PUNE INSTITUTE OF COMPUTER TECHNOLOGY, PUNE - 411043

Department of Electronics & Telecommunication Engg.

AY: 2022-23 Class: S.E.-07
Subject: Electronic Skill Development (lab) Date of Performance:
Roll No. 22348 Batch: G7
Experiment No.: 05

Title : Designing of single layer PCB layout

Aims:
• Design and simulate electronic circuits using KiCAD software
• Learn each step for developing the PCB layout design using KiCAD software.
• To understand step by step fabrication of single layer PCB.

Software/ Simulator : KiCAD

Problem Statements:
• Dual variable power supply using three terminal device.

Instructions:

• Draw neat circuit diagram and specify component values.

• Draw PCB layout by considering single layer PCB design Rules.
• Paste the screen shots of the circuit along with the readings.

Circuit Implementation and Results:

Problem Statements
a)

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 PUNE INSTITUTE OF COMPUTER TECHNOLOGY, PUNE - 411043

Department of Electronics & Telecommunication Engg.

b)

c)

ESD- LAB AY 2022-23 Page :

 PUNE INSTITUTE OF COMPUTER TECHNOLOGY, PUNE - 411043

Department of Electronics & Telecommunication Engg.

Single Layer PCB fabrication

ESD- LAB AY 2022-23 Page :

 PUNE INSTITUTE OF COMPUTER TECHNOLOGY, PUNE - 411043

Department of Electronics & Telecommunication Engg.

PCB Manufacturing :

• Steps to follow for PCB fabrication

1. Create PCB layout using any suitable tool.
2. Print it dark to retain tracks properly.
3. Cut copper clad with suitable size with cutting machine.
4. Rub the copper clad using steel wool to remove oxidized
copper from copper side.
5. Dip copper clad inside photoresist for 1 second.
6. Bake for 2 minutes

7. Insert copper clad to UV exposure for 2 minutes.

8. Dip copper clad in to photo resist developer.
9. Again, bake for 2 minutes.
10. Insert UV exposed board, into etchant solution for 4 min.
11. Inspect PCB for continuity, proper tracks and any shorts,
breakage etc.
12. Drill holes of suitable diameter into PCB layout.
13. PCB is ready to use.

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 PUNE INSTITUTE OF COMPUTER TECHNOLOGY, PUNE - 411043

Department of Electronics & Telecommunication Engg.

• PCB Coater & Photoresist Dryer

1. Baking chamber
2. Photoresist tank.
3. PCB holder
4. Photoresist thinner
5. Negative photoresist E-1020
6. Power on switch
7. Timer on switch
8. Emergency stop
Mechanical dimensions (L X B X W)
42 X 12 X 45
Photo resist section –
o SS tank can hold 1 litre of mixture of negative photo (E-1020) resist
and photo resist thinner (alter mixing stir it for 1 min).
o In the tank photo resist can be applied on maximum Ad size of copper
clad.
Baking Section –

o It includes titanium heater which approximately heats the material till

4550°C within 4 min.
Operating procedure –

o This equipment has two sections 1. Photo resist section o Hold

copper clad with at least 0.5' (inch) away from actual expected area of
interest with the help of holding clips.
o Dip the copper clad in to mixture of negative photo
resist (E-1020) and photo resist thinner for 1 sec.

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 PUNE INSTITUTE OF COMPUTER TECHNOLOGY, PUNE - 411043

Department of Electronics & Telecommunication Engg.

2. Baking Section
o After applying photo resist on copper clad, keep the
clad with holding clips inside baking chamber. Close
the lid.
o Set the timer button on (set for 4 minutes by default).
o The LED indicator goes off after the set time.

Do not touch unit with bare hands it is hot. Let it cool for some time
and then process further.

Precautions/ safety –
 Make sure photo resist tank lid is closed.
 While baking PCB keep the lid closed.
 Do not touch copper clad with bare hands after application of photoresist
and baking.
 Keep watch on timer switch and LED indicator Use stop switch in case of
emergency.
 Follow all the procedure to avoid any damage to equipment, PCB and
accident to human.

• Ultra violet (UV) exposure

1. Power on switch
2. Timer on switch
3. Single / Double side select switch
4. Indicators for side select switch
5. Emergency stop button
6. UV Lights
7. Glass stand for copper clad &
tracing Mechanical dimensions (L X B
X W)
26 X46 X 32

UV Section –
o Upper & Lower Section with 4 UV lights of 8 W each
 PUNE INSTITUTE OF COMPUTER TECHNOLOGY, PUNE - 411043

Department of Electronics & Telecommunication Engg.

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 PUNE INSTITUTE OF COMPUTER TECHNOLOGY, PUNE - 411043

Department of Electronics & Telecommunication Engg.

Operating Procedure –
o Place copper clad board on glass
o Place track layout printed on tracing paper as if you are reading it on the top
of the base glass plate. o Switch power button on o Select TOP UV light
(by default itis at top) o Press timer switch. o Expose for 2 minutes
(automatically stops after timer) o Bake for 2 minutes after exposure.
o Dip in to photo resist developer for some time (few seconds)

Precautions/ Safety
 UV light are harmful to human eyes, do not peep in to the box after it is
on (Already precaution for auto-off after lid open is available)
 Glass plates stick to each other as vacuum is created between them, place
a small unused paper between them.
 Timer is set for 2 min, in case required expose two times for the same
time, do not change timer.
 Provide good darkness in order to have good exposure of UV.

• PCB Etching unit

1. Power on switch
2. Timer on switch
3. Timer
4. Emergency stop button
5. Water bucket
6. PCB holder
7. Ferric chloride ( FeCl2)
Mechanical dimensions (L X B X W)
40 X 48 X 15
Etching Section –

12 litres of Etching Solution – Ferric Chloride (FeCl2)

500 Watt Heater – To heat the echant

Titanium sensor – To on/off the heater for temperature control (450C to
480C)

Diaphragm pump – oxidization process

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 PUNE INSTITUTE OF COMPUTER TECHNOLOGY, PUNE - 411043

Department of Electronics & Telecommunication Engg.

Operating Procedures –
o Press start button (5-10 min before you want to start etching)
o Hold PCB board with the special clips as labelled 6 in image.
o Dip PCB board in to the echant tank o Temperature will be
maintained at 450C-500C o Set timer on (4 min) o Dip &
Cover the Tank

Precautions/ Safety
 The etchant solution forms bad patches on surface so take care.
 Use clean water always after every etching to avoid those patches.
 Don't spill the etchant on surface as well as cloths.

Conclusion:
We learnt about designing and creating electronic circuits as well as PCB layouts using KiCAD
software

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