applied for offshore. The
number of copper layers in a standard stack is the start of costing this is true,
however, the individual adders can quickly increase the cost. Let’s review more of
those and then circle back to layer count.
Layer Via Descripon Layer Name Material Type Dielectric Dielectric Copper Trace Trace Width Current Characterisc Edge Coupled Broadside Coupled
No. Constant Thickness Thickness Clearance (Amps) Impedance (Zo) Differenal (Zdiff) Differenal (Zdbs)
Soldermask Dielectric 3.3 0.5
1 8 Signal Top Conducve 1.4 10 4 0.31 88.39 146.11
Prepreg Dielectric 4.3 5
2 Signal RF SIGNAL Conducve 1.4 5 5 0.37 52.14 80.21
Core Dielectric 4.3 4.3
3 Plane GND Conducve 2.8
Prepreg Dielectric 4.3 10
4 Plane GND Conducve 2.8
Core Dielectric 4.3 5.5
5 Plane PWR Conducve 2.8
Prepreg Dielectric 4.3 10
6 Plane GND Conducve 2.8
Core Dielectric 4.3 4.3
7 Signal DIGITAL SIGNAL Conducve 1.4 5 5 0.37 52.14 80.21
Prepreg Dielectric 4.3 5
8 Signal Boom Conducve 1.4 10 4 0.31 88.39 146.11
Soldermask Dielectric 3.3 0.5

Target Tol +/-% Layer No. Trace Trace Width Current (Amps) Characterisc Edge Coupled Broadside Coupled
Impedance Clearance Impedance (Zo) Differenal (Zdiff) Differenal (Zdbs)
Pair 1 10 1 10 4 0.31 88.39 146.11
Pair 1 10 2 5 5 0.37 52.14 80.21
Pair 1 10 7 5 5 0.37 56.23 83.42
Pair 1 10 8 10 4 0.31 82.38 139.16

Via Span Definions

From To Hole Size Tol +/- Aspect Rao Via Type

1 1 8 2 6.09:1 PTH

A multilayer PCB stack-up such as this is standard and balanced copper. Both sides of
the core have the same copper weight.

“
LAYER COUNT CONSIDERATIONS DURING
DESIGN SHOULD BE NUMBER ONE WHEN
THE COST IS A CONCERN.
 Cost Adder
#2
Copper Weight of the Part

When we talk about copper in the manufacturing world, we typically talk about
base copper. Base copper is the total in ounces for inner layer material per side
and the starting weight of the outer layers. Inner layer copper is the same weight
from start to finish; there is not additional plating to the inner copper surface. The
base copper for external or outer layer is a starting foil weight with the addition of
plating to the surface and holes.

Using 1/2oz copper - 1oz and even 2oz copper is typically a standard cost when
the copper is >2oz the material has an increase in price and delivery in some
cases. Cores come in different copper weights, but not all overall thicknesses in
some instances are considered special order. Consulting your PCB fabricator on
stack-up and lead time can save you cost and time to production.

For example, standard practice to use cores with the same copper weight on
both sides versus 1oz on one side and 2oz on the opposing side is a lesser cost,
easier to manufacture, and more likely to be in stock. Balanced construction using
all 1oz or all 2oz is recommended, however, as long as the core is balanced,
the PCB will be less in cost and easier to build. Mixed copper or using 1oz on
one side and 2oz on the opposite side adds cost for the laminate and time to
processing.
Layer Via Span & Descripon Layer Name Material Type Dielectric Dielectric Copper Trace Trace Width Current Characterisc Edge Coupled Broadside Coupled
No. Hole Constant Thickness Thickness Clearance (Amps) Impedance (Zo) Differenal (Zdiff) Differenal (Zdbs)
Soldermask Dielectric 3.3 0.5
1 8 4 8 Signal Top Conducve 1.4 15 12 0.69 26.86 52.45
Prepreg Dielectric 4.3 2.8
2 Plane GND Conducve 0.7
Prepreg Dielectric 4.3 2.8
3 Signal SIGNAL Conducve 1.4 20 12 0.69 12.77 25.38 25.32
Core Dielectric 4.3 42
4 Signal SIGNAL Conducve 1.4 20 12 0.69 12.77 25.38 25.32
Prepreg Dielectric 4.3 2.8
5 Plane VCC Conducve 0.7
Prepreg Dielectric 4.3 2.8
6 Signal Boƒom Conducve 1.4 15 12 0.69 26.86 52.45
Soldermask Dielectric 3.3 0.5

Target Tol +/-% Layer No. Trace Trace Width Current (Amps) Characterisc Edge Coupled Broadside Coupled
Impedance Clearance Impedance (Zo) Differenal (Zdiff) Differenal (Zdbs)
Pair 1 10 1 15 12 0.69 26.86 52.45
Pair 1 10 3 20 12 0.69 12.77 25.38 25.32
Pair 1 10 4 20 12 0.69 12.77 25.38 25.32
Pair 1 10 6 15 12 0.69 26.86 52.45

Via Span Definions

From To Hole Size Tol +/- Aspect Rao Via Type

1 6 8 2 5.74:1 PTH
1 2 4 1 0.47:1 Blind
2 3 8 2 0.28:1 Buried

This 6-layer PCB has unbalanced copper, making it harder to process the images and
core in production as well as special tooling for blind vias.

“
IT’S ONLY COPPER, BUT IS IT? WHAT IT IS IS
THE BASE OF ALL CIRCUIT BOARDS AND ONE
OF THE FIRST ADDERS TO THE TOTAL PRICE.
 Cost Adder
#3
Blind and/or Buried Vias

When processing blind or buried vias and vias-in-pad, this is a specialty process
requiring special equipment to produce. Not all manufacturers can produce
these types of holes, and in some cases, they just don’t want to. Depending on
the number of sets of these holes and the to/from layers involved will determine
the additional processing steps needed to complete the part. The more steps
for processing, the more time is needed to complete the part and the increased
chance of fall out and scrap cost.

Blind vias are processed from either outer layer to a mid-layer point; if there are
several layers of contact, there are several setups for processing from the top,
bottom, or both sides combined. Buried vias are internal only from inner layer
to inner layer and can also impact several inner layers. The processing of blind
vias is different than buried, which must be processed through drilling and plating
of inner layers. Blind vias are processed on a completed pressed board as a
controlled depth drill and plating process. Most via-in-pad holes are through-hole
and pierce a surface pad that requires a component to be placed over the hole.
The via-in-pad is plated, filled, planarized, and invisible when done correctly.

Some of the time, these specialty vias cannot be helped or avoided, however,
other times it may be possible to avoid them partially or altogether. How? When
looking at cost, this type of hole is something we are highly successful at but
would always prefer not to do and mostly due to time to process and engineer.

Limiting multiple sets from one or both sides is one way to cut costs; limiting to
only the top side or the bottom side is an even better option for us. Consider
making the PCB into more layers, taking a 4-layer to a 6- or 8-layer with no blind
or buried holes in most cases will be a lesser cost. Looking at the physical land of
the part increasing the available space can also assist in eliminating B/B/V holes.
The blind and buried vias, as well as stacked vias, can add 40-60% cost to the part as
well as additional time in production.

“
THE BLIND AND THE BURIED ARE COOL TO
USE BUT, SPECIALTY PROCESSING, SPECIALTY
EQUIPMENT, AND SOMETHING TO THINK
ABOUT REDUCING.
 Cost Adder
#4
Surface Finish

We offer many different types of finishes for your PCBs. Gone are the days of
60/40 tin lead over copper. This finish has been replaced with HASL, hot air
solder level, and yes it does contain lead and is not RoHS compliant. To some
aspect, it will most likely never completely go away due to military work that is
locked in paperwork to use it or will take too much red tape to change it due to
low requirements in volume. HASL has replaced the processing of tin/lead.

As RoHS came to be, other finishes were needed to help get the lead out. The
quickest to zoom to market were LFHASL (lead-free HASL) & ENIG (electroless
nickel immersion gold). Others followed like immersion tin, immersion silver, OSP
(organic solderability preservative), and of course in the beginning, they all had
their own issues. Today, we use them all still with the most popular being ENIG.

ENIG is the most widely used industry-wide it does have a cost with it but
because it is used the most and everywhere there isn’t a lead time issue, and
it does not have a 3rd party outsource adder applied. Yes, a cost is added if all
surface finishes are not in-house, plating houses are trusted partners but when
quoting parts ask the question if there is an additional cost and if the finish is in-
house. LFH is the least requested least used surface treatment. Hard gold is still
used for keypad areas, gold plug-in tabs, and other requests; 30u is a standard.
We some of the time see a request for 50u this comes with an additional cost and
lead time can be an issue.
The surface finish applied to the part is something to consider for shelf life as well as
costing.

“
MAKING THE FINAL COATING OF PCBS
CHEAPER ISN’T THE WAY TO GO; IT ALSO MAY
NOT BE AVAILABLE AND CAN CAUSE DELAYS.
 Cost Adder
#5
Material Base Cost

PCB material supplies have come a long way, and there are many good brands
available for production. In the past, FR4 callouts were just meant to make the
board using common stock. As technology pushed past 2-layer PCBs, it was soon
evident that the paper-based product would fail assembly and UL.

Flame retardant and stability were a must-have and a change to fiberglass/resin

products was developed. For a large amount of time, the FR4 130Tg material
was sufficient and held its own; we became comfortable using it our environment
as some pushed for more changes. The electronics boom brought the PCBs to
the forefront of technology, and the dirty part of the process was exposed, too.
Cleaner air, landfills, homes, air quality, it was clear PCBs and their components
would need to change as well to do its part in the environment initiative. We had
to change materials, chemistries, and finishes and at a higher cost.

As RoHS was on everyone’s mind and its new lead-free friendly components
were developed, we also needed a better material to withstand the higher
temperatures needed for multiple pass assemblies and rework.
Materials that withstood higher temperatures were developed and are better
known as 170Tg and 180Tg temp. Defining your PCB as RoHS, with a specific
surface finish will steer us to 170Tg standard. Calling out 180Tg will imply this is
the minimum needed.

How do you determine the Tg for use? 170Tg is used in most products and the
Tg is very stable and reliable. On very high technology parts with two side surface
mount, hand assembly parts, and known rework area 180Tg should be used.
Stay away from calling out specific brands. Manufacturing with common stock by
different suppliers is easier on the wallet as well as readily available.
As you can see, we stock a wide variety of laminates, and this is just some of it.
Knowing what we have in stock can save you lead time and cost.

“
WITH MATERIALS, IT CAN BE SUCH A
PROBLEM AND COST DRIVER THAT IT
DOESN’T NEED TO BE; ASK EPEC DURING
DESIGN.
 Cost Adder
#6
Physical Size

Most standard manufacturing processes are set to run a master panel of 24 x 18

inches with a usable area of 22 x 16 inches. The 1-inch area on the master edges
is commonly used for production tooling holes, targets, pinning, thieving, and text.

Whether you allow for arrays, scoring, routing, and waste details will depend
on the yield per master. The more pieces we can fit per square inch of material
impacts the cost, yes, but on the other end, when the part is slightly too big and
pushes the yield down this drives the cost up as well.

For example, a part that is roughly 11x7 will fit 4 times on a master panel, change
the 11 to 11.1 x 7 this part will now fit 3 up on the master decreasing yield by 25%
and increasing the cost to produce. As you can see, if you consider the known
master size it will impact your cost in a negative or positive way when it comes to
the size of the design.
A PCBs physical size impacts your cost. There are 20 individual parts on this 18x24,
along with thieving, tooling, text, and coupons.

“
SIZE MATTERS IN A LOT OF BOARDS
(SMALL, COMPACT, LARGER) TO FIT ALL THE
COMPONENTS, BUT EVEN THE SMALLEST
PART CAN COME WITH A COST THAT YOU ARE
NOT AWARE OF.
 Summary
The cost of your part is driven by the supplies for manufacturing, of course.
We are the manufacturer, sure, but it is out of many supplied materials
that we do not have any control over the price. Items such as laminate,
chemistries, copper, mask, silk legend, gold, and silver, to name a few, are
purchased and are a set cost by volume.

Yes, we can buy larger volumes or quantities at a better price for some
items, but that is a fine line as well. Some materials have lead time and
shelf life; sitting on the shelf is good for no one. Whenever we can buy
larger volumes to save cost, we do it at the manufacturing level.

For the best way to save costs on your PCBs, start with consulting an Epec
engineer with your initial design files. Use Epec’s always-free DFM service
for file and stack-up review. Speak with engineering on cost savings,
array layout, and stack-up adjustments as well as materials and surface
treatments.

Epec strives to be a competitive supplier of electronic goods consulting with

Epec on the design and layout will in most cases save time to process and
cost. Following a few of the mentioned points this Ebook will save cost and
provide quality printed circuit boards.

Visit Our Website @ www.epectec.com

Need Help With Your PCB?
Epec has more than 70 years in the printed circuit board
(PCB) industry. PCB layout and design services is one
of the ways that we help our customers get to market
faster as our engineering team has significant
real world experience designing PCBs for
performance and manufacturability.

Our team of engineers and CAD/CAM

operators are available to discuss any
project needs that our customer may
have as we are fully licensed and
utilize industry leading tools.
Our team can work with you
to review your design to
make sure that printed
circuit boards can be
manufactured with
the highest quality
at the best Custom Solution For Your Product
overall cost.
Our custom fabricated PCBs are manufactured to
the highest quality. We support more than 5,000
active customers that represent a wide range of
leading OEM and EMS companies in the automotive,
communications, medical, military, aerospace, and
portable device industries.

Request a Quote Request a FREE DFM

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 About The Author
Angie Brown - PCB Product Manager

Angie Brown has over 38-years of experience

within the printed circuit board industry.
After having spent many years in the
manufacturing of PCBs she turned her focus
to CAM engineering and has worked on
processing thousands of data sets. Angie also
has production background proven to be a
successful combination in helping to improve in
every manufacturing process.

As the PCB Product Manager Angie acts as

the main resource for Epec’s printed circuit
board product solutions. She works closely with
Customers to assist in their PCB designs to help
improve or resolve any data or technical issues.

Additionally, Angie oversees Epec’s entire CAM engineering team to verify a

seamless transition for all orders from the time of quote to final production. Angie
also works closely with our Engineering, Quality, and Sales teams on various
circuit board related projects.

Visit Our Website @ www.epectec.com

 Contact Us
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