Ver：4.

0
Rev date：2018-11-30

®
F•RST Polyolefin
Solar Module Encapsulant

TF4&TF8

Product Specification

Hangzhou First Applied Material Co., Ltd.

Web: www.firstpvm.com
Tel: +86-571-63812086
Fax: +86-571-63710907

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1. Introduction
F·RST®TF series is one kind of cross linkable polyolefin elastomer encapsulant, developed by

Hangzhou First Applied Material Co., Ltd. The TF series has high water barrier ability, electric

insulation, as well as strong PID resistant property. It is very suitable for PID-sensitive cells such as

p-PERC bifacial cell, N-PERT cell as well as IBC cell. It is also applicable for traditional P cells which

are encapsulated as frame free double glass module and glass-back sheet module used in high

humidity area.

F·RST®TF series has below typical advantages：

1) Low water vapor transmission rate;

2) Excellent PID resistance;

3) Strong electric insulation;

4) Fast curing speed；

5) Good adhesion with glass, backsheet as well as metal;

6) UV and Damp heat durable;

2. Specification
F·RST®TF series typical size is specified as below, and can be adjusted per customer

request.

Model TF4 TF8

2 2
Gram weight & Tolerance (430±20) g/m (430±20) g/m

a a
Thickness & Tolerance 0.50±0.05mm 0.50±0.05mm

Length per roll 120m / 300m 120m / 300m

Width tolerance (0/+7) mm (0/+7) mm

Notes: The above specification values also can be adjusted for customization.

a
: 0.50mm is the name of general thickness specifications, the final apparent thickness should be

determined by the embossed pattern.

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3. Technical specification

value
Characteristic Test methods unit
TF4 TF8

Optical
Light 1100nm-380nm ASTM D1003 % ≥90 ≥90

transmittance 380nm-290nm ASTM D1003 % ≥70 ≤30

Cross link
1
Gel content FST method Gel% ≥60 ≥60

Electrical
16 16
Volume resistivity IEC62788-1-2 Ω·cm ≥1.0×10 ≥1.0×10

Dielectric strength ASTM D149 kV ≥28.0 ≥28.0

Mechanical
Adhesion to glass GB/T 2709 N/cm ≥60 ≥60

Adhesion to TPT backsheet GB/T 2709 N/cm ≥60 ≥60

Tensile strength ISO 527-3 MPa ≥10 ≥10

Elongationat break ISO 527-3 % ≥500 ≥500

Shrinkage
MD GB/T 29848 % ≤3 ≤3

TD GB/T 29848 % ≤1.5 ≤1.5

Barrier
2 2
WVTR ASTM F1249 g/m /24hr ≤5.0 ≤5.0

PID resistance
3 4
Module power loss IEC62804 % ≤5.0 ≤5.0

Weathering
UV resistance GB/T 29848 △YI ≤5.0 ≤5.0

Damp heat resistance GB/T 29848 △YI ≤5.0 ≤5.0

Note：
1
: xylene extraction method.
2 o
:test condition: 38 C, 100%RH.
3
:N type and P type cell;
4 o
:test condition：85 C, 85%RH,-1000V,96h

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4. Product properties
 Normal properties

 Crosslinking Property

Time(min)
11 13 15 17 20 25
Tep(℃)

135 NG NG NG

140 NG

145 NG

150 NG /

155 NG / /

Notes： “ ”Gel content >80%；

“ ”Gel content is 70%-80%；

 Light transmittance curve

 PID resistance(85oC,85%RH,-1500Vdc)

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glass + TF4 +p-PERC bifacial cells+ TF4+ glass

Front side
Initial PID96h, Power Loss < 5% PID192h, Power Loss < 5%

Back side
初始 PID96h, Power Loss < 5% PID192h, Power Loss < 5%

glass + TF4 +N-PERT bifacial cells+ TF4+ glass

Front side
Initial PID96h, Power Loss < 5% PID192h, Power Loss < 5%

Back side
Initial PID96h, Power Loss < 5% PID192h, Power Loss < 5%

5. Shelf life and storage condition

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The product shall be stored in an indoorwarehousewith the original packing form at

temperature between 0 and 30oCand humidity below 60% RH.Avoid exposures of product to air,
direct sunlight, heat, dusts, and any other substances such as oil, water, solvents, chemicals.

Six monthsfrom manufacturing datefollowing the recommended Storage Condition

asdescribed above.

6. Application
Product shall be used up within 24 hours once the original package is opened. Return all
unused portions to original or comparable packing form and re-seal. For any rolls which were
open, used,and re-packed,1 week guarantee only when the rolls are re-packed and sealed with
their original or equivalent packing form.

Recommendedlamination condition

Lamination condition

o o
Temperature 140 C~155 C

Vacuum time 5min~6min

Press time 12min~20min

The above recommended lamination condition is a typical application, customers shall adjust
the parameter depending on the laminator, module structure, desired curing speed, etc.

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