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To: Holders of Avtechtyee Component Maintenance Manual (CMM) 33-20-08, Revision 11, June 3, 2019. Revision 12: January 22, 2020 Highlights
To: Holders of Avtechtyee Component Maintenance Manual (CMM) 33-20-08, Revision 11, June 3, 2019. Revision 12: January 22, 2020 Highlights
To: Holders of Avtechtyee Component Maintenance Manual (CMM) 33-20-08, Revision 11, June 3, 2019. Revision 12: January 22, 2020 Highlights
This Revision 12 includes revised testing and calibration procedures and expanded procedures
for cleaning, inspection and check, and repair.
NOTE: The pagination in this revision does not match previous revisions. Please replace
previous versions of CMM 33-20-08 with this Revision 12.
AvtechTyee, Inc.
6500 Merrill Creek Pkwy, Everett, WA 98203
Tel: 425.290.3100 | Fax: 425.513.6474
CAGE: 30242
Electronic Ballast
Export Control Classification Number (ECCN) for the 8184-1 Electronic Ballast is 7A994.
Export Control Classification Number (ECCN) for this CMM 33-20-08 (IPN 8184-9000) is 7E994.
RECORD OF REVISIONS
This Record of Revisions documents the revision of the Component Maintenance Manual as released by
AvtechTyee, Inc. Retain this record in front of the manual. Upon receipt of a revision, insert the revised
pages into the manual. Add a signature/initials and date that the new pages were added the manual.
Rev. Issue Date Date Inserted By
000 Apr 04/96
001 Sep 10/98
002 Oct 05/00
003 Apr 06/01
004 Sep 30/03
005 Nov 20/03
006 Apr 02/09
007 Oct 08/09
008 Jun 10/11
009 Aug 16/12
010 Apr 30/19
011 Jun 03/19
012 Jan 22/20
TABLE OF CONTENTS
INTRODUCTION
1. Overview ............................................................................................................................... Intro-1
A. Scope ....................................................................................................................... Intro-1
B. Manual Conventions ................................................................................................. Intro-1
C. Manual Sections ....................................................................................................... Intro-2
D. Units and Measures.................................................................................................. Intro-3
E. Product Support Services ......................................................................................... Intro-3
F. Comments or Corrections ........................................................................................ Intro-3
2. Electrostatic Discharge (ESD) Sensitive Devices................................................................. Intro-3
3. Shop Verification ................................................................................................................... Intro-4
4. Abbreviations and Acronyms ................................................................................................ Intro-4
DISASSEMBLY
1. Introduction ............................................................................................................................. 3001
2. Required Equipment ............................................................................................................... 3001
3. Disassembly Procedure .......................................................................................................... 3002
A. Remove the Baseplate ............................................................................................... 3002
B. Remove the Cover...................................................................................................... 3002
C. Disassemble the Electronic Ballast Subassembly ..................................................... 3002
CLEANING
1. Introduction ............................................................................................................................ 4001
2. Safety Precautions ................................................................................................................. 4001
3. Cleaning Tools and Materials ................................................................................................ 4002
4. Cleaning Procedures ............................................................................................................. 4002
A. Cleaning Printed Circuit Boards (PCBs) and Magnetic Devices
(Transformers/Inductors) ............................................................................................ 4002
B. Cleaning Tarnished Gold Contacts or Fingers ........................................................... 4003
C. Cleaning Metal and Plastic Parts ............................................................................... 4003
REPAIR
1. Introduction ............................................................................................................................. 6001
2. Recommended Tools and Equipment .................................................................................... 6001
3. Standard Torque Requirements for Stainless Steel Fasteners .............................................. 6001
A. Standard Screws and Nuts ......................................................................................... 6001
B. Locking Screws and Nuts ........................................................................................... 6001
4. Recommended Repair Materials ............................................................................................ 6002
5. PCB Repair Procedures ......................................................................................................... 6003
6. Repairing Metal Parts ............................................................................................................. 6003
7. Ballast Exterior Finish Repair ................................................................................................. 6004
8. Repair Notes for Power PCBs 8184-30, 8184-30-1, and 8184-30-2 ...................................... 6004
9. Repair Notes for IO PCBs 8184-40 and 8184-40-1 ................................................................ 6007
ASSEMBLY
1. Introduction ............................................................................................................................. 7001
2. Recommended Tools and Equipment .................................................................................... 7001
3. Required Materials .................................................................................................................. 7001
4. Standard Torque Requirements for Stainless Steel Fasteners .............................................. 7002
A. Standard Screws and Nuts ............................................................................................. 7002
B. Locking Screws and Nuts................................................................................................ 7002
5. Assembly Procedures ............................................................................................................. 7002
A. Assemble the Subassembly ....................................................................................... 7003
B. Top Assembly ............................................................................................................. 7003
IPL Figure 3A. 8184-30-1 and 818430-2 Power PCB Assemblies ................................................. 10036
IPL Figure 4. 8184-40 and 8184-40-1 IO PCB Assembly .............................................................. 10043
LIST OF FIGURES
Figure Intro- 1. Electronic Ballast 8184-1..............................................................................................Intro-5
Figure Intro- 2. Electronic Ballast 8184-1 Major Subassemblies ..........................................................Intro-6
Figure Intro- 3. Guide to Using the Manual ...........................................................................................Intro-7
Figure 1.8184-1 System Level Block Diagram.............................................................................................. 3
Figure 2. 8184-1 Outline Dimensions ........................................................................................................... 4
Figure 3. U401 Hybrid Bridge Circuit ............................................................................................................ 9
Figure 4. U402 - On/Off, Bright/Dim Control Hybrid ................................................................................... 10
Figure 5. Boost Control Hybrid U301 .......................................................................................................... 11
Figure 1001. Dielectric / Insulation Resistance Test Setup .................................................................... 1002
Figure 1002. Functional Test Setup Using TR8170-1-1 ......................................................................... 1006
Figure 1003. Filament Voltage Test Setup ............................................................................................. 1007
Figure 1004. Open Circuit Voltage Test Setup ....................................................................................... 1008
Figure 1005. Functional Test Setup - Option 2 ....................................................................................... 1012
Figure 1006. Selectable Resistors R303, R304 (Power PCB)................................................................ 1017
Figure 1007. Calibration Setup - Option 1 .............................................................................................. 1019
Figure 1008. Calibration Setup - Option 2 .............................................................................................. 1021
Figure 1009. Power PCB 8184-30, Pre SB 8184-33-901 ....................................................................... 1022
Figure 1010. IO PCB 8184-40 and 8184-40-1 ........................................................................................ 1024
Figure 2001. 8184-1 Electronic Ballast Block Diagram .......................................................................... 2003
Figure 2002. IO PCB Assembly 8184-40, 8184-40-1 ............................................................................. 2005
Figure 2003. Power PCB Assembly 8184-30, 8184-30-1, 8184-30-2 .................................................... 2007
Figure 2004. U300 Buck Controller Hybrid ............................................................................................. 2009
Figure 3001. Electronic Ballast Disassembly .......................................................................................... 3003
Figure 6001. Power PCB 8184-30, 8184-30-1, 8184-30-2 Repair Notes ............................................... 6005
Figure 6002. IO PCB 8184-40 and 8184-40-1 Repair Notes .................................................................. 6008
Figure 7001. Thermal Pad [1-60] Replacement ...................................................................................... 7003
Figure 7002. Electronic Ballast Assembly............................................................................................... 7004
Figure 9001. AvtechTyee Ballast Tester P/N 8170-1-1 .......................................................................... 9004
Figure 9002. AvtechTyee Ballast Tester P/N 8170-1-1 Schematic ........................................................ 9005
Figure 9003. AvtechTyee Test Cables TC8170-1-9 and TC8170-1-40 .................................................. 9006
IPL Figure 1. 8184-1 Electronic Ballast Assembly ................................................................................ 10020
IPL Figure 2. 8184-21-3 Electronic Ballast Subassembly ..................................................................... 10023
IPL Figure 3. 8184-30 Power PCB Assembly ....................................................................................... 10026
IPL Figure 3A. 8184-30-1 and 8184-30-2 Power PCB Assemblies ...................................................... 10036
IPL Figure 4. 8184-40 and 8184-40-1 IO PCB Assembly ..................................................................... 10043
LIST OF TABLES
Table 1. 8184-1 Mod Level Configuration Changes ..................................................................................... 2
Table 2. Equipment Specifications ................................................................................................................ 2
Table 3. U300 Buck Controller Hybrid Modification History .......................................................................... 8
Table 1001. Equipment Required for Functional Testing Option 1 ......................................................... 1003
Table 1002. Equipment Required for Functional Testing Option 2 ......................................................... 1011
Table 1003. Fault Isolation Guide ........................................................................................................... 1016
Table 1004. Selectable Value Resistors ................................................................................................. 1017
Table 4001. Cleaning Tools and Materials ............................................................................................. 4002
Table 5001. Tools and Equipment Necessary for Inspection and Check ............................................... 5001
Table 6001. Standard Torque Requirements for Stainless Steel Fasteners .......................................... 6002
Table 6002. Recommended Repair Materials - Cleaning ....................................................................... 6002
Table 6003. Repair Materials .................................................................................................................. 6003
Table 7001. Standard Torque Requirements for Stainless Steel Fasteners .......................................... 7002
Table 8001. Standard Torque Requirements for Stainless Steel Fasteners .......................................... 8001
Table 9001. Required Test Equipment ................................................................................................... 9001
Table 9002. Selectable Value Metal Film Resistors for Calibration ........................................................ 9002
Table 9003. Cleaning Materials .............................................................................................................. 9002
Table 9004. Inspection and Check Tools and Equipment ...................................................................... 9002
Table 9005. Repair and Assembly Materials .......................................................................................... 9003
Table 9006. Storage and Shipping Materials .......................................................................................... 9003
Table 15001. Storage and Shipping Materials. ..................................................................................... 15001
INTRODUCTION
1. Overview
A. Scope
This manual provides procedures for maintenance, testing, fault isolation, repair, and
replacement of components that comprise the AvtechTyee Electronic Ballast 8184-1.
This document is prepared, issued, and revised by AvtechTyee, Inc. (AvtechTyee) for the
exclusive use of its customers and is intended for use in provisioning, repair, and
maintenance of the aircraft components described herein.
The content of this document is proprietary to AvtechTyee and its customers and is
subject to change. The use of any part of this document by any other person or persons
for any other purpose without written consent of AvtechTyee is expressly prohibited. In
addition, AvtechTyee expressly disclaims any and all responsibility arising from or in any
way related to any unauthorized use of this manual.
B. Manual Conventions
1) The format of this manual follows the guidelines of the Air Transport Association
specification (ATA iSpec 2200) for Component Maintenance Manuals and the
Boeing Technical Data Guide D6-54487.
WARNING! An operating procedure, technique, etc., that may result in personal injury if
not carefully followed. A warning notice precedes the procedure to which it
applies.
C. Manual Sections
(2) FRONT MATTER - Includes Title Page, List of Effective Pages, Record of
Revisions, Record of Temporary Revisions, Service Bulletin List, Table of
Contents and Introduction.
(4) TESTING AND FAULT ISOLATION (page block 1001) contains bench test,
fault isolation, and calibration procedures.
(7) CLEANING (page block 4001) contains procedures to clean ACP components.
(8) INSPECTION AND CHECK (page block 5001) contains procedures to check
parts for excessive wear, corrosion, and other damage.
(9) REPAIR (page block 6001) contains procedures to refinish and rework parts to
serviceable condition.
(11) FITS AND CLEARANCES (page block 8001) provides information on torque
values for standard and locking fasteners and in-service wear limits.
(12) SPECIAL TOOLS, FIXTURES, AND EQUIPMENT (page block 9001) contains
a table of recommended special tools, fixtures, and test equipment.
(13) ILLUSTRATED PARTS LIST (IPL) (page block 10001) contains the information
needed to order replacement parts. A list of vendors, numerical index, and
exploded view illustrations are provided to help locate and identify parts.
All weights and measurements in this manual are in English units, with metric
equivalents in parenthesis.
Abbreviations and symbols for weights and measures follow the conventions of
the National Institute for Standards and Technology (NIST) Guide for the Use of
the International System of Units (SI).
Abbreviations for electrical units are per the Institute of Electrical and Electronics
Engineers (IEEE) Style Manual.
Complete assemblies, replacement parts, and spares are available from AvtechTyee.
AvtechTyee Inc.
6500 Merrill Creek Parkway
Everett, WA 98203-5860
Tel: 425.290.3100
Fax: 425.513.6474
After hours/AOG: 425.290.3100
http://www.avtechtyee.com
F. Comments or Corrections
Every effort has been made to give complete and accurate information in this CMM and
to present the information in a clear and concise manner.
CAUTION: ACP components contain electrostatic sensitive devices (ESD) that can be
damaged by electrostatic discharge. Use appropriate ESD precautions and
procedures whenever you see one of these or any other ESD precaution
symbols.
3. Shop Verification
The following tests and procedures were performed in the AvtechTyee engineering and repair
station by authorized engineers and FAA-authorized repair technicians.
Abbreviation Definition
A/amp Ampere
ADJ Adjust
ALT/NORM Alternate/Normal
AR As Required
ASSY Assembly
ATA Air Transport Association
AWG American Wire Gage
CAGE Commercial and Government Entity
cm Centimeter
CMM Component Maintenance Manual
DMM Digital Multimeter
ECCN Export Control Classification Number
EMI Electromagnetic Interference
ESD Electrostatic Discharge
ESDS Electrostatic Discharge Sensitive
GND Ground
Hz Hertz
IEEE Institute of Electrical and Electronics Engineers
in. Inch
IPL Illustrated Parts List
kg Kilogram
lb Pound
LED Light Emitting Diode
ms Millisecond
mA Milliampere
MHz Megahertz
N/A Not Applicable (Does not apply)
NHA Next Higher Assembly
OVI Optional Vendor Index
PCB Printed Circuit Board Assembly
P/N Part Number
Abbreviation Definition
psi Pounds per Square Inch
PTT Push to Test/Push to Talk
PWM Pulse Width Modulator
RF Reference
RMS Root Mean Square
RTCA Radio Technical Communications for Aeronautics
RTN Return
UUT Unit Under Test
Vac Volts Alternating Current
Vdc Volts Direct Current
1. Introduction
The AvtechTyee 8184-1 Electronic Ballast is a repairable, dimmable, solid state ballast designed
for use in the Boeing 747-400 cabin. It has a 115 V, 400 Hz input for use with one or two
fluorescent T8 Octron rapid start fluorescent lamps rated at 265 mA nominal lamp current.
Because of its feedback-regulated current, the 8184-1 can drive many combinations of different
length Octron lamps ranging from a single 9 watt lamp to dual 40 watt lamps. A five-to-one step
dimming function is activated by connecting the BRIGHT/DIM control line to the control line
return. Average lamp current in bright mode (265mA) and in dim mode (50mA). Starting voltage is
controlled by means of a feedback path to the BOOST controller IC. A slow start circuit allows the
filaments to be energized for approximately 500 ms before the lamp starts. Filament voltage is
derived from an off-line 400 Hz transformer.
The BOOST controller IC is configured as a power factor correcting stage. This stage keeps the
power factor high and the harmonic distortion low. Constant lamp current is maintained by
sensing and feeding it back to the BUCK controller IC. Power conversion is accomplished at 100
kHz while maintaining the output lamp voltage and current at 400Hz. This allows the use of
relatively small magnetic components to handle the power. The 400Hz lamp output allows for low
EMI generation. The 8184-1 includes a power factor correcting stage at the front end that makes
the ballast look resistive to the line.
The 8184-1 has the capability of shutting off all outputs, while input power is applied, by
connecting the ON/OFF control line to the control line return.
The 8184-1 is designed to withstand considerable abuse without sustaining damage. It can
withstand: Shorted filaments, shorted lamps, and over-temperature.
Figure 1 shows a system-level block diagram of the 8184-1 Electronic Ballast.
2. Modification History
Refer to Table 1 for a summary of 8184-1 modification history.
8184-1 Electronic Ballast was introduced in April, 1995.
8184-1 Mod A was released in September, 1995 per internal change paper. Mod A
addresses a customer request to increase the height of the IO PCB standoff by 0.030 in
(0.076 cm).
8184-1 Mod B, was released in June, 2015 per service bulletin 8184-33-903. Mod B
replaces buck controller hybrid U300, P/N SCD313-49-4 with SCD313-49-5 due to
obsolescence. The IC mounting clip was also revised from 8184-22 to 8184-22-1.
8184-1 Mod C was released in March, 2016 per service bulletin 8184-33-904. Mod C
replaces buck controller hybrid U300, P/N SCD313-49-5 with SCD313-49-6 to improve
DIM mode reliability.
3. Mechanical Description
The 8184-1 Electronic Ballast is housed in a two-piece aluminum chassis that consists of a cover
and base plate. The cover has silkscreened artwork that provides unit identification, mod level,
serial number, date of manufacture, J1 connector pinout, and schematic diagram illustrating
connections to fluorescent lamps. There are no external controls, indicators, service, or
adjustment controls. The ballast connects to aircraft power through the J1 connector on the
IO PCB.
8184-1 Ballast outline dimensions are show in Figure 2. Specifications are listed in Table 2.
Feature Specification
Length 7.00 in. (17.78 cm)
Height 1.50 inches (3.8 mm)
Width 2.00 inches (5.1 mm)
Lamp Type T8 Octron fluorescent lamps
Maximum Load 80 watts
Weight 0.73 lb (0.3 kg)
Normal Operating Temperature 20 to 130 °F (-7 to 55 °C)
Maximum Operating Temperature -40 to 158 °F (-40 to 70 °C)
A AND F IS OFF
A OPEN F IS ON
D AND F IS DIM
D OPEN TO F IS BRIGHT
4. Operation
This 8184-1 Electronic Ballast operates from 115-Vac, 400-Hz aircraft power. The ballast supplies
power to any combination of Octron, T8, rapid-start fluorescent lamps from a single, 9-Watt to
dual, 40-Watt loads. It provides control lines for ON/OFF and BRIGHT/DIM modes. Electronic
feedback controls the ballast. It does not require an impedance in series with the lamp.
5. Electrical Description
This circuit description describes the operation of the Ballast from bus input to lamp output.
Schematic diagrams of the Ballast PCBs are shown in the SCHEMATICS AND WIRING
DIAGRAMS section.
A. Input Section
The input section starts at the input terminals J1-E and J1-G and includes the following
components: F401, L401, L402, L403, C401, C402, C409, C417, C418, C450, CR411,
CR412, CR413, CR414, R411, R412 and R450.
B. Boost Control
The boost control circuit is part of a thick-film hybrid (U301). This hybrid (along with
inductor L301, transistor Q301, diode D302 and capacitor C302) make a boost circuit.
The boost circuit is a current mode circuit that operates through voltage feedback. This
circuit boosts the rectified line voltage to 640 Vdc. The 640 Vdc output goes to the current
sense/level shifter circuit.
NOTE: Do not try to replace any faulty components on the hybrid.
D. Buck Control
The buck control circuit is part of a thick film hybrid (U300). This hybrid (along with
inductors L302 and L303, diode D305, and transistor Q302) makes a current-feedback,
current-mode buck circuit. The Buck Control circuit decreases the 640 Vdc to the voltage
needed to start and keep an arc in the selected lamp set. The current feedback keeps the
lamp current at a constant 255 mA in bright mode and 50 mA in dim mode.
On hybrid U300, a delayed start circuit delays the high voltage on the lamps until the
filaments are warm (approximately 500 mS).
The Pulse Width Modulator (PWM) Dimming circuit is also part of the hybrid U300. This
circuit decreases the duty cycle of the lamp current during dim mode. This makes an
average dim mode current that is approximately 20% of the bright mode current.
E. Bridge Hybrid
The bridge hybrid (U401) takes the 640
Vdc output from the buck control circuit and converts it to a symmetrical, 400 Hz square
wave to drive the lamps.
NOTE: Treat this hybrid as a single component. Do not try to replace any faulty
components on the hybrid.
The bridge hybrid input is converted to a square wave as each side of the lamp load is
alternately connected between the high voltage rail and circuit ground.
First, transistors Q101 and Q104 are set on, and then reversed biased off as transistors
Q102 and Q103 are set on. The base drive for Q101 and Q103 comes from independent
windings of transformer T402. The base drive for Q102 and Q104 comes from a common
winding because their emitters are connected to circuit ground. Resistors R103, R104
and R405 give proper bias for the transistors. Resistors R111 and R112 give a return
path to ground for stored base current. (Refer to the Figure 2002, sheets 1 and 2 in the
SCHEMATICS section).
Capacitors C126, C127, C128 and C129 decrease the bridge switching frequency, which
reduces radiated emissions.
F. Filament Transformer
The filament transformer (T402) supplies filament voltage for the lamps, bridge drive for
bridge hybrid U401, and power for hybrids U300 and U301. The base drive windings of
T402 supply approximately 5.0 Vrms at 40 mA base current.
(1) AC Switch
Transformer T401 drives an AC switch that includes diodes CR416, CR417 and
transistors Q405 and Q406. This AC switch is connected in series with the
primary windings of transformer T402.
Primary voltage for T401 comes from a capacitive voltage divider C409, C417
and C418. The T401 primary voltage is 8.2 Vrms when the line voltage is 115
Vrms. The voltage divider shifts the phase of the T401 primary current relative to
the T402 primary current. Resistor R410 limits current through the primary
windings of T401.
6. Integrated Circuits
1. Introduction
This section contains the procedures for calibration, functional testing, and troubleshooting the
subassemblies and components of the 8184-1 Electronic Ballast.
Before performing calibration or functional testing, make sure all external components are in good
mechanical condition. Examine the ballast as described in Section 5000, INSPECTION AND
CHECK. Correct/repair any defects before beginning test procedures.
2. Test Conditions
3. UUT Verification
Prior to beginning any test or calibration procedure verify the UUT configuration by checking the
nameplate part number, serial number, and mod level.
4. Continuity Test
Measure the continuity between the ballast connector (pin H) and the ballast chassis.
The test lead nulled resistance must be < 0.1Ω.
5. Dielectric Test
B. Test Procedure
2) Measure the difference between pin H (case ground) and all of the other pins tied
together.
3) Apply and remove 1520 Vdc at a rate of 250 to 500 volts per second. There must
be no arcing, sparking, or leakage current > 0.5 mA.
B. Test Procedure
2) Measure the difference between pin H (case ground) and all of the other pins tied
together.
3) Apply 500 Vdc to the unit. Insulation resistance must be > 40 MΩ.
Functional testing may be performed with or without AvtechTyee Ballast Tester TR8170-1-1. This
section describes functional testing using the TR8170-1-1 tester.
B. Test Setup
2) Use the TC8170-1-40 cable to connect the FO40 lamps to TR8170-1-1 connector
J1.
3) Use the TC8170-1-9 cable to connect the FO9 lamp to TR8170-1-1 connector J2.
NOTE: All currents are measured as voltages at the LAMP CURRENT METER
jacks, (J12 and J13). The relationship is 1 to1 (i.e. 100mV = 100mA)
SWITCH SETTING
S1 PWR OFF
S2 ON/OFF CNTRL OFF
S3 BRT/DIM BRT
S4 LOAD SELECT 2XFO40
6) Set the AC power supply for an input voltage of 115 ± 5 Vac, 400 ± 5 Hz.
SWITCH SETTING
S1 PWR ON
S2 ON/OFF CNTRL ON
8) Connect the true-RMS DMM to 115 Vac, 400 Hz (J4, J5). Verify that the voltage
is 115 ± 5 Vac, 400 ± 5 Hz.
C. Current Test with Two FO40 Lamps or Two FO17 Lamps as the Lamp Load
The ballast can be in either the DIM or BRIGHT mode for this test.
While the lamps are operating, measure the lamp filament voltages by
connecting the true-RMS DMM to tester FILAMENT JACKS (J6, J7), (J8, J9),
and (J10, J11). The filament voltage must be between 3.0 and 4.0 Vrms.
SWITCH SETTING
S2 ON/OFF CNTRL OFF
S4 LOAD SELECT OPEN CKT
S3 BRIGHT/DIM BRIGHT
S2 ON/OFF CNTRL ON
c) Measure the open circuit voltage using the true RMS DMM. The voltage
must be between 630 and 660 Vrms.
SWITCH SETTING
S1 PWR ON
S2 ON/OFF CNTRL OFF
S3 BRT/DIM BRT
S4 LOAD SELECT 1XFO9
S2 ON/OFF CNTRL ON
Connect the true RMS DMM to INPUT CURRENT METER jacks (J14, J15). The
line current must measure ≤ 0.28 Arms..
Measure the current using the average responding meter. The current must be
between 245 and 275 mA.
Set the BRT/DIM switch (S3) to DIM. Measure the DIM lamp current using the
average responding meter. The current must be between 40 and 60 mA.
SWITCH SETTING
S2 ON/OFF CNTRL OFF
S4 LOAD SELECT 2XFO40
S3 BRT/DIM BRT
S2 ON/OFF CNTRL ON
2) Set the line input voltage to 104 ± 0.5 Vac, 400 ± 5 Hz.
f) Measure the BRIGHT lamp current using the average sensing DMM. The
current must be between 245 and 275 mA.
b) Measure the DIM lamp current using the average sensing DMM. The
current must measure between 40 and 60 mA.
SWITCH SETTING
S3 BRT/DIM BRT
S2 ON/OFF CNTRL OFF
b) Measure the OFF lamp current using the average sensing DMM. The
current must be ≤ 10 mA.
SWITCH SETTING
S2 ON/OFF CNTRL OFF
S4 LOAD SELECT 1XF09
S3 BRT/DIM DIM
S2 ON/OFF CNTRL ON
S3 BRT/DIM BRT
b) Measure the BRIGHT lamp current using the average sensing DMM. The
current must measure between 245 and 275 mA
b) Measure the DIM lamp current using the sensing DMM. The current must
measure between 40 and 60 mA.
SWITCH SETTING
S2 ON/OFF CNTRL ON
S3 BRT/DIM BRT
2) Connect the true RMS DMM to 115 Vac, 400 Hz, (J4, J5).
3) Set the line input voltage to 122 ± 0.5 Vac, 400 ± 5 Hz.
b) Measure the DIM lamp current using the average sensing DMM. The
current must measure between 40 and 60 mA.
SWITCH SETTING
S2 ON/OFF CNTRL OFF
S4 LOAD SELECT 2XF040
S2 ON/OFF CNTRL ON
S3 BRT/DIM BRT
b) Measure the BRIGHT lamp current using the average sensing DMM. The
current must measure between 245 and 275 mA.
b) Measure the DIM lamp current using the average sensing DMM. The
current must measure between 40 and 60 mA.
Functional testing may be performed with or without AvtechTyee Ballast Tester TR8170-1-1. This
section provides a functional test procedure that can be performed without the AvtechTyee
Ballast Tester.
B. Test Setup
Refer to Figure 1005.
C. Current Test with Two FO40 Lamps or Two FO17 Lamps as the Lamp Load
(1) Input Current
a) Connect the lamp load consisting of two FO40 lamps or two FO17 lamps
to the ballast.
e) Set the input voltage between pin E and pin G of the ballast connector to
115 ± 5 Vac, 400 ± 5 Hz.
f) Use the true RMS DMM to measure the input current. The input current
must measure 0.97 Arms maximum for FO40 lamps or 0.54 Arms max
for FO17 lamps.
e) Use the true RMS DMM to measure the open circuit voltage between
ballast connector pin J and pin C. The open circuit voltage must be
between 630 and 660 Vrms.
b) Connect the lamp load consisting of one FO9 lamp as shown in Figure
1005.
f) Adjust the input voltage between pin E and pin G of the ballast connector
to 115 ± 5 Vac, 400 ± 5 Hz.
g) Use the true RMS DMM to measure the input current. The input current
must measure 0.28 Arms maximum.
Set the BRIGHT/DIM switch (S1) to BRIGHT (open). Use the ac current probe
and the average sensing DMM to measure the BRIGHT lamp current. The
BRIGHT lamp current must be between 245 and 275 mA.
Set the BRIGHT/DIM switch (S1) to DIM (closed). Use the ac current probe and
the average sensing DMM to measure the DIM lamp current. The DIM lamp
current must be between 40 and 60 mA.
5) Adjust the power source to 104 Vac, 400 Hz, and turn it on.
6) Use the ac current probe and the average sensing DMM to measure the BRIGHT
lamp current. The BRIGHT lamp current must be between 245 and 275 mA.
7) Set the ON/OFF switch (S2) to OFF (closed). The lamps must go off.
9) Remove the single FO9 lamp load and connect the two FO40 lamps or two FO17
lamps.
15) Use the ac current probe and the average sensing DMM to measure the BRIGHT
lamp current. The BRIGHT lamp current must be between 245 and 275 mA.
6) Use the ac current probe and the average sensing DMM to measure the BRIGHT
lamp current. The BRIGHT lamp current must be between 245 and 275 mA.
7) Set the ON/OFF switch (S2) to OFF (closed). The lamps must go off.
9) Remove the two FO40 or two FO17 lamp load and connect the single FO9 lamp
load.
12) Use the ac current probe and DMM2 (average sensing DMM) to measure the
BRIGHT lamp current. The BRIGHT lamp current must be between 245 and
275 mA.
This section provides information for isolating the most common BALLAST faults. Refer to Table
1003 for symptoms, probable causes and associated corrective actions. Specific repair
procedures are located in the REPAIR section.
When all test procedures are complete, power down the test equipment and disconnect the
ballast from the tester/test connector.
11. Calibration
NOTE: Perform calibration ONLY if the open circuit voltage (see 7.C.(5) or 8.C.(5)) is out of spec.
Calibration may require replacement of R303 and/or R304 [3-530] / [3A-490] (Figure 1006) with a
resistor of higher or lower value than the nominal value of 1.07 MΩ. Selectable resistors are listed
in Table 1004.
b) The true RMS DMM should show an open circuit voltage between 630
and 660 Vrms.
c) If, the voltage is not within the range of 630 - 660 Vrms, adjust it (up or
down) by changing resistors R303 and/or R304.
R303 and R304 are connected in series (Figure 1006), so either one
resistor or both resistors can be changed to obtain the correct voltage,
depending on how much change is required. For example:
d) Disconnect the ballast from the test equipment. Disassemble the ballast
to get access to R303, R304 on the power PCB. (Refer to the
DISASSEMBLY section of this manual).
e) If the voltage was too high, replace R303 and/or R304 with a lower
value. If the voltage was too low, replace R303 and/or R304 with a
higher value.
f) Measure calibration again by performing above steps B.(3) steps a), b),
and c). Select a new resistor value if the open circuit voltage is not in the
specified range.
g) When the open circuit voltage is within the specified range, reassemble
the ballast per the instructions in the ASSEMBLY section of this manual.
CONNECT OFF
CONNECT DIM
Refer to Figure 1009 and Figure 1010 to aid in testing and troubleshooting the Power PCB and
IO PCB.
1. Introduction
This section provides
Figure 2001: 8184-1 Electronic Ballast block diagram
Figure 2002: Schematic diagrams for IO PCB 8184-40 and 8184-40-1
Figure 2003: Schematic diagrams for Power PCB 8184-30, 8184-30-1, 8184-30-2
Figure 2004: U300 Buck Hybrid Controller
NOTE: The schematics for AvtechTyee testers and test cables are located in SPECIAL
TOOLS, FIXTURES, AND EQUIPMENT.
RETURN
IN
DC VOLT
A CONNECT TO F IS ON
A NOT CONNECT TO F IS OFF
D CONNECT TO TO F IS DIM
D NOT CONNECT TO F IS BRIGHT
15VDC
15VDC
DISASSEMBLY
1. Introduction
Before disassembling the Electronic Ballast, use the procedures in section 1000, TESTING AND
FAULT ISOLATION, and section 5000 INSPECTION/CHECK of this manual to assure that the
unit is operating properly. If the unit is not operating properly, test results will help you to locate
the defective component. Disassemble the ballast only as far as necessary to repair or replace
defective components.
The procedures in this section are in sequence. Do the procedures in this sequence to make sure
that the ballast is not damaged during disassembly. Do not disassemble the ballast beyond the
steps shown.
In these procedures, parts are identified by IPL figure number and item number [X-XX]. For
example, [3-50] refers to IPL Figure 3, item 50, Heatsink.
WARNING! RISK OF INJURY! Ballast capacitors may have stored voltage. Turn off power
to the ballast before you disassemble the unit or make a repair.
2. Required Equipment
3. Disassembly Procedure
1) Remove the flat head screw [1-20] that attaches the baseplate [1-10] to the
electronic ballast subassembly [1-70C].
2) Remove four pan head screws [1-30] that attach the cover [1-40C] to the
electronic ballast subassembly [1-70C] and baseplate [1-10].
1) Hold the PCB connector (J401) [4-300] and carefully remove the electronic
ballast subassembly [1-70C] from the cover [1-40C].
3) Only if the thermal pad [1-50A] is damaged: Remove the thermal pad [1-50A]
from the top of L301 on the power PCB [2-10B]. Remove any residual adhesive
or pad material from the top cover.
4) Remove hybrid mounting clip [1-60A]: Turn the subassembly upside down so the
solder side of the IO PCB [2-20A] is face up. Use a flat bladed screw driver or
similar tool to gently pry one edge of the hybrid mounting clip off the board.
Remove the clip and set it aside.
1) Slide the slots in the PCBs off the tabs in the heatsink brackets [3-50A] or [3A-50]
and [4-50]. The PCBs will be attached only at the ribbon cable. [2-30A].
CAUTION: Risk of Equipment Damage. Take care to avoid damage to the ribbon
cable when separating the IO PCB from the Power PCB.
Do not put direct pressure on the areas shown in Figure 3001. Pressure
on the heatsink may crack the hybrid U401 [4-20A].
NOTE: The conformal coating may cause the heatsink bracket tabs to stick to the PCBs.
If necessary, use a flat screwdriver to push the tab and the PCB edges away
from each other and break the conformal coating seal.
CLEANING
1. Introduction
This section provides cleaning instructions for the 8184-1 Electronic Ballast. Cleaning is an
extremely important repair function for parts that are exposed to repeated wear, impacts, and
liquid spills. Following these procedures provides acceptable cleaning, minimizes hazards to
personnel, and prevents possible damage to the equipment. Clean all parts thoroughly before
inspection and reassembly in order to determine the existence of, extent of, and exact location of
potential defects.
The recommended tools and materials are given in Table 4001. Equivalent substitutes may be
used after appropriate tests are made to ensure that the equivalent materials do not react with the
component being cleaned.
NOTE: The companies that make the cleaning materials can change the formulation. Therefore,
always follow the instructions given on the container. Instructions to mix and use the
cleaning materials, given on or provided with the container, supersede the instructions
given here.
CAUTION: Use all applicable ESD precautions when you handle or work on the ballast.
2. Safety Precautions
All cleaning materials have some hazard related to their use. Follow the safety warnings given
below to make sure personnel are safe and to prevent damage to the equipment.
CAUTION: Risk of personal injury. Use care when using cleaning solvents. Avoid
splashing solvents on your skin or face. Always where eye protection.
Recommended cleaning materials are listed below in Table 4001. Equivalent materials may be
substituted.
4. Cleaning Procedures
To remove dry contaminants (dust, dirt) from the PCB, use low-pressure
compressed air or a small, delicate brush with soft, dry bristles.
NOTE: Compressed air can cause component damage. Use with extreme care.
Remove solder flux using isopropyl alcohol and a small tooth brush. Flood fluxed
area with alcohol and use wipe or brush to scrub area thoroughly and wipe area
dry.
NOTE: In cases where RMA or water soluble flux residue could contaminate
contact surfaces on unsealed components like potentiometers, switches
or receptacles, do not flood these unsealed components with cleaning
agent. Carefully clean soldered area using swabs or wipes. Always
remove RMA or water soluble flux residue after soldering as soon as
possible.
Remove organic water soluble (OR) flux using de-ionized (DI) water. Flood fluxed
area with DI water and scrub area vigorously with brush till foaming bubbles are
minimized, then wipe area dry, repeat if necessary. After DI water cleaning, clean
with isopropyl alcohol and wipe dry.
1. Introduction
This section provides a detailed inspection procedure for the 8184-1 Electronic Ballast, describes
acceptable conditions, defect conditions, and remedies for defect conditions.
Inspect the 8184-1 Electronic Ballast whenever it is removed from the aircraft for maintenance. If
the Ballast is not functioning properly, refer to the TESTING AND FAULT ISOLATION section. If
defect conditions are found during inspection, refer to the CLEANING and/or REPAIR sections of
this manual. A preliminary cleaning before initial inspection will facilitate location of obvious
defects.
Description Source
Light source (Flashlight, drop light, etc.) Commercially available
Magnifier, 5X-power or greater Commercially available
UV Blacklight, 365 - 395 nm Commercially available
Round telescoping inspection mirror, mirror size: Commercially available
1-1/4 in. (3.18 cm)
3. Inspection Procedure
Examine Ballast components thoroughly for any condition that could cause a malfunction or
premature failure. Inspect all parts with a light source (a magnifier of 5X power or greater may be
used if necessary) to find nicks, cracks, cuts, evidence of corrosion, crossed or stripped threads,
chafing, scoring, charring, evidence of overheating, or any other obvious defects, which will cause
the assembly/component to malfunction.
(3) Enclosure
See IPL Figure 1.
Inspect the top cover [1-40C] and baseplate [1-10] for dents, cracks, pitting, loss
of finish, and signs of corrosion. Make sure the black anodize finish is not
damaged.
Defect Conditions:
Replace the damaged component or return to AvtechTyee for repair if either of
the following conditions is present:
Dents that are serious enough to cause short circuits, mechanical failure,
or otherwise compromise performance of the Ballast.
Corrosion penetration > .02 in. (5 mm)
Acceptable Conditions:
Minor dents, scratches, loss of finish, minor pitting, and other cosmetic
blemishes are not cause for rejection. Repair minor dents, scratches,
loss of finish, and pitting per the instructions in REPAIR (6. Repairing
Metal Parts).
If the corrosion penetration is < .02 in. (5 mm): clean and repair per the
procedures in CLEANING (4.C. Cleaning Meta and Plastic Parts) and
REPAIR (6. Repairing Metal Parts).
(a) Inspect PCB components on the Power PCB [2-10B] and IO PCB
[2-20A] for signs of warping, charring, or burning. Make sure that all
component casings are smooth, not dented, or bulging.
Remove/replace damaged components per REPAIR 5. or return the
Ballast to AvtechTyee for repair.
(b) Use a UV blacklight to inspect the conformal coating on the PCBs for any
gaps or missing areas. Make sure the conformal coating has a uniform
neon blue appearance under the UV blacklight.
As necessary, touch up any gaps in the conformal coating per
REPAIR 5. or return the Ballast to AvtechTyee for repair.
REPAIR
1. Introduction
Before beginning repair procedures
Make sure that the defective component(s) has been correctly identified.
Clean and examine the ballast (refer to the CLEANING and CHECK sections).
Disassemble the ballast only as far as necessary to replace defective components (refer
to the DISASSEMBLY section).
CAUTION: This ballast has components that can be damaged by electrostatic discharge
(ESD). Use ESD precautions when working on this ballast.
Tighten components that have threaded fasteners, such as, switches, potentiometers,
jacks, LEDs, etc., per manufacturer’s specifications or specifications in this manual. If no
tightening instructions are given, tighten the fastener till spring action of locking device is
in full contact with bearing surface, then apply small amount of additional torque.
Locking screws and nuts usually require significant torque well before they become snug
against the mating surface. The preferred method of tightening is to visually observe
them while applying torque. When the head of the screw is seen to be snug against the
mating surface, apply small amount of additional torque.
Item Source
Tex Wipe (lint Free, generic wipes) TexWipe Co. LLC (V21994)
Safety glasses/goggles Commercially available
Soft bristle brush (acid brush) Commercially available
Mild household detergent Commercially available
Toothbrush Commercially available
Cotton-tipped swabs Commercially available
Pipe cleaners Commercially available
Demineralized water Commercially available
Isopropyl alcohol Commercially available
Windex S. C. Johnson & Son, Inc. (V0U826)
Compressed Air - 30 psi max (206843 Pa) Commercially available
Soft pencil eraser such as Pink Pearl Commercially available
3M Adhesive Remover 3M Company (V76381)
1) When replacing PCB components and/or repairing damaged or defective traces, observe
the procedures described in the following industry standards:
J-STD-001 - Requirements for Soldered Electrical and Electronic Assemblies
IPC 7711 - Rework of Electronic Assemblies
IPC 7721 - Modification, Rework and Repair of Printed Boards and Electronic
Assemblies
FN 3. Before soldering, L301 must be held securely against the PCB. Bend pins of L301 in
the direction shown (4 places). Trim pin 1 so it is as far as possible from any adjacent
trace to ensure maximum electrical spacing. Do not adjust other pins. Height of L301
pins after bending shall be .05 (1.27 mm) max.
FN 9. R308, R310, R314, and R315 must have a clearance of .06 +.02/-.00 in. (1.52 +
0.51/0.00 mm) above PCB.
FN 10. D309 and D310 must have a clearance of .06 ± .02 in. (1.52 ± 0.51 mm) above PCB.
FN 11. Install Nomex [3-45] between U300 and Q302/D302 as shown to protect U300 from
metal screws. Secure Nomex to PCB at lower two corners using RTV. Avoid excess
RTV on surrounding components.
FN 13. Do not replace the heatsink [3A-50] unless it is damaged. If necessary to replace the
heatsink:
1) Insert the heatsink [3A-50] into the power PCB [2-10B] from the component side.
2) Hold the heatsink flush to the PCB while twisting each solder lug, from the solder
side, approximately 30 degrees (in either direction).
3) Trim the solder lugs to .04 (1.02 mm) max from the solder-side surface of the
PCB. Assure that the heatsink is as perpendicular to the PCB as possible.
4) Apply solder to the solder lugs per industry standards listed in 5. PCB Repair
Procedures.
FN 1. Install rubber pad [4-30] flush with top of hybrid U401, as shown .
FN 2. Install kapton tape [4-40] between heatsink [4-50] and U401. Install kapton tape
[4-40] flush to top of U401 to prevent tape from shorting to pins. To ensure proper
mounting, clean the mounting surfaces of the heatsink [4-50] and U401 with alcohol
prior to kapton tape. There shall not be any air gaps between the kapton tape [4-40],
heatsink [4-50], and U401.
FN 3. Install Nomex washer [4-104] between L401 and PCB. Use bus wire [4-105] to mount
L401 to PCB. Pull the bus wire tight and bend over prior to soldering.
FN 4. Secure C401 and C402 together using RTV. Bend capacitors away from connector
J401. After bending, capacitor max height shall be 0.45 in (1.14 cm).
FN 7. Bend C409 toward U402. Secure C409 to U402 with RTV. Note: Do not bend U402
after soldering or damage may occur.
FN 8. Bend C419 toward connector J401 and secure to connector with RTV.
FN 9. R404, R410, and R450 must have a clearance of .08 ± .02 (2.03 ± 0.51 mm) from the
PCB surface.
FN 13. Install Q405 and Q406 as shown in View A if using plastic-packaged components.
FN 16. Do not replace the heatsink [4-50] unless it is damaged. If necessary to replace the
heatsink (Refer to Figure 6002, Sheet 2):
1) Insert the heatsink [4-50] into the IO PCB [2-20A] from the component side.
2) Hold the heatsink flush to the PCB while twisting each solder lug, from the solder
side, approximately 30 degrees (in either direction).
3) Trim the solder lugs to .04 (1.02 mm) max from the solder-side surface of the
PCB. Assure that the heatsink is as perpendicular to the PCB as possible.
4) Apply solder to the solder lugs per industry standards listed in 5. PCB Repair
Procedures.
ASSEMBLY
1. Introduction
Before assembling the 8184-1 Electronic Ballast, perform the procedures described in
CLEANING, INSPECTION and CHECK, and REPAIR.
The procedures in this section are in assembly sequence. Do the procedures in the sequence
given to avoid damage to the components and subassemblies of the ballast.
In these procedures, parts are referred to by figure-item number [X-XX] format. The first number
is the IPL figure in which the part is shown. The digits after the dash are the item number in the
detailed parts list for that figure. For example 3-50 indicates IPL Figure 3, item 50, heatsink
bracket.
WARNING! RISK OF INJURY! Ballast capacitors may have stored voltage. Turn off power
to the ballast before you disassemble the unit or make a repair.
Special equipment necessary to test the ballast after repair and assembly is shown in the
TESTING AND FAULT ISOLATION and SPECIAL TOOLS, FIXTURES, AND EQUIPMENT
sections.
3. Required Materials
Tighten components that have threaded fasteners, such as, switches, potentiometers,
jacks, LEDs, etc., per manufacturer’s specifications or specifications in this manual. If no
tightening instructions are given, tighten the fastener till spring action of locking device is
in full contact with bearing surface, then apply small amount of additional torque.
Locking screws and nuts usually require significant torque well before they become snug
against the mating surface. The preferred method of tightening is to visually observe
them while applying torque. When the head of the screw is seen to be snug against the
mating surface, apply small amount of additional torque..
5. Assembly Procedures
WARNING! Risk of injury! Threadlock adhesive can cause bodily injury and fire.
Threadlock adhesive liquid and vapor is highly flammable, causes serious
eye irritation, may cause an allergic skin reaction, and may cause
drowsiness. Follow approved safety precautions.
NOTE: Shake threadlock adhesive well before each use. Apply a length of 1 to 1-1/2 times the
fastener diameter, filling threads 50-100%.
CAUTION: Risk of equipment damage. Avoid putting direct pressure on the places
shown in Figure 7002.
1) Gently slide together the Power PCB [2-10B] and the IO PCB [2-20A].Make sure
the slots in the PCB assemblies mate with the slots/tabs in the heatsink brackets
[3A-50] and [4-50].
The two PCBs will slide together to form the electronic ballast subassembly [2-1].
B. Top Assembly
NOTE: The flanges of the baseplate fit over the outside of the cover.
4) Install four pan head screws [1-30] to attach the baseplate [1-10] to the
subassembly [1-70C].
5) Apply a small amount of threadlock to flat head screw [1-20] and install it to
attach the baseplate [1-10] to the subassembly [1-70C]. Tighten to 3 in-lb
(0.834 Nm).
1. Introduction
This section contains fits and clearances data and the torque values required to support the
disassembly, assembly, installation, and removal of the 8184-1 Electronic Ballast.
3. Critical Fits
The 8184-1 Electronic Ballast is enclosed in an aluminum chassis with one external connector
and no user controls, indicators, or annunciators. It is hard mounted where needed to power
cabin lighting with four pan head screws. Once installed, the ballast does not have any moving
parts that contact surrounding components causing in-service wear. Therefore, the ballasts do
not have any critical fits or clearances.
1. Introduction
This section provides a comprehensive list of all required and recommended tools, test
equipment, and consumable materials necessary to disassemble, repair, test, calibrate, and
reassemble the 8184-1 Electronic Ballast.
With the exception of the AvtechTyee Ballast Tester listed in Table 9001, all other tools, test
equipment, cleaning supplies, and consumables are commercially available.
To order the AvtechTyee tester listed in Table 9001, contact the AvtechTyee sales department at
1.425.249.4609 (Pacific Time).
NOTE: Equivalent tools and supplies may be substituted for those listed.
2. Recommended Tools
With the exception of the AvtechTyee Ballast Tester and test cables (see Table 9001), no special
tools are required for disassembly, testing, cleaning, inspection, repair, or assembly.
The following test equipment, or equivalent alternatives, is necessary to test the ballast.
4. Selectable Resistors
Refer to the Calibration procedure (in TESTING AND FAULT ISOLATION) for information on
using selectable resistors. Equivalent resistors may be substituted for those listed in Table 9002.
Description Source
Light source (Flashlight, drop light, etc.) Commercially available
Magnifier, 5X-power or greater Commercially available
UV Blacklight, 365 - 395 nm Commercially available
Round telescoping inspection mirror, mirror Commercially available
size: 1-1/4 in. (3.18 cm)
Depending on the nature and extent of repairs, some or all of the following materials may be
necessary during assembly. Vendor contact information is listed by vendor code in the
ILLUSTRATED PARTS LIST. Equivalent materials may be substituted for those listed below.
The following materials will be required if the ballast is put into storage or shipped.
Item Description
Static Shielding Bag 8 in. x 10 in. (20.32 cm x 25.4 cm), Self-Sealing, Recloseable,
(commercially available)
Bubble wrap Pink, ESD-Safe (commercially available)
Packing material Brown paper packing material (commercially available)
Cardboard box (storage) Sturdy cardboard box of appropriate size (if the original container is not
available) (commercially available)
Cardboard Box (Shipping) Large enough to hold the storage box plus brown paper packing material
Adhesive Packing Tape For sealing the box. (commercially available)
1. Introduction
This section includes a numerical index, vendor code list, detailed parts list, and illustrations
showing the subassemblies and components of the Audio Control Panel 5145-1-64.
When a part number is modified in any of the ways described above, the
complete, unmodified true part number will be shown in the Nomenclature
column following the notation TRUE P/N.
SCD Part Numbers: Items which have a part number beginning with SCD
(Specification Control Document) should be replaced only with identical SCD
items available from AvtechTyee.
D. Nomenclature Column
This column contains an identifying noun or key word and additional modifying words as
necessary. For electrical/electronic components, actual values, allowable tolerances, and
percentages are listed. The nomenclature includes details of the relationship of the
assemblies, subassemblies and detail parts, and any applicable history information.
1 2 3 4 5 6 7
End Item or Major Assembly
. Detail parts for assembly
. Attaching parts for assembly
. . Subassembly
. . Attaching parts for subassembly
. . . Detail parts for subassembly
. . . Attaching parts for detail parts
. . . . Sub-subassembly
. . . . Attaching parts for sub-subassembly
When AvtechTyee procures components from a vendor and lists the part in the
IPL Part Number column using the manufacturer’s original part number, that
manufacturer’s Commercial and Government Entity (CAGE) Code, listed as
(V#####) is included in the Nomenclature column. Manufacturer contact
information is listed numerically by CAGE Code in this IPL Introduction.
(3) ESDS
When AvtechTyee sources a part from multiple vendors for use without
modification, an AvtechTyee part number is assigned to that part. In this case,
the notation SEE OVI added to the Nomenclature column. An Optional Vendor
Index is provided in this IPL Introduction with parts listed numerically by
AvtechTyee part number.
If AvtechTyee has been issued Parts Manufacturing Authority for the end item or
assembly part number, the abbreviation “PMA” appears in the NOMENCLATURE
column.
When existing parts are modified or reworked or additional parts are installed by
a service bulletin, the Service Bulletin Number is shown in the Nomenclature
column as follows:
PRE SB ###-##-####
POST SB ###-##-####
ADDED BY ###-##-####
DELETED BY ###-##-####
E. Effectivity Column
Effectivity codes are used to show limited interchangeability.
Effectivity codes are assigned to each different end-item in an IPL figure. This
code shows that the item must be used with other items identified with the same
effectivity code or a blank code.
Effectivity codes are applicable for one figure only and do not relate to other
figures.
A blank in the effectivity code column indicates that line item used on all end
items in that figure.
In each figure, item numbers with the same effectivity codes and those without
codes can be mixed together, when there are no special notes in the
nomenclature column that prevent this.
7. Illustrations
Exploded isometric drawings are used to show assembly and disassembly of the ACP. PCB
assemblies have flat views. The first sheet of a figure showing a PCB identifies hardware items
by use of figure/item numbers and leader lines with arrowheads. The second sheet shows the
PCB with a grid overlay that gives the location shown in the Equipment Designator Index. The
designators, area locations and figure item numbers are also shown on a table on the last
sheet(s) of the illustration.
CAGE VENDOR
29454 Johansson Dielectrics
15191 Bledsoe Ave, Sylmar CA 91342 | Tel: 818.364.9800
30242 AvtechTyee, Inc.
6500 Merrill Creek Parkway, Everett WA 98203-5860 | Tel: 425.249.4609
31433 KEMET Corporation
2835 Kemet Way, Simpsonville SC 29681 | Tel: 864.963.3333
55566 R A F Electronic Hardware Inc
95 Silvermine Rd, Seymour CN 06483 | Tel: 203.888.2133
56637 RCD Components
520 E Industrial Park Dr, Manchester NH 03109 | Tel: 603.669.0054
59124 Koa Speer Electronics
PO Box 547, Bradford PA 16701 | Tel: 814.362.5536
60991 Microchip Technology
2355 W Chandler Blvd, Chandler AZ 85224 | Tel: 480.792.7387
63027 Thomas and Betts Corp.
8155 T&B Blvd, Memphis TN 38125 | Tel: 901.252.5000
66958 STMicroelectronics
Lexington Corp Center, 10 McGuire Rd, 3rd Floor, Lexington MA | Tel:
781.861.2650
713B5 Custom-Pak Products, Inc.
N118 W18981 Bunsen Drive, Germantown WI 53022 | Tel: 262.251.6180
71984 Dow Corning 2200 W Salzburg Rd, Midland MI 48686 | Tel: 989.496.7618
76381 3M Company
3M Center Bldg 220 11W 02, Saint Paul, MN 55144 | Tel: 866.556.5712
83008 Staco Energy Products
2425 Technical Dr, Miamisburg, OH 45342-6137| Tel: 866-261-1191
95266 F.W. Bell (OECO, LLC)
4607 SE International Way, Milwaukie OR 97222-4619 | Tel: 971.233.7261
99109 Humiseal , 128 1st St, Pittsburgh PA 15238 | Tel: 800.323.4182
1. Introduction
Observe proper storage procedures to ensure that the ballast is protected from degradation due
to exposure to atmospheric elements.
2. Storage Conditions
When the ballast is not installed on the aircraft, store the it in a clean, dry room.
The recommended ambient conditions are:
Temperature: 68 °F ± 27 °F (20 °C ± 15 °C)
Relative Humidity: < 85%
3. Storage Materials
The following materials are required to prepare the ballast for storage.
Item Description
Static shielding bag Self-Sealing, Recloseable. Commercially available
Bubble wrap Pink, ESD-Safe. Commercially available
Brown paper Brown paper packaging material (commercially available)
Cardboard box (Storage) Sturdy cardboard box of appropriate size (if the original
container is not available). Commercially available.
Cardboard box (Shipping) Large enough to hold the storage box plus brown paper
packing material. Commercially available.
Adhesive packing tape For sealing the box. Commercially available.
4. Storage Procedure
If the ballast will not be returned to service immediately, use industry-standard storage
procedures or:
1) Perform a visual inspection, checking for structural damage or deterioration. If any
problems are discovered, follow the procedures in the CLEANING,
INSPECTION/CHECK, and/or REPAIR sections of this manual.
2) Cover the J1 connector with the attached protective caps.
3) Put the ballast in a static-shielding bag. Gently press the air out of the bag and seal shut.
4) Line the cardboard storage box with pink ESD-safe bubble wrap.
5) Place the ballast in the box and completely wrap all sides with bubble wrap.
6) Close the box and seal with packing tape. Mark the box with the ballast part number,
serial number, and date of service.
5. Transportation/Shipping Procedure
If the original shipping container is not available, observe local and/or international packaging
regulations applicable to the mode of transport.
1) Package the ballast in accordance with the Storage Procedure above.
2) Line a shipping box with brown paper packing material.
3) Place the sealed storage box in the center of the paper packing material.
4) Completely wrap all sides of the storage box with the brown paper packing material.
5) Add enough additional brown paper packing material to completely fill the shipping box.
6) Close the shipping box and seal with adhesive packing tape.