---TUTORIAL---

Matrix of MEMS Design Representation

for
Capacitive Accelerometer
Sudeep Sudarshan Rana
20EE37005
Design Framework [for MEMS]:
Design Hierarchy 3 different views at each Level
 SYSTEM: Component placement,  BEHAVIOURAL: How a design works
component interaction, upper-level  STRUCTURAL: How elements are
packaging. connected together
 MODULE: Sets of components that  PHYSICAL: How designs are
combine into a sub-system. implemented
 CIRCUIT: Representation of
individual sensor.
 DEVICE: Numerical representations
of the MEMS device.
 MATERIAL: Fundamental/raw
substances.
*For VLSI Design Framework, the design Hierarchy is
[ SYSTEM->REGISTER->LOGIC ->CIRCUIT->DEVICE->MATERIAL]
Design Framework for Capacitive Accelerometer:
BEHAVIOURAL STRUCTURAL PHYSICAL
SYSTEM Acceleration Proof Mass Packaging Design
Sensing Design (Third Level Packaging)
Mechanism
MODULE Sensing Signal Suspension 3D View
Conditioning Mechanism
CIRCUIT Signal Interconnection Layout
Conditioning
DEVICE Numeric MEMS 3D Representation
Representation Structure
MATERIAL Sensor Response MEMS -
Behavior Fabrication
Material
 BEHAVIOURAL STRUCTURAL PHYSICAL

3.5
S 3
2.5
Y 2
Voltage

S 1.5
1
T 0.5
E 0
0 0.5 1 1.5 2 2.5 3
M Acceleration

M
E 3.5
C 3
Displacement

H 2.5
2
A 1.5
N 1
I 0.5
M C 0
0 0.5 1 1.5 2 2.5 3
O A
L Acceleration
D
U E
L L 3.5
E 3
E C 2.5
2
Voltage

T 1.5
R 1
I 0.5
C 0
0 0.5 1 1.5 2 2.5 3
A
L Displacement

C
I
R
C
U
I
T
D
E
V
I
C
E

M
A
T
E
-
R
I
A
L

[Fig: Matrix of MEMS Design Representation]