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GR241AG Fiber Gateway 4x4 V5.8
GR241AG Fiber Gateway 4x4 V5.8
GR241AG Fiber Gateway 4x4 V5.8
Lista de Material
Lista de Material
1300009990
GR241AG Fiber Gateway 4x4
Confidencial
1300009990 - GR241AG Fiber Gateway 4x4
Lista de Material
CIRCUITOS INTEGRADOS
0580 1 UN S 1700218033 1.5MHz 1A ADJ PWM Step-Down Conv. RT8010
1400022448 , RT8010GQW , Richtek Technology Corporation
CI1
0590 1 UN S 1700217377 4x4 2.4/5GHz 802.11ac WiFi SoC BCM4366E
1400022294 , BCM4366EKMMLWG , Broadcom Corporation
1400024314 , BCM4366EKMMLW1G , Broadcom Corporation
CI10
0600 4 UN S 1700208139 5GHz WLAN Front-End Module SKY85712-21
1400020527 , SKY85712-21 , Skyworks Solutions, Inc.
CI11,CI12,CI4,CI9
0610 2 UN S 1700202581 3.5A 6V 1.2MHz STEP-DOWN CONVERT. MP2130
1400019555 , MP2130DG-LF-Z , Monolithic Power Systems
1400019695 , MP2130DG-LF-P , Monolithic Power Systems
CI13,CI24
0620 1 UN
Não Montar
CI14,CI40
0630 1 UN S 1700192625 2Gb x16 DDR3-1866 SDRAM K4B2G1646E-BCMA
1400018515 , K4B2G1646E-BCMA , SAMSUNG
1400018516 , MT41J128M16JT-107:K , Micron Technology, Inc.
1400018517 , H5TQ2G63DFR-RDC , SK hynix Inc.
1400018518 , IS43TR16128A-107MBL , INTEGRATED SILICON SOLUTIONS I
1400018530 , H5TQ2G63FFR-RDC , SK hynix Inc.
1400019203 , K4B2G1646Q-BCMA000 , SAMSUNG
1400022362 , K4B2G1646F-BCMA000 , SAMSUNG
1400022971 , H5TQ2G63GFR-RDC , SK hynix Inc.
1400023363 , K4B2G1646F-BCMA0CV , SAMSUNG
1400024180 , K4B2G1646F-BCMATCV , SAMSUNG
1400024127 , MT41K128M16JT-107:K , Micron Technology, Inc.
CI15
0631 1 UN S 1700153433 2Gb x16 DDR3-1333 SDRAM MT41J128M16HA
1400014720 , MT41J128M16HA-15E:D , Micron Technology, Inc.
1400014721 , EDJ2116DEBG-DJ-F , Elpida Memory Inc
1400014722 , H5TQ2G63BFR-H9C , SK hynix Inc.
1400014723 , K4B2G1646C-HCH9 , SAMSUNG
1400017576 , H5TQ2G63DFR-H9C , SK hynix Inc.
1400017577 , K4B2G1646E-BCH9 , SAMSUNG
1400018163 , H5TQ2G63FFR-H9C , SK hynix Inc.
1400019149 , K4B2G1646Q-BCH9 , SAMSUNG
0640 1 UN S 1700115168 SINGLE 2-INPUT POS-AND GATE 74LVC1G08GW
1400011206 , 74LVC1G08GW,125 , NXP Semiconductors
1400024402 , 74LVC1G08SE-7 , DIODES INCORPORATED
CI16
0650 3 UN S 1700214076 2.4GHz 802.11b/g/n/ac Wi-Fi FEM RFFM4293
1400022040 , RFFM4293TR7 , Qorvo, Inc.
CI17,CI18,CI19
0660 2 UN S 1700183338 BUFFER/LINE DRIVER 3-STATE 74LVC1G126GW
1400017307 , 74LVC1G126GW,125 , NXP Semiconductors
1400020117 , SN74LVC1G126DCKR , TEXAS INSTRUMENTS
1400020118 , 74LVC1G126SE-7 , DIODES INCORPORATED
CI2,CI5
0670 1 UN S 1700191883 EPON/GPON VoIP SFU/GW PROCESSOR BCM68380
1400018339 , BCM68380IFSBG , Broadcom Corporation
CI20
0680 1 UN D 1700222147 GAP FILLER PAD TG6050 20x20x1,2mm
1400023129 , TG6050-20-20-1.2 , T-Global Technology
CI20
- Aplicado sobre o CI20 para servir de
interface térmico entre o CI e a tampa
da blindagem BL2.