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Abstract
This document describes the features and specifications of the cost
effective and high-performance NEO-M8 modules, which feature
the u-blox M8 concurrent GNSS engine with reception of GPS,
GLONASS, BeiDou and QZSS signals.
www.u-blox.com
UBX-13003557 - R08
NEO-M8 - Hardware Integration Manual
Document Information
Title NEO-M8
Subtitle u-blox M8 concurrent GNSS modules
Document type Hardware Integration Manual
Document number UBX-13003557
Revision and Date R08 21-Oct-2015
Document status Production Information
u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein
may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this
document or any part thereof without the express permission of u-blox is strictly prohibited.
The information contained herein is provided “as is” and u-blox assumes no liability for the use of the information. No warranty, either
express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular
purpose of the information. This document may be revised by u-blox at any time. For most recent documents, visit www.u-blox.com.
Copyright © 2015, u-blox AG.
u-blox® is a registered trademark of u-blox Holding AG in the EU and other countries. ARM® is the registered trademark of ARM Limited in
the EU and other countries.
Contents
Contents ........................................................................................................................................ 3
2 Design...................................................................................................................................... 9
2.1 Pin description ...................................................................................................................................................... 9
2.2 Minimal design ................................................................................................................................................... 10
2.3 Layout: Footprint and paste mask ....................................................................................................................... 10
2.4 Antenna ............................................................................................................................................................. 11
2.4.1 Antenna design with passive antenna ......................................................................................................... 11
2.4.2 Active antenna design................................................................................................................................. 12
4 Product handling................................................................................................................... 15
4.1 Packaging, shipping, storage and moisture preconditioning ................................................................................ 15
4.2 Soldering ............................................................................................................................................................ 15
4.3 EOS/ESD/EMI precautions .................................................................................................................................... 18
4.4 Applications with cellular modules ...................................................................................................................... 20
Appendix ..................................................................................................................................... 23
Recommended parts ....................................................................................................................................................... 23
A.1 Design-in recommendations in combination with cellular operation..................................................................... 24
Related documents...................................................................................................................... 25
Contact......................................................................................................................................... 26
1 Hardware description
1.1 Overview
u-blox M8 modules are standalone GNSS positioning modules featuring the high performance u-blox M8
positioning engine. Available in industry standard form factors in leadless chip carrier (LCC) packages, they are
easy to integrate and combine exceptional positioning performance with highly flexible power, design, and
connectivity options. SMT pads allow fully automated assembly with standard pick & place and reflow-soldering
equipment for cost-efficient, high-volume production enabling short time-to-market.
For product features see the NEO-M8 Data Sheet [1] and the NEO/LEA-M8T Data Sheet [9].
To determine which u-blox product best meets your needs, see the product selector tables on the u-blox
website www.u-blox.com.
1.2 Configuration
The configuration settings can be modified using UBX protocol configuration messages, see the u-blox M8
Receiver Description including Protocol Specification [2]. The modified settings remain effective until power-
down or reset. If these settings have been stored in BBR (Battery Backed RAM), then the modified configuration
will be retained, as long as the backup battery supply is not interrupted.
For NEO-M8N module, configuration can be saved permanently in SQI flash.
Figure 1: Backup battery and voltage (for exact pin orientation, see data sheet)
1.4 Interfaces
1.4.1 UART
NEO-M8 positioning modules include a Universal Asynchronous Receiver Transmitter (UART) serial interface
RxD/TxD supporting configurable baud rates. The baud rates supported are specified in see the NEO-M8 Data
Sheet [1] and the NEO/LEA-M8T Data Sheet [9].
The signal output and input levels are 0 V to VCC. An interface based on RS232 standard levels (+/- 12 V) can be
implemented using level shifters such as Maxim MAX3232. Hardware handshake signals and synchronous
operation are not supported.
1.4.2 USB
A USB version 2.0 FS (Full Speed, 12 Mb/s) compatible interface is available for communication as an alternative
to the UART. The USB_DP integrates a pull-up resistor to signal a full-speed device to the host. The VDD_USB
pin supplies the USB interface.
u-blox provides Microsoft® certified USB drivers for Windows Vista, and Windows 7 operating systems (also
Windows 8 compatible). These drivers are available at our website at www.u-blox.com
1.4.4 SPI
An SPI interface is available for communication to a host CPU.
SPI is not available in the default configuration, because its pins are shared with the UART and DDC
interfaces. The SPI interface can be enabled by connecting D_SEL to ground. For speed and clock
frequency, see the NEO-M8 Data Sheet [1] and the NEO/LEA-M8T Data Sheet [9].
The TX Ready functionality can be enabled and configured by AT commands sent to the u-blox cellular
module supporting the feature. For more information, see the GPS Implementation and Aiding Features
in u-blox wireless modules [7].
SAFEBOOT_N
If the SAFEBOOT_N pin is “low” at start up, the u-blox M8 module starts in Safe Boot Mode and doesn’t begin
GNSS operation. The Safe Boot Mode can be used to recover from situations where the Flash has become
corrupted.
TIMEPULSE 1
A configurable time pulse signal is available with all u-blox M8 modules. By default, the time pulse signal is
configured to one pulse per second. For more information, see the u-blox M8 Receiver Description including
Protocol Specification [2]
TIMEPULSE 2
On NEO-M8T TIMPULSE 2 are available
The TIMEPULSE 2 outputs generate pulse trains synchronized with GNSS or UTC time grid with intervals
configurable over a wide frequency range. Thus it may be used as a low frequency time synchronization pulse or
as a high frequency reference signal.
The TIMEPULSE 2 pin should not be held LO during start-up.
By default the primary time pulse signal is enabled and configured to 1 pulse per second. For more information
see the u-blox M8 Receiver Description including Protocol Specification [2].
If, for example, a cellular signal radiates into an unshielded high-impedance line, it is possible to generate noise
in the order of volts and not only distort receiver operation but also damage it permanently.
On the other hand, noise generated at the I/O pins will emit from unshielded I/O lines. Receiver performance
may be degraded when this noise is coupled into the GNSS antenna (see Figure 14).
To avoid interference by improperly shielded lines, it is recommended to use resistors (e.g. R>20 Ω), ferrite beads
(e.g. BLM15HD102SN1) or inductors (e.g. LQG15HS47NJ02) on the I/O lines in series. These components should
be chosen with care because they will affect also the signal rise times.
Figure 3 shows an example of EMI protection measures on the RX/TX line using a ferrite bead. More information
can be found in section 4.3.
>10mm
FB RX
Receiver
GNSS
FB TX
BLM15HD102SN1
2 Design
2.1 Pin description
Function PIN No I/O Description Remarks
Power VCC 23 Supply Voltage Provide clean and stable supply.
GND 10,12,13 Ground Assure a good GND connection to all GND pins of the module,
, 24 preferably with a large ground plane.
V_BCKP 22 Backup Supply It is recommended to connect a backup supply voltage to V_BCKP in
Voltage order to enable warm and hot start features on the positioning
modules. Otherwise, connect to VCC.
VDD_USB 7 USB Power To use the USB interface, connect this pin to 3.0 – 3.6 V.
Supply If no USB serial port used connect to GND.
Antenna RF_IN 11 I GNSS signal The connection to the antenna has to be routed on the PCB. Use a
input from controlled impedance of 50 Ω to connect RF_IN to the antenna or
antenna the antenna connector.
VCC_RF 9 O Output Voltage VCC_RF can be used to power an external active antenna.
RF section
UART TxD 20 O Serial Port/ SPI Communication interface,.
MISO Can be programmed as TX Ready for DDC interface.
If pin 2 low => SPI MISO.
RxD 21 I Serial Port / SPI Serial input. Internal pull-up resistor to VCC. Leave open if not used.
MOSI If pin 2 low => SPI MOSI.
USB USB_DM 5 I/O USB I/O line USB bidirectional communication pin. Leave open if unused.
USB_DP 6 I/O USB I/O line
System TIMEPULSE 3 O Timepulse 1 Configurable Timepulse 1 signal (one pulse per second by default).
1 Signal Leave open if not used.
SAFEBOOT_ 1 I/O Timepulse 2 Configurable Timepulse 2 signal (must not be held LO during start-
N / Signal up)
TIMEPULSE
2 (NEO-M8T)
SAFEBOOT_ I Reserved For future service, updates and reconfiguration, leave OPEN
N (NEO-
M8N/Q/M)
EXTINT0 4 I External External Interrupt Pin.
Interrupt 0 Internal pull-up resistor to VCC. Leave open if not used. Function is
disabled by default.
EXTINT1 15 I External External Interrupt Pin.
(NEO-M8T) Interrupt 0 Internal pull-up resistor to VCC. Leave open if not used. Function is
disabled by default.
- Reserved Leave open.
RESERVED
(NEO-M8N/
Q/M)
SDA 18 I/O DDC Data / SPI DDC Data
CS_N If pin 2 low => SPI chip select.
SCL 19 I DDC Clock / DDC Clock.
SPI If pin 2 low => SPI clock.
SCK
ANT_ON 14 O ANT_ON ANT_ON (antenna on) can be used to turn on and off an optional
external LNA.
RESET_N 8 I Reset input Reset input
D_SEL 2 I selects the Allow selecting UART/DDC or SPI
interface open-> UART/DDC; low->SPI
RESERVED 16,17 - Reserved Leave open.
3.0 mm
Stencil: 150 µm
[43.3 mil]
1.1 mm
[23.5 mil]
[31.5 mil]
0.6 mm
0.8 mm
[39.3 mil]
1.0 mm
2.4 Antenna
2.4.1 Antenna design with passive antenna
A design using a passive antenna requires more attention to the layout of the RF section. Typically, a passive
antenna is located near electronic components; therefore, care should be taken to reduce electrical noise that
may interfere with the antenna performance. Passive antennas do not require a DC bias voltage and can be
directly connected to the RF input pin RF_IN. Sometimes, they may also need a passive matching network to
match the impedance to 50 Ω.
Figure 6 shows a minimal setup for a design with a good GNSS patch antenna.
Figure 6: Module design with passive antenna (for exact pin orientation see the NEO-M8 Data Sheet [1] and the NEO/LEA-M8T
Data Sheet [9])
Use an antenna that has sufficient bandwidth to receive all GNSS constellations. See Appendix.
Figure 7 shows a design using an external LNA to increase the sensitivity for best performance with passive
antenna.
Figure 7: Module design with passive antenna and an external LNA (for exact pin orientation see the NEO-M8 Data Sheet [1]
and the NEO/LEA-M8T Data Sheet [9])
The ANT_ON pin (antenna on) can be used to turn on and off an optional external LNA.
The VCC_RF output can be used to supply the LNA with a filtered supply voltage.
Active antenna design using VCC_RF pin to supply the active antenna
Figure 8: Active antenna design, external supply from VCC_RF (for exact pin orientation see the NEO-M8 Data Sheet [1] and the
NEO/LEA-M8T Data Sheet [9])
In case the VCC_RF voltage does not match with the supply voltage of the active antenna, use a filtered external
supply as shown in Figure 9.
Figure 9: Active antenna design, direct external supply (for exact pin orientation see the NEO-M8 Data Sheet [1] and the
NEO/LEA-M8T Data Sheet [9])
The circuit shown in Figure 9 works with all u-blox M8 modules, also with modules without VCC_RF
output.
Assignment
SAFEBOOT_N
SAFEBOOT_N
1 Leave open. / TIMEPULSE Leave open. No difference
2
selects the -> Different functions, compatible only when not
2 SS_N SPI Slave Select D_SEL
interface using SPI for communication.
Timepulse 1
3 TIMEPULSE 1 TIMEPULSE 1 Timepulse 1 (1PPS) No difference
(1PPS)
External Interrupt External Interrupt
4 EXTINT0 EXTINT0 No difference
Pin Pin
5 USB_DM USB Data USB_DM USB Data No difference
6 USB_DP USB Data USB_DP USB Data No difference
7 VDD_USB USB Supply VDD_USB USB Supply No difference
If pin 8 is connected directly to pin 9, the RESET
function is not available. If the RESET function
shall be used, a 3k3 resistor from pin 8 to pin 9 in
conjunction with an open drain buffer is required
Pin 8 and 9 for u-blox 6. For NEO-M8 modules pin 8 can be
must be connected to pin 9 or can be left open. Do not
8 RESERVED RESET_N Reset input
connected populate the 3k3 resistor.
together. Behavior of RESET_N has changed; For u-blox 7
and M8, a RESET will erase the time information in
the BBR, which has maintained in u-blox 6.
Therefore, with u-blox 7 and M8 a RESET will not
result in a hot start, etc.
Can be used for Can be used for
active antenna or active antenna or
9 VCC_RF VCC_RF No difference
external LNA external LNA
supply. supply.
10 GND GND GND GND No difference
GNSS signal
11 RF_IN RF_IN GNSS signal input No difference
input
12 GND GND GND GND No difference
13 GND GND GND GND No difference
ANT_ON (antenna on) can be used to turn on and
off an optional external LNA.
SPI MOSI / -> Different functions, no SPI MOSI and
Used to turn on
Configuration configuration pins with NEO-M8. If not used as
MOSI/ and off an
14 Pin. ANT_ON default configuration, it must be set using
CFG_COM0 optional external
Leave open if software command!
LNA
not used. It is not possible to migrate from NEO-6 to NEO-
M8N, if NEO-6 pin 14 is connected to GND. In this
case, migrate to NEO-M8M!
SPI MISO /
MISO/ Configuration
15 RESERVED Leave open.
CFG_COM1 Pin. Leave open
if not used.
NEO-6 NEO-M8
Pin Name Typical Pin Name Typical Assignment Remarks for Migration
Pin
Assignment
Power Mode
Configuration
CFG_GPS0/
16 Pin / SPI Clock. RESERVED Leave open.
SCK
Leave open if
not used.
17 RESERVED Leave open. RESERVED Leave open. No difference
DDC Data / SPI No difference for DDC. If pin 2 low = SPI chip
18 SDA DDC Data SDA
CS_N select
DDC Clock / SPI
19 SCL DDC Clock SCL No difference for DDC. If pin 2 low = SPI clock
SCK
Serial Port Serial Port / SPI
20 TxD TxD No difference for UART. If pin 2 low = SPI MISO
MISO
Serial Port Serial Port / SPI
21 RxD RxD No difference for UART. If pin 2 low = SPI MOSI
MOSI
Backup Supply Backup Supply Check current in Data Sheet
22 V_BCKP Voltage V_BCKP Voltage If on u-blox 6 module this was connected to GND,
no problem to do the same in u-blox M8.
Supply voltage Supply voltage
NEO-6G: NEO-M8M:
1.75 – 2.0V 1.65 – 3.6V
23 VCC VCC
NEO- NEO-M8N/Q:
6Q/M/P/V/T: 2.7 – 3.6V
2.7 – 3.6V
24 GND GND GND GND No difference
Make sure that the RF path (antenna and filtering) matches that of the GNSS constellations used.
4 Product handling
4.1 Packaging, shipping, storage and moisture preconditioning
For information pertaining to reels and tapes, Moisture Sensitivity levels (MSL), shipment and storage
information, as well as drying for preconditioning see the NEO-M8 Data Sheet [1] and the NEO/LEA-M8T
Data Sheet [9].
Population of Modules
When populating the modules, make sure that the pick and place machine is aligned to the copper pins
of the module and not on the module edge.
4.2 Soldering
Soldering paste
Use of “No Clean” soldering paste is highly recommended, as it does not require cleaning after the soldering
process has taken place. The paste listed in the example below meets these criteria.
Soldering Paste: OM338 SAC405 / Nr.143714 (Cookson Electronics)
Alloy specification: Sn 95.5/ Ag 4/ Cu 0.5 (95.5% Tin/ 4% Silver/ 0.5% Copper)
Melting Temperature: 217 °C
Stencil Thickness: see section 2.3
The final choice of the soldering paste depends on the approved manufacturing procedures.
The paste-mask geometry for applying soldering paste should meet the recommendations.
The quality of the solder joints on the connectors (’half vias’) should meet the appropriate IPC
specification.
Reflow soldering
A convection type-soldering oven is highly recommended over the infrared type radiation oven.
Convection heated ovens allow precise control of the temperature, and all parts will heat up evenly, regardless
of material properties, thickness of components and surface color.
As a reference, see the “IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and wave)
processes”, published in 2001.
Preheat phase
During the initial heating of component leads and balls, residual humidity will be dried out. Note that this
preheat phase will not replace prior baking procedures.
• Temperature rise rate: max. 3 °C/s. If the temperature rise is too rapid in the preheat phase it may cause
excessive slumping.
• Time: 60 – 120 s. If the preheat is insufficient, rather large solder balls tend to be generated. Conversely, if
performed excessively, fine balls and large balls will be generated in clusters.
• End Temperature: 150 – 200 °C. If the temperature is too low, non-melting tends to be caused in areas
containing large heat capacity.
Heating/ Reflow phase
The temperature rises above the liquidus temperature of 217°C. Avoid a sudden rise in temperature as the slump
of the paste could become worse.
• Limit time above 217 °C liquidus temperature: 40 – 60 s
• Peak reflow temperature: 245 °C
Cooling phase
A controlled cooling avoids negative metallurgical effects (solder becomes more brittle) of the solder and
possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good
shape and low contact angle.
• Temperature fall rate: max 4 °C/s
To avoid falling off, the u-blox M8 GNSS module should be placed on the topside of the motherboard
during soldering.
The final soldering temperature chosen at the factory depends on additional external factors like choice of
soldering paste, size, thickness and properties of the base board, etc. Exceeding the maximum soldering
temperature in the recommended soldering profile may permanently damage the module.
Optical inspection
After soldering the u-blox M8 module, consider an optical inspection step to check whether:
• The module is properly aligned and centered over the pads
• All pads are properly soldered
• No excess solder has created contacts to neighboring pads, or possibly to pad stacks and vias nearby
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residues underneath the modules cannot be
easily removed with a washing process.
• Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard
and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits
or resistor-like interconnections between neighboring pads.
• Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into the two
housings, areas that are not accessible for post-wash inspections. The solvent will also damage the sticker
and the ink-jet printed text.
• Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators.
The best approach is to use a “no clean” soldering paste and eliminate the cleaning step after the soldering.
Wave soldering
Base boards with combined through-hole technology (THT) components and surface-mount technology (SMT)
devices require wave soldering to solder the THT components. Only a single wave soldering process is
encouraged for boards populated with u-blox M8 modules.
Hand soldering
Hand soldering is allowed. Use a soldering iron temperature setting equivalent to 350 °C. Place the module
precisely on the pads. Start with a cross-diagonal fixture soldering (e.g. pins 1 and 15), and then continue from
left to right.
Rework
The u-blox M8 module can be unsoldered from the baseboard using a hot air gun. When using a hot air gun for
unsoldering the module, a maximum of one reflow cycle is allowed. In general, we do not recommend using a
hot air gun because this is an uncontrolled process and might damage the module.
Attention: use of a hot air gun can lead to overheating and severely damage the module.
Always avoid overheating the module.
After the module is removed, clean the pads before placing and hand soldering a new module.
Never attempt a rework on the module itself, e.g. replacing individual components. Such
actions immediately terminate the warranty.
In addition to the two reflow cycles, manual rework on particular pins by using a soldering iron is allowed.
Manual rework steps on the module can be done several times.
Conformal coating
®
Certain applications employ a conformal coating of the PCB using HumiSeal or other related coating products.
These materials affect the HF properties of the GNSS module and it is important to prevent them from flowing
into the module. The RF shields do not provide 100% protection for the module from coating liquids with low
viscosity; therefore, care is required in applying the coating.
Conformal Coating of the module will void the warranty.
Casting
If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such
processes in combination with the u-blox M8 module before implementing this in the production.
Casting will void the warranty.
• When handling the RF pin, do not come into contact with any
charged capacitors and be careful when contacting materials that
can develop charges (e.g. patch antenna ~10 pF, coax cable ~50 –
80 pF/m, soldering iron, …)
Failure to observe these precautions can result in severe damage to the GNSS module!
Small passive antennas (<2 dBic and Passive antennas (>2 dBic or performance Active antennas
performance critical) sufficient)
A B C
RF_IN
RF_IN
RF_IN
Receiver
Receiver
Receiver
GNSS
GNSS
GNSS
LNA
L
D
Protection measure A is preferred because it offers the best GNSS performance and best level of ESD
protection.
D E F
GPS GPS
Bandpass Bandpass
RF_IN
Filtler Filtler
RF_IN
Receiver
Receiver
GNSS
GNSS
LNA
LNA with appropriate ESD rating and GNSS Band pass Filter: SAW or
maximum input power Ceramic with low insertion loss and
appropriate ESD rating
In a handheld type design, an isolation of approximately 20 dB can be reached with careful placement of the
antennas. If such isolation cannot be achieved, e.g. in the case of an integrated GSM/GNSS antenna, an
additional input filter is needed on the GNSS side to block the high energy emitted by the GSM transmitter.
Examples of these kinds of filters would be the SAW Filters from Epcos (B9444 or B7839) or Murata.
In-band interference
With in-band interference, the signal frequency is very close to the GNSS constellation frequency used, e.g. GPS
frequency of 1575 MHz (see Figure 13). Such interference signals are typically caused by harmonics from
displays, micro-controller, bus systems, etc.
GPS Carrier
Power [dBm]
Jamming 1575.4 MHz GPS
signal signals
0
Jammin
g signal
GPS input filter
-110 characteristics
Frequency [MHz]
Out-band interference
Out-band interference is caused by signal frequencies that are different from the GNSS carrier (see Figure 15).
The main sources are wireless communication systems such as GSM, CDMA, WCDMA, Wi-Fi, BT, etc.
Measures against out-band interference include maintaining a good grounding concept in the design and
adding a SAW or band pass ceramic filter (as recommend in section 4) into the antenna input line to the GNSS
receiver (see Figure 16).
Appendix
Recommended parts
Recommended parts are selected on data sheet basis only. Other components may also be used.
Part Manufacturer Part ID Remarks Parameters to consider
Diode ON ESD9R3.3ST5G Standoff Voltage>3.3 V Low Capacitance < 0.5 pF
Semiconductor ESD9L3.3ST5G Standoff Voltage>3.3 V Standoff Voltage > Voltage for active antenna
ESD9L5.0ST5G Standoff Voltage>5 V Low Inductance
SAW TDK/ EPCOS B8401: B39162-B8401-P810 GPS+GLONASS High attenuation
TDK/ EPCOS B3913: B39162B3913U410 GPS+GLONASS+BeiDou For automotive application
TDK/ EPCOS B4310: B39162B4310P810 GPS+GLONASS Compliant to the AEC-Q200 standard
ReyConns NDF9169 GPS+ BeiDou Low insertion loss, Only for mobile application
muRata SAFFB1G56KB0F0A GPS+GLONASS+BeiDou Low insertion loss, Only for mobile application
muRata SAFEA1G58KB0F00 GPS+GLONASS Low insertion loss, only for mobile application
muRata SAFEA1G58KA0F00 GPS+GLONASS High attenuation, only for mobile application
muRata SAFFB1G58KA0F0A GPS+GLONASS High attenuation, only for mobile application
muRata SAFFB1G58KB0F0A GPS+GLONASS Low insertion loss, Only for mobile application
TAI-SAW TA1573A GPS+GLONASS Low insertion loss
TAI-SAW TA1343A GPS+GLONASS+BeiDou Low insertion loss
TAI-SAW TA0638A GPS+GLONASS+BeiDou Low insertion loss
LNA JRC NJG1143UA2 LNA Low noise figure, up to 15 dBm RF input
power
Avago ALM-GN001 LNA Low noise figure, with pre-LNA filter,
concurrent GNSS
Avago ALM-GN002 LNA Very low noise figure, with post-LNA filter,
concurrent GNSS
Inductor Murata LQG15HS27NJ02 L, 27 nH Impedance @ freq GPS > 500 Ω
Capacitor Murata GRM1555C1E470JZ01 C, 47 pF DC-block
Ferrite Murata BLM15HD102SN1 FB High IZI @ fGSM
Bead
Feed thru Murata NFL18SP157X1A3 Monolithic Type For data signals, 34 pF load capacitance
Capacitor NFA18SL307V1A45 Array Type For data signals, 4 circuits in 1 package
for Signal
Feed thru Murata NFM18PC …. 0603 2A Rs < 0.5 Ω
Capacitor NFM21P…. 0805 4A
Resistor 10 Ω ± 10%, min 0.250 W Rbias
560 Ω ± 5% R2
100 kΩ ± 5% R3, R4
Recommended antennas
Manufacturer Order No. Comments
Hirschmann (www.hirschmann-car.com) GLONASS 9 M GPS+GLONASS active
Taoglas (www.taoglas.com ) AA.160.301111 36*36*4 mm, 3-5V 30mA active
Taoglas (www.taoglas.com ) AA.161.301111 36*36*3 mm, 1.8 to 5.5V / 10mA at 3V active
INPAQ (www.inpaq.com.tw) B3G02G-S3-01-A 2.7 to 3.9 V / 10 mA active
Amotech (www.amotech.co.kr) B35-3556920-2J2 35x35x3 mm GPS+GLONASS passive
Amotech (www.amotech.co.kr) A25-4102920-2J3 25x25x4 mm GPS+GLONASS passive
Amotech (www.amotech.co.kr) A18-4135920-AMT04 18x18x4 mm GPS+GLONASS passive
Amotech (www.amotech.co.kr) Amotech AGA363913- GPS+GLONASS+ BeiDou active
S0-A1
INPAQ (www.inpaq.com.tw) ACM4-5036-A1-CC-S 5.2 x 3.7 x 0.7 mm GPS+GLONASS passive
Additional antenna Manufacturer: Allis Communications, 2J, Tallysman Wireless
3G/4G cellular
On-chip LNA
2G cellular
2G/3G/4G
SAW LNA
Antenna
Variant
cellular
Family
SAW
SAW
MAX-6 Any • •
NEO-6 Any • •
LEA-6 Any • •
EVA-7 M •
C •
MAX-7 W •
Q •
N • •
NEO-7 M •
P • •
EVA-M8 M •
C •
MAX-M8 W •
Q •
N • •
M •
NEO-M8
Q • •
T • •
S • •
LEA-M8
T • •
PAM-7 Q • • • •
C • • •
CAM-M8
Q • • •
• = integrated = optimal performance
Table 6: Combinations of u-blox GNSS modules with different cellular technologies (2G/3G/4G).
See the GPS Implementation and Aiding Features in u-blox wireless modules [7]
Related documents
[1] NEO-M8 Data Sheet, Docu. No. UBX-13003366
[2] u-blox M8 Receiver Description including Protocol Specification (Public version), Docu. No. UBX-
13003221
[3] GPS Antenna Application Note, Docu. No. GPS-X-08014
[4] UBX-M8030 Data Sheet, Docu. No. UBX-13001634
[5] GPS Compendium, Docu. No. GPS-X-02007
2
[6] I C-bus specification, Version 2.1, Jan 2000,
http://www.nxp.com/acrobat_download/literature/9398/39340011_21.pdf
[7] GPS Implementation and Aiding Features in u-blox wireless modules, Docu. No. GSM.G1-CS-09007
[8] u-blox 7 to u-blox M8 Software Migration Guide, Docu. No. UBX-13003254
[9] NEO/LEA-M8T Data Sheet, Docu. No. UBX-14006196
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Revision history
Revision Date Name Status / Comments
R01 11-Oct-2013 jfur Objective Specification
R02 23-Jan-2014 jfur Status changed to Advance Information.
NEO-M8Q-0 and NEO-M8M-0 added
Table 6: Blocking dependence on different cellular technology (2G/3G/4G) added
Recommended parts updated
R03 13-May-2014 jfur Document status changed to Early Production Information.
Updated Table 4 (Recommended parts); added: Combinations of u-blox GNSS modules
with different cellular technologies (2G/3G/4G); updated Figure 7.
R04 28-Oct-2014 jfur Added NEO-M8T product variant, updated SAFEBOOT_N pin description.
R05 02-Dec-2014 julu Document status changed to Production Information.
R06 20-Apr-2015 jfur/amil Updated Table 4 (Recommeded parts) and Table 6, NEO-M8T PCN FW TIMRAW 1.02
R07 02-Jun-2015 julu Updated section 1.5 (added Electromagnetic interference on I/O lines).
R08 21-Oct-2015 julu Updated product type number to NEO-M8M-0-01 and NEO-M8Q-0-01,added relevant
PCN references, Updated Figure 5.
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