SDS-8100
TrustedTM Industrial Control System
TrustedTM Controller Chassis-T8100
FRONT PANEL
DESCRIPTION
TM
The Trusted Controller Chassis
is designed to accommodate a
maximum of eight single-width
TM
Trusted Interfaces and up to
two triple-width TrustedTM TMR
Processors.
The chassis consists of a
backplane, power connection
terminals, and the Inter-Module
Bus connectors. The chassis is
6U (10.5ins) high and is either
front mounted in a 483mm (19-
inch) fixed frame or swingframe,
or can be panel (rear) mounted in
a suitable electrical enclosure.
The two slot positions on the left
(as viewed from the front) are for
TM
installing the Trusted TMR
Processors. The eight remaining
slots are for installing the
TrustedTM Interfaces. Each
module plugs into the chassis
backplane, connecting to the
triplicated Inter-Module Bus.
Double and single connector
options are available.
The backplane is part of the
TM
Trusted Controller Chassis and
provides electrical interconnection
and other services for the
modules. A triplicated 4-position
DIP switch is provided for user
configuration of the system
identification..
Power connection to the
TM
Trusted Controller Chassis is
provided via a 4-pole connector
on the chassis backplate. The
Trusted
TM
Controller Chassis is
designed for a nominal dual +24V
dc power supply.
FEATURES

2 x 90mm Trusted
TM
TMR
Processor slots

8 x 30mm Trusted
TM
Interface Module slots

No user-serviceable parts

Fast assembly

Minimum tooling/parts

Up to twelve High Integrity
I/O modules supported per
TM
Trusted Expander
Chassis

Dual redundant power
TM
supplies from the Trusted
High Integrity Power Supply
Unit

Module slot keying

Triplicated Inter-Module
Bus connections

Front or rear (panel)
mounting on 483mm (19-
inch) dimensions

32,48,64 and 96-way
DIN41612 I/O port
connector capability
Issue 5 Jan 2006
SDS-8100
TrustedTM Industrial Control System
TrustedTM Controller Chassis T8100

BACKPLANE BLOCK DIAGRAM MECHANICAL

SPECIFICATION
Dimensions (HxWxD):
266.7mm x 483mm x
312mm
(10.5ins x 19ins x 12.28ins)

Weight:
5kg
(11lbs.

ENVIROMENTAL
Operating Temperature:

-5°C to 60°C
(23°F to 140°F)

Operating Humidity:
5 to 95%, non-condensing
ELECTRICAL SPECIFICATION Vibration:
10 to 57Hz ±0.075mm
Power Requirements 20 to 32V dc
57 to 500Hz 1.0g
Power Dissipation None – refer to the TMR Processor and
associated TMR Interface module Data Sheets
Shock:
Module Interface Triple redundant Inter-Module Bus
15g, ½ sine wave, 11ms

EMI (IEC 801):

ESD
Air discharge to 15kV
Contact discharge to 8kV

Radiated Fields
10V/m, 27MHz to
500MHz

Transients and Bursts

2kV, 2.5kHz for
t=60 seconds

ICS Triplex Technical data sheets are intended for

information and guidance. The Company
has a policy of continual product
development and improvement.
Specifications are subject to change
without notice. For latest information, visit
our Website:- www.icstriplex.com