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1986effective Thermal Conductivity of A Metal Hydride Bed Augmented With A Copper Wire Matrix
1986effective Thermal Conductivity of A Metal Hydride Bed Augmented With A Copper Wire Matrix
1986effective Thermal Conductivity of A Metal Hydride Bed Augmented With A Copper Wire Matrix
Summary
1. Introduction
Details of two different types of the heat transfer paths are shown in
Fig. 1, where Model I will provide the shortest path length S and Model II
FtlELI mm II
.REFEREKE K4TEFtIAL
DIRECTION OF
HEAT Fu)c(
THEFK#JPLES
WRRUGATFD
WIRE-NET
‘FLAT WIRE-t.53
‘COOLING FUJID
TABLE 1
Physical properties of the copper wire matrix
Material CU
Density (kg mm31 8920
Void fraction 0.91
Surface urea per unit volume (m2 mm3) 6882
Thermal conductivity -1 K-1 389
1
Wire diameter ;:;1 0.2 x 10-S
Matrix size (mesh) 50
will give the longer path S + 44. In each model the average values of L, S and
M are given as 2.2 mm, 3.5 mm and 5.0 mm respectively.
The maximum distance from the matrix to any part of the hydride bed
is less than 1.25 mm which enables rapid heat transfer and this distance is
well within the range recommended by Suda et al. [7]. The physical prop-
erties of the copper wire matrix are given in Table 1.
The heat transfer Q through the matrix can be calculated using the
Fourier equation:
37
dQ = --&‘A g (1)
R=fdX (2)
K,’ dA
By analogy with an electrical circuit, the resistance to heat flow in the
paths given by the two models can be expressed as a sum of the resistances.
Model I R, = Rs + R,
Model II RI1 =R,+R,+ZR, (3)
Es = S/(&A,)
R, = ~/(K~A~)
R, = l/(&h,) (4)
The value of R, depends on the conditions of the contact surfaces
between two layers of the copper wire matrix. From a geometrical point of
view, Model II occurs about five times more often than Model I. When all
the terms are included in Eqn. (1) the heat Q transferred by the copper wire
matrix is found to be
Q=
I_d!_
f&Ad
“I- -+
5&k
9
Tz) (5)
3. ~pe~en~l apparatus
HEATING FWID
cm FOXEN
FLU
CUT
INSULATION
COJLING FLUID
HEATING FLUID
5 3 OUTLET
THEMJX#JPLES
TABLE 2
Physical properties of the reference materials
Lead shot
Average particle size (m) 2.24 X 1O-3
Density (kg me3) 11,320
Void fraction 0.418
Sample weight (kg) 1.815
Thermal conductivity (W m-l K-l) 35.3
Ethyl alcohol
Thermal conductivity (W m-l K-l) 0.168
Reference material
Thermal conductivity (W m’-’ K-l) 1.64 - 0.00192’,”
Fig. 3. Details of experimental apparatus: (1) Piping for heating fluid; (2) Difron insu-
lator; (3) O-ring seal; (4) reference bed; (5) metal hydride bed; (6) cooling jacket; (7)
pipes for thermocouples; (8) inlet for hydrogen gas; (9) sintered metal filter (2 pm);
(10) Difron insulator.
TABLE 3
Particle size distribution of MmNi 4.46A1e.s4 hydride after 15 sorption cycles
Diameter Distribution
(Pm) (%)
22 7.65
16 21.98
11 25.54
7.8 24.64
5.5 13.05
3.9 5.37
2.8 1.63
1.9 0.12
40
4. Experimental procedure
Fig. 4. K,' vs.P for an improved metal hydride bed, showing the effects of temperature
and hydrogen or helium atmosphere.
-0.5
6
F
k!
-0.1 3
ii!
I I I II 1 I II 1
0 0.1 0.2 0,3 04 0,s 0.6 0.7 0.8 0. 0.2 089 0,6 0,X 1.0
HITIM TO - PETAL ATCtl RATIO ( HM ) HYDROGEN - TO - t’ETA1 ATOM RATIO (H/N)
Fig. 5, K,’ vs. H/M ratio for absorption (solid symbols) and desorption (open symbols)
processes at various temperatures.
Fig. 6. P us. H/M ratio for absorption (solid symbols) and desorption (open symbols) of
~rn~i~,~**s~ at 40 and 60 “C.
6. Conclusions
K,’ of a hydride reaction cell with a copper wire matrix has been mea-
sured in vacuum and under helium and hydrogen atmospheres, and analysed
to separate the effects of several parameters such as system pressure, particle-
to-particle heat conduction, and hydrogen-to-metal atom ratio. An empirical
equation is presented for a MrnNieSG6A1 e-s4 hydride bed. The copper wire
matrix will improve I&’ by 0.4 W m-l K-r.
References
1 S. Suda, F’roc. 5th World Hydrogen Energy Conf., Toronto, Canada, 15 - 20 July
1984, Hydrogen Energy Prog. V, Pergamon, Oxford, 1984, p. 1201.
2 M. Matsubara, Y. Komazaki, M. Nagel, T. Amaiwa and S. Suda, Proc. 17th Fall
Meeting, Sendai, Japan, 1983, Society of Chemical Engineering of Japan, Tokyo.
3 M. Nagel, S. Suda, Y. Komazaki and M. Uchida, J. Less-Common Met., 104 (1984)
319 - 327.
4 G. Anevi, L. Jansson and D. Lewis, J. Less-Common Met., 104 (1984) 341 - 348.
5 M. Ron, J. Less-Common Met., 104 (1984) 259 - 278.
6 D. A. Rohy, R. A. Argabright and G. W. Wade, Proc. 17th Intersociety Energy Con-
version Engineering Conf., Los Angeles, CA, 1982, IEEE, New York, 1982, p. 1160.
7 S. Suda, N. Kobayashi, E. Morishita and N. Takemoto, J. Less-Common Met., 89
(1983) 325 - 332.
8 S. Suda, Y. Komazaki and N. Kobayashi, J. Less-Common Met., 89 (1983) 317 - 324.
9 Y. Ishido, M. Kawamura and S. Ono, Int. J. Hydrogen Energy, 7 (1982) 173 - 182.
10 N. Wakao and D. Vortmeyer, Chem. Eng. Sci., 26 (1971) 1753 - 1765.
11 A. Kempf and W. R. B. Martin, Proc. 5th World Hydrogen Energy Conf., Toronto,
Canada, 15 - 20 July 1984, Hydrogen Energy Prog. V, Pergamon, Oxford, 1984, pp.
1255 - 1267.
12 E. H. Kennard, Kinetic Theory of Gases, McGraw-Hill, New York, 1938, p. 311.
Appendix A: Nomenclature
A area (m2)
AC cross sectional area of contact (m2)
cross sectional area of a wire (m2)
$M
fP
H/M ratio correlation factor
system pressure correlation factor
gH,M H/M ratio correlation factor to MHP conduction
4 heat transfer coefficient (W m-l K-i)
HIM hydrogen-to-metal atom ratio
&h thermal conductivity of copper (W m-l K-l)
K,’ effective thermal conductivity (W m-’ K-l)
K gas conduction from gas to solid (W m-’ K-l)
K MH thermal conductivity of MHP under vacuum conditions (W m-l K-l)
K rad radiation heat transfer (W m-’ K-l)
K ref thermal conductivity of reference material (W m-l K-l)
P system pressure (Pa)
Q heat transfer (W m-l K-l)
R resistance to heat transfer (K W’)
RI. II thermal resistance of Model I or Model II (K W-l)
RC thermal resistance of contact points (K W-l)
R S,M thermal resistance of the wire length S or M (K W’)
T temperature (K)
X length, distance (m)