1) Give any 4 reasons why Silicon is the most widely used substrate material for

MEMS.
(i) It is mechanically stable and it is feasible to be integrated into electronics on the same
substrate (b/c it is a semiconducting material).
(ii) Electronics for signal transduction such as the p or n-type piezoresistive can be readily
integrated with the Si substrate-ideal for transistors.
(iii) Its thermal expansion coefficient is about 8 times smaller than that of steel, and is
more than 10 times smaller than that of aluminum.
(iv) Silicon shows virtually no mechanical hysteresis. It is thus an ideal candidate material
for sensors and actuators.

2) Define sheet resistivity.

For a uniformly doped layer, the sheet resistivity is defined as:

o =
t
The sheet resistivity is normally expressed as ohms/square or Ω/□
For non-uniformly doped n-type layers, ie., if ρ is non-uniform:
1
= t
1
0 (x)dx
The sheet resistivity of an emitter layer is typically measured with a four-point-probe.

3)

4)

5) Distinguish between Ion implantation and Diffusion.

Ion Implantation Diffusion
It is a high temperature process
i. It is a low temperature process

The profile of the spread of dopant in

ii. The profile of the spread of dopant in silicon by diffusion is wide
silicon by ion implantation is narrow

It is a chemical process
iii. It is a physical process
6) Write a note on resists used in Photolithography process.
Positive Resists
There are two kinds of positive resists:
(1) the PMMA (polymethymethacrylate) resists,
(2) the two-component DQN resist involving diazoquinone ester (DQ) and phenolic
novolak resin (N).
In the latter kind, the first component takes about 20-50% by weight in the compound.
Positive resists are sensitive to UV lights with the maximum sensitivity at a wavelength
of 220 nm.
Negative Resists
(1) Two-component bis (aryl) azide rubber resists, and
(2) Kodak KTFR (azide-sensitized polyisotroprene rubber).
Negative resists are less sensitive to optical and x-ray exposures but more sensitive to
electron beams.
Xylene is the most commonly used solvent for developing negative resists.

7)

8)
9) .What is the difference between Bulk micro machining and surface
micromachining?

Bulk micromachining in which substrate material is removed by physical or chemical

means.
The surface micromachining techniques build microstructure by adding materials layer by
layer on top of the substrate.

10)
11)
12) List out the advantages of LIGA process?
1. Virtually unlimited aspect ratio of the microstructure geometry
2. Flexible microstructure configurations and geometry
3. The only one of the three techniques that allows the production of metallic
microstructure.
4. The best of the three manufacturing process for mass production, with the provision for
injection molding.

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