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RA13H4452M
RA13H4452M
RA13H4452M
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
DESCRIPTION
BLOCK DIAGRAM
The RA13H4452M is a 13-watt RF MOSFET Amplifier Module 2 3
for 12.5-volt mobile radios that operate in the 440- to 520-MHz
range.
The battery can be connected directly to the drain of the
enhancement-mode MOSFET transistors. Without the gate
1 4
voltage (V GG=0V), only a small leakage current flows into the drain
and the RF input signal attenuates up to 60 dB. The output power 5
and drain current increase as the gate voltage increases. With a
gate voltage around 4V (minimum), output power and drain current
increases substantially. The nominal output power becomes
available at 4.5V (typical) and 5V (maximum). At VGG=5V, the
typical gate current is 1 mA.
This module is designed for non-linear FM modulation, but may
also be used for linear modulation by setting the drain quiescent
current with the gate voltage and controlling the output power with 1 RF Input (Pin)
the input power.
2 Gate Voltage (VGG), Power Control
3 Drain Voltage (VDD), Battery
FEATURES
• Enhancement-Mode MOSFET Transistors 4 RF Output (Pout)
(IDD≅0 @ VDD=12.5V, VGG=0V) 5 RF Ground (Case)
• Pout>13W, ηT>40% @ VDD=12.5V, VGG=5V, Pin=50mW
• Broadband Frequency Range: 440-520MHz
• Low-Power Control Current IGG=1mA (typ) at VGG=5V
• Module Size: 66 x 21 x 9.88 mm
• Linear operation is possible by setting the quiescent drain current
with the gate voltage and controlling the output power with the
input power
ORDERING INFORMATION:
All parameters, conditions, ratings, and limits are subject to change without notice.
25 100 V GG =5V
-30
INPUT VSWR ρin (-)
HARMONICS (dBc)
Pout P in =50mW
TOTAL EFFICIENCY
20 80
-40 nd
2
15 ηT 60
η T(%)
-50
10 V DD=12.5V 40
rd
V GG=5V -60 3
5 ρ in P in =50mW 20
0 0 -70
430 450 470 490 510 530 430 450 470 490 510 530
FREQUENCY f(MHz) FREQUENCY f(MHz)
OUTPUT POWER, POWER GAIN and OUTPUT POWER, POWER GAIN and
DRAIN CURRENT versus INPUT POWER DRAIN CURRENT versus INPUT POWER
50 5 50 5
Pout
DRAIN CURRENT I DD(A)
P out
OUTPUT POWER
Gp
Gp
P out(dBm)
P out(dBm)
30 3 30 3
20 2 20 2
I DD ID D
f=440MHz, f=480MHz,
10 1 10 1
VDD=12.5V, VDD=12.5V,
VGG =5V VGG=5V
0 0 0 0
-15 -10 -5 0 5 10 15 20 -15 -10 -5 0 5 10 15 20
INPUT POWER Pin(dBm) INPUT POWER Pin(dBm)
40 4
OUTPUT POWER
Gp
P out(dBm)
30 3
20 2
I DD
f=520MHz,
10 1
V DD=12.5V,
V GG =5V
0 0
-15 -10 -5 0 5 10 15 20
INPUT POWER Pin(dBm)
OUTPUT POWER and DRAIN CURRENT OUTPUT POWER and DRAIN CURRENT
versus DRAIN VOLTAGE versus DRAIN VOLTAGE
30 6 30 6
f=440MHz, f=480MHz,
OUTPUT POWER Pout(W)
25 P out 5 25 V GG=5V, 5
DRAIN CURRENT I DD(A)
V GG=5V,
DRAIN CURRENT I DD(A)
P out
P in=50mW P in=50mW
20 4 20 4
15 ID D 3 15 ID D 3
10 2 10 2
5 1 5 1
0 0 0 0
2 4 6 8 10 12 14 16 2 4 6 8 10 12 14 16
DRAIN VOLTAGE VDD(V) DRAIN VOLTAGE V DD(V)
25 V GG=5V, 5
15 3
ID D
10 2
5 1
0 0
2 4 6 8 10 12 14 16
DRAIN VOLTAGE VDD(V)
OUTPUT POWER and DRAIN CURRENT OUTPUT POWER and DRAIN CURRENT
versus GATE VOLTAGE versus GATE VOLTAGE
30 6 30 6
f=440MHz, f=480MHz,
OUTPUT POWER P out(W)
15 ID D 3 15 3
I DD
10 2 10 2
5 1 5 1
0 0 0 0
2.5 3 3.5 4 4.5 5 5.5 2.5 3 3.5 4 4.5 5 5.5
GATE VOLTAGE VGG(V) GATE VOLTAGE VGG (V)
25 VDD=12.5V, 5
DRAIN CURRENT I DD(A)
Pin=50mW
Pout
20 4
15 3
ID D
10 2
5 1
0 0
2.5 3 3.5 4 4.5 5 5.5
GATE VOLTAGE VGG(V)
66.0 ±0.5
17.0 ±0.5
9.5 ±0.5
4.0 ±0.3
5
1 2 3 4
2.0 ±0.5
14.0 ±1
Ø0.45 ±0.15
12.0 ±1
16.5 ±1
43.5 ±1
55.5 ±1
3.1 +0.6/-0.4
0.09 ±0.02
7.5 ±0.5
(9.88)
2.3 ±0.3
(50.4)
1 RF Input (P in)
2 Gate Voltage (V GG)
3 Drain Voltage (V DD)
4 RF Output (P out)
5 RF Ground (Case)
ZG=50Ω ZL=50Ω
Signal Pre- Directional Directional Power
Attenuator Attenuator Attenuator
Generator amplifier Coupler Coupler Meter
C1 C2
- + + -
DC Power DC Power
C1, C2: 4700pF, 22uF in parallel Supply V GG Supply V DD
1 RF Input (P in)
2 Gate Voltage (V GG)
3 Drain Voltage (V DD)
4 RF Output (P out)
5 RF Ground (Case)
EQUIVALENT CIRCUIT
2 3
1 4
For long-term reliability, it is best to keep the module case temperature (Tcase) below 90°C. For an ambient
temperature Tair=60°C and P out=13W, the required thermal resistance Rth (case-air) = ( Tcase - Tair) / ( (P out / ηT ) - Pout +
Pin ) of the heat sink, including the contact resistance, is:
Rth(case-air) = (90°C - 60°C) / (13W/40% – 13W + 0.05W) = 1.53 °C/W
When mounting the module with the thermal resistance of 1.53 °C/W, the channel temperature of each stage transistor
is:
Tch1 = Tair + 40.9 °C
Tch2 = Tair + 69.6 °C
The 175°C maximum rating for the channel temperature ensures application under derated conditions.
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but
there is always the possibility that trouble may occur. Trouble with semiconductors may lead to personal injury, fire or property
damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such
as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material, or (iii) prevention against any
malfunction or mishap.
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