Calce SARA

CALCE Simulation Assisted Reliability
Assessment (SARATM) Software
Michael Osterman
CALCE Electronic Products and Systems Center
University of Maryland
College Park, Maryland 20742
http://www.calce.umd.edu/software/
Center of Advanced Life Cycle Engineering 1 University of Maryland
http://www.calce.umd.edu Copyright © 2018 CALCE
CALCE Simulation Assisted Reliability
Assessment (SARA®) Software
http://www.calce.umd.edu/software
calceEP
calcePWA Device andPackage
Circuit Card Assemblies Failure Analysis
Thermal Analysis
Vibrational Analysis
Shock Analysis
Failure Analysis
Conductor II
Whisker
Spacing (ls)
calceFAST
Conductor I
Failure Assessment
calceTinWhisker FailureRiskCalculator Software Toolkit

Simulation Assisted Reliability Assessment
Virtual Qualification
Design Capture Failure Risk Life-Cycle Loads
Identification
Load
Transformation
Failure
Quantification
Ranking of Potential Failure

Sites and Mechanisms
2 3
Load
1
Field
Time to Failure
Physical Verification: Test Setup, Specimen Characterization, Accelerated Stress Test

Uses of Virtual Qualification
• Life assessment under anticipated loading conditions

• Design trade-offs
• Accelerated test planning
• Interpretation of accelerated test results with respect
to field life
• Remaining life assessment
• Prognostics development

CalcePWA Software Assessment (Military Radio)
Analysis Results:
Objectives: • 20 pin Leadless Chip Carrier (LCC) was weak in design
• Estimated life under operating conditions - 6.5 years
• Assess reliability of Control
Module in the military environment
• Improve reliability of Control
Aluminum Backplane
Module
Board 1
Frame
Testing Results: Board 2
117
Board 3
121 Aluminum Backplane
123
Model Prediction
20 Year Life
124
125
131
Developed Log Case Study
132 for Potential Improvements
151 • Module Level - 5,000 units
202
fielded - 20 years field life
206
0 500 1000 1500 2000
Testing of CCAs demonstrated failures
LCC Failure Model prediction predicted by CalcePWA Analysis. Redesign
Module Timeline 20 Year life
of module results in an estimated savings of
$27 mil in avoided cost.
Successful Application of calceSARA
Design-Build-Test-Fix vs. Simulation Assisted Design
Pontiac Pontiac
Grand Am Aztek
(Development Period - 130 Wks) (Development Period - 109 Wks)

Program Comparison: Moderate More Complex
E/E Technology: Proven Tech/Compts - No Electromech. Proven Tech/Compts+4 Onboard Relays
Functional/Software Complexity: Moderate More Functions, More Complex
Power/Internal Heat: Low Power/Heat High Power & Thermal Challenges
Packaging: I.P. Mounted Snap Fit, 1 conn. Console Mnt., Integt’d w/Fuse (NEW)
Supplier: Supplier A - Highly Capable Supplier A - Highly Capable
Results: Completed 1/98 Completed 8/99

# of Total Test Issues Identified:: 16 6
• Product development using simulations produced a more robust design, faster

• First pass issue reductions: 100% E/E circuits, 83% permanent failures, 75% EMI, 63% total
• The more complex module using the simulated assisted design achieved higher quality durability and
reliability by beta version in a faster period.
Applications of CALCE Software
Comanche Seagate
• Commonality w/ AF F-22 •Virtual Qualification
• Commercial ICs Inserted
• $50M O&S savings Emerson
•Virtual Qualification of CCA
•Failure assessment of a individual component.
JSTARS Ground Station
• PoF Analysis on circuit cards VISTA Controls CPU Card
Mezzanine Card
• Recommended commercial Conducted virtual Assembly
processor circuit card qualification of military
• $12M Savings CCA
Mars Path Finder
AAAV Verified robustness of flight
Virtual Qualification CCA
of circuit cards
Bradley Fire Support Vehicle
GM • Identified potential problems
83% reduction in design • Increased Reliability
issues Honeywell
>10% reduction in time to Virtual qualification of engine
markert controller
Life Cycle PoF Analysis Provides Considerable ROI
System Requirements for CALCE SARA®
Software
• Platforms
– x86-32, x86-64 Hardware
• Windows 10, Window 8, or Windows 7
• Disk Space and Memory
• 233 MB recommended
• 2 GB recommended
Testing and development is conducted primarily on a system with a

2.3 GHz i5-5300U, 8 GB, Windows 7
CALCE Software Web Site
CalceSARA can be downloaded from the CALCE Web Site. The

web site provides software, user’s manuals, installation instructions,
past workshop materials, and other software documentation.
Software is updated approximately every four months.
https://calce.umd.edu/calce-sara-software

Installation of calceSARA Release 8.0
The installation of calceSARA 8.0 is facilitated by installation software that takes

you step-by-step through the software installation procedure.

Starting calceSARA 8.0
The calceSARA applications are launched like any other Windows

application, by selecting the desired application from the list of
available tools under calceSARA folder.
CalcePWA, calceFAST, calceEP, and calceWhiskerRiskCalculator,

the CALCE Software Update application, and the user
documentation can all be launch from the Start Menu.
CalceTCExtractor
The TC Extractor is used to

cover temperature time
history into discrete half
temperature cycles and
reduced half cycles.

TC Extracted Data Uses
Temperature cycles extracted using the calceTCExtractor can be used

in calcePWA, calceFAST, and calceEP.

PWA Failure Assessment Software
calcePWA 8.0
Interface to CAD
Assessment Management Design Capture
Life Cycle
Characterization
Life Expectancy and
Stress Assessment Failure Assessment
calcePWA VQ Inputs
Product Construction Information
• Bill of Materials (BOM) – Parts list with manufacturer and manufacture part
number sufficient to obtain mechanical package information for the assembly
under review.
• Part layout (x,y, orientation) on the printed wiring assembly may be imported
from a CAD intermediate file for the assembly under review.
• Board thickness and material lay-up
• Solder stencil thickness and solder material
• Mechanical support positions on the printed wiring board
Operational and Usage Information

• Operating power of parts within the assembly.
• Expected thermal management of the printed wiring assembly.
• Life expectancy of the assembly under review
• Expected operational temperature cycling
– Maximum temperature
– Minimum temperature
• Expected vibration loading
– Defined PSD normal to the surface of the printed wiring board
• Operation voltage levels of electrolytic capacitors

CALCE VQ Outputs
• Steady State Board and Component Temperatures
• Mode Shapes, Natural Frequencies, Displacement
Response to Random Vibration and Shock Loading
• Time to Failure of
– Package to board interconnects due to temperature cycle and
vibration loading
– PTH under temperature cycle loading
– Electrolytic Capacitors under steady voltage and temperature
operation (calceFAST)
• Probability of failure of
– Package to board interconnects due to shock loading
– MLCC under mechanical bending (calceFAST)
• Acceleration Factors between specified test and life
conditions.
• Equivalent Life Time for a specified test.

Managing the CCA Virtual Qualification Process
Project Selection
Bar
Modeling CCA Selection Tab
Stress
Assessment
Reliability Thumbnail images

Assessment of CCA
Status of the
calcePWA
evaluation process
can be quickly
viewed in this panel.

calcePWA Libraries
To promote reuse of data, the calcePWA software has the

following database libraries. Libraries can be build either top
down and bottom up.
Printed Wiring Assembly Design Manager
The PWA design manager provides the ability to define and/or modify
the PWA model. Model items include board outline, material inserts,
layer stack-up, vias, component, part, and materials.
Supported CAD Text File Imports
Import currently available for

• ODB++
• P-CAD
• Veribest
• GENCAD 1.4
• Mentor Neutral File
• Cadance IDF file
• PADS 1.0, 3.5, 4.0 text files
• Zuken-Recal (CADIF) text files
Import typically provides board outline, part list,

component list, and component positions referenced to
the board outline. The import procedure was developed
by extracting data from example text files.
Thermal Assessment
Boundary
Condition
Unassigned Selection
Grid Locations Palette
Boundary are calculated
conditions are
applied
to each layer
Flood Fill Toggle

Button allows for
rapid assignment
of boundary
conditions at the
edge of the board
Cooling Modes modeled in calcePWA
Cooling Mode Description
Conduction Internal conduction only
Conduct_VC Internal conduction, natural convection with assumed vertical orientation.
Conduct_VC_Rad Internal conduction, natural convection with assumed vertical orientation

with surface radiation.
Flowover Internal conduction, surface convection based on defined air flow.
Conduct_HC Internal conduction, natural convection with assumed horizontal

orientation, venting of air assumed.
Conduct_HCNV Internal conduction, natural convection with assumed horizontal

orientation, no venting of air assumed.
Conduct_Rad Internal conduction, surface radiation to enclosure.
Conduct_HC_Rad Internal conduction, surface radiation to enclosure, natural convection with

assumed horizontal orientation, venting of air assumed.
Conduct_HCNV_Rad Internal conduction, surface radiation to enclosure, natural convection with
assumed horizontal orientation, no venting of air assumed.
ColdPlate Fin Structure Required. Internal conduction. Internal convection to
Air in defined fin structure.
Coldplate_with_NC Fin Structure Required. Internal conduction. Internal convection to
Air in defined fin structure. Natural convection with assumed vertical
orientation.
( * Natural Convection is assumed to occur in the y direction (bottom to top as board appears on the screen)
Display of Thermal Analysis Results
CalcePWA
Thermal
Display Tool
presents the
results of a
thermal
analysis.
Cross-Section Plot Tabular view of component

information

Determining Component Temperatures
Substrate Temperatures
Tsub  Tlayer  Q R z
Tlayer -- Layer temperature below component
. Z
Rz -- 05
Kz Ac
Ac -- Planar component area
Case Temperatures
Tca se  Tsu b  Q R ca se
Rcase -- Parallel resistance of leads and

case to substrate
Junction Temperatures
T junction  Tcase  Q  jc
The display tool shows component
temperatures calculated from the  jc --User specified
thermal analysis.

CalcePWA Thermal Analysis Module
Demonstrated for Avionics Printed Wiring Board
Assembly Flight Equipment Board
Percentage error between the case temperature

predicted by CalcePWA and the experimental data
CalcePWA Thermal Results
Analysis results: Thermal analysis Benefit for the EADS: Development

software in CalcePWA has been of an optimized plan for accelerated
validated against experimental data. qualification testing
Validation of calcePWA Thermal Analysis
The thermal analysis software in
calcePWA has been extensively
validated against experimental
test data and accepted
numerical simulations.
CalcePWA
Thermal Software
Found to be within
Validation of Conduction Analysis 5% of experimental
test data
Comparison of Component junction temperature
( oC) for natural convection case study
Component type and power calcePWA Program “PCB

dissipation EXPLORER”
24 lead DIP (1.56 W) (U55) 124 134
16 lead DIP (0.32 W) (U38) 79 75
Comparison of Component junction temperature

( oC) for flow over case study
Component type and calcePWA Program “PCB MRCs
power dissipation EXPLORER” SUPERPOSITION
METHOD
24 lead DIP (1.56W) 101 110 108
(U55)
16 lead DIP (0.32W) 67 62 59
(U38)
Validation of Coldplate Analysis

Vibration Analysis Manager
Spring
Clamped
Simple
Vibration Analysis Manager allows you to assign supports to the board for consideration in
the modal analysis and dynamic response. Additional options have been added to toolbar to
facilitate use of the software.
Displaying Advanced Vibration Analysis Results
Displacement
Mode Shapes
Analysis results include:

Mode Shapes,
Natural Frequencies,
Board Displacement,
Board Curvature,
Component Displacement, and
Component Curvatures Component Curvature
Using TC Extracted Data in calcePWA
For calcePWA, the Life Profile Manager module has been modified.
Selection of an extracted temperature cycle file is done by selecting
the Extacted TC Data option under the Import menu.
Extracted TC Data Selection Dialog
• Input in dialog includes:

– Extracted Temperature Cycles File
– Maximum Temperature Offsets
– Minimum Temperature Offsets

Temperature Offsets
• The temperature offsets
allow the user to vary
temperature of individual
components from the
extracted maximum and
minimum temperatures
by a fixed offset
temperature.
The temperature offsets is defined by creating a temperature set

using the Create/Import Temperature Data option under the File
menu.
Create/Import Temperature Data
• This program
allows the user
to import csv
formatted data
or assign data
manually.

Assigning Temperatures
The new option will
automatically create
data entry points for
each component
under the active
design project.

Highlighting Data Items
To assign component temperatures, highlight the components to be

assigned and the select the Refine option under the Edit menu.

Assign Temperatures
After setting
package and board
temperatures,
selecting the Ok
button will result in
all highlighted
components being
assigned the value
set in the dialog.
Saving Assigned Temperature Data
After assigning the
individual component
temperature offsets,
you can save the data
set by selecting the
Save or Save As
option under the File
menu.

Creating the Temperature Segments
After assigning temperature

offsets and the processed
rainflow data, the Life Cycle
Profile will automatically
create the temperature load
segments.

Viewing Temperature Segments
Individual load segments can be view by highlighting the desired

segment and selecting the View/Edit button at the bottom of the
interface window.
Life Assessment Results
After creating the Life Cycle Profile Database (LSPDB) from the
define loading condition, you can conduct a life assessment with the
calcePWA Life Assessment Manager. In this application, you will
select the desired LSPCB, down select the desired fail models (if
desired), and run the assessment.
Inspecting Individual Segment Result
Failure results can be view

by selecting the View
button on the failure
results table.

Validation of CalcePWA Vibration Analysis
Modal Analysis & Displacement
ANSYS calcePWA
ANSYS
Resonant Frequencies
710 Hz
1331 Hz
1444 Hz
calcePWA
Resonant Frequencies
724 Hz
1348 Hz
1399 Hz

Validated against Measured Test Results
BFIST - XM7 VEU Video Processor CCA
Vibration Analysis Results

Input frequency to Solder Joint 1st Natural
Fatigue is lowest value of CALCE Frequency (Hz) Max.
1st Natural
results and ESS test results SEI ESS Displacement
Frequency (Hz)
(mils)
CALCE Test Data CALCE
Applied Boundary Conditions

Video Processor CCA 372 510 .33
Power Filter CCA 226 230 13.5
Processor CCA 248 265 .47
Interface CCA 303 265 .66 Frequency and Modal Analsyis
Serial I/O CCA 261 N/A* .61
Backplane CCA 417 410 .04
The vibration analysis software in calcePWA has been extensively

validated against experimental data and numerical simulations.

Life Assessment
Life assessment in calcePWA is conducted predefined a life cycle profiles
1. Select a predefined life cycle profile
2. Save life assessment problem,
3. solve life assess

Defining the Life Cycle Profile
Stress condition refinement dialog
Application Stress Manager
Available Stress Types
The Life Cycle Profile Manger allows you to define multiple loading conditions over which
that PWA can be analyzed.
PWA Life Assessment
The life assessment module uses the PWA model, results of thermal and
vibration simulations defined in a life cycle scenario to determine life
expectancy of design.
Color coding to highlight

items that fail to meet life
expectancy

Available Failure Models
• Thermal Fatigue of Solder Interconnects
– Most conventional package styles (SOIC, PLCC, QFP,
BGA, SOT, HSOP, HSLCC, PGA, DIP, LCCC, LCC)
• Thermal Fatigue of PTH
• Thermal Fatigue of Die to Package Interface
• Vibration Induced Fatigue of Package to Board
Interconnects
• Mechanical Shock Induced Failure of Package to Board
Interconnects
• Die Level Electromigration
• Die Level Metallization Corrosion
• Die Level Dielectric Breakdown
Modeling Validation
1st Order Thermal Fatigue Leadless Chip
CALCE PTH Thermal Fatigue Model
Carrier Model Validation
10000
1000
Experimental Life
100
10
1
1 10 100 1000 10000
JPL AT&T CALCE Predicted Life
1st Order Thermal Fatigue PBGA Model Validation

Interconnect fatigue failure
models have been validated BGA model has been
though experimental data compared against
and detailed numerical over 40 measured
simulation. These models results obtained from
are reviewed on a continual the published papers,
basis and updated as conference articles
necessary. and experiments.

Vibration Testing of 160 IO CABGA Test Boards
Applied Loading
Test Dwell Input Input Resp. Resp.
Freq. Acc. Acc. Acc. Acc.
(Peak (g) (Peak- (g)
- Peak)
Peak)
P1 209 20 10 738 369
P2 210 14 7 596 298
Mounted Test Specimen P3 206 2 1 64 32
P4 209 6.3 3.15 197 98.5
P5 205 10.3 5.15 303 151.5
T1 205 10.3 5.15 393 196.5
T2 205 6.5 3.25 198 99
T3 202 6.8 3.4 280 140
T4 200 8.7 4.35 347 173.5
8x4.5x0.062 inches
Test boards were monitored with accelerometer and four strain gages.
Comparison of Board Strain versus Input with
calcePWA Vibration Module and Test Data
Comparing test strain to measured strain shows

relatively good correlation.
Comparison of CTF
These plots contain curves for life expectancy of lead-free (SAC) and
SnPb solder interconnects under harmonic load conditions at varying
input accelerations generated by the calcePWA software for the
CABGA test board. Test results plotted against these curves reveal
good agreement.
Validated Temperature Cycle Induced Solder
Interconnect Fatigue Model for SAC
2 mm thick board contained PBGA, TSOP,
TQFP, CLCC packages. The simulation
model was based on a test vehicle used
under the JGPP/JCAA Pb-free Solder Test
Program. Test assemblies were subjected
to a -55 to 125oC temperature cycle and a
-20 to 80oC cycle condition
calcePWA Model
CALCE Simulation
-55 to 125 C test

Experiment
M. Osterman and M. Pecht, Strain Range Fatigue Life Assessment of Lead-free Solder Interconnects Subject to Temperature Cycle Loading, Soldering & surface
Mount Technology, Vol. 19, No. 2, pp. 12-17, 2007.

Model vs. Experiment Data for SN100C
1. M. Osterman, C07-06 CALCE EPSC Project, 2007

2. J. Arnold, N. Blattau, C. Hillman, K. Sweatman, Reliability Testing of Ni-Modified SnCu and SAC305 – Accelerated
Thermal Cycling, SMTA International 2008, pp 187-190, Aug. 2008
3. M. Osterman, C08-08 CALCE EPSC Project, 2008

Probabilistic Physics of Failure (PPOF)
Assessment in calcePWA
PDF
PDF
PDF
Material Properties Geometry Loads
Evaluate Failure Model

TTFx
FFOP Time-to-Failure

Probability Physics of Failure (PPOF)
• The default failure assessment process in calcePWA is to use
nominal values for all parameters with the assumption that the
failure assessment results represent time to 50% failure.
• To assess the effect of input variations, you can directly vary
inputs and re-run the assessment. This requires modifying
model data, regenerating the LCPDB, and re-running the
failure assessment.
• The PPOF capability within the calcePWA failure assessment
module offers two alternatives: assigned distributions and
calculated distributions.
– Assigned distributions include Weibull and Lognormal which can be applied
on a model-by-model basis.
– Calculated distributions are established by defining distributions to input
parameters and using a Monte Carlo technique to establish the failure
distribution.
Selecting PPOF Assessment for Multiple Failure Models
Failure assessment is conducted

in the Life Assessment Manager.
Assessment is based on the
selected Life Cycle Loading
Scenario. Probabilistic failure
assessment may be conducted by
direct assignment of
distributions for failure models
or through Monte Carlo
simulation.
Supported Distributions
a = n +l
b = n+u a = n +l
b = n+u
a n b a n b
Triangular Distribution Uniform Distribution
Where:
l – Lower variation
u – Upper variation
Example
Nominal Value: 5 mm
Upper: 2 mm
Lower: -1mm
a = 4, b = 7 Edit Distribution Dialog

Handling Multiple Environments
Damage is defined as the percent of life consumed. If damage is linearly

accumulated, then we define a probabilistic damage index for x percent
failure as
n
DP(x) 
NP(x)
where n is the applied time (cycles, etc) and NP(x) is the survivable time
(cycles, etc). For multiple environments and the same failure site and
mechanism, the total damage is the sum of the damage for the individual
environments:
( x) 
DPtotal  P(x)
D
i
i
Failure occurs when DPtotal  1

( x)

Example of Monte Carlo Analysis
Life Cycle Profile:
1.Temperature Cycle –40 to 100oC
( 1 CPH) – 12 cycles
2. Shock 20G .5s Half-Sine
3. Random Vib: 0.2 G/Hz (100 to 500
Hz) – 100 hrs
4. Temperature Cycle 0 to 80oC (1
CPD)
Expected life is calculated based on the

defined life cycle and assumes that the
loading condition persists until failure.
The total damage (DR) is based on the
defined life cycle loading condition.

Acceleration Factors
In product qualification, it is often impractical to test the
system for its full expected lifetime. As a result, high load
frequency and load levels may be used. In order to relate the
test condition to the anticipated use condition, a failure
assessment under both conditions must be completed. If the
same failure mechanisms and sites are produced under both
conditions, the test and use condition can be related. An
acceleration factor is the term used to relate the test and use
condition.
N use tuse
AFcycle  AFtime 
N test ttest
The ability to present acceleration factors has been recently
added to the calcePWA software. In calcePWA, the
acceleration factor is presented in the time domain.
Determining Acceleration Factors in calcePWA
User must create a test profile and a use profile. Both life assessments must be
conducted for both profiles. To evaluate the acceleration factor for a particular use
and test condition, the user should load the use condition. Next, the user should
select the Run  Acceleration Factor menu item and use the selection dialog to
select the test assessment.
Time Domain Acceleration Factors
The acceleration factors determined in calcePWA are presented in the time domain. As
such, the time in test is related to the time under the use condition. Therefore, an
acceleration factor of 50 means that a part requiring 2 months for failure under the test
would required 100 months to fail under the prescribed use condition. Alternatively, if a
part can survive 2 months in test, it should be expected to survive 100 months in the field.
Assessment of Tin Whisker Risk in
calcePWA
The calceWhiskerRiskCalculator has been integrated into the calcePWA . The

current implementation only considers part self shorting. Later versions will
allow for evaluation of part to part shorting.
Importing Components in
calceTinWhiskerRiskCalculator
Software will report

leaded components that
it is unable to determine
one or more site
parameters
The number of pairs is calculated based on part interconnect format (SIP, DIP, QUAD)
SIP : NP = Nleads -1
DIP: NP = 2*(Nleads/2 – 1)
QUAD: NP = 4*(Nleads/4 – 1)
Conduct spacing gap is determined based on lead width (Wlead) and interconnect center line
spacing or pitch (P)
Lgap = P – Wlead
Conductor area
Aconduct = Llead*(Tlead+Wlead)

Risk Assessment Results from calcePWA
models
After setting the target life and samples, you can evaluate the whisker risk by selecting
Risk->Assessment option. This will evaluate reliability of the system defined by the set
of parts under evaluation.
CalceFAST Software Interface
Menu Bar
Tool Bar
Data
Model Entry
Feature Panel
List
CalceFAST 5.0 (Failure Assessment Software Toolkit) software provides the
capability to bypass full scale design modeling and conduct failure assessment
using individual failure models. The software implements a failure model plug-in
interface and allows the failure model software to be used in calcePWA 5.0 and
on the CALCE Web Site.
Expanded Models in calceFAST
Package and
device models
from CADMP-II
are now available
in calceFAST.

Sensitivity Analysis Results
In the case of multiple attribute sensitivity, the attributes and their assigned
values are presented in the text report. The X-axis of the graph defines the
percent values over which the selected attributes were varied.
Iso-Time To Failure Results
Cycles To Failure
1750
Decreasing
Time to Failure 1500
1250
1000
750
Iso-time to failure assessment provides you with plots that can be used to examine
the effect of changes in environment loading conditions versus design parameters.
From the example above, a reduction in plating thickness by 0.01mm can reduce the
life by 44%.
calceFAST Implementation
The calceFAST implementation assumes the user has already

processed a time history file and “Import Extracted Temperature
Cycle Data” option allows the user to select a processed output file.
Segmented Temperature Cycles
In order to view the segmented temperature cycles, you will need to

select the Multiple Stress Condition Options.
Segmented Temperature Cycles
In order to conduct an assessment with the segmented temperature

data, you will need to assign the Analysis Mode to Multiple under
the Analysis Parameters Feature Panel.

calceFAST Fatigue Model Output Example
After saving and executing the analysis, the results are presented
with damage ratios for each segment.
calceEP Device and Package Level
Toolbox
Package and Device Modeling
Life Cycle Profiling Package and Device Life Assessment

calceEP Failure Models
Failure models are based on those available in open literature and
JEP122. As well as those internally developed at CALCE. List of
supported failure models will include:
• Electromigration
• Stress Driven Diffusive Voiding (SDDV)
• Time Dependent Dielectric Breakdown (TDDB)
• Metallization Corrosion
• Electrolytic Breakdown
• Dielectric Breakdown
• Die Attach Thermal Fatigue
• Wire Bond Thermal Fatigue

Whisker Risk Assessment Software
A software package that implements the fixed risk assessment algorithm has
been developed. Software allows you to define conductor pairs and select
finish type to look up whisker growth or directly define whisker growth
parameters.
Conducting A Risk Assessment
The software allows you to define the target life time of the system, desired
risk level in parts per million, and the percentage of whisker containment
afford by the application of a conformal coat. The target life is used in
combination with the database of whisker growth tables to determine the
whisker growth characteristics. The risk level is used to define the sample
size (i.e. the number of Monte Carlo iteration).

Risk Assessment Results
The software outputs the

probability of whisker
failure for each conductor
pair considered. The
probability of failure for
each conductor pair is then
rolled up to provide the total
whisker reliability of the
system.


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CALCE Simulation Assisted Reliability

Assessment (SARATM) Software

Center of Advanced Life Cycle Engineering 2 University of Maryland

Ranking of Potential Failure

Physical Verification: Test Setup, Specimen Characterization, Accelerated Stress Test

• Life assessment under anticipated loading conditions

Center of Advanced Life Cycle Engineering 4 University of Maryland

Testing Results: Board 2

(Development Period - 130 Wks) (Development Period - 109 Wks)

Results: Completed 1/98 Completed 8/99

• Product development using simulations produced a more robust design, faster

Testing and development is conducted primarily on a system with a

CalceSARA can be downloaded from the CALCE Web Site. The

Center of Advanced Life Cycle Engineering 9 University of Maryland

The installation of calceSARA 8.0 is facilitated by installation software that takes

Center of Advanced Life Cycle Engineering 10 University of Maryland

The calceSARA applications are launched like any other Windows

CalcePWA, calceFAST, calceEP, and calceWhiskerRiskCalculator,

The TC Extractor is used to

Center of Advanced Life Cycle Engineering 12 University of Maryland

Temperature cycles extracted using the calceTCExtractor can be used

Center of Advanced Life Cycle Engineering 13 University of Maryland

Operational and Usage Information

Center of Advanced Life Cycle Engineering 15 University of Maryland

Center of Advanced Life Cycle Engineering 16 University of Maryland

Modeling CCA Selection Tab

Reliability Thumbnail images

Center of Advanced Life Cycle Engineering 17 University of Maryland

To promote reuse of data, the calcePWA software has the

Import currently available for

Import typically provides board outline, part list,

Flood Fill Toggle

Conduction Internal conduction only

Conduct_VC Internal conduction, natural convection with assumed vertical orientation.

Conduct_VC_Rad Internal conduction, natural convection with assumed vertical orientation

Conduct_HC Internal conduction, natural convection with assumed horizontal

Conduct_HCNV Internal conduction, natural convection with assumed horizontal

Conduct_Rad Internal conduction, surface radiation to enclosure.

Conduct_HC_Rad Internal conduction, surface radiation to enclosure, natural convection with

Cross-Section Plot Tabular view of component

Center of Advanced Life Cycle Engineering 23 University of Maryland

Ac -- Planar component area

Rcase -- Parallel resistance of leads and

Center of Advanced Life Cycle Engineering 24 University of Maryland

Percentage error between the case temperature

CalcePWA Thermal Results

Analysis results: Thermal analysis Benefit for the EADS: Development

Component type and power calcePWA Program “PCB

Comparison of Component junction temperature

Center of Advanced Life Cycle Engineering 26 University of Maryland

Analysis results include:

• Input in dialog includes:

Center of Advanced Life Cycle Engineering 30 University of Maryland

The temperature offsets is defined by creating a temperature set

Center of Advanced Life Cycle Engineering 32 University of Maryland

Center of Advanced Life Cycle Engineering 33 University of Maryland

To assign component temperatures, highlight the components to be

Center of Advanced Life Cycle Engineering 34 University of Maryland