[ Roll No •

National Institute of Technology, ffamirpur (.7f0

Name of the Examination: B.Tech./B Arch./M.Tech./MSc./MBA
Branch : M Tech VLSI Design ist
Semester
Automation & Techniques
Title of the Course : VLSI Technology & Applications
Course Code : EC-602

Time: 3 Hours
Maximum Marks: 60
Note : Attempt all questions

I a) What is the need of Cleaning, explain the various steps involve in cleaning
process of Si wafer.

b) Explain the basic transport processes and reaction kinetics involved in Vapor
Phase Epitaxy.
[5,5]
II a) Explain briefly various Oxidation Techniques.

b) Describe Molecular Beam Epitaxy process with a schematic diagram and also
explain the essential requirements for high quality epitaxial films.
[5,5]

III a) Write Fick's 1D diffusion equation with explaining its significance.

b) Explain the process of X-ray lithography. What is the role of positive and
negative photo-resist in Photolithography process?
[4,6]

IV a) How reliability considerations are reshaping oxide scaling, device geometry in

process technology?
b) How the simulation models are classified? Explain modeling of isothermal

devices. [5,5]
V a) Describe the principle of Bolometer, its various components and applications.

b) briefly discuss basic principle of RF MEMs Switch. Explain advantages of

MEMS switches over pin diode and FET switches.
[5,5]

VI a) Which factors make packaging of RF MEMS more challenging than packaging of

IC circuits?
b) Write a note on MEMs based optical readable thermal imaging technology.
[5,5]