一、Electric energy meter SMT production line

(flow chart)

2. Electric energy meter SMT production line

(equipment picture)
serial Device name Equipment photos
number
 Suction board
1
machine

2 printing press

Online solder
paste
3
inspection
machine

4 SMT machine

Lead-free
reflow
5
soldering
machine

AOI test
6
device

7 Unloader

三、Electric energy meter SMT production

line (process description)
Describe the working principle and function of each process, and then move
on to a logical explanation of the next process. (This can be combined with
the process flow chart above and the corresponding EXCEL table splitting
instructions.

1. Send board :
1.1. PCB boards to be produced into the baking oven, adjust the temperature of the oven according to
the process requirements, and put them into the turnover box for storage after baking. (The
function of the oven: to remove moisture from components and PCB boards )
1.2. Board loading: Then put the PCB board in the turnover box into the board suction machine . After
fixing the position of the PCB board, click the touch screen button to automatically start feeding
the board. ( The function of the board suction machine : use vacuum suction to fix the PCB boards
and send them to the next process in sequence; the function of the turnover box: store the PCB
boards )
Equipment used : 1 suction board machine
Tools used: 15 turnover boxes and 1 baking oven.

2. print :
2.1 . Printing preparation: ① Take out the solder paste from the refrigerator , warm it up and put it
into a solder paste mixer for mixing; ② Take out the alcohol from the explosion-proof cabinet and
add it to the alcohol tank of the printing machine cleaning device; ③ Wipe the stencil The paper is
installed into the printing machine cleaning device; (the function of the refrigerator: to store solder
paste, because solder paste needs to be stored at a temperature of 5 -10 ℃; the function of the
solder paste mixer: to centrifugally stir the solder paste evenly, and then the solder paste before it can
be used; the function of the explosion-proof cabinet: used to store chemicals such as alcohol; the
function of the stencil wiper: used for automatic cleaning of the stencil of the printing machine)
2.2 . Start printing: Put the stencil into the printing machine for installation and fixation. Put the mixed
solder paste into the stencil of the printing machine for printing. After printing, use the connecting
table to transfer the PCB board to the next process. , (The function of the printing machine: printing
solder paste onto the PCB board).
Equipment used: 1 printing press
Tools used: 3 stencils, 1 solder paste mixer, 1 refrigerator, 1 explosion-proof box, 1 box of stencil
wiping paper , 1 connecting station

3. Solder paste test:

Before the test, check whether the program of the online solder paste inspection machine is
accurately adjusted and whether the track width is consistent with the board. After confirmation, click
the software to start the test. After the software test is completed, determine whether the printing
quality meets the production requirements based on the results. After the test is completed, use the
connecting station to transfer the PCB to the placement machine. (The function of solder paste
detector: used to detect the height, volume, area, short circuit and offset of solder paste after PCB
board printing )
Equipment used: 1 online solder paste inspection machine
Tools used: 1 docking station

4. Patch :
4.1 . Installation: Use special construction tools to position the placement machine horizontally, and
then connect the power supply through a regulated power supply. (The role of the regulated power
supply: a power supply system that provides stable power supply to the placement machine,
preventing damage to the placement machine due to excessive power fluctuations ; the role of special
construction tools: assisting in installing the placement machine in a designated area)
4.2. Material preparation: ① Collect the required materials from the warehouse and put them into
the turnover box; ② Take the materials out of the turnover box and use the offline power supply of
the material gun according to the size of the material to load the materials into Samsung 8mm/ 12
mm/ 16mm/24mm/32mm/44mm/ 56mm material gun and multi-rod vibrating material gun; ③ Put
the installed material gun into the material gun truck according to the station of the program to
prepare materials, and then receive the IC chip required for the product from the ultra-low humidity
and moisture-proof cabinet and place it on the I C Place it on the table; (The function of the ultra-low
humidity and moisture-proof cabinet: used to store IC chips , moisture-proof and drying; the function
of the material gun : a device that can automatically supply components to the placement machine;
the function of the material gun cart : used for storage Material gun; the function of the turnover
frame: to store materials)
4.3. Material splicing: Put the same excess materials into the material rack for later use. When the
same material station is about to be finished, use SMT double -sided splicing tape to splice the
materials (the function of the material rack: to store materials; the function of SMT double-sided
splicing tape: Connect patch materials )
4.4. SMT: Install the corresponding nozzle on the head of the SMT machine according to the nozzle
model set in the program; load the material gun into the SMT trolley, and place the IC chip on the
backpack machine Afterwards, the components can be mounted. After the mounting is completed,
the PCB board is transferred to the reflow soldering station using a connecting station. (The function
of the placement machine: to mount electronic components on the PCB board with high precision; the
function of the suction nozzle: to pick up the components)
Equipment used: 2 placement machines (including 1 backpack machine )
Tools used: 1 stabilized power supply, 1 ultra-low humidity and moisture-proof cabinet, 2 material gun
carts , 1 45 material guns , 116 suction nozzles , 10 boxes of SMT double-sided splicing tape , an I C
placement table, material 1 off-line power supply for the gun , 10 turnover frames , 1 material rack, 1
connection table, and 5 sets of special construction tools.

.
5. Solder paste soldering:
5.1. ① When the reflow soldering reaches the set temperature and operates normally, first use a
reflow soldering oven temperature tester to test the furnace temperature curve of the reflow
soldering. After the test results meet the process requirements, the mounted PC CB can be passed
through the furnace to melt tin. . ②After coming out of the furnace, use the connecting table to
transfer the PCB board to the next process. (The function of reflow soldering: Send the PCB board with
the components attached into the reflow soldering chamber. After high temperature, the solder paste
used to solder the components is melted through the process of high-temperature hot air to form a
reflow temperature change, so that the components and P The pads on the CB board are combined
and then cooled together; the function of the reflow oven temperature tester: to detect whether the
reflow oven temperature curve is normal; the connection station: transfer the PC ( CB board)
5.2. For defective products produced after passing the furnace, use a hot air gun to remove the
defective components, and use a soldering iron to repair the components again. (The function of the
hot air gun: use high-temperature blowing to remelt the solidified solder paste , which can loosen the
fixed components; the function of the soldering iron and solder: re-solder the components on the PCB
board )
Equipment used: 1 lead -free reflow soldering equipment
Tools used: 1 connecting station, 2 soldering irons , 1 hot air gun, 1 reflow oven temperature tester

6. Optical detection
6.1. When the PCB flows into the optical inspection process, the A OI testing device
automatically scans the PCB through the camera , collects images, and compares the
tested solder joints with the qualified parameters in the database. After image
processing, defects on the PCB are detected , and the defects are detected through
the computer. Defects are displayed / marked for maintenance personnel to repair,
and the qualified PCB flows into the next process ( the function of the AOI testing
device: to detect whether the solder joints of the welded PCB board are qualified )
6.2. After the A OI test is completed, the operator must take the first board as the first piece on the
PCBA inspection workbench to conduct the first piece inspection and comparison against the product
B OM in the computer . After passing the inspection, place the PCB board It flows into the next
process on the connecting table.
used : 1 AOI test device, 1 connecting station
used : 1 PCBA testing workbench , 2 computers

7. Close the board

7.1.Debug the width of the frame where the PCB board is stored ;
7.2. Confirm the spacing of the boards in the frame, and then click the button on the touch screen to
close the boards . After the frame is full, the frame will be automatically replaced and the boards will
continue to be closed. You can put the PC CB in the frame into an anti-static turnover vehicle to
increase the storage capacity. (The function of the unloading machine: used to automatically collect
the PCB boards transferred from the previous process ; the upper and lower plate machine frames:
used to collect and store PCB boards ; the anti-static turnover vehicle: to store qualified PCB boards )
7.3 . Paste the barcode paper on the PCB upper board, and then use the scanner gun to
scan the barcode and upload it to the system.
used : 1 unloading machine
Tools used: 25 upper and lower trigger frames , 2 scanner guns , 10 rolls of barcode printing paper ,