Journal of Advanced Manufacturing Technology (JAMT)

Journal of Advanced Manufacturing Technology (JAMT)

Journal of Advanced Manufacturing Technology (JAMT)
Structural
Journal of Advanced Manufacturing Analysis
Technology on Nanocomposites Lead Free Solder using Nanoindentation
(JAMT)
Journal STRUCTURAL
Journalof ofAdvanced
AdvancedManufacturing ANALYSIS
ManufacturingTechnology
Technology (JAMT) ON NANOCOMPOSITES LEAD FREE
(JAMT)
STRUCTURAL ANALYSIS ON NANOCOMPOSITES LEAD FREE
STRUCTURAL ANALYSIS
SOLDER USINGON NANOCOMPOSITES LEAD FREE
NANOINDENTATION
STRUCTURAL ANALYSIS
SOLDER USINGON NANOCOMPOSITES LEAD FREE
NANOINDENTATION
STRUCTURAL
STRUCTURAL ANALYSIS
ANALYSIS
SOLDER USINGON
ON NANOCOMPOSITES
NANOCOMPOSITESLEAD
NANOINDENTATION LEADFREE
FREE
SOLDER USING NANOINDENTATION
Z. SOLDER
Bachok USING
1, A.A. NANOINDENTATION
Saad 1, M.A. Abas1, M.Y.T. Ali2
SOLDER USING NANOINDENTATION
Z. Bachok1,1 A.A. Saad1,1 M.A. Abas 1, M.Y.T. Ali2
Z. Bachok1, A.A. andSaad
K. , M.A.
Fakpan Abas
3 1, M.Y.T. Ali2
Z. Bachok , A.A.
andSaad
K. 1, M.A. Abas
Fakpan 3 1, M.Y.T. Ali2
Z.Z.Bachok
Bachok,1,A.A.
1
A.A.Saad1
Saad
and K.,1,M.A.
M.A.Abas
Abas
Fakpan 3 1 ,1,M.Y.T.
M.Y.T.Ali22
Ali
and K. Fakpan 3
1 and
School of K.
K.Fakpan
Mechanical
and 33
Engineering,
Fakpan
1School of Mechanical Engineering,
Universiti
1SchoolSains
1SchoolSains
Malaysia, Engineering,
of Mechanical 14300 Nibong
Universiti of Mechanical
Malaysia, Engineering,
14300 Nibong
1School
Universiti
1SchoolTebal,
ofof
SainsPenang,
MechanicalMalaysia,
Mechanical Malaysia.
Engineering,
14300 Nibong
Engineering,
Universiti Sains Malaysia,
Tebal, Penang, Malaysia. 14300 Nibong
Universiti
Universiti Sains
Tebal,Sains Malaysia,
Penang,
Malaysia, 14300
Malaysia.
14300 Nibong
Nibong
Tebal,
2Jabil Penang,
Circuits Sdn.Malaysia.
Bhd.,
Tebal,
Tebal,
2Jabil Penang,
Penang,
Circuits Sdn. Bhd.,Malaysia.
Malaysia.
56, Hilir 22Sungai
Jabil Circuits KluangSdn. 1, 11900
Bhd.,Bayan
Jabil Circuits
56, Hilir2 Sungai KluangSdn. Bhd.,Bayan
1, 11900
56, HilirLepas,
Jabil
Sungai
2Jabil Penang,
Circuits
Circuits Kluang Malaysia.
Sdn.
Sdn. 1,Bhd.,
11900 Bayan
56, HilirLepas, Sungai Penang, Kluang 1, Bhd.,
Malaysia. 11900 Bayan
56, Hilir
56, Hilir Sungai
Lepas,
Sungai Kluang
Penang,
Kluang 1, 11900
11900Bayan
Malaysia.
1, Bayan
3Lepas,
Faculty Penang,
of Malaysia.
Engineering,
Lepas,
3Lepas, Penang,
Penang,
Faculty of Engineering, Malaysia.
Malaysia.
King Mongkut’s University 3Faculty of
3Faculty of
ofEngineering,
Technology North Bangkok,
King Mongkut’s University ofEngineering,
Technology North Bangkok,
King Mongkut’sBangkok, 3 Faculty
University
3Faculty 10800,
of of Thailand. North Bangkok,
ofEngineering,
Technology
Engineering,
King Mongkut’sBangkok, University 10800,of Technology
Thailand. North Bangkok,
King Mongkut’s
King Mongkut’sBangkok, University
Bangkok,
University of Technology
10800,
of Thailand.North
Technology NorthBangkok,Bangkok,
Corresponding Author’s 10800,
Email: Thailand.
1azizsaad@usm.my
Bangkok,
Bangkok, 10800,
10800,
Corresponding Author’s Email: azizsaad@usm.my Thailand.
Thailand.
1
Corresponding Author’s Email: 11azizsaad@usm.my
Corresponding Author’s Email:1 azizsaad@usm.my
Article History: Received 15Author’s
Corresponding
Corresponding September
Author’sEmail: 2021; azizsaad@usm.my
Email: Revised
1azizsaad@usm.my 9 June 2022; Accepted
Article History: Received 15 September 2021; Revised 9 June 2022; Accepted
Article History: Received 15 September 20 June 2022 2021; Revised 9 June 2022; Accepted
Article History: Received 15 September 20 June 2022 2021; Revised 9 June 2022; Accepted
Article
ArticleHistory:
History:Received
Received1515September 20 June2021;
September 2021;Revised
2022 Revised9 9June June2022;2022;Accepted
Accepted
20 June 2022
ABSTRACT: As lead-based 2020June Junesolder
2022 has been restricted, the
2022
ABSTRACT: As lead-based solder has been restricted, the
ABSTRACT:
microelectronics
ABSTRACT:industry
industry has been looking
As lead-based
As lead-based
solder
solder
for lead-free
has been
has been
solderrestricted,
like SAC. But the
microelectronics has been looking for lead-free solderrestricted,
like SAC. But the
ABSTRACT:
ABSTRACT:
there have been cases
microelectronics AsAs oflead-based
industry solder
has been
lead-based joints solder
failing,
looking
solder forhas has been
reducing
lead-free been restricted,
product
solder SAC.the
likereliability
restricted, But
the
microelectronics
there have been cases industry has been
of solder joints looking
failing, for reducing
lead-free solder product likereliability
SAC. But
because
microelectronics
there the
have
microelectronics formed
been intermetallic
industry
cases has
of been
solder compound
looking
joints for
failing,layer (IMC)
lead-free
reducing is
solder brittle.
like
product The
SAC. thick
But
reliability
there
because have been industry
the formed cases of has
intermetallicsolder been looking
joints
compound for
failing,layer lead-free
(IMC) solder
reducing isproduct likeThe
brittle. SAC. But
reliability
thick
there
IMC
because
there have
layer the
have been
reduced
formed
been cases theofofsolder
intermetallic
cases solder joints
joint
compound
joints failing,
strength.
failing, reducing
layer This
(IMC)
reducing product
paper is brittle.
product reliability
analyses real
The thick
reliability
because
IMC layer thereduced
formed intermetallic
the solder joint compound strength. layer (IMC)
This paper is brittle.
analyses The thick
real
because
industrial
IMC
because the
layer
theformed
package
reduced
formed intermetallic
assemblies
the solder
intermetallic compound
of nanocomposite
joint strength.
compound layer
layer (IMC)
lead-free
This
(IMC) issolder
paper
isbrittle. The
joints.
analyses
brittle. The thick
TiO 2,
real
thick
IMC layer
industrial reduced
package the solder
assemblies joint strength.lead-free
of nanocomposite This paper solderanalyses
joints. TiO real
2,
Fe
IMC O ,
industrial
IMC
2 3 and
layer NiO
layerpackage nanoparticles
reduced
reduced the
assembliessolder
the solder with 0.05
joint
of nanocompositeweight
strength.
jointweightstrength. percentage
This
lead-free (wt.%)
paper
This paper were
analyses
solder analysesmixed
real
joints. TiO
real2,
Feindustrial
2O3, and NiO package assemblies
nanoparticles of nanocomposite
with 0.05 lead-free
percentage solder
(wt.%) joints.
were TiO
mixed 2,
into
Fe 2O96.5%
industrial3, and
industrial Sn-3.0%
package Ag-0.5% Cu
assemblies
NiO nanoparticles
package assemblies of
with
of (SAC305)
nanocomposite
0.05 weight
nanocomposite solder paste using
lead-free
percentage
lead-free solder
(wt.%)
soldera joints.
mechanical
were
joints.TiO
mixed
TiO 2,2,
Fe2O96.5%
into 3, andSn-3.0%
NiO nanoparticles
Ag-0.5% Cu with 0.05 weight
(SAC305) solder percentage
paste using (wt.%) were mixed
a mechanical
stirrer
Fe 2O
into
Fe 2O ,to
3,96.5%
3and make
NiO nanocomposite
nanoparticles
Sn-3.0% Ag-0.5%with lead-free
Cu 0.05
0.05weight
(SAC305) solders. Thepaste
percentage
solder effects(wt.%)
usingof nanoparticles
awere mixed
mechanical
into
stirrer toand
96.5% NiO
makeSn-3.0%nanoparticles
Ag-0.5% with
nanocomposite Cu (SAC305)
lead-free weight
solders. solderpercentage
Thepaste
effects (wt.%)
using a were mixed
mechanical
of nanoparticles
in
into miniaturized
96.5%
stirrer
into 96.5% Sn-3.0%
to make solder
Sn-3.0% on
Ag-0.5%
nanocomposite
Ag-0.5% joiningCu
Cu quality
(SAC305)
lead-free
(SAC305) in IMC
solder
solders.
solder layers
paste
The and
using
effects
paste using nanocomposite
ofananoparticles
amechanical
mechanical
instirrer to make solder
miniaturized nanocomposite
on joining lead-free
quality solders.in IMC layers The effects of nanoparticles
and nanocomposite
stirrer
solders
in toto make
were
miniaturized
stirrer make nanocomposite
studied
solderusingon joining
nanocomposite a lead-free
scanningquality
lead-free solders.
electron
in IMC
solders. The effects
microscope
layers
The and
effects ofof
nanoparticles
(SEM) and a
nanocomposite
nanoparticles
in miniaturized
solders were studied solderusingon joining a scanning qualityelectron in IMC microscopelayers and nanocomposite
(SEM) and a
nanoindenter.
in miniaturized
solders
in were
miniaturized Adding
solder
studied onTiO
using
solder using ,
joining
on joining
2 Fe
a O
scanning
2 ,
quality and
quality in
3 in NiO
IMC
electron
IMC nanoparticles
layers and
microscope
layers changed
nanocomposite
(SEM)
and nanocomposite thea
and
solders
nanoindenter. were Adding
studied TiO 2, a Fescanning
2O3, and electron NiO microscope
nanoparticles (SEM) and
changed thea
microstructure
solders
nanoindenter.
solders were and
werestudied
Adding
studied reduced
using
using the
TiO2a, ascanning
Fe IMC
2O3, and
scanning layer
electron thickness
microscope
NiO nanoparticles
electron microscopeby 29%-35%.
(SEM)
changed
(SEM) The
and
and a
the
nanoindenter.
microstructure Adding
and reducedTiO2, the Fe 2OIMC 3, and layer NiO nanoparticles
thickness by 29%-35%. changed Thethea
nanoindenter.
nanocomposite
microstructure
nanoindenter. Adding
solder's
and reduced
Adding TiO
TiO 2,2, Fe
hardness the
Fe2 Oand ,
IMCand
elastic NiO
layer modulusnanoparticles
thickness
2O3, and NiO nanoparticles changed the
3 are changed
increased
by 29%-35%. by the
1%-
The
microstructuresolder's
nanocomposite and reducedhardness theand IMC layer
elastic modulusthickness are by 29%-35%.
increased by 1%-The
microstructure
11% and 8%-31%,
nanocomposite
microstructure and reduced
respectively.
solder's
and hardness
reduced the
the IMC
In
andIMC layer
comparison
elastic
layermodulusthickness to are
thickness by
pure by 29%-35%.
SAC305,byThe
increased
29%-35%. the
1%-
The
nanocomposite
11% and 8%-31%, solder's hardness and
respectively. In elastic
comparison modulus to arepure increased
SAC305,by the 1%-
composition
nanocomposite
11% and 8%-31%,
nanocomposite of SAC305
solder's
solder's with
hardness
respectively.
hardnessNiO and nanoparticles
and Inelastic
comparison
elastic modulussoldertopaste
modulus are
arepure hadSAC305,
increased the highest
increased byby1%-the
1%-
11% and 8%-31%,
composition of SAC305respectively.
with NiO nanoparticles In comparison soldertopaste pure hadSAC305,
the highest the
hardness,
11% and
composition
11% and and ofwith
8%-31%,
8%-31%, Fe2O3
SAC305 had
respectively.
with
respectively. the
NiO highest
In
nanoparticles
In elastic
comparison
comparison modulus.
to
solder to pure
paste
pureThis
had proves
SAC305,
the
SAC305, that
the
highest
the
composition
hardness, andof SAC305
with Fe2O3with hadNiO nanoparticles
the highest elasticsolder modulus. paste hadproves
This the highest
that
the incorporation
composition
hardness,
composition and withof nanoparticles
ofofSAC305
SAC305Fe2O3 with
with hadNiO
NiOthe of TiO2, Feelastic
nanoparticles
highest
nanoparticles 2O3solder
, solder
and NiO
paste
modulus.paste hashadenhanced
This
had the the
highest
proves
the that
highest
hardness,
the and with
incorporation Fe2O3 had theofhighest
of nanoparticles TiO2, Feelastic 2O3, and modulus.
NiO has This proves the
enhanced that
hardness,
mechanical and
the incorporation
hardness, and with
properties
with Fe2O3
of had
of pure
nanoparticles
Fe2O3 had the
SAC
the highest
of and
highest ,elastic
TiO2increased
Fe 2O3,modulus.
elastic andtheNiO
modulus. This
reliability
has
This proves
enhanced
proves that
of solderthe
that
the incorporation of nanoparticles of TiO
mechanical properties of pure SAC and increased the reliability of solder 2, Fe 2O 3, and NiO has enhanced the
Journal of Advanced
the
joints Manufacturing
incorporation
in
mechanical
the incorporation Technology
miniaturised of
propertiesof (JAMT)
nanoparticles
electronic
of pure
nanoparticles of
packaging.
SAC of TiO
and
TiO 2, Fe O
increased , and NiO
the has enhanced
reliability
2, Fe2O3, and NiO has enhanced the
2 3 of the
solder
mechanical
joints properties
in miniaturised of purepackaging.
electronic SAC and increased the reliability of solder
mechanical
joints
mechanical properties
in miniaturised ofofpure
propertieselectronic pureSAC SACand
packaging. andincreased
increasedthe thereliability
reliabilityofofsoldersolder
joints in miniaturised electronic packaging.
KEYWORDS
joints in :
miniaturised electronic
Nanocomposite
joints in miniaturised electronic packaging. packaging.
Lead Free Solder; Nanoindentation

ISSN: 1985-3157 Vol. 16 No. 2 May-August 2022 15

1.0 INTRODUCTION
Tin-lead (Sn-Pb) solder has been widely used in electronics over the
Journal of Advanced Manufacturing Technology (JAMT)

KEYWORDS: Nanocomposite Lead Free Solder; Nanoindentation

Journal of Advanced Manufacturing Technology (JAMT)

1.0 INTRODUCTION
Tin-lead (Sn-Pb) solder has been widely used in electronics over the
last few decades due to its low melting temperature, low cost, good
solderability, and satisfactory mechanical properties. However, due to
human health and environmental concerns, lead (Pb) is being phased
out of electronic products [1]. Pb content was limited to less than
1000ppm under the Restriction of Hazardous Substances Act (RoHS 1)
[2]. Sn-Ag-Cu (SAC)-based materials are currently the most promising
surface mount alloy solutions [2]. The SAC305 alloy, which contains
96.5% tin, 3.0% silver and 0.5% copper, is the preferred option for
surface mounting technology (SMT) assembly. The melting point for
the most widely used lead alloys, such as Sn-60 Pb-40, is 183°C, while
the melting point of the most commonly used lead free alloy, SAC305,
is 217°C to 219°C [3]. The melting point transition is crucial for the
formation of intermetallic bonds during the reflow process. SAC
mechanical properties such as melting temperature, hardness,
wettability, and tensile stress are improved by incorporating
nanocomposite materials such as Ag, Fe2O3, NiO and Al2O3 [4].

A thin IMC layer formed between the solder and the substrate is useful
for joint bonding. However, the thicker IMC layer reduces joint
strength due to low fracture strength and brittleness [5]. The presence
of voids in the IMC layer causes the solder joint to fracture and fail.
These voids act as crack initiators and propagate at random. IMC
typically forms tin-based compounds such as Cu6Sn5 or Cu3Sn during
the reflow soldering process [6]. As time and temperature rise, the
interface will first form a good Cu6Sn5 IMC layer and then gradually
deteriorate into a weak brittle Cu3Sn IMC layer. Chromik et al. [7]
reported that Cu6Sn5 had the highest hardness compared to Cu3Sn and
Ag3Sn, while Cu3Sn was brittle whereas Ag3Sn was ductile. On the
other hand, Xiao and Yuang [8] found that the Cu3Sn hardness and
elastic modulus were higher than Cu6Sn5. Xu and Pang [9] and Rao et
al. [10] found that Cu3Sn elastic modulus and hardness exceeded
Cu6Sn5. Yang et al. [11] found that the mechanical reactions of both
Cu6Sn5 and Cu3Sn depended largely on the strain rate during loading.

The hardness and elastic modulus of solder joint are measured by the
Continuous Stiffness Measurement (CSM) nanoindentation
technology.
Journal of Advanced These
Manufacturing mechanical
Technology (JAMT) properties are continuously updated
from the beginning till the end of indentation [12]. Thermal energy
causes Cu atoms to dissolve and diffuse with Sn atoms to create Cu3Sn
in a solder junction [13]. The aging temperature and strain rate rise
when the solder joint's fracture mode changes from ductile to brittle.
Several researchers [4-13] investigate the effects of nanoparticle
reinforcement's mechanical properties on SAC solder paste. However,
the
16 author is ISSN: unaware1985-3157of any
Vol.studies
16 No.that have used
2 May-August real industrial
2022
assembly packages to analyse the mechanical properties of
nanoparticle reinforcement of SAC305 with TiO2, Fe2O3, and NiO using
nanoindentation. There is one study found on the hardness profiles of
Journal of Advanced Manufacturing Technology (JAMT)

causes CuStructural
atoms to dissolve and diffuse with Sn atoms to create Cu3Sn
Analysis on Nanocomposites Lead Free Solder using Nanoindentation
in a solder junction [13]. The aging temperature and strain rate rise
when the solder joint's fracture mode changes from ductile to brittle.
Several researchers [4-13] investigate the effects of nanoparticle
reinforcement's mechanical properties on SAC solder paste. However,
the author is unaware of any studies that have used real industrial
assembly packages to analyse the mechanical properties of
nanoparticle reinforcement of SAC305 with TiO2, Fe2O3, and NiO using
nanoindentation. There is one study found on the hardness profiles of
SAC305 with TiO2 by using nanoindentation [14], but it has not used
real industrial assembly packages. The author also found one study
that used real industrial assembly packages showed in [15] however,
did not focus on nanoindentation analysis.

The aim of this study was to evaluate the effect of nanoparticle

reinforcement in solder paste on the microstructure and thickness of
the IMC layer in solder joints, as well as the effect of nanoparticle
reinforcement on the hardness and elastic modulus of the IMC layer
and bulk solder. The real industrial assembly packages with
nanocomposite lead-free solder joints samples were analysed by using
a three-sided Berkovich pyramidal indenter for nanoindentation
experiments. The composition of the bulk solder and indentation mark
were analysed using the SEM for data analysis and the Energy
Dispersion X-ray spectrum (EDX) for analysing the distribution of the
compound in the solder joint.

2.0 METHODOLOGY

2.1 Sample Preparation

The industrial assembly packages used in this study was a 01005
capacitor with a size of 0.4 × 0.2mm mounted on a printed circuit board
(PCB) via reflow soldering, as shown in Figure 1 [16]. TiO2, Fe2O3 and
NiO nanoparticles with particle sizes of 10nm are used. The particle
size of SAC305 is between 15 and 25 µm as received. Prior to assembly,
each type of nanoparticle with 0.05% weight is mixed with pure
SAC305 solder paste using a mechanical stirrer at 300rpm for
approximately 10 minutes to achieve homogeneity. Thus, three
nanocomposite lead free solder mixtures are produced: SAC305-
0.05wt%
Journal of Advanced TiO2, SAC305-0.05wt%
Manufacturing Technology (JAMT) Fe2O3, and SAC305-0.05wt% NiO.

The lead free solder paste was printed with a thickness of 0.127 mm.
The assembly packages was placed on the printed lead free SAC305-
nanocomposite solder paste using the component placement machine.
The soldering was carried out in a complete convection reflow oven
with a lead-free reflow profile. The reflowed PCBs were then washed
with an aqueous cleaning machine for de-fluxing. The ready PCB with
mounted capacitor was then cut into a small piece at the target area for
cold mountingISSN: 1985-3157
sample Vol. 16 followed
preparation, No. 2 May-August 2022
by a polishing 17
process to
produce a good surface finish for further characterization of the IMC
layer, as shown in Figure 2.
 The lead free solder paste was printed with a thickness of 0.127 mm.
The assembly packages was placed on the printed lead free SAC305-
nanocomposite solder paste using the component placement machine.
Journal of Advanced Manufacturing Technology (JAMT)
The soldering was carried out in a complete convection reflow oven
with a lead-free reflow profile. The reflowed PCBs were then washed
with an aqueous cleaning machine for de-fluxing. The ready PCB with
mounted capacitor was then cut into a small piece at the target area for
cold mounting sample preparation, followed by a polishing process to
produce a good surface finish for further characterization of the IMC
layer, as shown in Figure 2.

Figure 1: Industrial assembly packages that contain a 01005 capacitor

mounted on printed circuit board (PCB) [16]

(a) (b)
Figure 2: (a) Cold mounting sample and (b) SEM image of solder joint

2.2 Nanocomposite Lead Free Solder Joint Characterization

The IMC layer hardness was measured with a NanoTest Vantage, Micro
Materials equipped with a three-sided Berkovich pyramid tip and a
maximum load of 10 mN, a loading rate of 0.5 mN/s, and a dwell time of
60 s [17-19]. These parameters are determined by the effect of loading rate
on creep characteristic and indentation size at each maximum load. The
SEM is used to observe IMC microstructure and indentation marks on
samples
Journal of Advanced as shown
Manufacturing in Figure
Technology (JAMT) 3. The scanning is done at 15 kV to determine
the indentation mark and the microstructure of the IMC layer. The solder
joint's area of interest is captured, and an EDX analysis is performed on
specific regions to analyse its composition. The indentation parameters
are 0.1 mN limit stop load and 0.02 mN image load.

18 ISSN: 1985-3157 Vol. 16 No. 2 May-August 2022

Journal of Advanced Manufacturing Technology (JAMT)

joint's area of interest is captured, and an EDX analysis is performed on

specific regions to analyse its composition. The indentation parameters
Structural Analysis on Nanocomposites Lead Free Solder using Nanoindentation
are 0.1 mN limit stop load and 0.02 mN image load.

Figure 3: Indentation regions for IMC layer and nanocomposite solder

2.3 Nanoindentation Testing

Oliver and Pharr’s method is widely used in nanoindentation to
determine the hardness and elastic modulus. Figure 4 shows the load-
displacement curve, which gives the maximum load (Pmax), maximum
displacement (hmax) and elastic unloading stiffness or contact stiffness (S).

Figure 4: Load-displacement curve of identation [18]

The unloading processes shown in Figure 4 are used to calculate

hardness and elastic modulus. The Berkovich indenter is used at an
angle of 𝜙𝜙𝜙𝜙 = 70.3°. Assuming the pile-up is negligible, the elastic
model shows the sink-in amount, hs is given in Equation (1), where ϵ
(Geometry constant of the indenter) = 0.75 for the Berkovich paraboloid
indenter. The contact depth (ℎ𝑐𝑐𝑐𝑐 ) is used to calculate the contact area
(𝐴𝐴𝐴𝐴 = 𝐹𝐹𝐹𝐹(ℎ𝑐𝑐𝑐𝑐 )). Equation (2) gives the value of ℎ𝑐𝑐𝑐𝑐 . However, the projected
Journal of Advanced Manufacturing Technology (JAMT)
contact area is obtained from Fischer – Cripps by Equation (3).
𝑃𝑃𝑃𝑃𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚
ℎ𝑠𝑠𝑠𝑠 = 𝜖𝜖𝜖𝜖 𝑠𝑠𝑠𝑠
(1)
𝑃𝑃𝑃𝑃𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚
ℎ𝑐𝑐𝑐𝑐 = ℎ𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚 − 𝜖𝜖𝜖𝜖 𝑠𝑠𝑠𝑠
(2)
𝐴𝐴𝐴𝐴 = 24.49ℎ𝑐𝑐𝑐𝑐2 (3)

The hardness, elastic modulus and stiffness of the projected area can be
calculated using Equations (4)-(6), respectively.
ISSN: 1985-3157 Vol. 16 No. 2 May-August 2022 19
𝑃𝑃𝑃𝑃𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚
𝐻𝐻𝐻𝐻 = 𝐴𝐴𝐴𝐴
(4)
2
𝑆𝑆𝑆𝑆 = 𝛽𝛽𝛽𝛽 𝐸𝐸𝐸𝐸𝑒𝑒𝑒𝑒𝑒𝑒𝑒𝑒𝑒𝑒𝑒𝑒 √𝐴𝐴𝐴𝐴 (5)
 𝑃𝑃𝑃𝑃𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚
ℎ𝑠𝑠𝑠𝑠 = 𝜖𝜖𝜖𝜖 𝑠𝑠𝑠𝑠
(1)
𝑃𝑃𝑃𝑃𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚
ℎ𝑐𝑐𝑐𝑐 = ℎ𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚 − 𝜖𝜖𝜖𝜖 (2)
Journal of Advanced Manufacturing Technology (JAMT) 2 𝑠𝑠𝑠𝑠
𝐴𝐴𝐴𝐴 = 24.49ℎ𝑐𝑐𝑐𝑐 (3)

The hardness, elastic modulus and stiffness of the projected area can be
calculated using Equations (4)-(6), respectively.

𝑃𝑃𝑃𝑃𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚𝑚
𝐻𝐻𝐻𝐻 = (4)
𝐴𝐴𝐴𝐴
2
𝑆𝑆𝑆𝑆 = 𝛽𝛽𝛽𝛽 𝐸𝐸𝐸𝐸 √𝐴𝐴𝐴𝐴 (5)
√𝜋𝜋𝜋𝜋 𝑒𝑒𝑒𝑒𝑒𝑒𝑒𝑒𝑒𝑒𝑒𝑒
1 1−𝑣𝑣𝑣𝑣 2 1−𝑣𝑣𝑣𝑣 2
𝐸𝐸𝐸𝐸𝑒𝑒𝑒𝑒𝑒𝑒𝑒𝑒𝑒𝑒𝑒𝑒
= 𝐸𝐸𝐸𝐸
+ 𝐸𝐸𝐸𝐸1
(6)

The value of 𝛽𝛽𝛽𝛽 = 1.034 is used as a constant. For Berkovich diamond

indenter, 𝐸𝐸𝐸𝐸1= 1141 GPa and 𝑣𝑣𝑣𝑣1 = 0.07. An assumption of 𝜈𝜈𝜈𝜈 = 0.3 is used
to calculate the elastic modulus of samples whose elastic modulus has
not been measured.

3.0 RESULTS AND DISCUSSION

3.1 IMC Layer Thickness and its Microstructure Analysis

The brittleness of the IMC layer, especially when it is thicker, contributes
to the failure of solder joints. Thus, it’s crucial to analyse the formation of
the IMC layer thickness between the copper pad and the bulk solder in
the real industrial assembly packages. The microstructure of the IMC
layer and its thickness is observed using SEM as depicted in Figure 5. It is
assumed that CU6Sn5 is the only IMC layer present due to the fact that
only a single IMC layer is visible via SEM in Figure 5. This assumption is
then proved by the EDX result in Figure 6, where only the elements of
copper (59.06%) and tin (40.02%) are available to show the Cu6Sn5 IMC
layer is visible between the copper pad and the bulk solder. The scallop-
shape pattern of IMCs was observed in pure SAC solder with thicknesses
ranging from 3.0 to 6.5 µm. In contrast, a different shape of IMC was found
in all nanocomposite solders, with a flat continuous shape identified, as
shown in Figure 5(b)-(d) which results in stronger solder joint. The IMC
layer thickness for SAC305-0.05wt% TiO2 is between 2.48 and 3.67µm as
shown in Figure 5(b), while the IMC layer thickness for SAC305-0.05wt%
Fe2O3 is between 2.31 and 3.58µm, as shown in Figure 5(c). In the SAC305–
0.05wt% NiO IMC layer, the thickness ranges from 2.01 to 3.55µm. All
three reinforced nanocomposite solders show that the IMC layer has a
thinner
Journal of Advanced thickness
Manufacturing and flat
Technology continuous-shape compared to pure SAC305.
(JAMT)

Table 1 shows that the thickness of the Cu6Sn5 IMC layer has decreased
due to the reinforcement of nanoparticles in SAC solder. The
nanoparticles addition into bulk solder refined the Ag3Sn intermetallic
compound. The Cu atom from the substrate is dissolved and diffused into
the Sn-rich solder during the reflow soldering process, and the Cu6Sn5
IMC layer is formed when the copper and tin reactions occur [15].
20 ISSN: 1985-3157 Vol. 16 No. 2 May-August 2022
The thickness of the Cu6Sn5 layer increases with the depth of continuous
diffusion of Cu. It has a higher surface energy than larger compounds like
Ag3Sn, which appear to disperse with a compound to form a lower surface
Journal of Advanced Manufacturing Technology (JAMT)

Table 1 shows that the thickness of the Cu6Sn5 IMC layer has decreased
due to the reinforcement of nanoparticles in SAC solder. The
Structural Analysis on Nanocomposites Lead Free Solder using Nanoindentation
nanoparticles addition into bulk solder refined the Ag3Sn intermetallic
compound. The Cu atom from the substrate is dissolved and diffused into
the Sn-rich solder during the reflow soldering process, and the Cu6Sn5
IMC layer is formed when the copper and tin reactions occur [15].

The thickness of the Cu6Sn5 layer increases with the depth of continuous
diffusion of Cu. It has a higher surface energy than larger compounds like
Ag3Sn, which appear to disperse with a compound to form a lower surface
energy compound. The refined Ag3Sn is then absorbed to the surface of
the IMC layer, acting as a diffusion barrier to reduce the diffusion of Sn in
nanocomposite solder and Cu from copper substrate. Since the IMC layer
thickness depends on the depth of the Cu atom being diffused, the IMC
layer growth is retained and eventually the IMC layer of nanocomposite
solder becomes smaller than the pure SAC305 as shown in Table 1.

(a) (b)

(c) (d)
Figure 5: IMC layers of (a) pure SAC305, (b) SAC305-0.05wt% TiO2,
(c) SAC305-0.05wt% Fe2O3 and (d) SAC305-0.05wt% NiO

ISSN: 1985-3157 Vol. 16 No. 2 May-August 2022 21

 Journal of Advanced Manufacturing Technology (JAMT)
Journal of Advanced Manufacturing Technology (JAMT)

Figure 6: EDX result of IMC layer

The 0.05wt% TiO2 nanoparticles addition in solder resulted in a 35%

reduction in thickness when compared to pure SAC305 solder. Despite
the fact that TiO2 nanoparticles have the greatest thickness reduction, their
Cu6Sn5 layer thickness is only 2.9-3.1 m, that is due to similar nanoparticle
sizes. Other researchers [14, 20-21] reported that TiO2 nanoparticles
inhibited the growth rate of the Cu6Sn5 layer and refined Ag3Sn in
composite solder. The reaction with nanoparticle TiO2 will generate a
stable compound with lower surface energy than the entangled
compounds. Therefore, Ag3Sn in solder reacts with TiO2 to refine the
compound's size and spacing. Similar to TiO2, the addition of Fe2O3
nanoparticles made it possible to sustain the growth of the IMC layer
[22]. When a small amount of Fe2O3 nanoparticles were added to
SAC305 solder, the nanoparticles tended to adsorb to the surface of Cu
substrates, thereby reducing surface energy. The small size of
nanoparticles that adsorb on the IMC layer, which has a low surface
energy, has a greater effect on inhibiting the formation of interfacial
IMC. The thickness of the IMC layer was reduced by about 32% when
Fe2O3 was added, and it was reduced by about 29% when NiO was
added, when compared to pure SAC305. The addition of NiO
nanoparticles to the solder paste reduced the thickness of the IMC layer
because NiO nanoparticles precipitated on the Cu6Sn5 surface, acting
as a barrier to prevent the IMC layer from growing [23]. This lower
thickness of the IMC layer is comparable to the findings of this study.

Table 1: Values of mean thickness of Cu6Sn5 IMC layer & percentage of

reduced thickness between different nanocomposites and pure SAC305
SAC305 SAC305– SAC305 – SAC305 –
Type of material
0.05wt%TiO2 0.05wt%Fe2O3 0.05wt%NiO
Mean thickness, µm 4.405 2.872 2.968 3.102
Reduced thickness, % 34.81 32.61 29.59

22 ISSN: 1985-3157 Vol. 16 No. 2 May-August 2022

Journal of Advanced Manufacturing Technology
Structural
(JAMT)
Analysis on Nanocomposites Lead Free Solder using Nanoindentation
Journal of Advanced Manufacturing Technology (JAMT)
Journal of Advanced Manufacturing Technology (JAMT)
3.2 IMC Layer Hardness and Elastic Modulus Analysis
3.2
3.2 IMCIMC Layer
Layer Hardness
Hardness and and Elastic
Elastic Modulus
Modulus Analysis
Analysis
The relationship between the IMC layers' indent positions, hardness, and
The
The relationship
relationship between
between the
the IMC
IMC layers'
layers' indent
indent positions,
positions, hardness,
hardness, and
and
elastic modulus is also investigated. When indent positions are moved
elastic
elastic modulus
modulus is
is also
also investigated.
investigated. When
When indent
indent positions
positions are
are moved
moved
from the Cu/IMC boundary to the nanocomposite solder, as seen in
from
from thethe Cu/IMC
Cu/IMC boundary to to the
the nanocomposite solder,
solder, as seen
seen in
Figure 7, the size of boundary
the indent increases. nanocomposite
The Cu/IMC boundary asindent in
is
Figure
Figure 7,
7, the
the size
size of
of the
the indent
indent increases.
increases. The
The Cu/IMC
Cu/IMC boundary
boundary indent
indent is
is
the smallest (2.06 m), whereas the IMC/solder boundary indent is the
the
the smallest
smallest (2.06
(2.06 m),
m), whereas
whereas the
the IMC/solder
IMC/solder boundary
boundary indent
indent is
is the
the
largest at 5.73 m. During the transition from Cu/IMC boundary to
largest
largest atat 5.73
5.73 m.m. During
During the transition from
from Cu/IMC boundary to
nanocomposite solder, the the transition
material's hardness Cu/IMC
and elastic boundary
modulus to
nanocomposite
nanocomposite solder,
solder,areathe material's
material'sashardness
theincreases, hardness and
and 8. elastic
elastic modulus
modulus
decrease as the contact seen in Figure The maximum
decrease
decrease as asinthe contact
contact area
thehardness area increases, asas seen
seen in Figure 8.
8. The maximum
difference andincreases,
elastic modulus in is
Figure
2 GPa The
andmaximum
20 GPa
difference in
difference inThis hardness
hardness and elastic modulus is 2 GPa
GPa and 20
and 20atGPa
respectively. is due andto a elastic modulus
large amount is 2accumulating
of Cu GPa
the
respectively.
respectively. This is
This isThe due
due to a large amount
to concentration
a large amount of Cu
of 6Cu accumulating at
at the
Cu/IMC boundary. high of Cu Sn5 accumulating
at Cu/IMC increases the
Cu/IMC boundary. The high concentration of Cu 6Sn5 at Cu/IMC increases
Cu/IMC boundary. The high concentration of Cu Sn
its resistance to deformation, resulting in a higher elastic modulus and
6 5 at Cu/IMC increases
its
its resistance
resistance to to deformation,
deformation, resulting
resulting inin aa higher
higher elastic
elastic modulus
modulus and and
hardness.
hardness.
hardness.
Tin (Sn) solder
Tin (Sn) solder
Tin (Sn) solder
5
5
5 4
4
4
Intermetallic compound (IMC) layer 3
Intermetallic compound (IMC) layer 3
Intermetallic compound (IMC) layer 3
2
1 2
1 2
Copper (Cu) Substrate 1
Copper (Cu) Substrate
Copper (Cu) Substrate

Figure 7: Indent size increases when Cu/IMC boundary is transferred to

Figure
Figure 7:
7: Indent size
size increases
Indentsolder increases when
when Cu/IMC
Cu/IMC boundary
boundary is
is transferred
transferred to
to
nanocomposite (indent position 1= Cu/IMC boundary; 2=close to
nanocomposite
nanocomposite solder
solder (indent
(indent position
position 1=
1= Cu/IMC
Cu/IMC boundary;
boundary; 2=close
2=close to
to
Cu/IMC; 3=middle of IMC; 4=close to IMC/solder; 5= IMC/solder boundary)
Cu/IMC;
Cu/IMC; 3=middle
3=middle of of IMC;
IMC; 4=close
4=close to
to IMC/solder;
IMC/solder; 5=
5= IMC/solder
IMC/solder boundary)
boundary)

Figure 8: Hardness & elastic modulus based on indent position (indent

Figure
Figure 8:
8: Hardness
Hardness & elastic
elastic modulus based on
on indent position (indent
position 1=Cu/IMC&boundary; modulus
2=closebased indent
to Cu/IMC; position
3=middle of(indent
IMC;
position 1=Cu/IMC
position 1=Cu/IMC boundary;
boundary; 2=close
2=close to
to Cu/IMC;
Cu/IMC; 3=middle
3=middle of
of IMC;
IMC;
4=close to IMC/solder; 5=IMC/solder boundary)
4=close to IMC/solder; 5=IMC/solder boundary)
4=close to IMC/solder; 5=IMC/solder boundary)
Furthermore, the effect of nanoparticle reinforcement on the hardness and
Furthermore,
Furthermore, the
the effect of of nanoparticle reinforcement on
on the hardness and
elastic
Journal of Advanced modulus
Manufacturing ofeffect
the IMC
Technology nanoparticle reinforcement
layer is observed.
(JAMT) thesamples
Four different hardnesswere
and
elastic modulus
elastic for
modulus of the IMC layer
of the IMC layer is observed. Four different samples were
tested nanoindentation alongisthe
observed.
Cu6Sn5 Four
layer.different
Figures samples
9(a) andwere
9(b)
tested for nanoindentation along the 6Sn5 layer. Figures 9(a) and 9(b)
testedthe
show forhardness
nanoindentation
and elastic along the Cu
modulus, 6Sn5 layer. Figures 9(a) and 9(b)
Curespectively.

ISSN: 1985-3157 Vol. 16 No. 2 May-August 2022 23

Journal of Advanced Manufacturing Technology (JAMT)

Journal of Advanced Manufacturing Technology (JAMT)

show the hardness and elastic modulus, respectively.

(a) (b)
Figure 9: Graphs of IMC layer: (a) hardness and (b) elastic modulus

From Figure 9(a), the hardness of pure SAC305, SAC305-0.05wt% TiO2,

SAC305-0.05wt% Fe2O3 and SAC305-0.05wt% NiO is 3-8 GPa, 3-5.5 GPa,
3-7 GPa and 3-8.5 GPa, respectively. Elastic modulus for pure SAC305 is
90-140 GPa, 90-150 GPa for SAC305-0.05wt% TiO2, 80-140 GPa for
SAC305-0.05wt% Fe2O3 and 90-160 GPa for SAC305-0.05wt% NiO. Figure
9(a) clearly shows that SAC305–0.05wt% TiO2 has the lowest hardness,
which due to the deviated indenter from the defined position. The
indentation is done on the upper part of the IMC layer, which is slightly
deviated from the defined position. The difference in hardness and elastic
modulus ranges is plotted, and their percentage differences are less than
10%, indicating that nanoparticle reinforcement has no significant effects
on the hardness and elastic modulus of the IMC layer. Although the
Cu6Sn5 IMC layer increases in thickness during thermal ageing, the elastic
modulus and hardness did not change significantly due to measurement
error. Due to differences in sample preparation, test procedure and data
treatment, the values of hardness and elastic modulus vary significantly
amongst different scientific literatures [8-14].

3.3 Nanocomposite Solder’s Hardness & Elastic Modulus Analysis

Figure 10 depicts the nanocomposite solder's hardness and elastic
modulus. The hardness of the reinforced solder is higher than the pure
SAC305, except for TiO2 which has a hardness of 2.26% lower than the
pure SAC305. These results contradict the findings of previous studies in
this field, which proposed increasing hardness by reinforcing low
concentration of TiO2 nanoparticles [19-20]. This reflects the effect of
surface roughness on sample hardness and elastic modulus.

Furthermore, the addition of 0.15wt.% TiO2 nanoparticles into solder

resulted in higher hardness as reported in [15] whereas the current studies
use a lower TiO2 composition (0.05 wt.%). The highest hardness is
achieved by a NiO nanoparticle reinforced solder of 0.198 GPa.

24 ISSN: 1985-3157 Vol. 16 No. 2 May-August 2022

 Structural Analysis on Nanocomposites Lead Free Solder using Nanoindentation
Journal of Advanced Manufacturing Technology (JAMT)

Meanwhile, the elastic modulus of three reinforced solders is higher than

the pure SAC305, and the elastic modulus of Fe2O3 nanoparticle reinforced
solder is the highest, at 66 GPa, among others. Nanoparticles added to
bulk solder refine the Ag3Sn aggregation distributed in the solder. The
Ag3Sn dispersion and embedded nanoparticles have been fixed to the
solder grain surface, preventing grain slipping and increasing hardness
over pure SAC305. In addition to NiO nanoparticles, a Sn–Ni physical
bond is formed between β-Sn and Ni nano-elements [23]. It is strong
enough to resist deformation on the sample surface when compared to the
reaction between molten solder and inert ceramic nanoparticles, giving it
the highest hardness among the others. In addition, the line curves for
hardness and elastic modulus are different in Figures 10(a) and 10(b).
Theoretically, the connection between hardness and elastic modulus is
generally proportionate. In Figures 10(a) and 10(b), it is depicted in
different ways, which is rather intriguing. Further examination of the
material surface is conducted to assess the effect of material surface
roughness on the contact between the indenter and the surface, and hence
the contact compliance. The difference between actual partial contact
and ideal perfect contact has led to an inaccurate penetrated depth
being obtained and then affected the contact area whereby hardness
and elastic modulus change also.

(a) (b)
Figure 10: Graphs of nanocomposite solder: (a) hardness and
(b) elastic modulus

4.0 CONCLUSION
The objectives of the study were achieved with the addition of the TiO2,
Fe2O3, and NiO nanoparticles to the pure SAC305 solder paste for
industrial assembly packages. The microstructure, thickness, hardness,
and elastic modulus of the Cu6Sn5 IMC layer and nanocomposite solder
were improved compared to those of pure SAC305. The Cu6Sn5 layer's
microstructure pattern changes from elongated-scallop shape (pure
SAC305) to flat continuous shape (nanocomposite solder) which results in

ISSN: 1985-3157 Vol. 16 No. 2 May-August 2022 25

 Journal of Advanced Manufacturing Technology (JAMT)
Journal of Advanced Manufacturing Technology (JAMT)

stronger solder joint. The addition of TiO2, Fe2O3, and NiO nanoparticles
changed the microstructure of SAC305 solder and decreased the IMC
layer thickness by 29% to 35% due to the presence of the refined Ag3Sn
growth barrier. It is good to have a thinner IMC layer as the brittle
behavior of the IMC layer is prone to failure, especially when the IMC
layer is thicker. The Cu6Sn5 IMC layer's hardness and elastic modulus data
show that different nanocomposite solders have similar values, implying
that adding nanoparticles has no effect on the mechanical properties of the
Cu6Sn5 IMC layer. This finding contrasts with the overall performance of
the nanocomposite solder, where NiO reinforcement has 11% higher
hardness and Fe2O3 has 31% higher elastic modulus than pure SAC305. It
is also worth noting that the indentation position influences the hardness
and elastic modulus of the Cu6Sn5 IMC layer.

ACKNOWLEDGEMENTS
The authors gratefully acknowledge the support of Universiti Sains
Malaysia through Short Term Grant 304.PMEKANIK.6315494 and
Research University Grant 1001.PMEKANIK.8014067.

REFERENCES
[1] H. Kotadia, P. Howes and S. Mannan, “A review: On the development
of low meting temperature Pb-free solders,” Microelectrons Reliability,
vol. 54, no. 6-7, pp. 1253-1273, 2014.
[2] C. Handwerker, U.R. Kattner and K.W. Moon, Fundamental properties of
Pb-Free solder alloys, Boston: Springer, 2007.
[3] W.N.C. Weng, Evolution of Pb-free solders in recent progress in soldering
materials. London, United Kingdom: IntechOpen, 2017.
[4] E. Efzan., A. Singh and T.C. Yap, “A review: Influence of nano particles
reinforced on solder alloy”, Soldering & Surface Mount Technology, vol.
25, no. 4, pp. 229–241, 2013.
[5] T. An and F. Qin, “Microelectronics Reliability Effects of the
intermetallic compound microstructure on the tensile behavior of
Sn3.0Ag0.5Cu / Cu solder joint under various strain rates,”
Microelectrons Reliability, vol. 54, no. 5, pp. 932–938, 2014.
[6] A. Roshanghias, A. Kokabi and Y. Miyashita “Formation of
intermetallic reaction layer and joining strength in nano-composite
solder joint”, Journal of Materials Science: Materials in Electronics, vol. 24,
no. 3, pp. 839-847, 2013.

26 ISSN: 1985-3157 Vol. 16 No. 2 May-August 2022

 Structural Analysis on Nanocomposites Lead Free Solder using Nanoindentation
Journal of Advanced Manufacturing Technology (JAMT)

[7] R.R. Chromik, R. P. Vinci, S.L. Allen and M.R. Notis “Measuring the
mechanical properties of Pb-Free solder and Sn-based intermetallics by
nanoindentation”, Journal of the Minerals, Metals & Materials, vol. 55, no.
6, pp. 66–69, 2003.
[8] G. Xiao and X. Yuang, “Mechanical properties of intermetallic
compounds at the Sn–3.0Ag–0.5Cu/Cu joint interface using
nanoindentation”, Materials & Design, vol. 88, no. 1, pp. 520-527, 2015.
[9] L. Xu and J. Pang, “Nano-indentation characterization of Ni-Cu-Sn
IMC layer subject to isothermal aging”, Thin Solid Films, vol. 504, no. 1-
2, pp. 362-366, 2006.
[10] B. C. Rao, J. Weng, L. Shen, T.k. Lee and K.Y Zeng, “Morphology and
mechanical properties of intermetallic compounds in SnAgCu solder
joints”, Microelectronic Engineering, vol. 87, no. 11, pp. 2416-2422, 2010.
[11] P. Yang, Y. Lai, S. Jian, J. Chen and R. Chen, “Nanoindentation
identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4
intermetallic compounds derived by diffusion couples”, Materials
Science and Engineering, vol. 485, no. 1-2, pp. 305-310, 2008.
[12] Y. Guozheng and S. Xuefeng, “Mechanical characterization of the IMC
layer by using Nano-indentation tests”, in 11th International Conference
on Electronic Packaging Technology, Xi’an, China, 2010, pp. 1077–1079.
[13] X. Luhua and J.H.L. Pang, “Nanoindentation on SnAgCu lead-free
solder and analysis”, in 7th Electronic Packaging Technology
Conference, Singapore, 2005, pp. 1-4.
[14] M.Z. Yahaya, F.C. Ani, Z. Samsudin, S. Sahin and M.Z. Abdullah
“Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by
nanoindentation”, Materials Science & Engineering: A, vol. 669, no. 1, pp.
178-186, 2016.
[15] F.C. Ani, A. Jalar, R. Ismail, Z. Mustafa, A.A. Saad, C.Y. Khor, N.K.
Othman, M.Y.T. Ali, M.A.F.M. Mukhtar and M.A. Abas, “TiO2
nanoparticles reinforced lead-free 96.5Sn-3.0Ag-0.5Cu solder paste for
ultra-fine package assembly in reflow soldering process”, Journal of
Advanced Manufacturing Technology, vol. 12, no. 1-2, pp. 413-424, 2018.
[16] Z. Bachok, A.A. Saad, F.C. Ani and M.A. Abas., “Structural Assessment
of Lead Free Solder Joint of Miniaturized Electronics Assembly”,
International Journal of Integrated Engineering, vol. 10, no. 5, pp. 26-31,
2018.
[17] M. Sadiq, M. Cherkaoui and J.S. Lecomte, “Nanoindentation for
measuring mechanical properties of lanthanum-doped tin-silver-
copper lead-free solders”, in 5th International Brazing & Soldering
Conference, Las Vegas, Nevada, USA, 2012, pp. 221-227.

ISSN: 1985-3157 Vol. 16 No. 2 May-August 2022 27

 Journal of Advanced Manufacturing Technology (JAMT)
Journal of Advanced Manufacturing Technology (JAMT)

[18] W.C. Oliver and G.M. Pharr, “Measurement of hardness and elastic
modulus by instrumented indentation: Advances in understanding
and refinements to methodology”, Journal of Materials Research, vol. 19,
no. 1, pp. 3-20, 2014.
[19] R. Tarefder and H. Faisal, “Effects of dwell time and loading rate on the
nanoindentation behavior of asphaltic materials”, Journal of
Nanomechanics & Micromechanics, vol. 3, no. 2, pp. 17-23, 2013.
[20] Y. Tang, S.M. Luo, K.Q. Wang and G.Y. Li, “Effect of nano-TiO2
particles on growth of interfacial Cu6Sn5 and Cu3Sn Layers in
Sn3.0Age0.5CuxTiO2 solder joints”, Journal of Alloys & Compounds, vol.
684, no. 1, pp. 299–309, 2016.
[21] J.C. Leong, L.C. Tsao, C.J. Fang and C.P. Chu, “Effect of nano-TiO2
addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu
composite Solder BGA Packages with immersion Sn surface finish”,
Journal of Materials Science: Materials in Electronics, vol. 22, no. 9, pp.
1443–1449, 2011.
[22] X. Zhao, Y. Wen, Y. Li and Y. Wang, “Effect of γ-Fe2O3 nanoparticles
size on the properties of Sn-1.0Ag-0.5Cu nano-composite solders and
joints”, Journal of Alloys & Compounds, vol. 662, no. 1, pp. 272–282, 2016.
[23] C. Srivalli and M.Z. Abdullah, “Microstructure and mechanical
properties of Pb-free Sn-3.0Ag-0.5Cu solder pastes added with NiO
nanoparticles after reflow soldering process”, Materials & Design, vol.
90, no. 1, pp. 499–507, 2016.

28 ISSN: 1985-3157 Vol. 16 No. 2 May-August 2022