Advanced Packaging Market Monitor Q3 2023-Product Brochure

INTELLIGENCE TO SHAPE YOUR TOMORROW
Advanced Packaging
Market Monitor
Q3 2023
Product Brochure
YINTM23315Q3 | www.yolegroup.com | ©Yole Intelligence 2023

TABLE OF CONTENTS
Part 1/3
• Glossary 5 o Long-term Fan-out Package Overview 50

• Key Terms and Definitions As Used In This Monitor 6 o Short-term Fan-out Package Revenue 52
• Advanced Packaging Monitor Scope 7 o Fan-out Package Revenue by Supplier 55
• Advanced Packaging Monitor – Market Segmentation 8 o Fan-out Package Pricing Dynamics 57
• Advanced Packaging Monitor Methodology 9 o UHD FO, HD FO, and Core FO Wafer Forecast (300mm Eq.) 59
• About The Authors 10 o Fan-out Wafer And Panel Revenue: UHD FO, HD FO, and Core FO 62
• Companies Cited 11 o Fan-out Package Application Mix 63
• Advanced Packaging Platform Definitions 12 • WLCSP Market Dynamics 65
• What Has Changed This Quarter 16 o Short-term WLCSP dynamics 67
• Packaging Industry Highlights 21 o Long-term WLCSP dynamics 68
• Capex Highlights – Investment and Expansion 31 o Short-term and Long-term WLCSP dynamics 69
• Analyst Commentary: Market Dynamics 33 o Short-term and Long-term WLCSP Shipments 70
• Key Market Metrics At A Glance 40 o Short-term and Long-term WLCSP Revenue 71
o Advanced Packaging Market Dynamics – Revenue 41 o Short-term WLCSP Shipments by Supplier 72
o Advanced Packaging Market Dynamics – Volume 42 o Long-term WLCSP Revenue by Supplier 73
o Advanced Packaging Market Dynamics – Wafer 43 o WLCSP Pricing Dynamics 75
o Advanced Packaging Market Dynamics – Quarterly 44 o WLCSP Application Mix 76
• Fan-out Market Dynamics 47
o Short-term Fan-out Package Overview 49
Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 2

TABLE OF CONTENTS
Part 2/3
• FCBGA Packaging Market Dynamics 78 o FCCSP Package Pricing Dynamics 105

o Short-term FCBGA Package Overview 80 o FCCSP Application Mix 107
o Long-term FCBGA Package Overview 81 • 3D-stacked Packaging Market Dynamics 109
o Short-term FCBGA Wafer Demand 82 o Short-term 3D-stacked Package Overview 112
o Short-term FCBGA Package Shipments 83 o Long-term 3D-stacked Package Overview 113
o Short-term FCBGA Package Revenue 84 o 3D-stacked IC Package wafer demand by technology 114
o FCBGA Package Shipments by Supplier 85 o 3D-stacked IC Package units by technology 115
o FCBGA Package Revenue Market Shares 86 o 3D-stacked IC Package revenues by technology 117
o FCBGA Package Pricing Dynamics 89 o Short-term 3D-stacked IC Package Shipments 119
o FCBGA Package Application Mix 91 o Short-term 3D-stacked IC Package Revenue 120
• FCCSP Packaging Market Dynamics 93 o 3D-stacked IC Shipments by Manufacturer 121
o Short-term FCCSP Package Overview 94 o 3D-stacked IC Revenue by Supplier 122
o Long-term FCCSP Package Overview 96 o 3D-stacked Package Application Mix 124
o Short-term FCCSP Wafer Demand 97
o Short-term FCCSP Shipments 99
o Short-term FCCSP Revenue 100
o FCCSP Shipments Split By Supplier 101
o 2022 FCCSP Packaging Service Revenue Market Shares 102
o FCCSP Revenue Split By Supplier 104

TABLE OF CONTENTS
Part 3/3
• Scope Of Module: SiP 126 o ASE (w/Usi and w/SPIL) 150

• SiP Market Dynamics 128 o JCET 151
o Short-term SiP Package Overview 130 o Amkor 152
o Long-term SiP Package Overview 131 o PTI 153
o Short-term SiP Dynamics By Market Segment: Shipments 132 o TFME 154
o Short-term SiP Dynamics By Market Segment: Revenue 133 o Nepes 155
o SiP Production By Supplier 134 o China WLCSP 156
o SiP Supplier Market Shares And Forecast: Revenue 135 o TianShui Huatian 157
o SiP Application Mix 137 • Conclusions 158
• Supplier Details 139 • Yole Group Corporate Presentation 159
o TSMC 141
o UMC 142
o Intel 143
o Sony (Stacked CIS) 144
o Samsung Electronics 145
o Texas Instruments 146
o Micron 147
o SK hynix 148
o YMTC 149

SEMICONDUCTOR PACKAGING ACTIVITY
Technology & Market Analyst, Senior Technology & Market Analyst,
Stefan CHITORAGA Yik Yee TAN Ph.D.
Semiconductor Packaging Semiconductor Packaging
Experience Experience
• 7+ years in electronics package development and design • 25+ years in Packaging and interconnects in R&D
At Yole Intelligence At Yole Intelligence
• Packaging, assembly and substrates • Packaging, assembly and substrates
Education Education
• M.Sc of Engineering in Electronics and Computer Science • Ph.D. in engineering science
Technology & Market Analyst, Technology & Market Analyst,

Gabriela PEREIRA Bilal HACHEMI Ph.D.
Semiconductor Packaging Semiconductor Packaging
Experience Experience
• 3+ years as R&D Engineer • 4+ years in electronics
At Yole Intelligence At Yole
• Packaging, assembly and substrates • Semiconductor manufacturing
Education Education
• Master’s degree in metallurgical and materials • Ph.D. in nanoelectronics
engineering
Technology & Market Analyst,

Vishal SAROHA
Semiconductor Packaging
Experience
• 4+ years in semiconductor and packaging industry
At Yole
• Semiconductor Packaging and Computing
Education
• M.Sc in Nanotechnology
• Bachelor of science in Physics

EXECUTIVE SUMMARY
After a weak first half of the year, Advanced Packaging revenues are expected to recover 23.8% in Q3 2023
While demand is remaining soft for several end-markets, inventory digestion is taking longer than expected and package
manufacturers have seen their utilization rates decline throughout the first half of 2023. In Q2 2023 revenues increased 8.3%
compared to the previous quarter. In the second half of the year, signs of recovery start to be seen and in Q3 2023 results are
expected to improve with strong sequential growth of ~23.8%, showing a ramp in manufacturing.
2023 will be a weaker year for the semiconductor industry and the AP market is expected to remain flat at $43.9B. AP market
revenues are expected to show a slight grow for 2.5D/3D, FCBGA and FO packaging, whereas for the other platforms,
revenues should decrease mainly due to the weak demand in mobile and consumer market. In 2024 we expect the AP
market to start recovering at a stronger pace with 12.4% growth. This growth will be driven by the AI hype generated by the
surge of generative AI applications such as ChatGPT, as its adoption is needed for devices such as CPUs, GPUs, FPGAs and
HBM.
Advanced packaging surpasses the overall semiconductor market growth, reaching $43.9B in 2022
Advanced packaging (AP) revenue is expected to grow at an 8.7% CAGR, from $43.9B in 2022 to $72.4B by 2028. AP revenues
have grown 9.9% in 2022 compared to the previous year, surpassing the semiconductor market growth rate, which achieved
2%. In terms of package units, AP market was flat due to soft demand in the mobile & consumer market. Reasons behind AP
market growth include the adoption of more advanced and complex packages with high ASPs. AP is driven by megatrends
like AI, HPC, automotive electrification and 5G adoption.
Flip-chip BGA, flip-chip CSP and 2.5D/3D are the dominating packaging platforms in terms of revenues, with 2.5D/3D
technologies showing the highest growth rate, as it is expected to grow from $8.9B in 2022 to $23.2B in 2028 with a 17.2%
CAGR. Advanced packaging units are expected to show a 4.1% CAGR2022-2028, with WLCSP, SiP and FCCSP leading in
terms of the total number of units.
Find more on www.yolegroup.com

IDENTITY CARD
What will you find in this monitor?
Systems Quick summary

Markets Technology Key metrics Advanced packaging (AP) revenue is
tracked expected to grow at an 8.7% CAGR, from
$43.9B in 2022 to $72.4B by 2028. In 2023
Action Cams Application processor the AP market is expected to remain flat
Automotive & Mobility Baseband Units at $43.9B.
Feature Phones
Smartphones RF transceiver
Smartwatches RF Front-End Value Key Features
Defense & Aerospace Q1-2021 – Q1-2025
Wireless earbuds Audio Quarterly timeframe • Direct access to the analyst providing
Tablets PMIC Wafer
opportunity for Q&A
Industrial DRAM • Packaging industry dynamics
Game Stations highlights and analyst viewpoint
Desktop PC / Mac NAND • Quarterly data update on key
SSD Controller Market shares
Medical Laptop Chromebook advanced package types: FCCSP,
Laptop PC / Mac CPU FCBGA, WLCSP/Fan-In, Fan-Out
packages, 3D-stacked packages, and
Workstations GPU Supply chain
Mobile & Consumer Players SiP
Flash Cards FPGA and ASIC • Market forecast through 2028, in $US,
USB Flash Drives CIS units and wafers
Strategy
Telecom and AR Headset MEMS and sensors • Average Selling Price (ASP) analysis
• End-product/device application mix
Infrastructure VR Headset And others… Financial • Supplier market shares for TSMC, Intel
Personal Robotics analysis Samsung Electronics, Amkor, JCET,
Frequency
Camera Depth ASE w/SPIL, PTI, Nepes, SPIL, Huatian,
TFME, SK Hynix and Sony
Passenger Cars (PC) Trends Business news
update Routers & Switches analysis • Advanced Packaging Capex
Base transceiver station

Q What’s new?
System Technology
Quarterly Computing Servers status 2023 Capex forecast update
Network/Switch Servers Module
End-system volumes have been updated
Y Yearly Machine Vision System
Ultrasound Portables
Sub-module
Component
Technology
Roadmap
for all modules
New investments and technology
Medical Robotics Process announcements
Military drone Wafer

Fighter / Attack Airplane Material
And others… Equipment

COMPANIES CITED*
Advanced Micro Devices (AMD), Amkor Technology, Apple, ASE, Authentec, Broadcom, China Resources
Microelectronics, China WLCSP, Chipbond, Chipmore Technology, ChipMOS, Deca Technologies, ECHINT,
Forehope Electronic, Foxconn, GlobalFoundries, Global Unichip Corp (GUC), Google, Hitech Semiconductor,
Hon Hai, IBM, Inari Berhad, Infineon, Intel, JCET, JSI, King Yuan Electronics, Lockheed Martin, MediaTek,
Micron, Murata, Nepes, Northrop Grumman, NVIDIA, Payton Technologies, Powertech Technology, Qorvo,
Qualcomm, Samsung Electronics, Samsung Electro-Mechanics, SJ Semiconductor (Jiangyin) Corp., SK Hynix,
Skyworks, SPIL, Sony, ST Microelectronics, Taiyo Yuden, Texas Instruments, TianShui Huatian, Tongfu
Microelectronics Co., Ltd., Taiwan Semiconductor Manufacturing Company, Unimos Microelectronics, United
Microelectronics Corporation, Universal Scientific Industrial (USI), UTAC, Wisol, Yangtze Memory
Technologies Corp, Yibu Semiconductor, Zhejiang Chuanghao Semiconductor, and more.
*non-exhaustive list

TOP 10 PACKAGING SUPPLIERS’ REVENUES – 2022 RANKING ESTIMATION
Top Packaging Supplier Ranking by 2020 Top Packaging Supplier Ranking by 2021 Top Packaging Supplier Ranking by 2022
Revenue ($M) Revenue ($M) Revenue ($M)
ASE (w/SPIL & w/o USI) ASE (w/SPIL & w/o USI) ASE (w/SPIL & w/o USI)
Amkor Amkor Amkor
Intel JCET TSMC
JCET Group TSMC JCET Group
TSMC Intel Intel
Powertech Technology Samsung Samsung

Powertech
Samsung Tongfu Microelectronics
Technology
Tongfu Microelectronics TFME Powertech Technology
Tianshui Huatian
Tianshui Huatian Tianshui Huatian
Microelectronics
Microelectronics
King Yuan Electronics UTAC
UTAC
TSMC, Intel, and Samsung revenues are estimated for the advanced packaging business

TOP 10 CHINESE OSAT REVENUES
Top Chinese OSAT Rankings by 2021 Top Chinese OSAT Rankings by 2022 Top Chinese OSAT 2022/2021
Revenue ($M) Revenue ($M) YoY Growth (%)
JCET Group JCET Group

JCET Group
Tongfu
Microelectronics Tongfu Microelectronics Tongfu Microelectronics
Tianshui Huatian Tianshui Huatian

Tianshui Huatian
Hitech Semiconductor Hitech Semiconductor

Hitech Semiconductor
Payton Technologies SJ Semi SJ Semi
China Resources
Microelectronics Payton Technologies Payton Technologies
Forehope Electronic Forehope Electronic Forehope Electronic
Chipmore Technology China Resources China Resources Microelectronics

Microelectronics
SJ Semi Chipmore Technology Chipmore Technology
China Wafer Level CSP Unimos Microelectronics Unimos Microelectronics

2021-2023 CAPEX HIGHLIGHTS FOR PACKAGING PLAYERS – Q1 2023 UPDATE
Estimated Packaging CapEx spending by top players [$M]

Packaging CapEx of top 9 players ($B)
2021 2022 2023
$18,000 20%
-1% since
$3,060 last quarter
*TSMC $3,600 $16,000 15%
$3,200 forecast
$14,000 10%
8%
$3,500
*Intel $4,000 $12,000 5%
$3,030
$10,000 0%
$1,375
*Samsung $2,000 $8,000 -5%
$1,800
$6,000 -10%
$1,800
ASE (w/ SPIL & USI) $1,700 $4,000 -15%
$1,150 -19%
$2,000 -20%
$780
Amkor $908 $0 -25%
$750 2021 2022 2023
$560 PTI Tianshui Huatian TFME
JCET $551
$560 JCET Amkor ASE (w/ SPIL & USI)
$1,000 *Samsung *Intel *TSMC

TFME $590
$500 YoY change (%)
$755
Tianshui Huatian $550
$450 In 2023 the packaging CapEx of the top nine players is expected
PTI
$550
$580
to reach $11.8B, which is 19% lower than the previous year.
$350
*Intel, TSMC, and Samsung’s packaging CapEx were estimated based on earnings
statements and announcements of investments, since packaging is not their primary
business focus. All CapEx data is estimated based on information gathered during Q2-2023

ADVANCED PACKAGING MARKET DYNAMICS – REVENUE
The Embedded Die (ED) packaging platform is presented to have a high-level view of the total advanced packaging market, though it is not part of the quarterly
update of the monitor.
FCCSP and FCBGA market revenues include bumping, assembly and materials (e.g., IC substrate) related revenues. Flip-chip assembly and IC substrate revenues
related to UHD FO and 2.5D packages are accounted in this chart under FCBGA.

ADVANCED PACKAGING MARKET DYNAMICS – VOLUME
The Embedded Die (ED) packaging platform is presented to have a high-level view of the total advanced packaging market, though it is not part of the quarterly
update of the monitor.

ADVANCED PACKAGING MARKET DYNAMICS – QUARTERLY
Advanced
packaging
market
reached $XXB
of revenue in
Q2-2023 and is
expected to
increase by
23.8% in Q3-
2023 to
achieve $XXB.

ADVANCED PACKAGING REVENUES OF THE TOP 6 PLAYERS IN 2021-2022
Quarterly Revenue by Player and Advanced Packaging Platform ($M)
3D Stacked FCBGA FCCSP FO WLCSP FC bumping SiP
1600
1400
1200
Revenue ($M)
1000
800
600
400
200
0
Q2 22 Q3 22 Q4 22 Q1 23 Q2 23 Q3 23 Q2 22 Q3 22 Q4 22 Q1 23 Q2 23 Q3 23 Q2 22 Q3 22 Q4 22 Q1 23 Q2 23 Q3 23 Q2 22 Q3 22 Q4 22 Q1 23 Q2 23 Q3 23 Q2 22 Q3 22 Q4 22 Q1 23 Q2 23 Q3 23 Q2 22 Q3 22 Q4 22 Q1 23 Q2 23 Q3 23
ASE w/SPIL & w/o USI Amkor Intel JCET TSMC Samsung Electronics
ASE Amkor Intel JCET TSMC Samsung

2022 Estimation*
*These revenues are only related to advanced packaging platforms analyzed in this monitor and the market shares of each player for each platform.

YOLE GROUP RELATED PRODUCTS
Reports
High-End Performance
Apple M1 Ultra SoC
Packaging 2023
Status of the Advanced AMD Instinct MI210 GPU with

Contact our Packaging Industry 2023 HBM2e
Sales Team
for more
information
2.5D & 3D Packaging

Fan-out Packaging 2023
Comparison 2022
AMD 3D V-Cache with TSMC

System-in-Package 2023
SoIC 3D Packaging

Monitors
Processor Market Monitor NAND Market Monitor
Semiconductor Test
DRAM Market Monitor
Contact our Consumables Market Monitor
Sales Team
for more
information
Wafer Fab Equipment Market Semiconductor Equipment

Monitor Subsystems Market Monitor
Wafer Data Monitor

Teardown Tracks
Consumer - Phone Consumer - Smart Home
Consumer - Tablet,
Consumer - Wearable
Contact our Computing & Gaming
Sales Team
for more
information
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Automotive - Infotainment Automotive - Telematics

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Please note that the entire document and its data is copyrighted © Yole Intelligence
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FIELDS OF EXPERTISE COVERING THE SEMICONDUCTOR INDUSTRY
• Photonics & Lighting

• Imaging
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Equipment • Power Electronics
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› Web access Topics
› Advanced Packaging Topics Types of analysis
Topics › Photonics GaAs/InP CS › Consumer: Phones, smart home, › Company profiling
› Battery, Compound › RF GaN CS › Cost model/ design
wearables, tablet, computing and
Semiconductor, Power Electronics, › Power SiC/GaN CS › Finance project: DD, M&A buy side,
gaming
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› Computing & Software, Memory, › Market analysis
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Semiconductor Packaging › Marketing analysis, market
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› Semiconductor Test › Telecom: Baseband unit, active › Patent analysis
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INTELLIGENCE TO SHAPE YOUR TOMORROW

YINTM23315Q3 | www.yolegroup.com | ©Yole Intelligence 2023

• Glossary 5 o Long-term Fan-out Package Overview 50

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 2

• FCBGA Packaging Market Dynamics 78 o FCCSP Package Pricing Dynamics 105

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 3

• Scope Of Module: SiP 126 o ASE (w/Usi and w/SPIL) 150

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 4

Technology & Market Analyst, Technology & Market Analyst,

Technology & Market Analyst,

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 5

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 6

Systems Quick summary

Base transceiver station

Military drone Wafer

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 7

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 8

Amkor Amkor Amkor

Intel JCET TSMC

JCET Group TSMC JCET Group

TSMC Intel Intel

Powertech Technology Samsung Samsung

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 9

JCET Group JCET Group

Tianshui Huatian Tianshui Huatian

Hitech Semiconductor Hitech Semiconductor

Payton Technologies SJ Semi SJ Semi

Forehope Electronic Forehope Electronic Forehope Electronic

Chipmore Technology China Resources China Resources Microelectronics

China Wafer Level CSP Unimos Microelectronics Unimos Microelectronics

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 10

Estimated Packaging CapEx spending by top players [$M]

$1,000 *Samsung *Intel *TSMC

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 11

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 12

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 13

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 14

ASE Amkor Intel JCET TSMC Samsung

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 15

Status of the Advanced AMD Instinct MI210 GPU with

2.5D & 3D Packaging

AMD 3D V-Cache with TSMC

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 16

Processor Market Monitor NAND Market Monitor

Wafer Fab Equipment Market Semiconductor Equipment

Wafer Data Monitor

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 17

Consumer - Phone Consumer - Smart Home

Automotive - ADAS Automotive - Electrification

Automotive - Infotainment Automotive - Telematics

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 18

Public Relations & External Communications

Visit our website: www.yolegroup.com

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 19

• Photonics & Lighting

• Semiconductor Packaging • Radio Frequency

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 20

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 21

REPORTS, MONITORS FINANCIAL SERVICES

JAPAN, KOREA, REST OF ASIA

Advanced Packaging Market Monitor Q3 2023 | Product Brochure | www.yolegroup.com 22

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$1,000 Samsung Intel *TSMC