Bac5583 Process For Potting Inserts

Cover Page
Standard: BAC5583 Rev: (G) 27-Aug-2003
WARNING - The Export Control or Intellectual Property language on this page takes precedence over any such
language that may appear on subsequent pages of this document.
EXPORT CONTROLLED - This technology or software is subject to the U.S. Export Administration Regulations
(EAR), (15 C.F.R. Parts 730-774). No authorization from the U.S. Department of Commerce is required for export, re-
export, in-country transfer, or access EXCEPT to country group E:1 or E:2 countries/persons per Supp.1 to Part 740 of
the EAR. ECCN 1E994
Boeing Proprietary, Distribution limited to Boeing employees and others covered by applicable proprietary information
or nondisclosure agreements.
Copyright © 1988, 1992, 2003 Boeing. All rights reserved.
Product Standards requirements are binding for all Boeing and non-Boeing production facilities and must be
implemented in accordance with the following: Part Standards: D-590-PREFACE, Material Specifications: BMS0-
PREF, Process Specifications: BAC001PREF, and Support Standards: BSS001PREF.
Any reproduction of this document or portions thereof must also reproduce this page of the document.
BOEING PROPRIETARY EXPORT CONTROLLED -
ECCN 1E994
******* PSDS GENERATED *******
1 SCOPE
NOTE: Incorporated PSDs: 6–35, 6–39, 6–42 and 6–43

Cancelled PSDs: None
a. This specification establishes the requirements for the installation and inspection of
potting core, inserts, and edges in sandwich panels.
ÈÈÈÈÈ
ÈÈÈÈÈ
WARNINGs maybe included throughout this specification. Do not
WARNING take these WARNINGs to be all inclusive, nor to completely
describe hazards or precautionary measures applicable to specific
procedures or operating environments.
Non–Boeing personnel shall refer to their employer’s safety

instructions for information concerning hazards which may occur
during operations described in this specification.
b. It is acceptable for qualified processors to process hardware in accordance with a

Manufacturing Process Control Document (MPCD) as defined herein. Prior to
issuing an MPCD, the facility is required to have a Boeing approved Operating
Procedure (OP) governing the use of MPCDs. Boeing approved OPs are listed in
BSS7023. Facilities not operating to an MPCD in accordance with BSS7023, are not
exempt from the provisions of this specification and shall use the reliable process
method given.
2 CLASSIFICATION
This specification consists of the following methods:
a. Method A – Prepotting of fastener holes
b. Method B – Wet potting of inserts
c. Method C – Edge potting
d. Method D – Joint potting (High strength and corrugated reinforced T section joining
are inactive for current design)
e. Method E – Installation of self–tapping screws. Method A is optional to Method E.
f. Method F – Inactive for current design. Use Method C.
g. Method G – Potting bonded assemblies for installation of fasteners.
ORIGINAL ISSUE: REV: (F) 16–SEP–1999 (G) 27–AUG–2003

03–JAN–1983
PROCESS FOR POTTING INSERTS AND BAC
Authorizing Signatures on File EDGES INTO SANDWICH PANELS
5583
BOEING PROCESS SPECIFICATION PAGE 1 of 53

REFER TO NUMERICAL INDEX FOR PSD ACTIVITY INFORMATION
CAGE CODE 81205
Copyright © Boeing. All rights reserved. See Cover Page.

ECCN 1E994
3 REFERENCES
The current issue of the following documents shall be considered a part of this
specification to the extent herein indicated.
ASME D 18.6 4 – Thread Forming and Thread Cutting Tapping Screws and
Metallic Drive Screws (inch series)
ASTM D 2240 – Rubber Property – Durometer Hardness, Standard Test
Method for
BAC5010 – Application of Adhesives
BAC5317 – Fiber Reinforced Composite Parts
BAC5317–2 – Manufacture of Low Temperature Autoclave Cured Epoxy
Structural Parts
BAC5317–3 – Manufacturing of High Temperature Resistant Epoxy
Structural Parts
BAC5564 – Fabrication of Crushed Core and Map Sandwich Panels
BAC5565 – Vacuum Bag and Multiple Opening Process for Phenolic
Sandwich Panels and Laminates
BAC5621 – Temperature Control for Processing of Materials
BAC5750 – Solvent Cleaning
BSS7002 – Storage of time and temperature sensitive materials
(TATS)
BSS7023 – Manufacturing Facilities With Approved Operating
Procedures for Manufacturing Process Control Documents
BSS7217 – Air Cleanliness, Shop Compressed Air
BSS7286 – Statistical Process Control of Designated
Engineering Characteristics
SAEAMS–STD–401 – Sandwich Constructions and Core Materials, General Test
Methods
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ORIGINAL ISSUE 03–JAN–1983 REVISED (G) 27–AUG–2003

ECCN 1E994
4 CONTENTS
Section Subject Page
1 SCOPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 CLASSIFICATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 REFERENCES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 CONTENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5 MATERIALS CONTROL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.1 DELIVERABLE MATERIALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.1.1 POTTING AND CASTING COMPOUNDS . . . . . . . . . . . . . . . . 7
5.1.2 MISCELLANEOUS MATERIALS . . . . . . . . . . . . . . . . . . . . . . . . 7
5.2 NON–DELIVERABLE MATERIALS . . . . . . . . . . . . . . . . . . . . . . 7
5.2.1 SOLVENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.2.2 RELEASING AGENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.2.3 PEEL PLY FABRICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.2.4 PARTING FILMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.2.5 GLOVES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.3 MATERIAL STORAGE CONTROL . . . . . . . . . . . . . . . . . . . . . . . 8
5.4 MATERIAL REPACKAGING AND RELABELING . . . . . . . . . . 9
6 FACILITIES CONTROL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6.1 METER/MIX DISPENSING EQUIPMENT . . . . . . . . . . . . . . . . . 9
6.2 PRE–KITTED CARTRIDGE MIXING MACHINES . . . . . . . . . . 9
6.3 TEMPERATURE CONTROL . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6.3.1 CALIBRATED METHOD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6.3.2 ALTERNATE CALIBRATED METHOD . . . . . . . . . . . . . . . . . . . 9
6.4 COMPRESSED GAS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
7 DEFINITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
8 MANUFACTURING CONTROL . . . . . . . . . . . . . . . . . . . . . . . . . 12
8.1 PROCESSING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
8.1.1 MIXING PROCEDURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
8.1.2 EXTENDED STORAGE OF BLENDED MATERIALS . . . . . . . 20
8.2 WORK LIFE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8.3 APPLICATION METHODS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
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4 CONTENTS (Continued)
8.3.1 GENERAL METHODS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

8.3.2 METHOD A – PREPOTTING OF FASTENER HOLES . . . . . . 22
8.3.3 METHOD B – WET POTTING OF INSERTS . . . . . . . . . . . . . . 23
8.3.3.1 Hole Preparation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
8.3.3.1.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
8.3.3.1.2 Blind Inserts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
8.3.3.2 Installation of Blind Inserts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
8.3.3.3 Installation of Through Inserts . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
8.3.3.4 Nonsnap–in Inserts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.3.3.5 Alternate Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.3.3.6 Preparation For Cure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.3.4 METHOD C – EDGE POTTING . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.3.4.1 Rigid Potting Compound . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.3.4.2 Flexible Potting Compound . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.3.4.3 Metal Edge Trim Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
8.3.4.4 Rigid Foam Edge Closeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
8.3.5 METHOD D – JOINT POTTING . . . . . . . . . . . . . . . . . . . . . . . . . 32
8.3.5.1 Square Corner Joining . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
8.3.5.2 Round Corner Joining . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
8.3.5.3 Standard T Section Joining . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
8.3.6 METHOD E – INSTALLATION OF SELF–TAPPING SCREWS 36
8.3.7 METHOD G – POTTING BONDED ASSEMBLIES FOR
INSTALLATION OF FASTENERS . . . . . . . . . . . . . . . . . . . . . . . 37
8.4 IN–PROCESS TESTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8.4.1 ALL METHODS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8.4.2 TESTING SPECIFIC TO METHOD B . . . . . . . . . . . . . . . . . . . . 38
8.5 CURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
8.6 REWORK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
8.7 PROCESS CONTROL PANEL . . . . . . . . . . . . . . . . . . . . . . . . . . 45
8.8 STATISTICAL PROCESS CONTROL AND ENGINEERING KEY
CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
9 MAINTENANCE CONTROL . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
10 QUALITY CONTROL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
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11 REQUIREMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
11.1 DEFECTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
11.2 PROCESS CONTROL REQUIREMENTS . . . . . . . . . . . . . . . . 48
11.2.1 INSERT PULLOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
11.3 HARDNESS REQUIREMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
12 TEST METHODS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
12.1 INSERT PULLOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
12.2 PEEL PLY AND PARTING FILM VERIFICATION . . . . . . . . . . 51
12.3 HARDNESS TESTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
12.4 SUFFICIENT POTTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
LIST OF FIGURES
Number Title Page
FIGURE 1 INITIAL CURE SCHEDULE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

FIGURE 2 ILLUSTRATION OF TYPICAL BLIND INSERT
INSTALLATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
FIGURE 3 ILLUSTRATION OF TYPICAL THROUGH INSERT
INSTALLATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
FIGURE 4 ILLUSTRATION OF TYPICAL BLIND INSERT
INSTALLATION IN THROUGH HOLE . . . . . . . . . . . . . . . . . . . . 29
FIGURE 5 POTTED JOINTS FOR SQUARE CORNERS . . . . . . . . . . . . . 32
FIGURE 6 OPTIONAL JOINING METHOD . . . . . . . . . . . . . . . . . . . . . . . . . 33
FIGURE 7 PANEL CUT–OUT FOR ROUND CORNER . . . . . . . . . . . . . . . 34
FIGURE 8 PREPARATION OF T SLOT . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
FIGURE 9 POTTED T JOINTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
FIGURE 10 CURE FOR BMS5–28 FOR MAGNOBOND 92–1
QUALIFIED TO BMS5–28 TYPE 18 CLASS 1 . . . . . . . . . . . . . 40
FIGURE 11 CURE FOR BMS5–28 FOR EPOCAST 1631 QUALIFIED TO
BMS5–28 TYPE 30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
FIGURE 12 PROCESS CONTROL TEST PANEL . . . . . . . . . . . . . . . . . . . . . . 45
FIGURE 13 TENSILE PULL–OUT TEST SPECIMEN . . . . . . . . . . . . . . . . . . . 50
FIGURE 14 TENSILE PULL–OUT TEST CONFIGURATION . . . . . . . . . . . . . 50
FIGURE 15 CONTAMINATION TEST PANEL CONSTRUCTION . . . . . . . . . 52
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LIST OF TABLES
Number Title Page
TABLE I MATERIALS STORAGE AND PROCESSING . . . . . . . . . . . . . 14

TABLE II FROZEN STORAGE OF BLENDED COMPOUND . . . . . . . . . 20
TABLE III HOLE SIZES FOR INSTALLING INSERTS . . . . . . . . . . . . . . . 24
TABLE IV HOLE DIAMETERS FOR SELF–TAPPING SCREWS . . . . . . 36
TABLE V POTTING REWORK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
TABLE VI PROCESS CONTROL PANEL CONSTRUCTION . . . . . . . . . 45
TABLE VII KEY CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
TABLE VIII INSERT PULL–OUT STRENGTH REQUIREMENTS . . . . . . . 48
TABLE IX HARDNESS REQUIREMENTS . . . . . . . . . . . . . . . . . . . . . . . . . 49
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5 MATERIALS CONTROL
5.1 DELIVERABLE MATERIALS
5.1.1 POTTING AND CASTING COMPOUNDS
MATERIAL SOURCE
a. BMS5–28 QPL
b. BMS5–92 (BAC5010,Type 70) QPL
c. BMS5–123, Type I, Class 2 QPL
5.1.2 MISCELLANEOUS MATERIALS
MATERIAL SOURCE
a. Phenoset Microspheres, No. BJ–0930 Asia Pacific
Microspheres SDN
BHD, West Malaysia
b. Cab–O–Sil, Type HS–5 Cabot Corporation
Tuscola, Ill
c. BMS8–133, Type I, Grade 18 or 20 QPL
5.2 NON–DELIVERABLE MATERIALS
The following is considered part of the reliable process method. The listed
nondeliverable (non–flyaway) materials have been found to be satisfactory for the
process. In accordance with the approved operating procedure listed in BSS7023, other
materials which are satisfactory when tested to the requirements of Section 11 and are
not detrimental to the function of deliverable (flyaway) materials may be used and shall
be called out in an MPCD.
5.2.1 SOLVENTS
Refer to BAC5750
5.2.2 RELEASING AGENTS
Material deviations from the reliable method are permissible if documented in an MPCD.
No testing is necessary.
MATERIAL SOURCE
a. Frekote 710NC Dexter Corp.
b. B15 Tool Seal Dexter Corp.
c. PVA Solution Enmar, Inc.
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5.2.3 PEEL PLY FABRICS
Material deviations from the reliable method are permissible if documented in an MPCD
and tested to the test procedure of Section 12.2.
MATERIAL SOURCE
a. 1B301–F 58 coated glass fabric (Not Hexcel Corp.
recommended for 350 F nominal cure)
b. No. 949 Nylon (Not recommended for 350 F Ferro Corp., Cordo Div.
nominal cure)
c. Paclease 58 40/40–002A N–21–P 600 (Not Catalina Pacific
recommended for 350 F nominal cure)
d. Polyester peel fabric style 60002. Code 56030 Precision Fabric Group, Inc.
(Not recommended for 350 F nominal cure)
e. Epoxy impregnated peel fabric, BMS15–3, QPL
Type I, Class 3, Grade A and Grade B (Use for
350 F nominal cure)
f. Nylon Peel Fabric, Code 51789 (Scoured Burlington Industrial
and Set) (Not recommended for 350 F nominal Fabrics Co.
cure)
g. Nylon Fabric, Style 51239 (Not recommended Open
for 350 F nominal cure)
h. Nylon Peel Fabric, Style 52006 SRB–Super Burlington Industrial
Release Blue (Not recommended for 350 F Fabrics Co.
nominal cure)
5.2.4 PARTING FILMS
Material deviations from the reliable method are permissible if documented in an MPCD
and tested to the test procedure of Section 12.2.
MATERIAL SOURCE
a. Halar ECTFE film Allied Signal
b. Teflon FEP film perforated or non–perforated DuPont
Hawkeye Enterprises,
Richmond Aircraft Products
Airtech International
c. WL 4600 Release Film 2 Mil thick, color – blue Airtech International
5.2.5 GLOVES
Glove material shall not be a contaminant to or cause the transfer of contaminants to

production parts or other materials used in the process.
5.3 MATERIAL STORAGE CONTROL
Materials included in this specification which are considered to be time and temperature
sensitive are listed in BSS7002 and shall be stored in accordance with BSS7002 from the
time of receipt through use see Table I.
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5.4 MATERIAL REPACKAGING AND RELABELING
a. Use only clean, dry, new airtight containers of metal, polyethylene or Teflon, no larger
than needed and minimize included air. Transfer all pertinent information on the
original container. Container labels shall meet all state and other applicable labeling
requirements.
b. Label containers with:
(1) BMS Number, Type, Class and Grade as applicable.
(2) Manufacturer’s designation and Batch No.
(3) Storage temperature and date.
(4) Storage expiration date and time.
(5) Packager’s identification.
(6) Safety information, if any.
6 FACILITIES CONTROL
The following is considered part of the reliable process method. In accordance with the
approved operating procedure listed in BSS7023, any MPCD documented facilities
controls that meet the requirements of Section 11 may be used instead or in addition.
6.1 METER/MIX DISPENSING EQUIPMENT
A periodic check of the meter/mix equipment shall be performed to assure proper

functioning of the equipment at a frequency of at least once every 30 days, or at another
frequency determined by Quality Assurance.
6.2 PRE–KITTED CARTRIDGE MIXING MACHINES
A periodic check of the pre–kitted cartridge mixing machines shall be performed to assure
the mixing machines are functioning properly. Frequency of such checks shall be
determined and approved by Quality Assurance.
6.3 TEMPERATURE CONTROL
All process equipment shall be adequate to control the time, temperature, and pressure
requirements of Section 8. All process equipment shall be calibrated and maintained to
ensure that all processing parameters can be held within required tolerances.
6.3.1 CALIBRATED METHOD
Calibrate process equipment in accordance with BAC5621, Class II, Type I.
6.3.2 ALTERNATE CALIBRATED METHOD
An alternate procedure may be used in lieu of Section 6.3.1 if the procedure is

documented and meets all the requirements of Section 6.3.
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6.4 COMPRESSED GAS
Compressed gas shall be free of oil, moisture and particulate matter when tested in
accordance with BSS7217.
7 DEFINITIONS
The following definitions shall apply to terms which are uncommon or have special
meaning as used in this specification.
Bubble – A cavity in the potting from trapped air. Air may be from mixing components or
from air that is trapped as the potting is put in place. Corners of a bubble are round and
the height is usually the largest dimension.
Deaeration – The removal of air introduced into compounds during blending operations.
Fill – The height of the potting relative to the top of honeycomb cell walls. Overfill and/or
underfill limits may be specified.
Full Cure – Cure time and temperature resulting in ultimate properties.
Gel Time – The time from initial mixing of components or thaw of one part systems until
the material becomes nonfluid in accordance with the procedure for BMS5–28. Gel is
often listed under worklife in Table I because better data is not available. Gel time and
work life depend upon the mass of material and the specific product. The type of
BMS5–28 potting may have a 50–minute minimum gel requirement with actual gel and
work life as follows:
Product A B
Gel time, minutes for 50 gm 70 90
Work life, minutes for 400 gm 35 45
(See work life)
Initial Cure – Cure to permit further processing such as sawing, trimming, machining or
painting. No load (such as torque or pullout for an insert) may be applied until potting is
fully cured (usually 7 days minimum at room temperature), unless an exception is called
out in Section 8.5.
Insert – A fastener (usually threaded) potted into a honeycomb sandwich. NAS number
or vendors part number such as SL for Shur–Lok (see Table III) identifies inserts.
Through Inserts establish a fastening hole through the cross section of the sandwich
from skin to skin.
Blind Inserts allow fastening from one side with included threading and are not seen
from the other side (unless a through hole is used for fabrication reasons).
Key Characteristic – A property of a material or process whose variability has the greatest
impact on the fit, performance, or service life of a finished part from the perspective of
the customer.
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7 DEFINITIONS (Continued)
Manufacturing Process Control Document (MPCD) – A document authorized through a

process specification and manufacturing operating procedures which provides processing
requirements unique to a supplier, facility or division that may be used in lieu of the
reliable method for a given process specification. The MPCD processing and control
methods will meet the engineering requirements of the original specification.
Prepot – Placement and cure of potting material prior to mechanical working such as
drilling for installation of an insert.
Reliable Method – A manufacturing process defined in the BAC process specification

established through testing and practice that allows the processor to meet the end–item
requirements. This process is optional when an MPCD is used.
Room Temperature – 65 to 85 F.
Shelf Life – Maximum storage time allowed at the purchaser’s facility, including
allowances for revalidated material.
Shrinkage – The reduction in potting volume during cure. Shrinkage in honeycomb core
is the reduction in potting column height relative to the top of the cell wall.
Stroke – A complete cycle of the up and down movement of the rotating mixing blades
traversing the entire length of the material in the pre–kitted cartridge.
Void – A cavity in the potting that may be from a bubble, cell underfill, or
potting shrinkage.
Work Life – Out Time – The time allowed out of refrigerated storage at workshop
temperatures. The time from mix or thaw to the point where the material is no longer
usable as intended. Worklife depends upon the individual product, mass mixed and the
temperature of the mix. Gel time is often a guide for worklife (See gel time).
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8 MANUFACTURING CONTROL
This is the reliable method for this process. In accordance with the approved operating
procedure listed in BSS7023, any MPCD documented procedure that meets the
requirements of Section 11 may be used instead.
ÈÈÈÈÈ
ÈÈÈÈÈ
This specification involves the use of chemical substances which
WARNING are hazardous. Boeing personnel shall refer to the work area
Hazard Communication Handbook for health effect and control
measure information contained in the HazCom Info Sheets and
Material Safety Data Sheets. For disposition of hazardous waste
materials, consult site environmental engineers for proper disposal
methods.
Non–Boeing personnel should refer to manufacturer’s Material

Safety Data Sheet(s) and their employer’s safety instructions.
a. Potting, processing and cure procedures are outlined in Table I. Materials shall be
hard and dry and not soft and tacky. Prior to further processing the potting shall be
tested in accordance with Section 12.1 to ensure sufficient curing.
b. Storage, blending instructions and cure information are given or referenced in Table I.
Maximum storage times are from the date of acceptance at the purchaser’s facility,
unless otherwise specified. For retest requirements, see Section 5.3.
c. All personnel who perform potting by this specification shall be familiar with the
general requirements of this specification and be capable of using the materials and
processes described in this specification.
d. Work life information in Table I is not a requirement to be enforced, but a guide to

aid manufacturing.
8.1 PROCESSING
8.1.1 MIXING PROCEDURES
a. Verify that materials are within age (storage) limits specified in Table I.
b. Discard any material with evidence of degradation such as leakage from containers,
corrosion on metal containers, gelling, or skinning.
c. Do not open containers with moisture on the outside. Wipe off the moisture. The
container may be opened if no condensation (moisture) reforms on the outside.
d. If filler addition is required, oven dry fillers (such as microballoons, Section 5.1.2a.) at
170 ± 10 F for at least 2 hours.
Immediately after drying, blend the filler with enough resin to make a heavy paste
and blend until smooth; then blend the rest of the resin into the paste. Heating the
resin–filler blend to 150 ± 10 F will help wet the filler.
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8.1.1 MIXING PROCEDURES (Continued)
e. Blend curing agents into resin in accordance with manufacturer’s instructions, unless
otherwise specified.
(1) Any type of mixer may be used to blend potting compounds provided they do not
break microballoons and give a smooth, homogeneous, workable blend with a
minimum of trapped air. Mixer blades shall be tested to be sure compound
densities do not increase. Avoid speeds that will cause buildup of heat. Heat or
excessive mixing will reduce work life.
(2) When hand mixing, use a stirrer, such as a metal spatula. Usually 7 to 8 minutes
of hand mixing is required for a smooth mix. Use long smooth strokes to prevent
air bubbles. To determine complete blending, spread a small amount of the
blend thinly on white paper. Even coloring indicates complete blending.
(3) Follow manufacturer’s instructions for combining components and blending

two–compartment cartridges (injection or barrier type), unless
otherwise specified.
f. Deaerate materials as required in Table I, FL 1. Apply a vacuum of at least 25 inches

of mercury, until foaming slows to a gentle boil. Release the vacuum periodically to
collapse excess foam. Deaeration is not required for compounds supplied and
blended in two–compartment plastic cartridges (injection or barrier type).
g. Pre–kitted cartridge (Semco Kit or equivalent) mixing for BMS5–28 materials.
(1) Check kit first for loss of material due to leaks in either the stem or tube of the
cartridge. Leaks from the stem are not acceptable. Leakage around the plug in
the barrel is acceptable if it does not cover the plug after standing vertically for a
minimum of one hour. The liquid is highly reflective where the plug has a dull
finish. Discard rejected tubes in accordance with the appropriate hazardous
material disposal provisions.
(2) Hold cartridge, grasp dasher rod and pull back until mixing impeller is
approximately centered. Insert ramrod into hollow of dash rod, break piston
loose and inject the hardener into the cartridge. Remove the ramrod. Use even
pressure. Do not force, tap, pound or jolt ramrod if piston does not break
loose readily.
(3) Place cartridge into mixing machine and mix for a minimum of 30 complete
strokes (one stroke is one complete up and down cycle).
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TABLE I MATERIALS STORAGE AND PROCESSING
MAXIMUM
WORK MINIMUM FULL
TIME LIFE TIME MINIMUM CURE TIME
STORAGE FIRST BETWEEN SHELF AT TEMP INITIAL AT TEMP
COMPOUND TEMP F RETEST RETEST LIFE FL 5 CURE FL 9 REMARKS FL 8
BMS5–28 FL 13 FL 13 FL 13 FL 13 20 min at Figure 1 7 Days at Deaeration is
Type I FL 3 room temp. room temp. required. Retest
or for gel time, and
5 hours at 125 F compression
strength and
modulus.
BMS5–28 FL 13 FL 13 FL 13 FL 13 20 min at Figure 1 7 Days at Retest for
Type 3 room temp. room temp. appearance, gel
or time, and
strength and
modulus.
BMS5–28 FL 13 FL 13 FL 13 FL 13 20 min at Figure 1 7 Days at Deaeration is
Type 4 FL 3 room temp. room temp. required. Retest
or for appearance,
5 hours at 125 F gel time, and
compression
strength and
modulus.
BMS5–28 FL 13 FL 13 FL 13 FL 13 60 min at Figure 1 FL 2 Work life
Type 6 room temp. indicated is for
FL 7 FL 11 FL 6 500 gm Retest
FL 12 for appearance,
gel time, and
compression
strength and
modulus.
BMS5–28 FL 13 FL 13 FL 13 FL 13 60 min at Figure 1 FL 2 Work life
Type 7 room temp. indicated is for
Class 1 FL 1 400 gm batch.
May be mixed in
batches up to
800 gm provided
it is immediately
subdivided into
batches of
400 gm or less.
Retest for
appearance, gel
time, and
compression
strength and
modulus.
BMS5–28 FL 13 FL 13 FL 13 FL 13 60 min at Figure 1 FL 2 Same as above.
Type 7 room temp.
Class 2
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TABLE I MATERIALS STORAGE AND PROCESSING (Continued)
MAXIMUM
WORK MINIMUM FULL
BMS5–28 FL 13 FL 13 FL 13 FL 13 60 min at Figure 1 7 Days at Work life
Type 9 room temp. FL 10 room temp. indicated is for
FL 1 FL 3 or 500 gm batch.
5 hours at 125 F Retest for
appearance, gel
time, and
compression
strength and
modulus.
BMS5–28 FL 13 FL 13 FL 13 FL 13 5 days at Figure 1 1 hour at 260 F Retest for
Type 10 room temp. appearance, and
compression
strength and
modulus.
BMS5–28 FL 13 FL 13 FL 13 FL 13 14 days at Figure 1 1 hour at 260 F Retest for
Type 11 room temp. appearance, and
compression
strength and
modulus.
BMS5–28 FL 13 FL 13 FL 13 FL 13 4 hours at N/A 1.5 hours at 260 Retest for
Type 12 room temp. F appearance,
or extrudability, and
1 hour at 350 F compression
strength and
modulus.
Type 13 room temp. F appearance
or extrudability, and
strength and
modulus.
Type 14 room temp. F appearance
Class 1 or extrudability, and
strength and
modulus.
BMS5–28 FL 13 FL 13 FL 13 FL 13 8 hours at N/A 1.5 hours at 260 Same as above
Type 14 room temp. F
Class 2 or
1 hour at 350 F
BMS5–28 FL 13 FL 13 FL 13 FL 13 10 to 30 3 hrs at 7 Days at Retest for
Type 15 min at room room temp. appearance
room temp. temp. or extrudability, and
strength and
modulus.
BMS5–28 FL 13 FL 13 FL 13 FL 13 20 to 40 Figure 1 7 Days at Retest for
Type 16 min at room temp. appearance,
FL 3 room temp. or gel time, and
strength and
modulus.
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ECCN 1E994
MAXIMUM
WORK MINIMUM FULL
BMS5–28 FL 13 FL 13 FL 13 FL 13 1 to 1.5 hrs Figure 1 7 Days at Retest for
Type 17 at room temp. appearance,
FL 3 room temp. or gel time, and
strength and
modulus.
BMS5–28 FL 13 FL 13 FL 13 FL 13 12 to 25 3 hrs at 7 Days at Retest for
Type 18 min at room room temp. appearance,
Class 1 room temp. temp. or extrudability,
or 5 hours at 125 F or gel time, and
Figure 10 Figure 10 compression
strength and
modulus.
BMS5–28 FL 13 FL 13 FL 13 FL 13 3 to 9 min 3 hrs at 7 Days at Same as above.
Type 18 at room room room temp.
Class 2 temp. temp. or
5 hours at 125 F
FL 3 room temp. or extrudability,
compression
strength and
modulus.
FL 3 room temp. or extrudability,
compression
strength and
modulus.
BMS5–28 FL 13 FL 13 FL 13 FL 13 1 hour at Figure 1 7 Days at Work life
Type 21 room temp. room temp. indicated is for
or 300 gm. Retest
1.5 hours at 260 F for appearance,
or gel time, and
strength and
modulus.
BMS5–28 FL 13 FL 13 FL 13 FL 13 1 hour at 16 hours 7 Days at Retest for
Type 24 room temp. at room room temp. appearance and
FL 3 temp. or gel time.
5 hours at 125 F
BMS5–28 FL 13 FL 13 FL 13 FL 13 1 hour at 4 hours at 7 Days at 77 F Retest for
Type 25 room temp. room or appearance,
temp. 1.5 hours at 260 F extrudability,
or gel time, and
strength and
modulus.
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ECCN 1E994
MAXIMUM
WORK MINIMUM FULL
BMS5–28 FL 13 FL 13 FL 13 FL 13 1 hour at 4 hours at FL 4 Retest for
Type 26 room temp. room appearance and
FL 3 temp. gel time.
BMS5–28 FL 13 FL 13 FL 13 FL 13 1 day at N/A 1 hour at 350 F or See Section
Type 27 room temp. 2 hours at 260 F 8.3.1c.(3) and
8.5e. when
performing
rework. Retest
for appearance,
extrudability,
gel time, and
compression
strength and
modulus.
BMS5–28 FL 13 FL 13 FL 13 FL 13 50 min at Figure 1 7 days at Retest for
Type 28 room temp. FL 10 room temp. appearance,
FL 1 FL 3 or gel time, and
strength and
modulus.
BMS5–28 FL 13 FL 13 FL 13 FL 13 12 to 25 3 hrs at 7 days at Retest for
Type 30 min. at room room temp. appearance,
room temp. temp. or or extrudability,
Figure 11 5 hours at 125 F or gel time, and
Figure 11 compression
strength and
modulus.
BMS5–92, FL 13 FL 13 FL 13 FL 13 2 hours at ––– 24 hours minimum Retest for
Type I 65 to 80 F at 60 to 100 F appearance,
or potlife and shear
20 to 60 minutes strength at room
at 250 F temperature.
or
130 minutes
at 160 F
or
180 minutes
at 120 F
BMS5–123 FL 13 FL 13 FL 13 FL 13 3 to 4 min. ––– 20 to 40 minutes Retest for
Type I below at 65 to 100 F appearance and
Class 2 100 F shear strength at
24 hours.
FL 1 When necessary to reduce viscosity to aid deaeration, heat the mixed compound to 140 F
maximum before pouring. Since heating reduces pot life, pour in place immediately. Deaeration
is required except for potting into honeycomb sandwich panels including edges and inserts (see
Section 8.1.1f.).
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Flagnotes (Continued)
FL 2 Gel time is approximately 1 hour at room temperature for 500 gm batch. Allow material to gel at
room temperature and if material has shrunk or settled below required level, add
additional material.
Precure for 24 hours nominal at room temperature or in accordance with Figure 1 to

provide sufficient hardness for machining. Before placing parts in service, complete cure
by one of the following methods:
Method I Cure potting in accordance with BAC5317 and BAC5317–2 separately or

concurrently with part layup.
Method II Cure potting in accordance with BAC5317 and BAC5317–3 separately or
concurrently with part layup.
Method III Cure for 1.5 hours minimum at 260 ± 15 F or 1 hour minimum at 350 ± 15 F
Method IV Cure seven days at room temperature. This cure is applicable only when
potting is done after the part is cured, and shall be specifically called out on the
Engineering drawing.
FL 3 For extended storage of mixed materials, see Table II.
FL 4 Cure for 7 days at ambient temperature. Cure may be staged if co–curing with a fabricated part
by an initial cure for 8 hours at ambient temperature (or for 1.5 hours at 150 F) then a full cure for
1.5 hours at 260 F (or 1 hour at 350 F).
FL 5 Sometimes called pot life. See work life definition. Material should be in place before it reacts
and gets hot. Material left in the container may become too thick for intended use. Large
quantities, such as a quart or pint, may get hot faster. Usually the gel time required by BMS5–28
is listed.
FL 6 Combine Parts A and B in accordance with manufacturer’s recommendations. Thoroughly blend

the two components within 6 minutes of mixing. Work life of 50 gm of the mixed potting
compound at room temperature is 60 minutes, maximum.
FL 7 BMS5–28, Type 6, potting compound shall not be used unless specified on the Engineering
drawing. It is 270 percent heavier (higher density) than BMS5–28, Types 15 through 20.
FL 8 Test in accordance with the appropriate BMS5–28.
FL 9 Accuracy for temperatures shall be ± 10 F. Maximum allowable heat–up rate of material is

5 to 7 degrees per minute for cures over 200 F. For secondary curing of parts, do not exceed the
original cure temperature of the part. When curing 250 F structure, do not exceed 160 F unless
envelope bagged and restrained to a support tool. When curing 350 F structure, do not exceed
210 F unless envelope–bagged and restrained to a support tool. The cure times are minimum
unless otherwise specified.
FL 10 Cure at 65 F minimum for 24 hours minimum, or in accordance with Figure 1 for elevated
temperature cure, or cure material to a state that is hard enough to machine and be acceptable
for further processing.
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ECCN 1E994
Flagnotes (Continued)
FL 11 The compression test for BMS5–28, Type 6 shall be run at room temperature after a 60 minutes
minimum cure at 350 ± 10 F.
FL 12 Type 6 potting compound may be cured using any of the following schedules:
(1) Allow potting compound to gel at room temperature followed by 30 minutes minimum at
200 ± 15 F and then 1 hour minimum at 260 ± 15 F.
(2) Cure for 7 days nominal at room temperature.
(3) Cure in accordance with Figure 1 plus 6 days minimum at room temperature.
(4) Allow potting compound to gel at room temperature followed by 1 hour nominal at 350 ± 15 F.
150
TEMPERATURE (F)
140 .
130
..
120
.
110
.
.
100 .
.
.. .
90 . . .
80 .
0 2 4 5 8 10 12 14 16 18 20 22 24
MINIMUM HOURS
NOTE: Curing shall be performed in warm circulating air. Material shall gel at room
temperature (30 minutes minimum) prior to exposure to temperatures
above 110 F.
NOTE: Initial cure of 24 hours nominal at 80 ± 15 F is preferred. For other conditions

use Figure 1 except where actual data exists and is documented in Table I or
Section 8.3.
NOTE: Parts requiring further processing such as machining may be cured in

accordance with Figure 1 prior to machining. They may then be machined. A
period of 6 days shall elapse after curing before parts are placed into service.
FIGURE 1 INITIAL CURE SCHEDULE
FL 13 See BSS7002
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8.1.2 EXTENDED STORAGE OF BLENDED MATERIALS
The storage life of blended compounds may be extended by freezing in accordance

with Table II.
a. Place blended potting material in a clean, 1 quart (or less) container not more than
5 minutes after mixing. Immediately seal and place the filled container in a storage
cabinet maintained at temperatures indicated in Table II. Package and label blended
compound in accordance with Section 5.4. Do not use paper containers that may
transfer foreign matter to the compound.
b. Refrigerate blended and deaerated compounds as follows:
(1) Refrigerate large batches (500 gm and over) not more than 5 minutes from start
of blending and not more than 20 minutes for smaller batches.
(2) Refrigerate as indicated in Table II.
c. The frozen material shall be thawed by setting it out at room temperature (65 to 85 F)
for approximately 1.25 hours. The work life of the freshly thawed material is
approximately 10 to 15 minutes less than freshly mixed material.
d. Discard excess thawed material – do not refreeze.
TABLE II FROZEN STORAGE OF BLENDED COMPOUND
STORAGE STORAGE TIME

BMS5–28 TYPE TEMPERATURE (F) (MAX)
1 FL 1 Below –40 21 days
6 Below –30 5 days
9 FL 2 FL 4 Below –30 5 days
28 FL 2 Below –30 5 days
BMS5–92 Type I, Below –40 42 days
(BAC5010, Type 70) FL 1 FL 3
FL 1 Quick freeze the cartridge of compound by packing it in finely divided dry ice at least
20 minutes. As an option, submerge sealed container in a fluid bath cooled to at least –
40 F for at least 10 minutes.
FL 2 Freeze not more than 5 minutes after blending. Store as two inch nominal thick (or less)
patties in air–tight polyethylene bags. Do not stack patties until frozen. Reduce available
work life by approximately 15 minutes.
FL 3 BMS5–92, Type I that has been frozen shall be used for edge potting only.
FL 4 Patties may be stored at temperatures above the minimum storage temperature required,
but below 32 F for a maximum of 4 hours prior to work life, which begins immediately
when taken from cold storage. Do not refreeze.
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ECCN 1E994
8.2 WORK LIFE
For compound work life, see Table I and definitions.
Work life is a guide to prevent the gelling of potting before necessary cavity filling and
wetting of substrate surfaces are accomplished. Receiving and inspection gel data may
be used to obtain a more specific work life.
8.3 APPLICATION METHODS
8.3.1 GENERAL METHODS
a. Injection
(1) Inject the potting compound with an injection gun such as a pneumatic gun with
(a) a disposable inner chamber,
(b) an air valve which releases the pressure on the potting compound, and
(c) a disposable plastic nozzle. Example: Semco Sealant Gun No. 250–6
and accessories.
(2) Extrude enough material to clear entrapped air (2 to 3 inches is usually

sufficient). Keep the tip of the nozzle submerged slightly below the surface of the
potting compound to reduce splattering of material during air evacuation.
b. Trowelling
(1) Trowel paste compounds with a spatula, using care to prevent air pockets.
(2) Excess potting compound shall be removed from surfaces, such as floor panel
edges, prior to cure. The resulting potted surfaces require smoothing prior
to cure.
c. Potting into Core
(1) Hand Application:
Mask the area to be potted. Press blended potting compound into the core using
a spatula or similar tool. Use an excess of potting and enough pressure to
thoroughly fill the cells.
(2) Pour Application:
Apply FEP (Section 5.2.4) and peel ply (Section 5.2.3) to tool and locate core.
Mask the area to be potted.
Apply weights on top of the core to maintain contact between the core and tool.
Blend a slight excess of potting compound and pot area. The use of a dam is
optional. Vacuum may be used if the liquid is too viscous. For vacuum assist
see Section 8.3.1c.(3). Heat is not recommended.
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ECCN 1E994
8.3.1 GENERAL METHODS (Continued)
(3) Vacuum Assist Application
Mask the area to be potted and apply an excess amount of potting compound.
Vacuum bag the part. Apply enough vacuum to draw the potting into the cavity or
core cells.
Sweep the exterior of the bag and completely fill depressions. Some
redistribution of potting may be required.
Remove excess potting prior to cure.
8.3.2 METHOD A – PREPOTTING OF FASTENER HOLES
a. Mask off the area adjacent to the insert location to protect it during
subsequent operations.
b. Cut a hole 1.8 ± 0.1 times the maximum diameter of the insert in the face of the
honeycomb sandwich panel.
c. Remove loose facing and core material from the hole.
d. Mix potting compound in accordance with Section 8.1.1.
e. Fill the hole with a slight excess of the potting compound.
f. Cure in accordance with Section 8.5 and Table I.
g. Sand or machine the potting compound flush with the face of the panel.
h. Drill the potting compound to the proper hole size as specified on the Engineering
drawing. Install the insert maintaining an edge margin (distance from the center of
the insert to the edge of the potting compound) of 0.9 times the maximum diameter of
the insert ± 0.1 inch.
OPTION: When prepotting is required, prepotting in layup may be done in lieu of

potting after cure. Fill the core cells in the area specified with BMS5–28
potting compound to the full depth of the core. Do not over fill the core.
The potting compound will be specified on the Engineering drawing.
When the potting compound is not specified, use BMS5–28 Type 9, 15,
16, 17, or 18 (room temperature cure) or BMS5–28 Type 10 (260 F cure).
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8.3.3 METHOD B – WET POTTING OF INSERTS
Use BMS5–28, Types 18, 19 or 20 for insert potting. BMS5–28, Type 30 may be used for
insert potting in honeycomb core sandwich panels. BMS5–28, Type 30 shall not be used
with foam core. For floor panel production, use BMS5–28 materials or BMS5–123,
Type I, Class 2.
8.3.3.1 Hole Preparation
8.3.3.1.1 General
a. Drill hole to size in accordance with Table III or by manufacturer’s recommendation.
b. Deburr face sheet for through holes to remove ridges caused by drilling to allow
insert tab to seat flush to panel surface.
c. Drill holes so that the hole depth of edge mounted insert is at least 0.25 inch beyond
the insert length.
d. Finish cutting may be accomplished with a hand cutter mounted in a drill motor to
bring the hole to the proper depth or to remove interfering core materials, provided
hole dimensions remain within tolerance.
e. Insert holes shall be free of face sheet material including burrs or loose skin, and
other material which would interfere with proper seating of the insert or prevent the
flow of potting around the insert.
f. Remove loose particles, including dust, from the hole using a suitable method such
as compressed air of less than 30 psi.
ÈÈÈÈÈ
ÈÈÈÈÈ
If compressed air (Section 6.4) is used, use with effective chip
WARNING guarding and eye protection to protect from flying particles.
g. Do not clean inserts unless they are contaminated with oil, grease, or similar
bond–inhibiting substances or particles that would prevent proper bonding of the
insert. Solvent clean in accordance with BAC5750. Gauze moistened with an
approved solvent may be used. Gloves (Section 5.2.5) may be worn when potting
inserts.
Handling inserts with bare hands may result in contamination that

CAUTION could reduce the adhesion of the potting compound to the
insert–bonding surface.
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ECCN 1E994
8.3.3.1.1 General (Continued)
TABLE III HOLE SIZES FOR INSTALLING INSERTS
BASIC PART NUMBER

INSTALLATION
BACI SHUR– NAS DELRON INSERT DASH NUMBER HOLE SIZES TYPE OF
NO. LOK NO. NO. NO. (THREAD SIZE) (INCHES) HOLE
12AA SL 601 1832 2177 06, 08, 3 FL 1 FL 2 0.561 to 0.566 Blind
4, 5 0.686 to 0.691
6 0.842 to 0.847
12AB SL 602 1833 2257 06, 08, 3 0.561 to 0.566 Through
4, 5 0.686 to 0.691
6 0.842 to 0.847
––– SL 603 1834 2248 06, 08, 3 0.561 to 0.566 Through
4, 5 0.686 to 0.691
6 0.842 to 0.847
––– SL 604 1834 2256 06, 08, 3 0.561 to 0.566 Through
4, 5 0.686 to 0.691
6 0.842 to 0.847
12AC SL 606 1835 2178 08, 3 FL 2 0.686 to 0.691 Blind
4 0.749 to 0.755
5 0.811 to 0.817
6 FL 3 0.874 to 0.880
12AD SL 607 1836 2395 06, 08, 3 FL 1 FL 2 0.452 to 0.457 Blind
4 0.499 to 0.504
––– SL 611 ––– ––– 06, 08, 3 0.561 to 0.566 Blind
4 0.686 to 0.691
––– SL 616 ––– ––– 06, 08, 3 0.686 to 0.691 Blind
––– SL 618 ––– ––– 06, 08, 3 0.561 to 0.566 Blind
––– SL 626 ––– ––– 06 0.436 to 0.441 Blind
08 0.499 to 0.504
––– SL 629 ––– ––– 3 0.686 to 0.691 Blind
––– SL 644 ––– D139HE 04, 06, 08, 3 0.452 to 0.457 Blind
295
4 0.499 to 0.504
––– SL649A3– ––– ––– 3 0.655 to 0.661 Blind
250
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TABLE III HOLE SIZES FOR INSTALLING INSERTS (Continued)
BASIC PART NUMBER

INSTALLATION
––– SL 2334 ––– ––– 06, 08, 3 0.562 to 0.565 Blind
4 0.687 to 0.690
5 0.812 to 0.815
6 0.937 to 0.940
––– SL 2748 ––– D114HE 06 0.311 to 0.317 Blind
08 0.342 to 0.348
3 0.392 to 0.398
––– SL 2790 ––– ––– 06, 08, 3 0.452 to 0.457 Through
––– SL 2820 ––– ––– 06, 08 0.452 to 0.457 Blind
––– SL 2821 ––– ––– 06, 08, 3 0.686 to 0.691 Through
––– SL 2853–2 ––– ––– None 0.751 to 0.756 Through
––– SL 2853–3 ––– ––– None 0.751 to 0.756 Through
––– SL2868 ––– ––– 06 0.561 to 0.566 Through
–SO6
–500
––– SL ––– ––– 3 0.561 to 0.566 Through
2686S3–5
00
––– SL 2869 ––– ––– 06, 08, 3 0.561 to 0.566 Blind
––– ––– 4, 5 0.686 to 0.691
––– SL 2884 ––– ––– 1/4 Turn 0.812 to 0.817 Blind
FL 4
––– SL 2899 ––– ––– 06 0.311 to 0.317 Blind
––– ––– 08 0.342 to 0.348
––– ––– 3 0.392 to 0.398
––– SL 2912 ––– ––– 06, 08, 3 0.561 to 0.566
––– ––– 4 0.686 to 0.691 Through
––– SL 2992 ––– ––– 3 0.676 to 0.681 Through
A3–267
––– SL 3047 ––– ––– 06, 08 0.452 to 0.457 Blind
––– ––– 3 0.499 to 0.504
––– ––– 4 0.624 to 0.629
––– SL 3089 ––– ––– 06, 08 0.594 to 0.599 Blind
––– ––– 3 0.686 to 0.691
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ECCN 1E994
TABLE III HOLE SIZES FOR INSTALLING INSERTS (Continued)
BASIC PART NUMBER

INSTALLATION
––– SL 6013 ––– ––– 06, 08 0.594 to 0.599 Blind
––– ––– 3 0.686 to 0.691
––– SL 6022 ––– ––– 06, 08 0.594 to 0.599 Blind
––– ––– 3 0.686 to 0.691
––– SL 6061 ––– ––– 06 0.311 to 0.317 Blind
––– ––– 08 0.342 to 0.348
––– ––– 3 0.392 to 0.398
––– SL 6063 ––– ––– 3 0.452 to 0.457 Blind
––– ––– 4 0.499 to 0.504
––– SL 6065 ––– ––– 3 0.686 to 0.691 Blind
FL 1 DELRON –1 thread size is equal to SHUR–LOK–06
FL 2 DELRON –2 thread size is equal to SHUR–LOK–08
FL 3 –6 thread size not available from DELRON 2178 insert
FL 4 Designates snap–in type. Insert generally distinguished by a shoulder that slips past the top skin
of a sandwich panel. Inject 100 percent of the required amount of potting compound into the hole
and install the insert into the prepared hole. See Figure 2, Figure 3 and Figure 4. Use BMS5–28,
Type 18, 19 or 20.
8.3.3.1.2 Blind Inserts
a. Hole depth shall be greater than the insert length, so the inserts do not come in
contact with the opposite face.
b. Presence of honeycomb core in the bottom of a blind hole is permitted if honeycomb

core is not crushed into the bottom of the hole or does not interfere with the flush
seating of the insert, thereby preventing the flow of the potting compound.
c. Core materials may be removed from the bottom of a blind hole, provided the
process does not cause skin damage or permanent dimpling on a decorative surface.
OPTION: When inserts are to be potted into both sides of a sandwich panel, the
blind holes on either side (but not both sides) may be replaced by through
holes making it possible to drill all insert holes from one side of the panel.
However, do not drill through a decorative panel except where the
drawing calls for an insert or hole on that surface. This method shall not
be used on floor panels.
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ECCN 1E994
8.3.3.2 Installation of Blind Inserts
Installation of blind inserts in through–holes is allowed in non–decorative areas.

Installation procedure Section 8.3.3.2a. through h. shall be followed. A rear side dam
(tape) shall be provided when potting inserts in through–holes (see Figure 4).
a. Examine holes for proper size and quality.
b. When pre–kitted potting compounds are used, Semco kits, discard approximately the
first 3 inches of material that is extruded out of the nozzle before potting inserts.
c. Prefill holes with enough potting compound to ensure that when insert is installed the
bottom of the insert will be immersed into the potting.
d. Before the initial gel time is achieved, push insert into the hole by applying even
pressure across the insert–tab until it is flush with the surface and complete
Section 8.3.3.2e. and f.
e. Inject potting compound into the hole of the insert tab until approximately a 0.25 inch
uninterrupted stream of potting compound is expelled through the other hole.
f. Inject potting compound into the opposite insert tab hole until approximately a
0.25 inch uninterrupted stream of potting compound is expelled through the
other hole.
g. Examine the insert to ensure that it is flush (+0.02/–0.00 inch) with the panel surface
and that surfaces are clean of potting compound.
h. Inserts shall be potted in a horizontal panel only in a downward direction. Only

BMS5–28, Types 18, 30 or BMS5–123, Type 1, Class II (see Section 8.3.3.5) may be
used for insert potting when the panel is oriented vertically.
8.3.3.3 Installation of Through Inserts
a. Examine holes for proper size and quality.
b. Install the insert to seat flush to the panel surface (see Figure 3).
c. When pre–kitted potting compounds are used, such as Semco kits, discard
approximately the first 3 inches of material that is extruded out of the nozzle before
potting inserts.
d. Inject potting compound into the hole of the insert tab until approximately a 0.25 inch
uninterrupted stream of potting compound is expelled through the other side.
e. Inject potting compound into the opposite insert tab hole until approximately a
0.25 inch uninterrupted stream of potting compound is expelled through the
other hole.
f. For through–inserts that do not match with panel thickness to within +0.02/–0.00 inch,
use the same insert listed in engineering except adjust grip length as needed to
insure it is flush with panel to within the tolerance specified above unless otherwise
specified on the engineering drawing. A rear side dam may be provided when potting
inserts in through holes (see Figure 3).
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ECCN 1E994
8.3.3.4 Nonsnap–in Inserts
For nonsnap–in inserts, inject potting compound through one hole in the alignment tab
until compound extrudes from the other hole. When a panel is installed vertically, the
holes of the potting ports shall be aligned vertically to insure complete potting of the core
material surrounding the insert.
8.3.3.5 Alternate Material
For floor panel production, BMS5–123, Type I, Class 2 may be used in place of other
BMS materials. BMS5–123, Type I, Class 2 may be used in place of BMS5–28 potting in
Method B, but only when required and as follows:
a. Rework in accordance with Section 8.6
b. Where insert fasteners need to be torqued in less than 24 hours and where the depth
of the insert is installed perpendicular to the plane of the sandwich in a foam edge.
For example the hinges on closets and stowage boxes.
c. Use of BMS5–123 is restricted because it is approximately twice as heavy as the

BMS5–28 materials. BMS5–123 has 3 to 4 minutes pot life and cures in 20 to
40 minutes at 65 to 100 F. When using BMS5–123 material in a side by side
cartridge, dispense adhesive and visually verify that both sides of the cartridge are
flowing evenly and freely. Purge the tip by dispensing and discarding a bead
approximately equal to the length and diameter of the mixing nozzle. Repeat the
process each time a new tip is used. Also, upon use of a new cartridge it is
mandatory that a new tip be attached and fully purged.
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ECCN 1E994
8.3.3.6 Preparation For Cure
a. Excess potting compound on part surface shall be removed. Solvent clean in

accordance with BAC5750. An approved solvent may be used on fiberglass or paper
base laminate surfaces for removing traces of potting material. Decorative laminate
surface may be protected from contamination by masking tape, and solvent cleaning
if needed.
b. Alignment tabs, protective tape, or et cetera shall be removed after extruded potting
is firm to the touch. Tab removal shall not disturb the seating of the insert.
c. The potting compound shall be cured in accordance with Section 8.5 and Table I.
POTTING PORTS
TAB (NAS1837)
INSERT
POTTING
COMPOUND
PANEL
FIGURE 2 ILLUSTRATION OF TYPICAL BLIND INSERT INSTALLATION
FIGURE 3 ILLUSTRATION OF TYPICAL THROUGH INSERT INSTALLATION

POTTING PORTS
TAB (NAS1837)
INSERT
POTTING
COMPOUND
PANEL
DAM
FIGURE 4 ILLUSTRATION OF TYPICAL BLIND INSERT INSTALLATION IN THROUGH HOLE
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ECCN 1E994
8.3.4 METHOD C – EDGE POTTING
8.3.4.1 Rigid Potting Compound
a. Rout the core from the edge of the panel to the required depth for either honeycomb
or foam core.
b. Completely fill the channel with potting compound.
BMS5–28, Type 9, 18, 24, 28. Type 28 is recommended as a replacement for Type 9
where improved flammability properties are important. A sweep or rubber glove
dampened with water may be used to smooth Type 9 or 28 potting after it is packed
into the edges. Excess potting may be cleaned from panel surfaces with hot soapy
water before the potting compound cures.
c. Cure the potting compound in accordance with Section 5 and Table I.
OPTION: When the potting compound is not specified on the Engineering drawing,
rigid foam may be used in lieu of the BMS5–28 potting compound in
accordance with Section 8.3.4.4.
8.3.4.2 Flexible Potting Compound
The materials described in the following method are intended for airplane exterior
applications and shall not be used unless specifically called out on the
Engineering drawing.
a. For panels with square (80 to 90 degrees) edges, rout the core to the depth
equivalent to the thickness of the panel. For panels with beveled (less than
80 degrees) edges, rout to the depth specified within 0.05 inch of inner surface of
face sheets. Otherwise rout core 0.03 inch to 0.06 inch deep and within 0.05 inch of
the inner surface of the face sheets.
b. Prepare potting compounds as follows (see Section 8.1.1e. for blending):
(1) BMS5–92, Type I (Section 5.1.1b.) (BAC5010, Type 70) (EC 2216 A/B) with
phenolic microballoons (Section 5.1.2a.). Dry the microballoons at 125 to 350 F
for 30 minutes +10/–0 minutes, until there is no more than 0.2 percent weight
loss on successive weighing.
Blend the A and B components of EC 2216 in accordance with BAC5010, Type

70, and then add fifteen parts by weight of microballoons to one hundred parts by
weight of blended EC 2216 and blend thoroughly.
(2) BMS5–28, Type 26
Thoroughly blend the A and B components in accordance with the

manufacturer’s instructions. Blended components may be stored in accordance
with Section 8.1.2. Up to 5 percent by weight of Cab–O–Sil (Section 5.1.2b.) or
Microballoon fillers may be mixed with the blended BMS5–28, Type 26 to
improve the handleability of the material. Mixed material shall
appear homogeneous.
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ECCN 1E994
8.3.4.2 Flexible Potting Compound (Continued)
c. Fill routed edges and expose core cells with above potting compound. The exposed
surface of the potting compound shall be smooth, flat and flush with the edges of the
panel face sheets.
d. Cure the potting compound in accordance with the requirements of BAC5010,

Type 70, or BMS5–28, Type 26 in accordance with Section 8.5 and Table I. Protect
from damage until cured. Exposed core edges on the surface of the cured potting
compound are acceptable if they are flush with the surface.
8.3.4.3 Metal Edge Trim Application
When the Engineering drawing specifies application of metal edge trim, use the
following procedure:
a. Rout the core from the edge of the panel in accordance with drawing requirement or
1.00 inch long (minimum) by 1.00 inch deep ± 0.12 inch. Rout within 0.06 inch of the
inner surface of each face.
Locate screw/potting 1.50 inches ± 0.50 inch in panel edge from each end of trim.
Place equally spaced (8.00 inches maximum) screw/potting locations between the
end positions. (Utilize largest equal spacing possible up to 8.00 inches.)
b. Fill the routed edge with potting compound. If potting compound is not specified on
Engineering drawing, use one of the following materials.
BMS5–28, Type 9, 24, 28. Type 28 is recommended as a replacement for Type 9

where improved flammability properties are important. A sweep or rubber glove
dampened with water may be used to smooth Type 9 or 28 potting after it has been
packed into the edges. Excess potting may be cleaned with hot soapy water from the
panel surface before it has been cured. Do not allow water into or behind
potting compound.
c. Cure the potting compound in accordance with Section 8.5, Table I.
d. Attach the metal edge trim specified by the Engineering drawing using 3/4 inch long,
self–tapping screws (specified by the Engineering drawing) installed within 0.10 inch
of the center of the potted sections, along the edge of the panel.
OPTION: Panel edges may be potted in accordance with Section 8.3.4.3b. and trim
may be installed by bonding in accordance with BAC5010 Type 71 in lieu
of the above. Panels with existing edge potting or existing edge foam
may have trim installed by bonding in accordance with BAC5010 Type 71
in lieu of the above.
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ECCN 1E994
8.3.4.4 Rigid Foam Edge Closeout
a. When the potting compound is not specified on the Engineering drawing, BMS8–133
Type I, Grade 18, or 20 rigid foam may be used in lieu of potting compound. Use a
strip of foam with a width equivalent to the thickness of the panel. Foam may be
applied as a core–to–foam joint or as an insert into a routed edge of a cured panel.
The cure temperature shall not exceed 260 F nominal.
b. For core–to–foam joint application, butt foam against core. When fabricating to
BAC5565, use no adhesive. For all other processes use BMS8–193, Type I film
adhesive allowing gaps of not more than 0.06 inch unless specified on the
Engineering drawing. Apply panel skins and cure in accordance with applicable
panel process specification.
c. For routed edge insert of cured panel, bond foam strip into routed edge in
accordance with BAC5010, Type 70 (BMS5–92, Type I) adhesive. The cure
temperature shall not exceed 260 F nominal.
8.3.5 METHOD D – JOINT POTTING
8.3.5.1 Square Corner Joining
a. Notch the edge of the panels as shown in Figure 5. When using the notching shown
in Figure 5(c), overlap the butting edge by an amount no less than the thickness of
the facing material and no greater than 0.063 inch.
t/2 min. t/2 min.
t/2 or 0.250 in. min.
t
t t
(a) t/2 or 0.250 in. min. (b) t/2 or 0.250 in. min. (c)
Potting Potting t/2 min.

Compound Compound
t/2 min.
t/2 min.
t/2 min.
t
t
(d) (e)
FIGURE 5 POTTED JOINTS FOR SQUARE CORNERS
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ECCN 1E994
8.3.5.1 Square Corner Joining (Continued)
b. Clean the excess core material from the notch. For nomex core panels, remove any
paper that is blocking the opened cells from the inside of the notch. Low pressure air
(Section 6) may be used to blow the loose material from the notch. Avoid damage to
the panel.
c. If no holding fixture is available, join the parts using masking tape as shown in
Figure 6. Press the masking tape to the panel of the entire length of the joint. When
fabricating joints as in Figure 5(e), mask off nonmating surfaces as necessary to
protect from contamination by potting compound and carefully remove Tedlar from
mating surfaces by light sanding. Care shall be taken during Tedlar removal to hold
damage of glass fiber reinforcement to a minimum.
2 in. nominal
Wide Masking
Panels
Butted
FIGURE 6 OPTIONAL JOINING METHOD
d. Force the potting compound into the notched areas of the panel. Be sure that all
open cells are filled on honeycomb core panels. Fill the joint completely, leaving a
slight excess of potting compound. When not specified on the Engineering drawing,
the following potting compounds are recommended: BMS5–28, Types 15
through 20.
e. Fold the two panels inward until the proper angle is obtained or assemble the parts
using the appropriate holding fixture.
f. Clean excess potting compound from the panel using a suitable scraper that will not
scratch faces. Solvent cleaning in accordance with BAC5750 using clean gauze
pads dampened with solvent may be used to facilitate removal of excess potting
compound. Do not allow solvent to contaminate the potting compound in the joint.
g. Cure the potting compound in accordance with Section 8.5 and Table I.
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ECCN 1E994
8.3.5.2 Round Corner Joining
a. Cut the panel, as a minimum, as shown in Figure 7 unless the Engineering drawing
specifies the depth of cut. Core removal shall not cause skin damage or permanent
dimpling on a decorative surface.
0.12 t min. t = panel thickness
FIGURE 7 PANEL CUT–OUT FOR ROUND CORNER
b. Clean the excess core material from the notch. For nomex core panels, remove any
paper that is blocking the opened cells from the inside of the notch. Low pressure air
(See Section 6) may be used to blow the loose material from the notch. Avoid
damage to the panel.
c. Force the potting compound into the notched areas of the panels. Be sure that all
open cells are filled on honeycomb core panels. Fill the joint completely, leaving a
slight excess of potting compound. When potting compounds are not specified on
the Engineering drawing, use the following: BMS5–28, Type 9, Types 15 through 20,
or Type 28.
d. Fold the panel to form the radius on the Engineering drawing.
e. Clean excess potting compound from the panel using a suitable scraper that will not
pads dampened with an approved solvent may be used to facilitate removal of
excess potting compound. Do not allow solvent to contaminate the potting
compound in the joint.
f. Cure the potting compound in accordance with Section 8.5 and Table I.
8.3.5.3 Standard T Section Joining
a. Trim panels to the approximate size required and pre–fit to ensure contact along the
full length of the bond line. Panel edges may be sanded to ensure proper fit. Do not
sand panel surfaces.
b. For nondecorative, faced panels, preassemble the parts in accordance with the
Engineering drawing and scribe lines onto the flat panel with a sharp, pointed tool
using the butting panel as a guide.
c. For decorative parts, the distance between scribe lines shall be equal to the
thickness of the butting panel minus the sum of 0.015 inch and the thickness of the
facings. The tolerance allowed for the distance between the scribe lines shall be
– 0.020 inch to + 0.015 inch. The butting panel should overlap the mating panel to
produce a joint with no gaps or void areas on the decorative face.
d. Cut the panel facing cleanly through to the core along each scribe line, taking care to
minimize damage to the core.
e. Peel the facing from the panel between the cut lines as shown in Figure 8.
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ECCN 1E994
8.3.5.3 Standard T Section Joining (Continued)
ÂÂÂÂÂ
ÂÂÂÂÂ
ÂÂÂÂÂ
FIGURE 8 PREPARATION OF T SLOT
f. Reassemble the panels and trim as necessary to ensure proper fit. Do not cut or
remove core.
g. Notch the edge of the butting panel in accordance with the Engineering drawing. If
the drawing does not specify cut–out size, then notch the edge to a minimum depth
and width equal to half the panel thickness. The core may be removed to within
0.063 inch of the inner surface of each face.
h. Force the potting compound into the notched and exposed core of both panels. Fill
all open cells completely leaving a slight excess of potting compound.
i. Assemble the parts as shown in Figure 9. When assembly jigs or holding fixtures are
not available, metal angles or wood blocks shall be used with holding clamps to
retain proper alignment of panels during cure.
OPTION: Metal or wood holding tools or blocks may be treated with release agent
to facilitate their removal after the potting compound has cured.
Sand this edge

only
Fill with
Potting
Compound
Decorative
(a) Surfaces
(b) (c)
FIGURE 9 POTTED T JOINTS
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ECCN 1E994
8.3.5.3 Standard T Section Joining (Continued)
j. Clean excess potting compound from the panel using a suitable scraper that does not
pads dampened with solvent may be used to facilitate removal of excess
potting compound.
k. Cure the potting compound in accordance with Section 8.5 and Table I.
l. Any potting compound that has hardened on the panel surface may be removed with
a scraper or by sanding. Take care not to damage the fiberglass panel facing when
hardened potting compound is removed.
8.3.6 METHOD E – INSTALLATION OF SELF–TAPPING SCREWS
NOTE: This method is for screws with a major diameter of 0.25 inch maximum.
a. Drill a 0.5 inch minimum diameter blind hole in the face of the panel to a depth
sufficient to totally encase the screw when installed.
b. Fill the hole with potting compound leaving a slight excess.
c. Cure the potting compound in accordance with Section 8.5 and Table I.
d. Sand or machine the potting compound flush with the face of the panel.
e. For ASME B 18.6.4 Type D, F, G and T thread cutting tapping screws, drill
interference hole in center of potted hole in accordance with Table IV.
f. For ASME B 18.6.4 Type A thread forming tapping screws, no pilot hole is required.
Tap the screw into the center of the potted hole maintaining an edge margin
(distance from the center of the screw to the edge of the potting compound) of
0.25 inch minimum.
TABLE IV HOLE DIAMETERS FOR SELF–TAPPING SCREWS
MAXIMUM HOLE
SCREW SIZE – DIAMETER (INCHES)
THREADS PER INCH FL 1
2 – 56 0.076
4 – 40 0.093
6 – 32 0.116
8 – 32 0.144
10 – 24 0.161
10 – 32 0.166
1/4 – 20 0.228
FL 1 Use nearest smallest drill size.
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ECCN 1E994
8.3.7 METHOD G – POTTING BONDED ASSEMBLIES FOR INSTALLATION OF FASTENERS
a. Mask off the area adjacent to the insert location to protect it during
subsequent operations.
b. Locate and drill a pilot hole in the panel to the tolerances called out for the fastener
on the Engineering drawing.
c. The core material in the area to be potted shall be severed and removed without
damaging the adjacent core. Particles that cannot be removed without causing
damage are acceptable if they can be completely imbedded in the potting compound.
The Engineering drawing shall specify the diameter of the core to be removed.
d. The panel shall be completely filled with potting compound. A slight amount of
excess resin may be allowed to compensate for slumping and air pockets. Distorted
cells in the periphery of the core removal shall be supported with potting compound.
A bleeder hole 0.069 inch to 0.074 inch in diameter may be drilled through one
facesheet within the area to be potted. The center of the bleeder hole shall be
0.06 inch to 0.09 of an inch just inside the radius of the area to be potted. The
bleeder hole shall be drilled in the facesheet opposite the fastener head except when
a structural member is bonded to that face. The bleeder hole shall be flush with the
facesheet surface after cure.
e. Cure the panel in accordance with Section 8.5 and Table I.
f. Drill the potted fastener hole to the diameter specified on the Engineering drawing.
Check the hole for defects.
8.4 IN–PROCESS TESTING
8.4.1 ALL METHODS
a. When utilizing two–part potting materials, shop personnel shall perform a check on
consistency of mixing and cure. Test hardness of the dispensed materials in
accordance with the frequency established by Quality Assurance and the procedures
of Section 12.3. (This does not apply to material dispensed from small tubes such as
Semco tubes):
b. For meter/mix dispensing only, purge the dispenser in accordance with the
instructions attached to the dispenser. Using a full pump stroke of material, cast
two bars approximately equal volume or cast one pump stroke in a continuous
application.
c. For manual mixing from bulk, cast two bars of approximately equal volume.
d. Configuration of test bar mold, of a length of at least 5 inches shall be maintained so

that at least one clean flat surface is maintained to measure hardness. A U–shaped
pattern can be extruded onto an aluminum plate with a cross–section of
approximately 1 inch wide by approximately 0.3 inches high.
e. To assure a proper cure or mix/cure of the material, take hardness readings in

accordance with Section 12.3.
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ECCN 1E994
8.4.2 TESTING SPECIFIC TO METHOD B
a. Process control panels shall be prepared in accordance with Section 8.7, tested in
accordance with Section 12.1 to the requirements of Section 11.2.1.
b. If test failures occur, examine the test specimen for sufficient potting in accordance
with Section 12.4.
8.5 CURE
a. Gel potting compounds at 75 ± 10 F before elevating temperature to cure. For gel

times see BMS5–28. Room temperature gelation is not required for types 12, 13, 14,
27, and 30 before elevating cure temperature.
b. Potting compounds shall be cured in accordance with Table I.
c. To achieve a cure sufficient to machine or sand, use initial cure conditions of Table I.
Where no initial cure data exists, use Figure 1. Hardness may be tested in
accordance with Section 12.3 to assure sufficient initial cure. Values measured at
room temperature shall be higher than those indicated in Table IX. Inserts potted
with Types 18 and 30 may be torqued when cured to an initial cure state in
accordance with Figure 10 and Figure 11.
d. Protective tape shall be used over potted inserts if the room temperature gel step is
omitted before curing at elevated temperatures.
e. Before applying mechanical stress to the potting compound, it shall undergo a full
cure as given in Table I with the exception stated in 8.5c.
f. Initial cure time may be considered as part of the full cure time.
g. Figure 10 and Figure 11 may be used as an alternative to the cure data for Types 18
and 30 found in Table I with the restrictions stated on the figures. Cure time shall
begin when all potting compounds are at or over the cure temperature.
h. To use Figure 10 and Figure 11 for the following cases:
(1) To find the time to reach Initial Cure or Full Cure at any temperature, do the
following:
(a) Extend a vertical line at the desired temperature into the region marked “Full
Cure” or “Initial Cure”.
(b) The corresponding time is the time required to reach full or initial cure, at that
temperature.
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ECCN 1E994
8.5 CURE (Continued)
(2) When parts are held for a period of time at ambient conditions, the parts will cure
at a slow rate. A credit can be given for this time to reduce the oven cure time.
Do the following:
(a) Draw a vertical line (A) upward from the Temperature axis at the ambient
temperature to intersect with a horizontal line (B) at the length of time parts
are held at ambient temperature before cure.
(b) At this intersection draw a line (C) parallel to the “Degree of Cure” line to
intersect with the vertical line (D) at the oven cure temperature.
(c) Draw a horizontal line (F) from the intersection of lines (C) and (D) to the
Time axis.
(d) Draw a horizontal line (E) from to the intersection of line (D) and a point
98 percent cure or higher to the Time axis.
(e) The difference between the times indicated by lines (E) and (F) is the
minimum time to reach Full Cure.
NOTE: This procedure also applies to where the cure is started at one
temperature and complete at higher temperature.
(3) When parts are cured to an initial cure at an elevated temperature then allowed
to Full Cure at ambient temperature, do the following:
(a) Draw a vertical line (D) upward from the Temperature axis at the elevated
temperature into the initial cure region.
(b) Draw a horizontal line (K) from the Time axis at the time required for Initial
Cure to the vertical line (D).
(c) At this intersection draw a line (H) parallel to the “Degree of Cure” line to
intersect with a vertical line (A) at the ambient temperature.
(d) Draw a horizontal line (J) from the intersection of lines (A) and (H) to the
Time axis.
(e) Draw a horizontal line (G) from the intersection of line (A) and a point
98 percent cure or higher to the Time axis.
(f) The difference between the times indicated by lines (G) and (J) is the
minimum time necessary to reach Full Cure.
NOTE: This procedure also applies to where the cure is started at one
temperature and completed at lower temperature.
(4) Assure that lagging parts are at the minimum temperatures. A 5 percent
contingency factor is recommended.
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ECCN 1E994
FIGURE 10 CURE FOR BMS5–28 FOR MAGNOBOND 92–1 QUALIFIED TO BMS5–28 TYPE 18
CLASS 1
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ECCN 1E994
FIGURE 11 CURE FOR BMS5–28 FOR EPOCAST 1631 QUALIFIED TO BMS5–28 TYPE 30
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ECCN 1E994
8.6 REWORK
a. Document rework as required by the applicable Quality Assurance provisions.
b. All rework shall be in accordance with the appropriate section of Table V.
c. Remove internal defects such as bubbles, pits, and cracks and any other internal
voids by mechanical means, rotary filling. Fill the removed areas with the same
compound used originally. However, BMS5–28, Type 6 may also be used to fill areas
originally potted with Type 27. Type 7 may be used to fill areas potted with Type 14.
Cure in accordance with Section 8.5, Table I.
d. Visible potting compound depressions found in insert fill holes are of a cosmetic
concern only. If the bottom of the depression is visible, no rework is required.
However BMS5–28, Type 9, 18 or 30 may be used if desired. If the bottom of the
depression is not visible, rework by injecting BMS5–28, Type 9, 18 or 30 potting
compound into the hole until full. A syringe and needle arrangement may be required
to accomplish this.
e. For panel rework or insert replacement, BMS5–123, Type I, Class 2 may be used in
place of BMS5–28 materials.
f. Entrapped air or potting porosity is not cause for rejection unless the voids exceed
0.1 inch in any dimension.
TABLE V POTTING REWORK
GENERAL a. Honeycomb core cell columns shall be filled within + 0.01 inch and
(Section 8.3.1) –0.03 inch after cure.
b. Voids greater than 0.10 inch require rework in accordance with
Section 8.6.
TYPE OF POTTING DEFECT REWORK
PREPOT a. Voids greater than 0.10 inch Refill voids
(Section 8.3.2),
Method A b. Incomplete fill of core Remove potting and repot in
accordance with Sections 8.3.2c.
through h.
c. Oversized hole Fill hole and redrill in accordance
with Sections 8.3.2e. through h.
d. Off center hole or extra hole Fill hole and redrill in accordance
with Sections 8.3.2e. through h.
e. Cracked potting compound Remove potting and repot in
accordance with Sections 8.3.2e.
through h.
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ECCN 1E994
8.6 REWORK (Continued)
TABLE V POTTING REWORK (Continued)
WET POTTED a. Inadequate core fill Remove insert and repot in

INSERTS accordance with Section 8.3.3.
(Section 8.3.3), b. Protrusion greater than 0.02 inch. Remove insert and repot in
Method B accordance with Section 8.3.3.
c. Mislocated inserts or incorrect
inserts, with the following
limitations:
– Only one insert may be
reworked within a 100 square
inch area.
No reworked insert shall be
within 6 inches of another
reworked insert.
– Rework to be no closer than
0.50 inch to edge of panel.
– No rework to panel section less
than 6 inches wide.
d. For through inserts which do not
match with panel thickness to
within + 0.02 / – 0.00 inch,
alternate insert with length that is
flush with panel to within + 0.02 /
– 0.00 inch may be used, unless
not allowed by the Engineering
drawing.
e. Blind insert in through hole. Pot the blind insert in accordance
with Section 8.3.3.
NONAPPEARANCE PARTS
EDGE POTTING RIGID a. Potting thickness after trim not in Rout out potting and repot in
(Section 8.3.4.1), accordance with drawing or less accordance with Section 8.3.4.1.
Method C than 0.25 inch if not specified.
b. Voids greater than 0.25 inch or Refill or rout out potting and repot
0.25 panel thickness in length in accordance with Section 8.3.4.1.
whichever is greater.
c. Voids greater than 0.25 inch deep Refill
or extend completely through
potting.
d. Voids that border either facing. Refill
APPEARANCE PARTS
a. Potting thickness after trim not in Rout out potting and repot in
accordance with drawing or less accordance with Section 8.3.4.1.
than 0.25 inch if not specified.
b. Visible voids Fill voids or rout out potting and
repot in accordance with
Section 8.3.4.1.
BAC
5583
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ECCN 1E994
8.6 REWORK (Continued)
TABLE V POTTING REWORK (Continued)
TYPE OF POTTING DEFECT REWORK

FLOOR PANELS
EDGE POTTING RIGID a. Potting thickness after trim not in Rout out potting and repot in
(Section 8.3.4.1), accordance with the drawing or accordance with Section 8.3.4.1.
METHOD C less than 0.070 inch if not
(Continued) specified. FL 1
b. Voids that border either facing. Refill
c. Voids deeper than 0.03 inch. Refill
d. Voids, largest dimension, Refill
– greater than 0.25 inch
– 0.13 to 0.25 inch, more than
three in two lineal inches.
– 0.06 to 0.13 inch, more than
eight in 1 lineal inch.
EDGE POTTING a. Voids in excess of 0.03 inch in Refill
FLEXIBLE diameter.
(Section 8.3.4.2), b. Voids extending completely Refill
METHOD C through potting compound.
c. Voids that border either facing. Refill
d. Exposed core edges in excess of Refill
0.05 inch from the inner surface of
the face sheets.
JOINT POTTING a. Voids greater than 0.10 inch. Refill
(Section 8.3.5) b. Broken or cracked potting Rout out damaged potting and repot
METHOD D compound. in accordance with Section 8.3.5.
POTTING BONDED a. Defects in excess of 0.03 inch Refill
ASSEMBLIES FOR b. Number of defects greater than 3 Refill
INSTALLATION OF
FASTENERS
(Section 8.3.7)
METHOD G
FL 1 Edge potting thickness is usually specified on the drawing rather than in Section 8.3.4.
BAC
5583
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ECCN 1E994
8.7 PROCESS CONTROL PANEL
Process control panel(s) is not required unless the part process specification requiring a
potting compound is listed in Table VI. Fabricate process control test panel(s) in
accordance with the MPCD or Figure 12 and Table VI. Processors shall select test
panel(s) representative of the process(es) currently used for fabricating parts. The
panel(s) shall be fabricated using production facilities and personnel.
Prepreg (See Table VI, Ply not applicable to Construction No. 3)
Prepreg (See Table VI)
BMS8–124, Type V, Class IV,

Grade 3.0, HC Core
Prepreg (See Table VI)

Prepreg (See Table VI, Ply not applicable to Construction No. 3)
Insert: (See Table VI)

Process: (See Table VI)
Thickness : (See Table VI)
FIGURE 12 PROCESS CONTROL TEST PANEL
TABLE VI PROCESS CONTROL PANEL CONSTRUCTION
NOMINAL
CONSTRU PART CORE POTTING
–CTION BAC5583 PROCESS PREPREG THICKNESS COMPOUND INSERT
NUMBER METHOD SPECIFICATION SKIN INCHES TYPE TYPE
1 B BAC5564 BMS8–274 0.375 18 SL2334–3A1
Method C Type II,
Class 2
2 B BAC5565 BMS8–226 0.95 18 SL2334–3A3
Methods B or C Type II,
Class 3A
3 B BAC5565 BMS8–226 0.350 18 SL618–3A
Method B or C Type II,
Class 3A
4 B BAC5565 BMS8–226 0.350 18 SL2334–3A1
Method A Type II,
Class 3A
or 3B
BAC
5583
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ECCN 1E994
8.8 STATISTICAL PROCESS CONTROL AND ENGINEERING KEY CHARACTERISTICS
Statistical process control methodology may be applied in accordance with BSS7286

where applicable in lieu of process control testing as described in Section 8.7,
Section 11.2, and Section 12 if Boeing Quality Assurance grants prior approval. For
manufacturing shops within Boeing, prior approval may be granted by Quality Assurance
and Boeing Materials Technology. The key characteristics are as follows in Table VII.
TABLE VII KEY CHARACTERISTICS
CONSTRUCTION
NUMBER
(Table VI) KEY CHARACTERISTIC
1 Insert Pull–Out Strength
9 MAINTENANCE CONTROL
Not applicable to this specification.
10 QUALITY CONTROL
a. Assure that the requirements of this specification are met by monitoring of the
process and examination of end–items in accordance with established quality
assurance provisions.
b. When an MPCD is used in accordance with an approved operating procedure listed

in BSS7033, any MPCD documented quality control procedures that meet the
requirements of Section 11 may be used.
c. When an MPCD is used:
(1) Identify key process parameters and maintain documentation to ensure the
process is being operated in accordance with the MPCD.
(2) Perform any tests necessary to ensure that process changes made to the MPCD
meet the requirements of this specification.
(3) Verification intervals shall be based on statistically valid data as documented in

the MPCD. The MPCD shall be an integral part of the processor’s continuous
quality improvement system and shall establish procedures and requirements of
statistical process control in accordance with BSS7286.
d. When consistent conformance to specification requirements has been demonstrated,

Quality Assurance may implement reduced testing in accordance with a suitable
sampling plan. The reduced test plan shall be approved by Boeing Quality
Assurance. Boeing written authorization of the reduced testing shall be kept in
permanent record.
BAC
5583
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ECCN 1E994
11 REQUIREMENTS
11.1 DEFECTS
a. General
(1) Honeycomb core cell columns shall be filled within +0.01 inch and –0.03 inch
after cure.
(2) Surface voids shall not exceed 0.10 inch in dimension.
b. Prepotting of Fastener Holes
(1) Drilled holes shall be within ± 0.05 inch in diameter.
(2) Off centered holes shall be within 0.10 inch of the desired location.
(3) No cracked potting shall be allowed.
c. Wet Potted Inserts
(1) The insert shall be at least 80 percent surrounded by potting compound.
(2) The insert shall not protrude more than 0.02 inch above or be less than flush with
the finished panel surface.
(3) Only one mislocated insert shall be reworked within a 100 square inch area. No
rework insert shall be within 6 inches of another reworked insert. Rework shall
be no closer than 0.50 inch to the edge of panel. No rework tot he panel section
shall less than 6 inches wide.
d. Rigid Edge Potting ( Non–floor panels)
(1) Non Appearance Parts
(a) Potting thickness after trim shall not exceed 0.25 inch unless specified on the
engineering drawing.
(b) Voids less than 0.25 inch or less than 0.25 panel thickness.
(c) Voids shall not extend through the potting.
(d) Void shall not border either facing.
(2) Appearance Parts
(a) Potting thickness after trim shall not exceed 0.25 inch unless specified on the
(b) Visible voids shall not be acceptable.
BAC
5583
Page 47

ECCN 1E994
11.1 DEFECTS (Continued)
e. Rigid Edge Potting (floor panels)
(1) Potting thickness after trim shall not exceed 0.070 inch unless specified on the
(2) Void shall not border either facing.
(3) Voids shall not be deeper than 0.03 inch in diameter.
(4) The largest dimension of a void shall not be greater than 0.25 inch, no more than
three within 0.13 inch and 0.25 inch in dimension in two lineal inches, or no more
than eight within 0.06 inch and 0.13 inch in dimension in one lineal inch.
f. Flexible Edge Potting
(1) Voids shall not exceed 0.03 inch in diameter.
(2) Void shall not extend completely through the potting compound.
(3) Voids shall not border either facing.
(4) Exposed edges shall not be in excess of 0.05 inch from the inner surface of the
face sheets.
g. Joint Potting
(1) Voids shall not exceed 0.10 inch in diameter.
(2) Potting compound shall not be broken or cracked.
h. Potting Bonded Assemblies for Installation of Fasteners
(1) Defects shall not exceed 0.03 inch in diameter.
(2) Number of defects shall not exceed 3.
11.2 PROCESS CONTROL REQUIREMENTS
11.2.1 INSERT PULLOUT
The Quality Assurance test required in Table VIII shall be performed, unless Statistical
Process Control has been granted in accordance with Section 8.8.
TABLE VIII INSERT PULL–OUT STRENGTH REQUIREMENTS
CONSTRUCTION MINIMUM AVERAGE MINIMUM INDIVIDUAL TEST METHOD

NUMBER (TABLE VI) LBS LBS SECTION
1 222 168 12.1
2 269 225 12.1
3 152 129 12.1
4 232 204 12.1
BAC
5583
Page 48

ECCN 1E994
11.3 HARDNESS REQUIREMENT
Materials shall be stored and processed in accordance with Section 8.1.
TABLE IX HARDNESS REQUIREMENTS
BAC5583 POTTING BAC5583 POTTING

COMPOUND MINIMUM SHORE D COMPOUND MINIMUM SHORE D
BMS5–/TYPE HARDNESS BMS5–/TYPE HARDNESS
28/1 65 28/19 65
28/3 75 28/20 60
28/4 60 28/21 85
28/6 80 ––– –––
28/7, Class 1 80 28/25 –––
28/9 55 28/27 80
28/10 55 28/28 50
28/12 Class 1 75 ––– –––
28/12, Class 2 80 ––– –––
28/13 85 ––– –––
28/14, Class 1 80 ––– –––
28/14, Class 2 80 ––– –––
28/15 50 ––– –––
28/16 55 ––– –––
28/17 55 ––– –––
28/18, Class1 60 ––– –––
28/18, Class 2 65 ––– –––
BAC
5583
Page 49

ECCN 1E994
12 TEST METHODS
12.1 INSERT PULLOUT
Fabricate test specimens for best insert pull–out strength as described below.
a. Fabricate test specimens as illustrated in Figure 13.
3.0 1.5 3.0
1.5
Core: See Figure 12

See Figure 12
for ply layup
Faces: (two plies each side)
(See Figure 12)
All values are 0.1
Insert: (Table VI) Potted in
All dimensions in inches
Accordance with BAC5583, Method B
FIGURE 13 TENSILE PULL–OUT TEST SPECIMEN
b. Prepare the test specimens for testing as shown in Figure 14. The rate of pull shall
be 0.05 inch per minute nominal to achieve failure within 1 to 2 minutes. A minimum
of 12 specimens shall be run.
Insert Potting Compound
2 in. Dia.
Threaded Rod Support
No. 10–32 Ring
Thread To Test 2 places
Machine
FIGURE 14 TENSILE PULL–OUT TEST CONFIGURATION
BAC
5583
Page 50

ECCN 1E994
12.2 PEEL PLY AND PARTING FILM VERIFICATION
Verify that new materials that contact prepregs transfer no contamination which may
reduce the adhesion properties of the prepreg.
a. Prepare three test specimens as shown in Figure 15. Each test specimen shall be
3.0 by 16 inches ± 0.1 inch. The 16 inch dimension shall be parallel to both the fabric
wrap and the core–ribbon direction.
b. The layup shall be as indicated in Figure 15 as follows:
(1) Apply the first two piles of the specified prepreg to a caul plate that is covered
with a release film. Lay the honeycomb over the prepreg.
(2) Pot the area of honeycomb as shown in Figure 15 in accordance with

Section 8.3.1c. using the specified potting compound.
(3) After the potting has jelled, add one strip of 1 inch wide peel ply across the top of
the layup as shown on Figure 15. The masked area is the
“NON–CONTAMINATED” area.
(4) Mask off two 4–inch nominal strips the width of the specimen with release film as
shown in Figure 15.
(5) Contaminate the exposed area with the test material. Apply the material to the
exposed potting. For liquids apply a thin film (1 to 2 mil thick). For solids lay the
material against the prepreg and lightly press it into the prepreg using a rubber
roller or a nylon sweep to ensure firm contact.
(6) Carefully remove the test material and release film.
(7) Lay the final ply over the layup.
(8) Vacuum bag and cure the layup in accordance with the appropriate BMS.
(9) If necessary, bond the panel to a stiff substrate to reinforce the honeycomb.
c. Cut the panel into three 3–inch nominal specimens.
d. Run ‘Climbing Drum Peel’ (see SAE AMS–STD–401) at a head speed of 1 inch per
minute nominal.
e. Report the average load for each 4 inch portion of the specimen and the repeal.
f. If the average load of the contaminated area is less than 90 percent of the average
load of the uncontaminated area then the material tested is unacceptable.
BAC
5583
Page 51

ECCN 1E994
12.2 PEEL PLY AND PARTING FILM VERIFICATION (Continued)

1 4 4 4 3
NON–CONTAMINATED
3
CONTAMINATED
3
PEEL PLY
3
FIXTURE
CUT
FL 1
FL 4
FL 2
FL 3
FL 5 POTTED AREA
FL 1
1 4 4 4 3
Note: All dimensions are in inches.
FL 1 Prepreg
FL 2 Peel Ply
FL 3 Parting Film
FL 4 Material Source of Possible Contamination
FL 5 HC Core BMS8–124, Type V, Class IV, Grade 3.0, 0.25 Inch
FIGURE 15 CONTAMINATION TEST PANEL CONSTRUCTION
BAC
5583
Page 52

ECCN 1E994
12.3 HARDNESS TESTING
a. Test hardness in accordance with ASTM D 2240, Type D.
b. Take a minimum of five measurements in accordance with Section 12.3a. along each
bar to assure uniform mixed and cured condition was achieved. Inspect each bar for
anomalous conditions such as tacky surface or soft spots. Record high and low
hardness readings for each pair of bars. If anomalous conditions are found or any
hardness reading lower than the value stated in Table IX is obtained, quarantine parts
from the time period represented by the test and defer the disposition of those parts
to Quality Assurance.
c. A log book shall be maintained by shop personnel to verify that the checks are
performed and to track the batch number of the material.
12.4 SUFFICIENT POTTING
a. Cut the test panel through the center of the insert and remove it.
b. Examine the potting for its adhesion to the insert.
c. Visually determine the amount of potting compound surrounding the insert.
d. The coverage shall be 80 to 100 percent.
BAC
5583
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Cover Page

Standard: BAC5583 Rev: (G) 27-Aug-2003

Copyright © 1988, 1992, 2003 Boeing. All rights reserved.

NOTE: Incorporated PSDs: 6–35, 6–39, 6–42 and 6–43

Non–Boeing personnel shall refer to their employer’s safety

b. It is acceptable for qualified processors to process hardware in accordance with a

This specification consists of the following methods:

a. Method A – Prepotting of fastener holes

b. Method B – Wet potting of inserts

c. Method C – Edge potting

e. Method E – Installation of self–tapping screws. Method A is optional to Method E.

f. Method F – Inactive for current design. Use Method C.

g. Method G – Potting bonded assemblies for installation of fasteners.

ORIGINAL ISSUE: REV: (F) 16–SEP–1999 (G) 27–AUG–2003

BOEING PROCESS SPECIFICATION PAGE 1 of 53

Copyright © Boeing. All rights reserved. See Cover Page.

ORIGINAL ISSUE 03–JAN–1983 REVISED (G) 27–AUG–2003

Copyright © Boeing. All rights reserved. See Cover Page.

Section Subject Page

ORIGINAL ISSUE 03–JAN–1983 REVISED (G) 27–AUG–2003

Copyright © Boeing. All rights reserved. See Cover Page.

Section Subject Page

8.3.1 GENERAL METHODS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

ORIGINAL ISSUE 03–JAN–1983 REVISED (G) 27–AUG–2003

Copyright © Boeing. All rights reserved. See Cover Page.

Section Subject Page

Number Title Page

FIGURE 1 INITIAL CURE SCHEDULE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

ORIGINAL ISSUE 03–JAN–1983 REVISED (G) 27–AUG–2003

Copyright © Boeing. All rights reserved. See Cover Page.

Number Title Page

TABLE I MATERIALS STORAGE AND PROCESSING . . . . . . . . . . . . . 14

ORIGINAL ISSUE 03–JAN–1983 REVISED (G) 27–AUG–2003

Copyright © Boeing. All rights reserved. See Cover Page.

5.1 DELIVERABLE MATERIALS

5.1.1 POTTING AND CASTING COMPOUNDS

5.1.2 MISCELLANEOUS MATERIALS

5.2 NON–DELIVERABLE MATERIALS

5.2.2 RELEASING AGENTS

ORIGINAL ISSUE 03–JAN–1983 REVISED (G) 27–AUG–2003

Copyright © Boeing. All rights reserved. See Cover Page.

5.2.3 PEEL PLY FABRICS

5.2.4 PARTING FILMS

Glove material shall not be a contaminant to or cause the transfer of contaminants to

5.3 MATERIAL STORAGE CONTROL

ORIGINAL ISSUE 03–JAN–1983 REVISED (G) 27–AUG–2003

Copyright © Boeing. All rights reserved. See Cover Page.

5.4 MATERIAL REPACKAGING AND RELABELING

b. Label containers with:

(1) BMS Number, Type, Class and Grade as applicable.

(2) Manufacturer’s designation and Batch No.

(3) Storage temperature and date.

(4) Storage expiration date and time.

(5) Packager’s identification.

(6) Safety information, if any.

6.1 METER/MIX DISPENSING EQUIPMENT

A periodic check of the meter/mix equipment shall be performed to assure proper

6.2 PRE–KITTED CARTRIDGE MIXING MACHINES