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Resume - Class Practice
Resume - Class Practice
Company Description
DeepSight Technology Inc. is a stealth mode startup company that has developed breakthrough technology in ultrasound imaging.
This new technology will both extend the range and clarity over current systems by 10x - 100x! We are setting new standards that
will dramatically improve the capabilities of ultrasound for many years. In order to develop and improve this technology, we need
dedicated team players on our side. Not only do we offer a great team-oriented environment, but we also offer a competitive
salary of $60,000-$166,000 a year, based on skills, experience, and office location. This position also earns generous benefits in
both our St. Louis, MO and Santa Clara, CA offices.
Job Description
In this role, as a member of a multi-disciplinary product development team, you will own the packaging development from concept
to production for state-of-the-art photonic integrated circuits (PICs). You will be also involved in integrating photonics components
with other modules in the system. This position will be looking for someone who can design, develop, and validate a low-cost, high
performance and reliable packaging platform for photonics components and system integration.
Responsibilities include:
Conceive novel concepts for low-cost fiber packaging through optical/mechanical design and modeling of photonic chip
coupling interfaces.
Simulate the performance of optical assemblies, with a mind towards the interface between PICs and package, as well as
manufacturing tolerances.
Characterize and qualify the developed packaging solution (optical/mechanical/reliability) with device and systems
engineers.
Work with contract manufacturers to define design rules for manufacturing.
Document and report to internal members and communicate with external vendors and partners.
Qualifications
You should have the following skills/qualities/experiences:
BS or above a relevant technical field (Optics, Mechanical, Electrical, Materials Science, Applied Physics, or similar)
5+ years of hands-on experience in packaging fiber-coupled devices and photonics integrated circuits chips.
Experience designing for manufacturability and automated assembly and characterization.
Knowledge of fiber-optical systems and optical polymers
Experience with 3D printing and/or CNC machining is preferred.
Ability to read and interpret engineering specifications, drawings, manufacturing instructions, and technical analyses.
Industry experience creating detailed design documentation (specifications, design descriptions, verification, and testing
plans).
1. DEGREE: The level of formal education and field of study required for the role.
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2. KNOWLEDGE: The specific areas of expertise, subject matter expertise, or domain knowledge required.
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3. TECHNICAL SKILLS: The skills needed to perform job responsibilities using tools, technologies, methods, or
procedures.
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5. PERSONAL QUALITIES: Traits like leadership, communication style, problem-solving approach, work ethic,
etc.
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6. TRANSFERABLE SKILLS: Skills that can apply across roles or industries, e.g. communication, collaboration,
critical thinking, etc.
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8. WHAT ELSE ARE THEY LOOKING FOR: Any additional unspecified skills, experiences, attributes, or
competencies implied to be important for the role.
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Now based on the information above, write either a chronological or a functional resume on the activity sheet.