INDEX

1. 2. 3. 4. 5. 6. 7. 7.1 7.2 8. 8.1 8.2 8.3 8.4 9. 10. 11. 11.1 11.2 11.3 11.4 PREFACE ACKNOWLEDGEMENT WHY A PROJECT MARKET SURVEY PRELIMINARY CONSIDERATION LAYOUT PROJECT DETAILS WORKING PRINCIPLE MANUFACTURING PROCESS DISCRIPTION OF COMPONENTS TRANSFORMAR TRANSISTOR DIODE ZENER DIODE ESTIMATING & COSTING FINANCIAL PROJECTIONS & PLANT CAPACITY TESTING & INSPECTION VISUAL INSPECTION TEST ASSEMBLE TEST FINAL TEST MECHANICAL VIBRATION TEST

12. 13. 14. 15.

PACKAGING & DELIVERY SALES & PUBLICITY CONCLUSION BIBLIOGRAPHY WHY A PROJECT
A student specially technical student is expected to do some

experimentation and research work on the subject, which he thought in the class textbook during the course of his studies. Such an effort when well organized with a definite aim or purpose is called a project. The object of a project is to envelope technical thinking and induced the student to make an ordinary analysis to the situation following at hand so as to search a definite conclusion.

By doing project student displays his spirit of inquiring creating & criticizing way of solving a problem through under standing of existing situation, independent thinking and ability to understand basic fact.

PREFACE
Today our country is passing through a critical stage employment is very scarce, growing number of educated people remain unemployed for long time. Our government is trying to do its best to provide employment, but the government has its own limitation. So self-employment is very important aspect according to present situation. To provide one with suitable guidance in this direction, project work has been included in our curriculum of the final year of diploma course. This project work reflects the theoretical and practical knowledge gained by the student during their studentship in the institute. It deals with an important aspect in the curriculum of a student in that the student should be able to design on his own the whole aspects of the component taken at hand and be able to suggest new ideas to manufacture a given component on the basis of economically justified ground in the light of improved techniques. COMMUNICATION BY LASER unit which is used in Home automation system ,with the above ends in views. This subject has a unique importance in the field of electronics .

COMMUNICATION BY LASER
We are designing a circuit which is based on Laser communication .In this circuit a microphone is used which converts audio voice in to electrical signals .These signals are amplified by using transistor t1 and then feed in the IC 741 to amplify the signals . The IC 741 giving output from Pin No 6 .This output is giving to the power transistor .The power transistor is connected to the laser . The laser converts these voice in to light signals these light signals are feed in a optical fiber .On the second end a sensor is connected this is photo transistor .This photo transistor converts light signals in to electrical signals . These electrical signals giving to transistor t4 and t5 by coupling capacitor c5 0.01 uf . Transistors are pre amplifying signals and then fee in ic 386 for final amplification .The final output is comes out from pin No 5 of ic 386 . This final output is giving to the speaker ,the speaker converts signals in to voice .
All the electronic circuits works on DC power supply . So we are require a rectifier circuit which gives pure DC supply . Rectifiers are two types half wave rectifier and full wave rectifier . full wave rectifier gives good performance then half wave rectifier. In the

Rectifier circuit stepdown transformer is used which converts 230 volt AC into 36 volt AC . This 36 volt AC is converted in to DC with the help four diodes . Diodes are used to change negative half cycle in to positive half cycle And this DC is not pure then DC is filtered with the help of electrolytic condencer Final output is DC . The output 1000 uf . . Full

is fed in a DC motor

wave rectifier is very good in efficiency . For power supply indication a L.E.D is used and a resistance is connected in series with the L.E.D to protect the L.E.D. A 25 ohm resistance wire is wound on a 1mm thin wire to heat and cutting purpose.

RESISTANCE
Resistors and resistive networks are extensively used in electronic circuits and measurement work. The foremost properties of material used in the construction of resistors meant for precision work are : stability or performance with time two resistance temperature co efficient low thermoelectric emf. With copper high resistively resistance to oxidation corrosion and moisture case of manufacture and low cost. Material Used for Resistors: The most widely used material for precision resistors are :

Mangnin :It is an alloy of copper manganese and nickel and is universally used as resistance material for precision resistors and for resistance measuring apparatus. It has a normal composition of 84% copper 12% manganese and 4% nickel. The foremost property of managing is that it has almost a zero temperature coefficient of resistance near about room temperature.

Constantine: These are series of alloy of nickel & copper containing 40 to 60 percent nickels, with a small amount of manganese to improve their mechanical properties. Constantan has a resistively at ordinary temperature of about 25times that of copper is corrosion resistant inexpensive & easy to work. It also finds application is resistors of 1000 -- & above as in voltmeter Multipliers.

Nickel Chromium alloys: These alloy have a somewhat higher temperature coefficient of resistance than that of manganin and costantan these alloys cannot be uses in precision resistance Nichrome has a very high resistively and resists corrosion even at very high temperature. Gold Chromium: It is an alloy of recent introduction which appears to be very promising for some application it is made with slightly over 2 percent of chromium. For many application the extremely small temperature coefficient of gold chromium alloys make their use desirable especially for heat resistant standard.

Resistance Wires: The resistance wire is generally double silk of silk and cotton covered The wire is enameled before these coating are applied. High quality resistors are wound with only layer of wire although this requires use of smaller wire than for multilayer coils. Resistance with a wide range of values are extensively used in electrical and electronic circuits. A colour code is used to indicate the resistance value and its percentage reliability. The resistor has a set of concentric rings to tit with their significance. The first two bands from the end indicate the first two significant figures of resistance is ohms The third band indicates the decimals multiplies and the last band stands for the tolerance in percent about the indicated value

Resistor Color Code

Color Black Brown Red Orange Yellow Green Blue Violet Gray White Gold Silver No Color Number 0 1 2 3 4 5 6 7 8 9 Multiplier 1 101 102 103 104 105 106 107 108 109 10-1 10-1 Tolerance -

5 10 20

LED- LIGHT EMITTING DIODE: A relatively new family display devices utilizes light emitting diodes

THEORY OF LED: The led is primarily a PN Junction semiconductor device The basic mechanism of Electro-magnetic radiation from the device is injection luminescence (IL) The occurs in two steps i.e(I) injection of minority caries across the junction and (ii) The radioactive recombination of minority carries When the diode has zero bias under thermal equilibrium condition the space charge of depletion layer potential prevents the cross over of large concentration of mobile conduction band electron & the valance band holes across et junction When a forward bias is applied to the device the magnitude of these potential barrier is reduced making it possible for diffusion of electrons and helps across the junction The minority carries concentrations on both sides to the junction are considerably increased which increased their rate of recombination This is responsible for electromagnetic radiation. Several different materials have used for LEDs the properties of some of commonly used materials age given in table

Properties of some LED Material

Material Gap : Zn,o ZaP : N GaP :NN Ga As 0.6 P0.4 Ga As 0.35P0.65:N Ga As 0.15{0.86 :N Color Red Green Yellow Red Orange Yellow Peak wave 695 570 590 649 632 589 External 1.5 0.5 0.1 0.5 0.5 0.2 Band Indirect Indirect Indirect Indirect Indirect Indirect Im/w 20 600 450 75 190 450

Thus the LED is a PN junction device which emits light when current passes through in the froward direction. Change carriers recombination occurs at a PN junction as electrons cross from N side & recombines with holes on the P side When recombination lakes places the chare carrier give up energy in the form of heat and light if the semiconductor material is translucent the light is emitting diode i.e. LED Figure shows a cross sectional view of a typical LED

Metal Film Connection Charge Carrier

Light emission

Metal Film Connection Diffuse P-Type Epitaxial N-Type

Cross- section In this LED charge carrier recombination lakes place in the Ptype material. Therefore the region becomes the surface off the devices . For maximum light emission a metal film anode is

deposited around The edge of the P-type material. The cathode connection fotr the device is usually a gold films at the bottom of Ntype regior. This helps in reflection the light to the surface. Semiconductors materials use for manufacture of LED are gallium arsenide phosphide (Ga As P ) which emits red of yellow light of gallium arrested (Ga A ) Which gives green of fed lightly emission > LEDs are use extensively in segmental & dot matrix displays of numeric & alphanumeric characters Several LEDs form a decimal point LEDs are available in many colours like green,yellow,amber & red. The major advantages of LEDs in electronic displays are:1. 2. LEDs are miniature in size & they can be stacked together to form numeric & alpha numeric displays in high-density matrix. The light output from an LED is a function of the current flowing through it Therefore intensity of light emitted from LEDs can be smoothly controlled. 3. LEDs have a high efficiency as emitters of electromagnetic radiation They require moderate power for their operation A typical voltage drop of 1.2 v and a current of 20mA us required for full brightness. 4. 5. LEDs are available which emit light in different colours like re green yellow and amber. The switching time (both on or off) is less than 1ns & therefore they are very useful where dynamic operation of large number of amays in involved.

6.

LEDs are rugged and can therefore withstand shocks and vibrations They can be operated over a wide range of temperature say 0-70 c.

Disadvantage
LEDs are not suited for lagrge area displays primarily because of their high cost. For large displays devices using gas filled plasma are used.

CAPACITORS
The fundamental relation for the capacitance between two flat plates separate be a dielectric materiel is given by C=0.08854KA where C= capacitance in p:f. K= dielectric constant A=Area per plate in square cm. D=Distance between two plates in cm Design of capacitor is connected with the relation of the proper dielectric caterial with particular type of application. The dielectric

material used for capacitors may be grouped in the various classed like Mica Glass air ceramic paper Aluminum electrolytic etc. The value of capacitance never remains constant except under certain filed condition it changed with temperature frequency and aging. The capacitance value marked on the capacitor strictly applies only at specified room temperature and at low frequencies some of the

DIODES
It is a two terminal device consisting of a P-N junction formed either in GE or SI crystal. The P- and N type regions are referred to as anode and cathode respectively. Commercially available diodes usually have some means to indicate which lead is P and which lead is N. Standard notations consists the number proceeded by IN Such as In 240 & 250 Here 240 and 250 correspond to color band.

P.C.B. MANUFACTURING PROCESS:

It is an important element in the fabrication to electronic equipment it is the design of property laid out PCBs that Printed Circuit Boards(PCBs) are certainly the most determine many of the limiting properties wither respect to noise immunity as well as to fast pules high frequency and low level characteristics of the equipment. High power PCBs in their turn require a special design strategy. The fabrication process to the printed circuit board will determine to a large extent the price and reliability to the equipment. A common target aimed at is the fabrication of small series of highly reliable professional quality PCBs with low investment cost. The target becomes especially important for custom tailored equipment in the area of industrial electronics.

The layout of a PCB has to incorporate all the information of the board before one can go on the artwork preparation. This means that a concept, that clearly defined all the details of the circuit and partly also of the final equipment is prerequisite before the actual lay out can start. The detailed circuit diagram is very important for the layout designer but he must also be familiar with the design concept and with the philosophy behind the equipment.

BOARD TYPES:
Only the two most popular PCB types are: 1. Single Sided Boards The single sided PCBs are mostly used in entertainment electronics where manufacturing costs have to be kept at a minimum. However in industrial electronics also cost factors connot be neglected and single sided boards should be used wherever a particular circuit can be accommodated on such boards. 2. Double Sided Boards Double sided PCBs can be made with of without plated through holes the production of boards with plated through holes is fairly expensive. Therefore plated through hole boards are only chosen where the circuit complexities and density does not leave any other choice.

DESIGN SPECIFICATION
STEP TAKEN WHILE PREPARING CIRCUIT (A) PCB DESIGNING

The main purpose of printed circuit is in the routing of electric currents of electric currents and signal through a thin copper layer that is bounded firmly to and instating base material some time called the base. This base is manufactured with an integral bounded layers of thin copper foil which has to be partly etched of other wise remove to arrive at a pre designed pattern to suite the circuit connections or whatever other application is noted.
The term printed circuit board is derived from the original method where by a printed pattern is used as the mask over be wanted areas of copper. The PCB provides an ideal; base board upon which to assemble and hold firmly most of the small components From the constructors point to view the main attraction of using PCB is its role as the mechanical support for small components. There is less need for complicate and time consuming metal work of chassis contraception except perhaps in providing the final enclosure Most

straight forward circuit designs can be easily covered in to printed wiring layer the thought required to carry out the inversion cab footed high light an possible error that would otherwise be missed in conventional point to point wiring. The finished project is usually neater and truly a work of art. Actual size PCB layout for the circuit shown is drawn on the copper board, while the help of a material inactivate of FeCl3 solution. The hoard is then immersed in FeCl3 solution for 12 hours, in this process only the hidden copper portion that is etched out by the solution. Now the paint is washed out by the petrol. Now the copper layout on PCB is rubbed with a smooth sand paper slowly and lightly such that only the oxide layers over the Cu is removed. Now the holes are drilled at the respective places according to component layout as shown in figure. (B) LAYOUT DESIGN:

When designing the layout one should observe the minimum size(component body length and weight) Before starting to design the layout have all the required components to hand so that an accurate assessment of space can be made it is often necessary to mount these so thwart the body is clear of the board to allow adequate air flow. Other space consideration might also include from case mounted

components over the printed circuit board or to access path to present components in the case.
It might be necessary to turn some components round to a different angular position so that terminals are closer to the connections of the components. The scale can be checked be positioning the components on the squared paper. If any connection cross, then one can reroute to avoid such condition. All common or earth lines should ideally be connected to a common line routed around tha perimeter of the layout this will act as the ground plane. If possible try to route the outer supply line ground plane. If possible try to route the other supply lines around the opposite edge to the layout to through the center. The first set is to tearing th circuit eliminate the crossover with out altering the circuit detail in any way. Plan the layout as if looking at the top side to this board first this should be translated inverse later for the etching pattern large areas rate recommended to maintain good copper adhesive it is impotent be bear in mind always that cooper track width must be atlas to the recommended minimum dimensions and allowance must be made fort increased width where termination holes are need from this aspect if can become little tricky to negotiate the route for connects to small transistors.

There are basically two ways one can effect the copper interconnections pattern in the under side to the board. The first is the removal of only the amount of copper necessary to isolate the junction to the components to each other resulting in the large areas of copper. The second is to make the interconnection pattern looking more like conventional point point wiring by routing uniform width of copper from component to component. (C) ETCHING PROCESS: Etching process requires the use of chemicals acid resistant dishes and running water supply Ferric chloride is maximum used solution but other enchants such as ammonium per sulfate can be used. Nitric acid can be used but in general it is not used due to poisonous fumes. The pattern prepared is glued to the copper surface of the board using a latex type of adhesive that can be cubed after use. The pattern is laid firmly on the copper use a very sharp knife to cut round the pattern carefully a remove the paper corresponding to the required copper pattern areas. Then apply the resist solution, which can be kind of ink proportion fort the purpose maintaining smoothing clean outlines as far as possible. While the board is drying test all the components Before going to next stage, check the whole gotten and cross cheek against the circuit diagram check for any freeing matte on the

copper. The etching bath should be in a galls or enamel disc. If using crystal of ferric- chloride these should be thouougly dissolved in water to the proportional suggested. There should be 0.5 Lt. Of water for 125 Gm of crystal. Waste liquid should be thoroughly deflated and druid in water land; never pour down the drain. To prevent particles of copper hindering further etching, agitate the solutions carefully be gently twisting or rocking the tray. The board should not be left in the bath a moment longer than is needed to remove just the right amount of copper. In spite of there being a resist coating there is no protection against etching away through exposed copper edges; this leads to over etching. Have running water ready so that etched board can be removed properly and rinsed; this will halt etching immediately. Drilling is one of those operations that calls for great care.because most of the holes will be made a very small drill. For most purposes a 1mm drill is used Drill all holes with this size first those that need to be larger can be easily drilled again with the appropriate lager size.

(D)

COMPONENT ASSEMBLE: From the greatest variety of electronic components available

today,which runs into tent of thousands of different types it is often a perplexing task to know which is the right task for a given job. There should be damage such as hair line crack intuit opera on PCB that could age a seriousefiec on the operational ability to the completed assemble. If there are than they can and should be repaired fiesta bye soldering a short link of bare copper wire over the affected part. The most popular method of holding all the items is to been the wires future apart after they eve been indebted in the appropriate holes. This will hold the component in position ready for soldering. Some components will be considerably lager than other occupying and possibly partly obscuring neighboring components. Because of this is best to start by mounting the smallest first and progressing through to the largest. Before starting make certain that no further drilling I likely to be necessary because access may be impossible later. Next will probably be the resistor small signal diodes of other similar size components. Some capacitors are also very small but it would be best to fit these after wards. When fitting each group of componets mark off each one on the components its as it is fitted and if we have to leave the job we know where to recommence.

Although transistors and integrated circuits are small items there are good reasons for leaving the soldering of these untile the last step. The main point is that these components are very sensitive to heart and if subjected to prolonged application to the soldering iron, they could be internally damaged.
All the component before mounting are rubbed with sand paper so that oxide layer is removed with sand paper so that oxide layer is removed from their tips. Now they are mounted according to the component layout . (E) SOLDERING: Flux is applied to the tips and then the component are solider now the board is prepared connected at respective place and 9v DC supply is given.Now the circuit goes under the following process. antenna and condenser mike are

CONCLUSION
The reliability and accuracy of an equipment is inversely proportional to the number of components being used. The less number of the components more reliability and accuracy can be achieved almost of the electronic components are temperature and voltage variation dependent. So more number of component more the problem, you have also it increase the maintenance cost. Our equipment has been designed using the most modern LSI chips available in the market which can take the voltage fluctuation of greater degree.

MARKET SURVEY
The marketing of any product depends on the way it is presented in the market. It is very important that the new product should be introduced in a manner that its entrance in the market is felt by the perspective customers. Before a product is planned to be introduced the following points are of almost importance. 1. 2. 3. 4. The market potential of the product proposed. The market plot locations from the works and different manufactures. Availability of the raw materials required. Economics of production and market prevailing.

With the above points in or view, we started exposing the market potential, location from book. In the market the E OFFICE available are costing about Rs. 5000/- to Rs. 6000/- where as our sale price is coming about Rs.1800/which is on the lower side of the market rate prevailing and also we go into the production we shall be purchasing the raw material in bulk which shall further reduced the raw material cost 30-40%which will enable us to get the bulk of market share.

Since we are being the technical students we will be getting the loans from the financial institution at the concessions rates and also will be getting the tax benefits for about 10 years. For successful marketing and establishing desirousness of product from the customers we propose the following. 1. 2. 3. Advertisement campaign in leading newspapers, demonstration free installation to develop confidence in our product Quick production after sales service Incentive scheme for retail out lets etc.

PRELIMINARY CONSIDERATION
The question if efficient organisation and control should be

brought into play from the very outset, when the scheme for any proposed work is being first mooted and not leftover all the work is completed. As experience shows that the industrial enterprises launches on without proper planning and per estimation of capitals and overheads costs have often come to brief. So far so starting a new business is concerned, it is highly essential that the entire scheme should first be most carefully laid out in details if best results are to be achieved. The choice of suitable location must play a dominant role in the success of any undertaking. The selection of site should be based on the availability of raw material. Proximity to market, transport facilities, availability of power fuel, availability of labour, conductive climatic and atmospheric conditions as also sale of the proposed product in the present market. Each section of the factory will have to be properly designed and relocated with due regards to the output of the production. Most careful and exhaustive estimate will have to be prepared for the

amount of capital that would be required, the probable annual or monthly output, the working cost, maintenance charges., administrative and selling expenses, the sale price likely to be realised and the profit anticipated in order to make sure that the venture would satisfy its existence. The approximate cost of the product must be based in precise and exhaustive assessment of reliable data. The success of the business is based in better quality and latest variety of a product being easily available in the present market and at a lower cost. FINANCING : For starting any industry, first requirement is capital. So we have to estimate in detail provision for a capital considering all the aspects of a factory. We have however been financed by the Govt. through

Industrial development co-operative of India . This agency has agreed to grant a loan of Rs. 5,50,000 /- this partners agreed to invest Rs. 1,00,000/-. All the transactions with industrial development cooperative shall be made by authorised cheques duly signed by the Manager. Consent of the money shall be then from the active coordinating partners.

SITE SELECTION Site selection means deciding a suitable location area, place, etc. Where the industry will function. In modern industrial management concept site or location of factory is a governing factor and thus is considerbly stressed while starting any industry. The selected site must be most advantageous and suitable in all respect. The factors which influences the selection establishing industry are following :1. 2. 3. 4. 5. 6. 7. 8. 9. Availability of raw materials Availability of labour Means of transportation Market Availability of power Availability of space Availability of water Climatic condition Future development of site for

For our project we have selected Industrial Estate ` in Mandideep as a site. The various plus points in favour of this particular site as follows :-

1.

AVAILABILITY OF RAW MATERIALS Nearness of raw materials the cost or transportation's of raw

materials from the senders end of industry therefore, the industry must be located close to the source of raw materials. As ours is an assembling process, the industry is situated at such a place where all components are readily available and in case of certain emergencies sources can be easily approached. As mandideep is situated on main railway track and national highway by passes it, availability of raw material is no problem. 2. AVAILABILITY OF LABOUR The location of industry is sometime affected by labour problems. As to manufacture our project a large number of workers are not needed so availability of labour doesnt play any significant role. As for requirment of skilled labour it can be meet easily in mandideep. 3. MEANS OF TRANSPORTATION

By transportation is meant carrying raw material form market to factory and finished product to market. It also includes carrying various equipment's articles and other things for running the industry.

As location of our site is on highway and Mandideep is situated on main railway track transportation of either raw material or finished products to any desired place is easily achievable. 4. SALES MARKET The manufacturers whose industry is situated near to market can capture a big share of the market and render quick service to the customer. Nearness of market also reduces the transportation cost to minimum. More over due to feasible transportation facilities product can also be marketed too for off places. 5. AVAILABILITY OF POWER Availability of power and availability of water doesnt play any significant role in developing any electronic industry, thus these factors can be neglected. 6. AVAILABILITY OF SPACE As our industry consists according to the layout given below. a.
b.

Availability of water Climatic condition

c.

Future development

LAYOUT The layout of a factory workshop of working area means the position of department or shops in the factory and of machine work place and storage points in the working areas including offices and staff facilities relative to one another. A bad layout can cause unnecessary movement of materials and consume time and energy of workers without any valuable addition in completion of job. The layout may be defined as work of planning and organising the physical conditions and relationships between factory equipments and other operation that will make possible as satisfactory degree of economy and efficiency in production. The main object of a good layout in broad sense is to make full and proper utilization of resources available so as to get good result.

LIST OF MACHINERY AND TOOLS S. NO S T 1. U 2. V 3. 4. 5. Drilling Machine Cutting Machine Bending Machine Temperature controlled soldering iron Digital Multimeter MACHINES AND TOOLS

MANUFACTURING PROCESS PRINTED CIRCUIT BOARD * LAYOUT Layout of the desired circuit, preparation is first and most important operation in any circuit board manufacturing process. First of all component side to be decide made in accordance with available of component dimensions. The following points are to be observed while performing the layout of P. C. B. A) B) Between two component sufficients space should be maintained. High voltage/Max. heat dissipated components i.e. high voltage resistors should be mounted at a sufficient distance form semiconductors and electrolytic capacitors. C) The first and most important point should be kept in mind that components layout is making proper copper side circuit layout. comprimilation with

D)

While drawing the layout of the copper side circuitry, one should be very cautious, that circuit copper line thickness is as per the expected current drain in the circuit at various stages.

PREPARTAION OF SCREEN Nylon bolting cloth (silk screen cloth) is stretched and attached on a wooden frame. A photosensitive chemical industry. Bombay is spread on the cloth and dried in total darkness. This prepared screen is then exposed to ultraviolet light through positive transparency after exposure developed in water and is ready for use. PRINTING So made screen is now placed on suitable copper laminated sheet on copper side and circuit black printing ink (acid resistance paint) is spread uniformly over it. (silcot-6 ) and amonium bicarbonate ( NH 4 CO )3 supplier M/s Agfa film and photo

NOTE A) B) Before printing the screen should be aligned properly. During printing process it should be observed that circuit edge should be smooth and uniform. After printing the PCB should be allowed for necessary drying in a dust proof chamber at least for 10 hrs. in a normal room temperature. NOTE Afterwards the whole circuit should be seen through a magnifying glass that there is no break is arriving, otherwise proper touching should be given to the circuit. ETCHING The removal of excess copper on the copper laminated PCB , apart form printed circuit is known as etching. There are three methods of etching A) General in this process the printed about one hour and then taken out. PCB is placed in a

solution of ferric chloride solution (FeCl3) and it kept so far

B) Continuous flow method in this method the printed circuit board is subjected to a continuous flow of ferric chloride solution and the excess copper is removed within half an hour time. C) In the force method printed PCB is subjected it is forced spray of ferric chloride solution, in a closed chamber by means of some electrical motor assembled machine is known as etching machine. Out if the above three method one so me development

/laboratory work. But other two age most economical for commercial industries. Because the rate of production in this two process varies between 500 to 1000 nos. in a day. After testing immediately the etched plates should dipped into a clean water for about one hour in order to get the printed plate away form any acidic properties which may cause poor performance of the circuit system by making chemical reactions with metal components leads. DRILLING Under this operation necessary drilling as per drawn circuit layout, is being made with suitable drill and high speed machine.

NOTE Always the drilling should be done form copper side in order to avoid possibility of coming out of the copper circuit and chipping out of the bakelite TINNING OF THE CIRCUIT SIDE After drilling the PCB circuit side is given tin plating to

increase the conductivity of the conducting media and top avoid the oxidizing effects. As copper gets oxidized very quickly and these circuits are designed and manufactured to work in open atmosphere. At this process is being done through electroplating system. The circuit plate is being treated as anode for operation. COMPONENT SIDE PRINTING In this process with the help of screen as in circuit, but with a white paint. Component values are their designations are printed as per earlier made layout. Generally this method is applied for commercial purpose, in order to make the assembly convenient. Then plates are allowed for drying in dust proof chamber. COMPONENT MOUNTING

In this operation first of all components are mounted at their respective places as per the component layout, then all are soldered on circuit side.

NOTE a) During this operation should be very cautions that the component are not everything which may damage semiconductors. b) The soldering iron being used for soldering of semiconductors should be of low voltage. c) While soldering semiconductors, heat sink should be use. d) There should not be blow holes which may cause discontinuity of the circuit and improper test. e) While soldering solder should not spread over the entire circuit solder tip should be sharp and smooth. f) For soldering flux cored solder with a fine ratio of tin (80:20) and lead should be used . g) While mounting components always values should be visible h) Semiconductors and other polarized components should be mounted be correct polarities. After this operation is over immediately the PCBs are given ultrasonic treatment.

TESTING AND INSPECTION

The testing and inspection procedure are laid down in such a way that equipment manufactured by a passes though all the simulation test, which may out instrument be subjected to in actual use. After a careful study we have laid down the final tests. 1) VISUAL INSPECTION TEST This test in a primary test to see the any physical damage. 1.1) PCL inspection 1.2) Mechanical strength 1.3) 2) Input/ output connection scheme.

ASSEMBLY TEST This test will cover all the functional test. 2.1) Components test 2.2) Circuit operation test using the test point signal.

3)

FINAL TEST This test will be carried out with the actual operation and conditions.

4)

MECHANICAL VIBRATION TEST This test will be done on the batch samples only.

TESTING Testing play a most important role in the manufacturing of any product, which defects the invisible defects and confirms the desired technical features of product. During testing product is subject to various type of testing. A) VISUAL CHECK In this it is seen that all components of proper values are mounted to their respective polarities. B) CRCUIT TESTING In this circuit is given to the required supply and various

parameters i.e. voltage current etc. are recorded and then is kept on for cycle operation that is for 24 hrs. and parameters are recorded after a certain intervals. TYPES OF TEST Generally this test is conducted on one prototype job which covers following stages :-

DAMP TESTING
`In this testing job is subjected to a wet atmosphere for one cycle at a designed temperature and afterwards immediately normal testing is conducted and observed that reading are in line with desired readings. On completing the testing the various stages readings are completed with designed parameters for necessary approval.

--

PACKING
Before packing of a product, final inspection is very necessary. This inspection should be done very carefully up to the standards as mentioned in the drawing. Packing should be done very carefully so that the product should not be damaged or scratched before reaching ,the customers hand.

DISPATCH AND DELIVERY After completing of the manufacturing of charger in

workshop, it is required to send these to the customer. So while dispatching, the complete charger should be re- inspected at a glance and make sure that all the components and other accessories are in working condition. After dispatching the charger to the customers independents views and reports form the customer should be sought, regarding the reliability of our product form time to time. Free service should be imparted to the customers in case of any fault, this imparts a better understanding with customers and gives repute to firm.

SALES AND PUBLICITY INTRODUCTION With the growth of business and multiplication of types of goods for sales and above all better competition advertising has become a part of trade to familiarize the people with our product. Advertisement forms a distinct branch of selling publication of advertisement is newspapers, cinema slides, TV etc. are powerful modern methods of publicity. The advertising publicity. The advertising policy must be co-related with sales policy becomes. 1. 2. 3. market. 4. product. 5. quality. 6. To investigate the liking of customer. To find out a good and attractive design of higher To give and attractive brand packing to the To ensure proper co-ordination of policy for To collect necessary statistical data, facts and To be aware about variation taking place in

stability of product in thew market with production. information for accurate forecasting.

7. introduced.
8.

To investigate if any special features can be To estimate the purchasing power of the customer To measure the strength and policy of competitive Choose suitable advertising media for publicity.

in different area.9. business. 10.

OBJECTIVES OF PUBLICITY 1. 2. 3. 4. quality. WAY OF PUBLICITY 1. 2. 3. 4. Circulating catalogue use and other printed Press advertising posters. Screen display in motion film theaters. Radio broad casting advertisement and TV To create a demand for new articles by arising To increase the sale of established product by

public interest. seeking to keep selling point fresh in buyers mind. To over come the false impression which stand in To estimate additional sale by uncovering present the way of sales promotion. customer to use the article more frequently and in increased

materials, deliveries either by post in through selling agent.

advertisement.

We will contract with Publicity Company, which will keeps us in increasing our sales us create demand for our product.

CONCLUSION The reliability and accuracy of an equipment is inversely proportional to the number of components being used. The less number of the components more reliability and accuracy can be achieved almost of the electronic components are temperature and voltage variation dependent. So more number of component more the problem, you have also it increase the maintenance cost. Our equipment has been designed using the most modern LSI chips available in the market which can take the voltage fluctuation of greater degree.

STEPS OF PROJECT MAKING

The following steps have been followed in carrying out the project 1. 2. 3. 4. Study the books on the relevant topic. Understand the working of the circuit. Prepare the circuit diagram. Prepare the list to components along with their specification estimate .the cost and procure them after carrying out market survey. 5. 6. 7. Plan and prepare PCB for mounting all the components. Fix the components on the PCB and solder them. Test the circuit for the desired performance .

8. 9. 10.

Trace and rectify faults if any. Give good finish to the unit. Prepare the project report.

OUR

EQUIPMENT

OFFER

THE

FOLLOWING

ADVANTAGES:1. 2. 3. 4. Robust and compact to use. Easy to use. Low cost. Use the locally available components.

PRECAUTION
1. Switch off the main switch or branch circuit breaker before opening the Switchboard for wiring. 2. Before touching any wire, make sure it is not live. Use a neon tester for the purpose. Wear rubber shoes/slippers. 3. Switch off the circuit, when it is not in use, to conserve the battery. 4. Check the wiring connections to switchboard before switching the on the mains.

BIBLIOGRAPHY
(1) ELECTRONICS PROJECTS VOL 1 ( THIRD EDITION ) (2) ELECTRONICS FOR YOU jan-2002 (3) POWER ELECTRONICS (4) PRINTED CIRCUIT BOARDS DESIGN AND TECHNOLOGY ( WALTER C. BOSSHART ) (5) 81 PROJECT MAKING BOOK