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CE222 - Digital Integrated Circuit Design

Nguyen Tran Son

ntsonvldt@gmail.com

Feb 01, 2023

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CMOS Transistor Theory

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Outline

1 Structure of MOSFET

2 Formation of Channel

3 MOSFET Characteristics
Operation Regions
IV relationship
Parasitic Capacitance
Source - Drain Resistance

4 Second order Effects


Body-Bias Effect
Channel length modulation
Velocity Saturation Effect
Hot Carrier Effect

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Prefixes Used for Large or Small Physical Quantities

Table: Prefixes Used for Large or Small Physical Quantities

Prefix Abbreviation Scale Factor


giga- G 109
meg- or mega- M 106
kilo- k 103
milli- m 10−3
micro- µ 10−6
nano- n 10−9
pico- p 10−12
femto- f 10−15

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Structure and Symbol of MOSFET

This device is symmetric, so either of the n+ regions can


be source or drain.

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State of the Art MOSFET Structure: NMOS

Source/Drain: n+ (n - Diffusion)
The gate is formed by polysilicon, and the insulator
by Silicon dioxide.

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State of the Art MOSFET Structure: PMOS

Source/Drain: p+ (p - Diffusion)

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MOSFET Symbol

D: Drain
G: Gate
S: Source
B: Bulk/Body

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Formation of Channel

First, the holes are repelled by the positive gate


voltage, leaving behind negative ions and forming a
depletion region. Next, electrons are attracted to the
interface, creating a channel ("inversion layer").

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MOSFET Characteristics

NMOS Cutoff:
VGS < VT H
ID ≈ 0

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MOSFET Characteristics
NMOS Linear:
VGS ≥ VT H and VDS ≤ VGS − VT H
W 2 
VDS
ID = µn COX (VGS − VT H )VDS −
L 2

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MOSFET Characteristics
NMOS Saturation:
VGS > VT H and VDS ≥ VGS − VT H
1 W
ID = µn COX (VGS − VT H )2
2 L

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MOSFET Characteristics

IDS vs. VDS Relationship

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MOSFET Characteristics

IDS vs. VGS Relationship

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MOSFET Parasitic Capacitance
Parasitic Capacitance:
Cg = Cgc + Cgb + Cgs + Cgd

Capacitance Cut-off Linear Saturation


Cgb COX W L 0 0
Cgd COX W LD COX W L/2 + COX W LD COX W LD
Cgs COX W LD COX W L/2 + COX W LD 2COX W L/3 + COX W LD

LD :lateral diffusion length (overlap)

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Source - Drain Resistance


Source - Drain Resistance:
The performance of a CMOS circuit may further be
affected by another set of parasitic elements, being the
resistances in series with the drain and source regions

L
RDS = R□ + RC
W
R□ : sheet resistance per square of the drain-source
diffusion
RC : contact resistance

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MOSFET Characteristics

N-channel MOSFET EQUATION:

Cut Off VGS ≤ VT IDS ≈ 0


 
2
VDS
Linear VGS > VT , IDS = µn COX W
L
(VGS − VT )VDS − 2
VDS ≤ VGS − VT

1 W
Saturation VGS > VT , IDS = µ C
2 n OX L
(VGS − VT )2
VDS > VGS − VT

P-channel MOSFET EQUATION:

Cut Off VSG ≤ |VT | ISD ≈ 0


 
2
VSD
Linear VSG > |VT |, ISD = µp COX W
L
(VSG − |VT |)VSD − 2
VSD ≤ VSG − |VT |

1 W
Saturation VSG > |VT |, IDS = µ C
2 p OX L
(VSG − |VT |)2
VSD > VSG − |VT |

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Second-Order Effects

The above equations constitute the most basic MOS IV


model
"Long channel model", "Quadratic model", "Low
field model"
Unfortunately it doesn’t describe modern CMOS devices
accurately
Pushing towards extremely small geometries has
resulted in very high electric fields
The above simple CMOS theory can’t describe
MOSFET operation correctly
Other second order dependencies arise

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Body-Bias Effect

Body-bias effects: occur when a voltage VSB exists


between the source and bulk terminals.
p p
VT = VT 0 + γ( 2|ϕF | + VSB − 2|ϕF |)
γ: body-bias coefficient (Unit: V 1/2 ), positive for NMOS
ϕF : Fermi potential, negative for NMOS
1. The depletion region is widen;
2. This, in turn, will decrease the channel depth.

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Channel length modulation


IV Characteristic:

1 W
IDS = µn COX (VGS − VT )2 (1 + λVDS )
2 L

λ = VDS ∆L/L

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Channel length modulation (Cont.)
IV Characteristic:

1 W
IDS = µn COX (VGS − VT )2 (1 + λVDS )
2 L

λ = VDS ∆L/L

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Velocity Saturation Effect

When the electric field reaches a critical value EC ,


(1.5 × 106 V/m for p-type silicon) the velocity of the
carriers tends to saturate (105 m/s for silicon) due to
scattering effects.

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Velocity Saturation Effect

Short channel devices display an extended saturation


region due to velocity-saturation

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Hot Carrier Effect

During the last decades transistors dimensions were


scaled down, but not the power supply.
The resulting increase in the electric field strength
causes an increasing energy of the electrons.
Some electrons are able to leave the silicon and
tunnel into the gate oxide.
Such electrons are called "Hot carriers".
Electrons trapped in the oxide change the VT of
the transistors.
This leads to a long term reliability problem.
For an electron to become hot an electric field of 104
V/cm is necessary.
This condition is easily met with channel lengths
below 1µm.
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Hot Carrier Effect

Hot carrier effects cause the I-V characteristics of an


NMOS transistor to degrade from extensive usage.

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Questions?

Thank you !

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