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Stps 40170 C
Stps 40170 C
Datasheet
A1
Features
K
A2 • High junction temperature capability
• Low leakage current
• High voltage capabilities
• Good trade-off between leakage current and forward voltage drop
• Low thermal resistance
A2 A2 • High frequency operation
A1 K K
TO-220AB TO-247 A1 • Avalanche specification
K • ECOPACK®2 compliant for TO-220AB and TO-247, on demand for D²PAK
A2
Applications
D²PAK A1
• Switching diode
• SMPS
• DC/DC converter
• Telecom power
Description
This dual center tab Schottky rectifier is suited for high frequency switched mode
power supplies.
Packaged in TO-247, D²PAK and TO-247, the STPS40170C is optimized for use to
Product status link enhance the reliability in applications.
STPS40170C
Product summary
Symbol Value
IF(AV) 2 x 20 A
VRRM 170 V
Tj 175 °C
VF (typ.) 0.69 V
1 Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified, per diode)
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Tj = 25 °C - 30 µA
IR(1) Reverse leakage current VR = VRRM
Tj = 125 °C - 7 30 mA
Tj = 25 °C - 0.92
IF = 20 A
Tj = 125 °C - 0.69 0.75
VF(2) Forward voltage drop V
Tj = 25 °C - 1.00
IF = 40 A
Tj = 125 °C - 0.79 0.86
Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient
average forward current (per diode) temperature (δ = 0.5, per diode)
18 18
16 16
14 14
12 12
10 10
8 8
6 6
T
4 4
2 IF(AV) (A) IF(AV) (A) 2
δ = tp/T tp
0
0
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28
0 25 50 75 100 125 150 175
Figure 3. Normalized avalanche power derating versus Figure 4. Relative variation of thermal impedance junction
pulse duration (Tj = 125 °C) to case versus pulse duration
0.8
0.7
0.1 0.6
0.5
0.4
0.01 0.3
0.2
Single pulse
0.1
t p(µs) t p(s)
0.001 0.0
1 10 100 1000 1.E-03 1.E-02 1.E-01 1.E+00
Figure 5. Reverse leakage current versus reverse voltage Figure 6. Junction capacitance versus reverse voltage
applied (typical values, per diode) applied (typical values, per diode)
I R (µA) C(pF)
1.E+05
1000
F = 1 MHz
Tj = 150 °C VOSC = 30 mVRMS
1.E+04 Tj = 25 °C
Tj = 125 °C
1.E+03
Tj = 100 °C
1.E+02 Tj = 75 °C
100
Tj = 50 °C
1.E+01
Tj = 25 °C
1.E+00
VR(V) VR(V)
1.E-01
10
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170
1 10 100 1000
Figure 7. Forward voltage drop versus forward current Figure 8. Thermal resistance junction to ambient versus
(per diode) copper surface under tab
60
10.0 Tj = 125 °C
(typical values) 50
40
Tj = 25 °C
(maximum values) 30
1.0
20
10
SCu (cm²)
VF(V) 0
0.1
0 5 10 15 20 25 30 35 40
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are
guaranteed.
Dimensions
16.90
12.20 5.08
2.54
1.60
3.50
9.75
A Heat-sink plane
E
∅P
S ∅R
L2
L1
L b1
b2
1 2 3 3 2 1
b c
A1 Back view
e
Dimensions
Dimensions
Dimensions
3 Ordering information
Revision history