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Suppression of Hydrogen Blistering
Suppression of Hydrogen Blistering
Extreme ultraviolet
Taken from Van den Bos et al., Journal lithography (EUVL)
of Physics D: Applied Physics, 2017
Blistering in EUVL
Taken from Van den Bos et al., Journal of Applied Physics, 2016
low Ar pressure
So why the difference?
• Both sample types deposited under same conditions, with same thicknesses
• Only difference was the Argon sputter gas pressure during Si deposition: 1∙10-3 – 3∙10-2 mbar
high Ar pressure
Hydrogen exposure: Structure Changes
Method: X-ray reflectivity High-P – As Dep Low-P – As Dep
High-P – H Exposed Low-P – H Exposed
Mo Mo
θ θ
High-P Low-P
Si, upper
Exposed Si, upper
Si, lower
• High-P scattering length density (SLD) profile barely changes upon hydrogen exposure compared to the
Low-P case
𝑞𝑧 = 2𝑘 𝑠𝑖𝑛(𝜃) • Low-P shows two interesting trends due to exposure:
1. The total layer expands considerably (‘swelling’), most notably the silicon.
2. The SLD profile has a drop towards zero density between the silicon and molybdenum, which is the blister
interface
Hydrogen exposure: Hydrogen Content
Method: Elastic Recoil Detection Sample H (1015 at/cm2)
Low-P – As Dep
Low-P As Dep 3±2 High-P – As Dep
Low-P – H Exposed
High-P As Dep 4±2 High-P – H Exposed
60%
• Both samples show increased H content upon exposure, even though
time after exposure is significant (>1 month)
• H increase is remarkably less for the High-P case (60%) than the Low-P
case (400%)
Possible hypotheses
• Leaky Si layer: High Ar pressure lowers a-Si density, making the Si permeable for H and H2
• Lower stress: Reduced build-up of in-plane stress during exposure increases the energy
required for blister formation
Testing “Leaky Layers” hypothesis
• If high-P Si is ‘leaky’ for hydrogen, then any low-P
Si layer should be enough to block hydrogen from
escaping
Lower stress:
Reduced build-up of in-plane stress during exposure increases the energy
required for blister formation
Stress hypothesis: outline
1. Depositing at higher Argon pressures
lowers the material density
2. Incorporation of hydrogen atoms
leads to high compressive stress, at
least for low-P deposited films
3. The high compressive stress makes it
energetically favourable for blister
formation to occur (relaxation)
Image Size:
1 x 1 µm2
Acknowledgments
Prof. Dr. Joost Frenken Dr. ir Jan Verhoeven Arend-Jan van Calcar Dr. Georgios Dr. Cristiane Vilas Dr. Roland Bliem Alessandro Troglia Stefan van Vliet
Kanoutas Boas
Prof dr. Fred Bijkerk Dr. Ir. Robert van der Kruijs Dr. Beata Tyburska-Pueschel Dr. Wim Arnold Bik Dr. Giuseppe Portale