Philadelphia University Student Name:

Faculty of Engineering Student Number:

Second Exam, First Semester: 2011/2012

Mechatronics Department
Course Title: Reverse Engineering Date: 18/12/2011
Course No: 640397 Time: 1 Hour
Lecturer: Dr. Mohammed Bani Younis No. of pages: 3
Question 1: (6 marks)
Draw a diagram that shows the Mechanical RE phases of engineering products.

Question 2: (6 marks)
a) Mention the Characteristics of the material of the object needed to have good
photographic image. (2 marks)

- Color - Diffusivity of a particular color - Superficial finish

- Reflection - Refraction - Transparency
- Eventual pattern of covering of the object
Philadelphia University Student Name:
Faculty of Engineering Student Number:

b ) Draw descriptive figures and explain Laminated Object Manufacturing

RP technology. (3 marks)

c) Mention two techniques used for digitalization of the physical model. (1 mark)

Mechanical probe CCD Camera Laser

Question 3: (6 marks)
Explain the difference between circuit extraction and System Level Analysis
in electronics RE.
Circuit Extraction:
ƒ De-layer to transistor level, then extract interconnections and
components to create schematics
ƒ Full circuit extraction means taking note of all transistors, all
contacts/vias between levels, and all interconnects at each level, and
then condensing them to a schematic readable by a design engineer.
ƒ Not a quick or easy task, but sometimes necessary.

System Level Analysis:

ƒ Analyze operations, signal paths, and interconnections .
ƒ Can be very complex, depending on what degree of analysis is
required.
Philadelphia University Student Name:
Faculty of Engineering Student Number:

Question 4: (5 marks)
Explain the observation step in RE of a PCB.

ƒ Obtain at least two samples of the board

ƒ Evaluate existing data
ƒ The physical unit is visually inspected and discrepancies between the
available data and the actual PCB are noted.
ƒ Identify all components and obtain specifications for each.
ƒ Formulate a management plan including minimum requirements of an
acceptable Technical Data Package (TDP).
ƒ The objective of this stage is to complete the TDP, which will be sufficient
for fabrication and procurement of the PCB assembly.

Question 5: (7 marks)
Draw descriptive figures and explain AVMG.

Image Lighting
Acquisition System

Low Level
Image processing

High Level Optical

Character
Image Processing
Recognition

Information Classifier

Graph Generator

Translator to Links
information code

Integrated
Verilog HDL
Circuit
Code Generator
Database

Good luck