Process Capability

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Contents
1. Laminate Material
2. Process/mechanical equipment
3. Pattern Design
4. Registration
5. Drilling & Plating & Via type
6. Solder mask
7. Surface coating
8. Shape
9. E-test and others

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1. Laminate Material
1.1 Base Material:
Rigid:
FR4 Tg135/Tg150/Tg170/Tg 200/Tg 250. CEM-1/CEM-3.
Teflon, Ceramic, Aluminum, BT, High Tg/Low Dk. RF material
Flex or Rigid-Flex:
FCCL, Coverlay, Now flow PP
1.2 Brand Of Laminate:
Rigid: HTE, Nan-Ya, ITEQ, Shinmore, EMC, Ventec, TUC, Huazhen, Rogers,
Arlon. Nelco, Isola, Taconica.
Flex or Rigid-Flex : ThinFlex, TaiFlex, EMC
1.3 Material Thickness
Rigid: 2~240mil (0.05mm~6mm)
Flex or Rigid-Flex : 1~3mil 3
1. Laminate Material
1.4 Max Finished Board Size
Rigid
Mass-Pro:21”*24”(457*533mm) & 47” (1194mm) for single layer.
Samples: 21”*27” (1~4L) & 20*26”(6L & Above)
Flex or Rigid-Flex:
Mass-Pro& Samples: 9.84”*14.74” (250*450mm)
1.5 Min Board Thickness
Rigid: 2L-8mil (0.2mm), 4L-14mil (0.35mm), 6L-22mil (0.55mm)
Flex: 1L-3.5mil (0.09mm), 2L—6mil (0.15mm)
Rigid-Flex: 4L-16mil (0.4mm), 6L—24mil (0.6mm)
1.6 Min Core Thickness
Rigid: 2mil 1/1oz
Flex or Rigid-Flex: 1mil T/Toz
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2. Process/ mechanical equipment
2.1 Max/ Min Layer count
Rigid Rigid-Flex
Flex
Multilayer HDI/IVH Stack hole Multilayer HDI Stack hole
4-10L 8L
Mass-Pro 1-20L 10-16L 10-16L 1-3L
(Flex 2L) (Flex 2L) only
12L 10L sample
Samples 22-26L 14-18L 14-18L 4L
(Flex 2L) (Flex 2L)

2.2 Finished Cu Thickness

Rigid Rigid-Flex
Flex
Multilayer HDI/IVH Stack hole Multilayer HDI Stack hole

Interlayer T~6oz H~1oz H~1oz T~1.0mil H~1.0mil H~1.0mil

1.0mil~10o H~1.0oz
Outer layer 1.0mil~1oz 1.0mil~1oz 1.0mil~1oz 1.0mil~1oz 1.0mil~1oz
z
Other:
a. One side 1oz and the other side to be 6oz finished. In the same side, some
location 2oz finished but some location 10oz finished. 5
2. Process/ mechanical equipment
2.3 Inter/ outer layer: In house, CCD & LDI exposure machine. Min. line width and
spacing is 3/3mil. alignment accuracy +/-2mil (50um).
2.4 lamination: Brown oxidation pretreatment.
2.5 Mechanical drilling: 200K RPM Drilling machine with depth control. Min. drilling
diameter is 6mil (0.15mm).
2.5.1 Back drilling: Depth tolerance +/-3mil(75um).
2.5.2 Blind drilling: Depth tolerance +/-2.5mil(62.5um), drilling diameter 0.15mm
2.5.3 Countersink: Yes
2.6 Laser drilling: Outsourcing, UV and CO2 laser.
2.7 Panel plating & Electroless plating: Vertical plating line, Aspect ratio 10:1 for
PTH, 1:2 for laser via.
2.8 Pattern plating: Vertical plating line, Aspect ratio 8:1 for PTH, 1:2.3 for laser via.
2.9 Copper fill: Outsourcing, laser via aspect ratio 1:1. The thickness of the
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dielectric layer is less than 5mil, the laser via diameter is less than 6mil.
2. Process/ mechanical equipment
2.10 Stack hole (laser via): Yes
2.11 Resin plug hole: Vacuum plug, PTH aspect ratio 40:1. Laser via diameter is
less than 6mil.
2.12 Solder mask: CCD exposure machine, alignment accuracy +/-50um.
2.13 Legend and mark: Automatic screen printing line and laser printer, with the
ability to print 1D and 2D barcodes.
2.14 Surface coating:
• ENIG: Yes
• Selective ENIG: Yes
• ENIPIG: Outsourcing
• Electro Soft Gold Plating: Yes
• HASL include lead free HASL: Yes
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2. Process/ mechanical equipment
2.14 Surface coating:
• Immersion tin and immersion silver: Yes
• Gold finger: Yes
• Full body hard gold: Yes
• OSP: Yes
2.15 CNC router: Dimension tolerance +/-0.1mm.
2.16 Punch: Dimension tolerance +/-0.1mm.
2.17 E-test: Dedicated tester, Universal tester, Flying probe tester.
2.18 AOI inspection: Yes
2.19 Carbon print: Yes
2.20 Peelable print: Yes
2.21 Copper paste and Silver paste: Yes 8
3. Pattern Design
3.1 Trace width
Rigid Rigid-Flex

Multilayer, HDI/IVH, Stack hole Multilayer, HDI, Stack hole

I/L trace width (W2)

(Finished copper thickness) 3mil (finished copper
I/L trace space (S2) * 3 thickness below 1.0oz),
O/L trace width EX: finished copper thickness Small than 3mil only
(W1) 1mil, then min. trace width or sample (finished copper
space is 3mil thickness below 1.0mil)
O/L trace space (S)

Flex

O/L trace width (W1) 1. 3mil (Max. finished copper thickness 1.0oz)

O/L trace space (S) 2. 2mil (Max. finished copper thickness Hoz)

3.2 Image Distortion

+/-20%
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3. Pattern Design
3.3 Via hole ring pad( original file)
Rigid Flex

Through hole Laser via Through hole

Min land size (R): 10mil (0.25mm) 10mil (0.25mm) 10mil (0.25mm)

I/L min. ring for via hole (R1): 3mil (0.075mm) 3mil (0.075mm) 3mil (0.075mm)

O/L min. ring for via hole (R1): 3mil (0.075mm) 3mil (0.075mm) 3mil (0.075mm)
Aspect ratio: 10:1
Dielectric layer: below Min hole size: 4mil
Remark Min hole size: 4mil
4mil (0.1mm) (0.1mm)
(0.1mm)

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3. Pattern Design
3.4 Min. BGA pad
IVH HDI
Multilayer or 2L flex VIP mechanical
VIP laser via
drilling
Min pad size (R2): 10mil (0.25mm) 10mil (0.25mm) 10mil (0.25mm)
Min pitch (with line)
19mil (0.48mm) 19mil (0.48mm) 19mil (0.48mm)
(R3):
Min line width (G): 3mil (0.075mm) 3mil (0.075mm) 3mil (0.075mm)
Remark: Finished conductor thickness 1.0mil
3.5 Min. QFP pad spacing with solder dam
Finished copper
T ≤1.5oz 1.5oz<T ≤2.0oz 2.0oz<T≤2.5oz 2.5oz<T≤3.0oz 3.0oz<T≤4.0oz T>4.0oz
thickness T
Min. pad spacing

Green/Blue/Red
Yellow/Clear
6mil 7mil 8mil 8mil 9mil 9mil

Matted black 6mil 7mil 8mil 8mil 9mil 9mil

Glossy black 9mil 9mil 10mil 10mil 11mil 12mil
White 8mil 8mil 9mil 9mil 10mil 10mil 11
3. Pattern Design
3.6 Tolerance
Trace width: +/-20%
Trace space: +/-20%
SMD/BGA pad: +/-2mil
Fiducial mark: +/-2mil.
Remark: Minimum tolerance for pads & trace to be +/- 15%

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4. Registration
4.1 Registration for layer
Registration of O/L to I/L (S1): Normal control +/-4mil
(0.1mm), Special control +/-2mil (0.05mm)
Registration of I/L to I/L (S2): +/-2mil (0.05mm)
4.2 Registration for drilling
Registration of drill to inner layer (S): +/-4mil (0.1mm)
Registration of drill to outer layer (S): +/-3mil (0.075mm)
Registration of first drill to second drill: +/-3mil (0.075mm)
4.3 Registration for S/M
Min clearance of S/M to pattern(S2-S1)/2: 1mil (0.25mm)
4.4 Registration for legend
Legend print accuracy: 2mil (0.05mm)
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4. Registration
4.5 Registration for via in pad
Registration of O/L to hole include mechanical drilling and
laser via(S): 3mil (0.075mm)
4.6 Registration for laser via
Registration of laser drill to target pad (S2): >0mil
Registration of trace to laser via (S1): >0mil
4.7 Registration for the stack hole
Registration of laser via to laser via : Without break out

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5. Drilling & Plating & Via type
5.1 Min. hole size(H)
Rigid or Rigid-Flex Flex

Mechanical drill Laser drill Mechanical drill

H
4mil (0.1mm) 4mil (0.1mm)
Min hole size Aspect ratio: 10:1 Aspect ratio: 1:2
4mil (0.1mm)

5.2 Hole size and location tolerance

Hole size>6.4mm
Normal Press-fit
Sqaure or rectangular slot
PTH +/-3mil (0.075mm) +/-2mil (0.05mm) +/-5mil (0.127mm)
NP +/-2mil (0.05mm) +/-5mil (0.127mm)

1st to 1st 1st to 2nd 1st to shape 2nd to shape

+/-3mil (0.075mm) +/-4mil (0.1mm) +/-4mil (0.1mm) +/-4mil (0.1mm)
Hole
location
1st to conductor 2nd to conductor 15
+/-3mil (0.075mm) +/-4mil (0.1mm)
5. Drilling & Plating & Via type
• 5.3 Max. aspect ratio
Panel plating Pattern plating Copper fill Remark
Through hole 10:1 8:1 N/A
Dielectric layer
Laser via 1:2 1:2.3 1:1 thickness is less
than 5mil
• 5.4 Via type
Filled
Blind Cap
Process Non conductive
Buried resin
Copper fill Cu Paste Ag Paste plating

Mechanical
Yes Yes No Yes Yes Yes
drilling
Laser
Yes Yes Yes Yes Yes Yes
drilling

• 5.5 Countersink: Yes

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5. Drilling & Plating & Via type
5.6 Back drilling
• Back drilling diameter (D2)= D1+0.15mm
• The thickness of the dielectric layer (H) is
greater than 6mil (0.15mm)
• Depth control +/-3mil (0.075mm)

5.7 Blind drilling

• Blinf drilling diameter is 0.15mm
• The thickness of the dielectric layer (A) is
less than 3mil (0.075mm)
• The thickness of the dielectric layer (B) is
greater than 5mil (0.127mm)
• Depth control +/-2.5mil (0.0625mm)

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6. Solder mask
6.1 Min. SMD space for dam (W2)
6mil (0.15mm)
6.2 Min. dam width (W1)
3mil (0.075mm) for green ink
6.3 Solder mask thickness
Thickness on copper area (H1): Min 0.3mil (7.5um),
Max is depend on customer define.
Min thickness at shoulder (H2): 0.2mil (5um)
6.4 Brand available
Taiyo PSR4000, PSR2000, Tamura, Onstatic, Glossy,
AMC(聯致), Nan Ya.
6.5 Color
Green, Black, Extra Black Matte, Blue, Red, Yellow, 18
White, Purple, Clear
7. Surface Coating
7.1 Thickness
HASL ( or Free HASL ) thickness include lead free: 40~1000u” (1~25um)
Entek/OSP thickness: 0.2~0.3um
ENIG: Ni 100~200u’’, Au 2~10u” and 4~10u” for wire bonding board.
ENIPIG: Ni 100~200u’’, Au 2~4u”
Fully body hard gold: 3~50u”
Immersion silver: 6~12u”
Immersion tin: 15~20u”
Electro Soft Gold Plating : 8~30u”
Electro Silver Plating : 50u”
Carbon: per customer request.
Peelable Soldermask : per customer request 19
8. Shape
8.1 Tolerance
Outline for punching: 4mil (0.1mm)
Outline for CNC route: 4mil (0.1mm)
Depth control: mass production +/-10mil (0.25mm), samples +/-6mil (0.15mm)

Board thickness: 62mil

Stack up for 3 panel: +/-0.127mm
Stack up for 2 panel:+/-0.075mm or +/-0.1mm (+/-0.075m for for sample only)
Stack up for 1 panel:+/-0.05mm for sample only

Board thickness: 31 mil

Stack up for 6 panel: +/-0.127mm
Stack up for 4 panel:+/-0.075mm or +/-0.1mm (+/-0.075mm for sample only)
Stack up for 2 panel:+/-0.05mm for sample only
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8. Shape
8.1 Tolerance
Location for V-cut: 5mil (0.125mm)
V-cut residual (B): 4mil (0.1mm)
Outline for beveling: 6mil (0.15mm)
Min inner radius: 16mil(0.4mm) for CNC routing, 8mil(0.2mm) for punch
8.2 V-cut
V-cut angle (C): 30, 45, 60
Range of board thickness (H): 15.7~126mil (0.4~3.2mm)
V-cut shift (D): 3mil
V-cut tolerance : 1/3 of the board thickness.

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9. Test and Others

9.1 E-Test
Flying probe, Universal, Dedicate
9.2 Impedance tolerance
+/-10% for impedance and Differential
impedance>50ohm tolerance.
9.3 Bow and Twist <0.75%

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