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stth1002c 1851878
stth1002c 1851878
stth1002c 1851878
Features
$
. Suited for SMPS
$
Low losses
. Low forward and reverse recovery times
Insulated package: TO-220FPAB
– Insulating voltage: 2000 VRMS sine
$ High junction temperature
.
$ $ Low leakage current
.
$
72)3$% ,ð3$. ECOPACK®2 compliant component for DPAK
and D²PAK on demand
.
Description
Dual center tap rectifier suited for switch mode
power supplies and high frequency DC to DC
$ converters.
.
$
Packaged in DPAK, D²PAK, TO-220AB, I²PAK
72$% and TO-220FPAB, this device is intended for use
in low voltage, high frequency inverters, free
. .
wheeling and polarity protection applications.
$ $ trr (typ) 20 ns
$ $
'3$.
1 Characteristics
Table 2. Absolute ratings (limiting values per diode at 25 °C, unless otherwise specified)
Symbol Parameter Value Unit
Tj = 25 °C - 5
IR(1) Reverse leakage current VR = VRRM µA
Tj = 125 °C - 3 40
IF = 5 A - 1.10
Tj = 25 °C
IF = 10 A - 1.25
VF(2) Forward voltage drop V
IF = 5 A - 0.78 0.89
Tj = 150 °C
IF = 10 A - 1.05
1. Pulse test: tp = 5 ms, < 2%
2. Pulse test: tp = 380 µs, < 2%
IF = 1 A
trr Reverse recovery time Tj = 25 °C VR = 30 V - 20 25 ns
dIF/dt = 100 A/µs
IF = 5 A
Reverse recovery
IRM Tj = 125 °C VR = 160 V - 5.9 7.6 A
current
dIF/dt = 200 A/µs
IF = 5 A
tfr Forward recovery time VFR = 1.1 x VFmax - 110 ns
Tj = 25 °C dIF/dt = 100 A/µs
Forward recovery IF = 5 A
VFP - 2.4 V
voltage dIF/dt = 100 A/µs
Figure 1. Peak current versus duty cycle Figure 2. Forward voltage drop versus forward
(per diode) current (typical values, per diode)
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Figure 3. Forward voltage drop versus forward Figure 4. Relative variation of thermal
current (maximum values, per diode) impedance junction to case versus pulse
duration
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Figure 7. Reverse recovery charges versus Figure 8. Reverse recovery time versus dIF/dt
dIF/dt (typical values, per diode) (typical values, per diode)
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M
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Figure 9. Peak reverse recovery current versus Figure 10. Dynamic parameters versus junction
dIF/dt (typical values, per diode) temperature (reference: Tj = 125 °C)
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Figure 11. Thermal resistance junction to Figure 12. Thermal resistance junction to
ambient versus copper surface under tab ambient versus copper surface under tab
6&X FPð 6&X FPð
2 Package information
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3 Ordering information
4 Revision history
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