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Patrick Fay · Debdeep Jena · Paul Maki
Editors
High-
Frequency
GaN Electronic
Devices
High-Frequency GaN Electronic Devices
Patrick Fay • Debdeep Jena • Paul Maki
Editors
High-Frequency GaN
Electronic Devices
123
Editors
Patrick Fay Debdeep Jena
University of Notre Dame Cornell University
Notre Dame, IN, USA Ithaca, NY, USA
Paul Maki
Office of Naval Research
Arlington, VA, USA
This Springer imprint is published by the registered company Springer Nature Switzerland AG.
The registered company address is: Gewerbestrasse 11, 6330 Cham, Switzerland
Preface
GaN and related materials (AlGaN, InGaN) have established themselves as a key
material system for RF and microwave power electronics and are vying for the posi-
tion in low-frequency power electronics applications as well. Perhaps, surprisingly,
the material properties of the GaN material family are quite well-matched to the
needs of ultrahigh-frequency electronics as well, with high carrier mobilities in
polarization-induced 2D electron gases and comparatively high densities of states
that enable both large current density and aggressive device scaling for high-
frequency operation. However, scaling of conventional device architectures such
as the high electron mobility transistor widely used in GaN for RF and microwave
power applications is only one of the several possible routes to exceptional high-
frequency performance in III-N devices. By leveraging the unique properties of
the nitrides along with less conventional physical bases of operation, entirely new
classes of devices with significant potential for high-frequency performance are
possible. This volume brings together scientists and device engineers working
on both aggressively scaled conventional transistors and unconventional high-
frequency device concepts in the III-N material system. Device concepts for
mm-wave to THz operation based on deeply scaled HEMTs, as well as distributed
device designs based on plasma-wave propagation in polarization-induced 2DEG
channels, tunneling, and hot-carrier injection are discussed in detail. In addition,
advances in the underlying materials science that enable these demonstrations and
advancements in metrology that permit the accurate characterization and evaluation
of these emerging device concepts are also included. Targeting both academic and
industrial researchers looking to push the envelope in GaN-based electronics device
research, this book aims to provide readers with a current, comprehensive treatment
of device concepts and physical phenomenology suitable for applying GaN and
related materials to emerging ultrahigh-frequency applications.
v
Contents
vii
viii Contents
Epilogue . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 301
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 303
Chapter 1
Introduction and Overview
P. Fay ()
University of Notre Dame, Notre Dame, IN, USA
e-mail: pfay@nd.edu
D. Jena ()
Cornell University, Ithaca, NY, USA
e-mail: djena@cornell.edu
P. Maki
Office of Naval Research, Arlington, VA, USA
Robert L. Coffie
1 Introduction
Since the invention of the first transistor by Bell labs in 1947 [24], scientist and
engineers have pursued novel semiconductor materials for enhanced performance
for particular applications. For example, one of the initial motivations to pursue
the development of silicon transistors was the larger band gap of silicon compared
to germanium [22]. The larger band gap allows silicon transistors to operate at
higher temperatures than germanium transistors. Due to the large number of possible
semiconductor materials (>600 [22]) and limited resources, researchers began
trying to predict the potential improvement of a new semiconductor material system
for a specific application based on material properties alone. These predictions
are typically based on a single expression known as a figure of merit. Figures of
merit now exist for many applications [1, 2, 7, 10, 13, 14, 25, 34]. This chapter
will focus on Johnson’s figure of merit (JFoM) published by E. O. Johnson
in 1965 [10]. Johnson’s figure of merit is often used to predict the potential
power/frequency performance of a material system based solely on its material
properties. Care must be taken when predicting performance based on JFoM as
many parameters not considered by JFoM can significantly impact performance.
The additional considerations of doping, low field mobility, thermal constraints, and
heterojunctions will also be discussed.
R. L. Coffie ()
RLC Solutions, Plano, TX, USA
e-mail: rcoffie@rlcsolutions.com
In order to derive JFoM, a relationship between the transit time of mobile carriers
from the point of injection to point of collection and the maximum possible voltage
the region of transit can sustain must be established. All the nomenclature for JFoM
will be in terms of an n-channel field effect transistor (FET). Thus, the point of
injection is the source and the point of collection is the drain. The distance the
electron travels after it is injected is the drain-source length (Lds ). The time it takes
an electron to transverse this distance is
τ = Lds vavg (2.1)
where vavg is the average velocity of the electron as it travels across Lds . Transit
time τ is minimized when the electron travels at its saturation velocity (vs ) across
the entire drain-source distance giving
τmin = Lds vs (2.2)
In order for mobile charges to reach their saturation velocity, a sufficient electric
field must be present which is equivalent to assuming the depletion region in the
semiconductor extends from drain to source. The lack of a low electric field region
in the gate-source access region further implies that the gate is self-aligned with the
source. The drain-source length can then be approximated as
Lds = Lg + XD (2.3)
where Lg is the gate length and XD is the depletion extension past the gate towards
the drain. We can now re-write (2.2) as
τmin = Lg + XD vs (2.4)
Passivation
Source Drain
Gate
Channel
Buffer
Highly doped Substrate
Fig. 2.1 Schematic cross-section of a typical high frequency field effect transistor
where Ex is the electric field in the x-direction. For high power operation, a large
voltage swing is desired and Ex should be maximized. All semiconductors have
a maximum or critical electric field (Ec ) that can be sustained before breakdown
occurs. This leads to a maximum value for (2.6) of
Johnson’s figure of merit is defined as the product of the maximum transit frequency
and maximum voltage for a given drain-source distance
JFoM = fT Vdsmax = Ec vs (2π ) (2.8)
Several key items should be highlighted regarding JFoM. First, JFoM is only defined
in terms of material parameters. This was one of Johnson’s goals and the attractive
nature of JFoM for researchers searching for novel semiconductor materials for
high power high frequency operation. Second, real devices never reach the value
predicted by JFoM. This is due to the fact that mobile carriers do not travel at
their saturation velocity across the entire drain-source region and the electric field
along the channel is non-uniform (at best Ex reaches Ec for a very small portion
of the channel). Third, breakdown voltage and fT are inversely related to each
other. Therefore, high frequency devices have lower breakdown voltages compared
to devices designed for lower operating frequency. Last, JFoM completely ignores
the low electric field regions in the transistor where electrons do not travel at their
saturated velocity. These low field regions in real transistors may account for a large
portion of the performance of highly scaled devices and thus cannot be ignored [17].
Despite the limitations of JFoM, a comparison of different material systems for
high power high frequency applications is often performed using JFoM. Although
JFoM can be calculated using (2.8), JFoM of a material system is typically
normalized to JFoM of a material system that has a known power/frequency
performance. The normalized JFoM is then a measure of how much “better” the new
material system may be compared to the material system used for normalization. For
8 R. L. Coffie
example, Table 2.1 shows material parameters from several different semiconductor
material systems. Since GaN-based high electron mobility transistor (HEMT)
technology is now the semiconductor to displace for future high frequency high
power applications, we will use GaN’s JFoM for normalization. Figure 2.2 shows
the normalized JFoMs for the material systems in Table 2.1. Three important
observations should be made. First, JFoM for Si and GaAs are more than 10×
smaller than all of the wide band gap semiconductors JFoMs. Since GaAs was
the dominant material system for high power high frequency applications before
GaN, the development of GaN transistors promised a greater than 10× JFoM
improvement over GaAs. Second, Table 2.1 shows the reason for the greater
than 10× improvement in JFoM for wide band gap semiconductors over Si and
GaAs is due primarily to their high critical fields. Third, only AlN and diamond
from Table 2.1 have a larger JFoM than GaN and both have less than 3× JFoM
improvement compared to GaN. Thus, critical field engineering alone is running
out of room to increase power performance.
Fig. 2.2 Johnson’s figure of merit normalized to GaN for the materials listed in Table 2.1
The relationship between JFoM and output power can be obtained by determining
the maximum power possible at a specific frequency. Our first approach will
determine the maximum output power for a device with a given fT . We will
define this metric as the output power figure of merit 1 (Pout FoM1). To establish
the Pout FoM1, a large signal model for the transistor must be chosen. The ideal
linear device model shown in Fig. 2.3a will be used for this analysis. Although
more sophisticated models may be chosen [33], they complicate the analysis with
limited additional insight. The ideal linear model is assumed to have a maximum
current Imax , a knee voltage Vk , a voltage independent transconductance gm , and
breakdown voltage VBD as shown in Fig. 2.3b. The drain terminal of the transistor is
connected to the DC drain supply and load by an ideal bias-tee and the gate terminal
is connected to the DC gate supply and AC signal source by an ideal bias-tee as
well.
The gate voltage vGS [t] is given by the sum of the DC component and the AC
component
loadline
G + D
S
Drain Voltage
Fig. 2.3 (a) Circuit model for ideal linear device. (b) ID − VD family of curves for ideal linear
device. Diagonal line is the loadline for Class A bias and maximum output power
10 R. L. Coffie
Imax vDS Vk , vDS ≤ Vk
ID,max = (2.10)
Imax , vDS ≥ Vk
Within the Imax boundary, the drain current iDS [t] is related to the gate voltage as
gm vGS [t] − Vp , vGS − Vp > 0
iDS [t] = (2.11)
0, vGS − Vp < 0
where Vp is the pinch-off voltage. In order to fully define the boundary conditions
of the problem, the conduction angle, the type of load being used, and the amount of
compression need to be specified. The analysis can be performed for many different
bias conditions and compression levels [18], but we will choose an input power
just prior to any clipping of the drain current or voltage waveforms due to the IV
boundaries and Class A bias defined as a drain bias current of
IDD = gm VGG − Vp = ID,max 2 (2.12)
Output power at this input power level is often referred to as maximum linear output
power. Class A bias at maximum linear output power results in no harmonic content
in the drain voltage or current waveforms, greatly simplifying the analysis. The lack
of harmonic content results in a purely resistive load as the optimum load. Due to
the ideal bias-tee, the drain voltage vDS and load voltage vL are
vDS [t] = VDD + vL [t] , vL [t] = −gm vgs cos [ωt] RL (2.13)
In general, a parametric plot of iDS [t] vs. vDS [t] over one period is called a loadline
plot. For a resistive load, a parametric plot is not needed since iDS can be written in
terms of vDS as
We still need to determine the load resistor that maximizes the power delivered to
the load. For Class A bias and a resistive load, the loadline will pass through the bias
point. Assuming the loadline intersects the Imax boundary at point (V1 , ID,max ), the
load resistance and gm vgs can be written as
2 High Power High Frequency Transistors: A Material’s Perspective 11
RL = (VDD − V1 ) ID,max − IDD = 2 (VDD − V1 ) ID,max
(2.16)
gm vgs = ID,max /2
By setting ∂Pload ∂V1 = 0, it can be shown that V1 = Vk is the required condition
to maximize the linear output power when VDD > 2Vk . Since we are trying to
maximize output power, we will assume that VDD > 2Vk . At a given bias voltage
VDD , the optimum loadline and maximum linear power are
Ropt = 2 (VDD − Vk ) Imax , Pout,lin = Imax (VDD − Vk ) 4 (2.18)
From (2.18), larger drain bias results in more output power, but the breakdown
voltage will limit the maximum possible drain bias. From (2.13), the peak drain
voltage during the AC period is
From the constraints imposed by (2.19), the bias voltage and load for maximum
output power are
VDD = (VBD + Vk ) 2, RL = (VBD − Vk ) Imax (2.20)
The loadline for maximum output power swings the drain current from zero to Imax
and the drain voltage from VBD to Vk . The maximum output power produced is
where qns is the mobile sheet charge density under the gate traveling at saturation
velocity and Wg is the total gate width of the FET. Increasing the charge in the
channel increases Imax , but lowers breakdown voltage. Therefore, there must be an
optimum channel charge that maximizes output power. If we assume that VBD
Vk , then maximum output power is obtained by maximizing Imax VBD . To determine
the optimum channel charge, we take into account 2D effects in top gated HEMTs.
12 R. L. Coffie
Using the coordinate system of Fig. 2.1, a better approximation for the constraint on
the electric field is
In order to pinch off the channel, the minimum electric field in the y-direction is
Ey ≈ σ s (2.24)
where σ is the fixed sheet charge density under the gate at pinch-off and s is
the permittivity of the semiconductor layer. We will assume qns in (2.22) and σ
in (2.24) are equal. Similar to Johnson, we will also assume
VBD ≈ Lg + XD Ex (2.25)
s Ec2 vs2 Wg Vk π s Wg Vk
Pmax,lin = 1− = J F oM 2 1− (2.29)
32π fT VBD 8fT VBD
The expression given in (2.29) is Pout FoM1. The maximum linear power is
proportional to Johnson’s figure of merit squared and inversely proportional to
fT . Thus, a material system that predicts 10× improvement in JFoM compared
to a known material system is expected to have about 100× the power density.
Also, JFoM requires lower breakdown voltage for higher fT . As a result, devices
designed for high frequency operation will have lower power density than devices
designed to operate at lower frequencies. Figure 2.4 shows a comparison of (2.29)
with Vk = 0 normalized to GaN for the material systems listed in Table 2.1. For the
same fT , Fig. 2.4 predicts over 100× more power from GaN compared to GaAs.
Experimentally, GaN-based HEMTs have demonstrated 40 W/mm at S-band [37],
but this is only a little over 10× the power demonstrated by a GaAs-based HEMT [5]
2 High Power High Frequency Transistors: A Material’s Perspective 13
Normalized PoutFoM1
AlN
Diamond
GaN -Ga2O3
Si GaAs 4H-SiC
Fig. 2.4 Power density for a specific fT normalized to GaN for the materials listed in Table 2.1
at S-band. Thus even normalized theoretical predictions can fall well short of what
can be realized experimentally. Additionally, only AlN and diamond predict any
significant improvement (∼5×) in output power compared to GaN. Despite this
prediction, to date the highest power density report from diamond at a frequency of
at least 1 GHz is only 2.1 W/mm [12]. Thus Johnson’s figure of merit and the output
power figure of merit are only guides. Other factors must be taken into account.
The loadline approach for predicting output power used in Sect. 3 assumes the
device has power gain at the frequency of interest. In this section, we determine
the maximum output power for a device with a given power gain. We will define
this metric as Pout FoM2. Re-writing (2.21) in terms of power gain allows the
relationship between frequency and output power to be determined.
Operating power gain (GP ) is the ratio of the average output power to the average
input power
2 |i2 | Re [1/yL ]
1 2
Pout
GP = = (2.30)
2 |i1 | Re [1/yin ]
Pin 1 2
where yL = 1/ZL is the load admittance and yin = 1/Zin is the input admittance of
the transistor. Our initial large signal model has infinite power gain since Re [Zin ] =
0. In order to make the model more realistic, additional components are added to the
model as shown in Fig. 2.5. The additional components model the gate resistance as
Rg , the capacitive coupling between the gate and channel as Cgs , the resistance of
the undepleted portion of the channel under the gate as Ri , the resistance of the
source access region and source ohmic contact as Rs , and the inductance associated
14 R. L. Coffie
with the source as Ls . The addition of these components to the model does not
change the output power calculation results from Sect. 3 and leads to a finite power
gain.
To keep the analysis general, we will first calculate power gain in terms of a
generic two-port model described by its y-parameters. Mathematically a two-port
network in terms of y-parameters is
i1 y11 y12 v1
= (2.31)
i2 y21 y22 v2
i2 = −yL v2 (2.32)
allowing the relationship between the input and output voltages to be written as
−y21
v2 = v1 (2.33)
y22 + yL
Substituting (2.33) into first equation of (2.31) gives the input admittance
i1 y12 y21
yin = = y11 − (2.34)
v1 y22 + yL
The current gain is obtained by taking the ratios of the two equations in (2.31) as
2 High Power High Frequency Transistors: A Material’s Perspective 15
i2 yL v2 y21 yL
=− = (2.35)
i1 yin v1 yin y22 + yL
Current
gain
can
be re-written in terms of the short-circuit current gain
h21 = y21 y11 as
i2 h21
= (2.36)
i1 1 + y (y11 yL )
where y = y11 y22 − y12 y21 . Note that (2.36) clearly shows that current gain
and short-circuit current gain of a two-port network are equal only when y = 0.
Inserting (2.34) and (2.36) into (2.30) gives
|h21 |2 Re 1 yL
GP = 2 (2.37)
1 + y (y11 yL ) Re 1 yin
2
fT RL
GP = (2.39)
f Rg + Ri + Rs + gm Ls Cgs
2 2
fT (VBD − Vk )2 J F oM 2 Vk 1
Pmax,lin = = 1− (2.41)
f 8GP Re 1 yin 16f 2 GP VBD Re 1 yin
AlN
GaN -Ga2O3
Si GaAs 4H-SiC
Fig. 2.7 Normalized comparison of the output power predicted by (2.41). All materials are
normalized to GaN
Figs. 2.4, 2.5, 2.6, 2.7, we see that the predicted normalized output power is higher
from (2.41) compared to (2.29). The reason for this difference is that Fig. 2.4 is the
comparison of output power at a fixed fT . Figure 2.7 is the comparison of output
power for a fixed power gain. Since the optimum load resistance is proportional to
1/Imax , it is proportional to 1/s . This results in different materials having different
optimum loads and therefore different fT ’s in order to achieve the same power gain.
In general, (2.41) is the more relevant output power expression since power gain is
the parameter that matters for power amplifiers, not fT . Alternatively, we can write
power gain in terms of output power as
2
J F oM 2 Vk 1
GP = 2
1− (2.42)
16f Pmax,lin VBD Re 1 yin
If we assume two materials have Vk = 0 and the same Re [1/yin ], then (2.42) states
that the material with a higher JFoM will have a higher power gain for the same
output power.
It is also instructive to plot the expected output power density as a function of
frequency predicted by (2.41). Assuming Re [1/yin ] = 1 -mm and Gp = 10
dB, a plot of the expected maximum linear output power from (2.41) as a function
of frequency for the different material systems in Table 2.1 is shown in Fig. 2.8.
The power densities predicted by (2.41) are much higher than the power densities
demonstrated experimentally (see Fig. 2.10). There are many reasons for the over
estimation of the output power density. One of the primary reasons is due to an over
estimation of the breakdown voltage.
2 High Power High Frequency Transistors: A Material’s Perspective 17
4H-SiC
AlN
GaN
-Ga2O3
GaAs
Si
Frequency (GHz)
Fig. 2.8 Power density as a function of frequency for the materials listed in Table 2.1. Power gain
and Re [Zin ] are assumed to be 10 dB and 1 -mm, respectively
The breakdown voltage is overestimated due to the fact that Ex is not constant
over the distance Lg +XD . A plot of a typical Ex profile along the channel compared
to the approximation Ex = Ec is shown in Fig. 2.9. The area under the curve is Vds .
To account for the nonlinear nature of the true Ex profile, we define a filling factor
α as
Lg +XD
Ex,true dx Ex,true,avg
α= 0
Lg +XD =− (2.43)
Ec dx Ec
0
Typical values for α are 0.2 to 0.35. Maximum linear output power is now expressed
as
18 R. L. Coffie
Frequency (GHz)
Fig. 2.10 Power density predicted by (2.45) for GaN along with the experimentally achieved
power densities from AlGaN/GaN HEMTs. Power gain and Re [Zin ] are assumed to be 10 dB
and 1 -mm, respectively, for lines calculated using (2.45)
2 2
JFoM Vk α2
Pmax,lin = 1− (2.45)
f VBD 8GP Re [Zin ]
A large assumption up to this point is that a controlled amount of free carriers can be
engineered into the semiconductor. The most common approach to engineering the
number of free carriers is called doping. The doping process consists of introducing
a different atom into the crystal that produces an energy level within the band gap
that can then be used to either excite an electron from this energy level into the
conduction band (donor dopant) or excite an electron from the valence band into
this energy level (acceptor dopant). The difference between the conduction band
minimum energy (EC ) and donor energy level (Ed ) is the donor binding energy
(or ionization energy) Ed = EC − Ed . The difference between the acceptor
energy level (Ea ) and valence band maximum energy (EV ) is the acceptor binding
energy (or ionization energy) Ea = Ea − EV . In order for a dopant to be useful
for producing free carriers, it should be capable of producing at least 1017 cm−3
carriers at the temperature of interest. We will call such dopants shallow dopants.
For our analysis, room temperature (300 K) is the temperature of interest. Assuming
Boltzmann statistics, the free electron concentration (n) and hole concentration (p)
are
EF − EC EV − EF
n = NC exp , p = NV exp (2.46)
kT kT
where m∗e and m∗h are the density of states effectives mass of electrons and holes,
respectively, and gC and gV are the degeneracy factors of the conduction and
valence bands. Table 2.2 lists the density of states effective mass, the degeneracy
factor, and effective density of states for both the conduction and valence bands for
the semiconductors in Table 2.1. The values for the valence band of β-Ga2 O3 are
still unclear and therefore, have been left empty.
Ideally, both shallow acceptors and donors would exist for the semiconductor of
interest as is the case for Si and GaAs. Unfortunately, wide band gap semiconductors
typically only have either one type (donor or acceptor) of shallow dopant or no
shallow dopants at all. Table 2.3 lists common dopants for the different material
systems from Table 2.1 along with their ionization energies. Also listed in Table 2.3
are the parameters φd and φa which are key to determining if a dopant is shallow. To
define φd , we consider a semiconductor that is doped with Nd donors and the band
gap is sufficiently large that there are a negligible number of electrons excited from
20 R. L. Coffie
the valence band to the conduction band at room temperature. Thus the electrons in
the conduction band only come from donors. The relationship between free carriers
n and Nd is
n = Nd+ = Nd − Nd
(0)
(2.48)
where Nd+ is the density of ionized donors and Nd is the density of neutral donors.
(0)
Nd
Nd+ = (2.49)
1 + g exp (EF − Ed ) (kT )
where g is degeneracy factor of the donor. Solving for EF in (2.46) and inserting
the expression into (2.49) gives
Nd
Nd+ = + (2.50)
1 + gNd NC exp Ed (kT )
We can now solve for the fraction of ionized donors (Nd+ /Nd ) in (2.50) as
2 High Power High Frequency Transistors: A Material’s Perspective 21
Nd+
φd
= −1 + 1 + 4Nd φd (2.51)
Nd 2Nd
where
NC Ed
φd = exp − (2.52)
g kT
Note that gφd is equal to the electron concentration when the Fermi level is
coincident with the donor energy level. Similar analysis for a semiconductor that
is doped with Na acceptors gives
Na− φa
= −1 + 1 + 4Na φa (2.53)
Na 2Na
NV Ea
φa = exp − (2.54)
g kT
surface. Unfortunately, the mobility of the holes in the surface channel is extremely
poor (∼100 cm2 /Vs) for hole charge densities greater than 1013 cm−2 [3, 6]. In
contrast, the ionized carriers from the surface states reside in the GaN channel for
AlGaN/GaN HEMTs. This results in large free carrier sheet charges (∼1013 cm−2 )
while maintaining good transport properties (room temperature electron mobility
>1500 cm2 /Vs and saturation velocity 2 × 107 cm/s). Simultaneously achieving
sufficient carriers and good transport properties still remains a significant challenge
for diamond electronics. Unless this problem can be solved, diamond transistors
with superior performance to AlGaN/GaN transistors will not be realized.
Although Johnson only considered carriers traveling at their saturation velocity, the
voltage drops across the access regions where mobile carriers do not travel at their
saturation velocity can impact performance. A key material property that determines
the resistance of the access regions is called the low field mobility. For our analysis,
we will consider two ways the resistance (and therefore the low field mobility) of
2
the access regions can impact performance. First is through the 1 − Vk VBD
term in (2.45). An approximation for the knee voltage is
Lg + XD 1 Lg + XD
Ron = Rsh = (2.56)
Wg qns μ Wg
2 High Power High Frequency Transistors: A Material’s Perspective 23
and μ is the low field mobility. Substituting (2.22), (2.44), and (2.56) into (2.55)
gives
Vk = vs Lg + XD μ (2.57)
resulting in
Vk vs
= (2.58)
VBD μαEc
“OH no,” the specialist said, “I don’t see what purpose it would serve,
your telling his wife exactly what happened. I prefer, indeed, that you
should not. No doubt it was the shock of hearing the voice on the
telephone that actually induced the state of mind. But to know the
fact doesn’t help us—it doesn’t help us towards the cure. All we can
do is to wait. His chance is that he’s not such a very young man. If it
had happened ten years ago there wouldn’t have been any chance
for him at all; but the brain-fibre—what the Germans call the Hirnstoff
—is tougher now. Anyhow, we can’t say.”
Sir William Wells, an unreasonably lugubrious man of fifty,
having in his eyes the look of a man doomed beyond hope, with
ruffled grey hair, an untidy grey beard, very dark eyebrows, a whitish
complexion, in which tints of blue predominated, except that on his
cheek-bones were patches of red so bright that he had the
appearance of having rouged—with an air, in fact, of having had all
his hair ruffled up the wrong way, and of remaining still a personage
of importance—Sir William Wells repeated:
“All we can do is to wait.”
“Don’t you think,” Robert Grimshaw said—they were in the great
man’s first-class consulting-room—a tall place, very gay, with white
walls, bright plaster-worked ceiling, chairs with seats and backs of
scarlet leather, and numerous cabinets inlaid with green and yellow
wood, very shiny and new, and yet conveying a sinister suspicion
that they contained not rose-leaves, silks, or bibelots, but
instruments, diagrams, and disinfectants—“don’t you think,” Robert
Grimshaw said, “that, since his mania, if it is a mania, is so much
along the lines of his ordinary character, that is an indication that his
particular state is not so very serious?”
“My dear sir,” the specialist answered, “what we’ve got to do is
to establish whether there is or isn’t a lesion in the brain. His
character’s nothing to do with it.”
“Of course we’re in your hands,” Grimshaw answered, “but I
should have thought that a man who’s been abnormal all his life ...”
“My dear sir,” Sir William repeated, shaking his glasses as if
minatorily at Grimshaw’s nose, “have you any profession? I suppose
not. But if you had a profession you would know how utterly
impossible the suggestions of laymen are to the professional. People
come to me for this sort of thing because I have had thousands—
literally, thousands—of similar cases. It’s no good my considering
individual eccentricities; my business is to put my finger on the spot.”
“Then, what do you propose to do?” Grimshaw said.
“Nothing,” the specialist answered. “For the present, absolutely
nothing.”
“But don’t you think a change ...” Grimshaw suggested.
Having entirely redecorated his house from top to bottom in
order to indicate that he was more prosperous than Dr. Gegg of No.
161, Sir William, who was heavily indebted to Jews, was upon the
turning-point between bankruptcy and possible salvation.
“No,” he said determinedly, so that he seemed to bay like a dog
from his chest, “certainly not. If I am to cure him, I must have him
under my own close personal attention. There’s nothing to be done
but to wait.”
He rose upon the points of his toes, and then brought his heels
sharply down upon the floor.
“You understand, we know nothing yet. Your friend doesn’t
speak a word. He’s no doubt aware that he’s watched. He has a
companion whom I have personally instructed, and who will report to
me. Get him to take as much exercise as he can. Keep him fairly
quiet, but have him in the room when cheerful people are about. I will
drop in at every moment of the day that I can spare.”
He paused to glare at Robert Grimshaw.
“I’m a very busy man, but I’ll pay special attention to your
friend’s case. I will try to be always in and out of Mr. Leicester’s
house. More I can’t do.”
Backed up as he was by Katya Lascarides’ suggestion that Sir
William was a good man, Grimshaw felt an intense satisfaction—
even a gratitude—to Sir William; and whilst he slipped his five-pound
note carefully wrapped round five shillings under the specialist’s
paper-weight, which was made of one huge aqua-marine, he uttered
a formal speech of thanks.
“Mind,” Sir William shouted at him as he reached the door, “I
don’t promise you a cure. I’m not one of those quacks. But you know
my position, and you know my reputation. I work from ascertained
facts, not from theories. If it were possible to communicate with your
friend—if he’d speak, or if it were possible to manipulate him—we
might get at something. If, for instance, we could get him to stand
with his heels together, his hands at his sides, and his eyes shut; but
we can’t get him to speak, and he doesn’t listen when he’s spoken
to. There’s nothing to do but wait until he does.”
II
BETWEEN his feet Peter’s nostrils jerked twice, and a little bubble of
sound escaped. He was trying to tell his master that a bad man was
coming up the stairs. It was, however, only Sir William Wells who,
with his brisk straightforwardness and his frowning authority, seemed
to push himself into the room as its master, and to scatter the tables
and chairs before him. In his harsh and minatory tones he informed
them that the Marchioness of Sandgate had gone to Exeter with Mrs.
Jjohns, and then he appeared to scatter the little group. It was,
indeed, as if he had thrown Ellida out of the room, so quickly—whilst
she exclaimed over her shoulder to Grimshaw: “Well, you’ll be round
to dinner?”—did she disappear.
With his rasping voice, shaking his glasses at her, Sir William
continued for some minutes to inform Pauline of the movements of
those of his patients who were of political prominence. They were his
patients of that class uneasily dispersing over the face of the country,
opening bazaars, bowling the first balls of cricket-seasons, devising
acts of graciousness all night, putting them into practice all day, and
perpetually shaking hands that soiled their delicate gloves. For that
particular world was full of the whispered words “General Election.”
When it was coming no one seemed to know, for the Prime Minister
with his amiable inscrutability very reasonably distrusted the great
majority of his followers. This disconcerted innumerable hostesses,
for no one knew when they wouldn’t have to pack up bag and
baggage and bolt like so many rabbits back to their burrows. This
febrile condition gave occupation of a secretarial kind to great
numbers of sleek and smooth-haired young gentlemen, but it was
very hard upon the London tradesman.
It was, Robert Grimshaw was thinking, very hard upon Pauline,
too. He couldn’t be absolutely certain what she meant to do in case
the General Election came before Dudley could make some sort of
appearance in the neighbourhood of Cove Park. In the conversations
that he had had with her they had taken it for tacitly understood that
he was to be well—or at least that he was to be well enough for
Pauline to run him herself.
But supposing it was to be a matter of some years, or even of
some months? What was Pauline thinking of when she thought of
the General Election that hung over them? Mustn’t it add to her
suspense? And he wondered what she meant to do. Would she
simply stick Leicester in bed and give it out that he had a temporary
illness, and run the election off her own bat? She had already run
Leicester down in their car all over the country roads, going dead
slow and smiling at the cottagers. And there wasn’t much chance of
the other side putting up a candidate....
Between his feet Peter was uttering little bubbles of
dissatisfaction whenever Sir William spoke, as if his harsh voice
caused the small dog the most acute nervous tension. Grimshaw
whistled in a whisper to keep the animal quiet. “All these details,”
Grimshaw thought, Pauline had all these details to attend to, an
incessant vigilance, a fierce determination to keep her end up, and to
do it in silence and loneliness. He imagined her to be quivering with
anxiety, to be filled with fear. He knew her to be all this. But Sir
William, having ceased to impart his social information, turned his
brows upon his patient, and Pauline came from the back room to sit
down opposite him by the fireplace. And all she had to say was:
“These coals really are very poor!”
III