(An Autonomous Institution, Affiliated to Anna University, Chennai)

NAME OF THE DEPARTMENT M.E.CAD/CAM

YEAR / SEMESTER I/I

REGULATION R-2022
SUBJECT CODE CC4101
SUBJECT NAME ADVANCED MANUFACTURING PROCESSES

UNIT– I SURFACE TREATMENT

Scope, Cleaners, Methods of cleaning, Surface coating types, and ceramic and organic methods of coating,
economics of coating. Electro forming, Chemical vapour deposition, thermal spraying, Ion implantation,
diffusion coating, Diamond coating and cladding.

PART-A (2-Marks)
S.N RBT
QUESTIONS CO
O LEVEL

1 What are surface coatings? C103.1 K1

2 What is the meaning of coating layers? C103.1 K1

3 What Specific Function Does the Coating Perform? C103.1 K2

4 Define Cementation. C103.1 K1

5 What are the types thermal spraying? C103.1 K2

6 What are the types of coating material? C103.1 K2

7 What are the types of ceramic compound coating. C103.1 K1

8 What is diffusion coating? C103.1 K1

9 What is diamond coating? C103.1 K2

10 What is meant by cladding? C103.1 K2

11 What is Physical vapor deposition (PVD) technology? C103.1 K1

12 What is Chemical vapor deposition (CVD) technology? C103.1 K1

13 What is meant by surface treatment? C103.1 K1

14 What is meant by flame hardening process? C103.1 K2

15 What is electro forming? C103.1 K2

16 What are the properties of coatings? C103.1 K1

17 State the process parameters of CVD that may influence coating properties. C103.1 K1

18 What is meant by pseudo diffusion CVD coating? C103.1 K1

19 What is meant by discontinuity at the coating-substrate interface? C103.1 K2

20 State the significance of metal nitride coating. C103.1 K1

PART-B (13- Marks Or 16-Marks or 8-Marks)

1 Explain the types of ceramic compound coating. C103.1 K2

2 Sketch and explain thin film surface resistivity. C103.1 K2

3 Explain the types of Physical vapor deposition (PVD) technology. C103.1 K3

Sketch of direct evaporation of an alloy from a single rod-fed source by Ion C103.1
4
Beam or electron beam. K3

5 Explain the main compound in general vacuum system design. C103.1 K3

6 Define and Sketch the principle of CVD. C103.1 K2

7 Explain briefly surface treatment by electron beam hardening. C103.1 K2

8 Explain briefly coat internal stresses measurement. C103.1 K2

State only methods of measurement the structural and chemical properties for C103.1
9
the surface and Coat, using Incident Ion. K3

10 Define and Explain briefly Coating on the plastic Substrate electrically. C103.1 K2

11 Explain the Methods of depositing ceramic coatings C103.1 K3

State the role of surface coating technology in achieving mechanical surface C103.1
12
property. K3

13 State the application of diamond coating in mechanical manufacturing. C103.1 K3

Why does cemented carbide substrate require special surface treatment before C103.1
14
the CVD process? K2
15 How can the performance of diamond coated tool be compared with that of the C103.1 K3
 uncoated tool in machining rolled aluminium?
Why does a mechanically functional surface coating require physical C103.1
16
characterization? K3

17 Explain some engineering application chromium coating C103.1 K2

18 Explain the different types of surface engineering. C103.1 K2

Can a diamond coated carbide tool generate higher force than a uncoated tool C103.1
19
during machining of Al-Si alloy? K3
Explain the different process parameters of CVD that may influence coating C103.1
20
properties. K3
UNIT– II NON-TRADITIONAL MACHINING
Introduction, need ,AJM, Parametric Analysis, Process capabilities, USM –Mechanics of cutting, models,
Parametric Analysis, WJM –principle, equipment ,process characteristics , performance, EDM – principles,
equipment, generators, analysis of R-C circuits, MRR , Surface finish, WEDM.

PART-A (2-Marks)
S.N RBT
QUESTIONS CO
O LEVEL

1 What are the abrasives used in AJM process? C103.2 K1

2 What are the desirable properties of carrier gas in AJM? C103.2 K1

3 List the applications of WJM process. C103.2 K2

4 State the benefits of Water Jet Machining process. C103.2 K1

5 What are the factors that affect the material removal rate in AJM process? C103.2 K2

6 State the applications of AJM process? C103.2 K2

7 State the working principle of Abrasive Jet Machining. C103.2 K1

8 Name the Transfer medium used in AJM process. C103.2 K1

9 What are the materials used for nozzle manufacturing in AJM process? C103.2 K2

10 List the Advantages and Disadvantages of AJM process C103.2 K2

11 List the benefits and disadvantages of WJM process. C103.2 K1

12 Reuse of abrasives is not recommended in AJM. Why? C103.2 K1

13 State the advantages and limitations of USM C103.2 K1

14 What are the abrasives used in USM process? C103.2 K2

15 What are the types of tool materials for USM? C103.2 K2

16 What are functions of dielectric fluid used in EDM? C103.2 K1

17 What are the basic requirements of dielectric fluid used in EDM? C103.2 K1

18 Name some of the tool material used in EDM? C103.2 K1

19 Why the servo-controlled system is needed in EDM? C103.2 K2

20 What are the principal components of EDM process? C103.2 K1

PART-B (13- Marks Or 16-Marks or 8-Marks)

Explain the working principle of AJM process with the help of suitable C103.2
1 diagrams. K3
Describe the principle and equipment for Abrasive Jet machining. (OR) Write C103.2
2 the names of various elements of AJM and explain them in brief K3
Explain the process parameter which controls the AJM machining quality.(or) C103.2
With a neat sketch explain the process of AJM? Explain the process control
3 measures to be taken to control quality and MRR. K3

4 Describe the principle and equipment for Water Jet Machining. C103.2 K3

5 Explain the different applications and process control features of WJM. C103.2 K3
Explain the principle of USM and its equipment. Explain the factors, which C103.2
6 influence the MRR in USM. Compare USM with traditional Abrasive
machining. K3
Explain the following in detail i) Types of transducers for USM ii) Feed C103.2
7
mechanisms in USM iii) USM typical applications iv) Abrasives for USM K3
Explain the functions of Transducer and horns used in USM. List the tool C103.2
8
materials used. K3
Briefly explain the effect of operating parameters on MRR. List the applications C103.2
9
of USM. K2
Describe the principle and working of a USM with a neat sketch. List the C103.2
10 advantages, limitations and applications of USM. Discuss about the control of
quality in machining in USM. K2
11 Discuss the effects of the following parameters on MRR and surface finish in C103.2 K2
 USM: i) amplitude and frequency ii) Abrasive size iii) Concentration of
abrasives iv) Material hardness v) static load vi) effect of slurry, tool and work
material.
i) Describe the principle and equipment for Water Jet Machining. ii) Explain the C103.2
12
different applications and process control features of WJM. K2

13 Compare USM, WJM and AJM in terms of process capabilities and limitations. C103.2 K3
With the help of a neat sketch, explain the working of a spark erosion machine. C103.2
14
(or) With the help of neat sketch, describe the EDM process. K3
What are the desirable properties of a dielectric fluid? Give some examples for C103.2
15
dielectric fluids. Explain the functions of dielectric fluid. K3
Explain the process of wire cut EDM and list any two of its advantages, C103.2
16 limitations and applications. (or) Explain the process of wire cut EDM with
respect to process equipment, applications, advantages and limitations. K3
Sketch and discuss the effects of the following parameters on MRR during C103.2
17 EDM a. Pulse duration on material removal rate, b. Surface finish and relative
electrode wear rate K3
With the help of a neat diagram the sequence of events constituting the process C103.2
18
of metal removal from the work piece by a single discharge in EDM process? K3
Explain the following on wire EDM technology: i) Dielectric system ii) C103.2
19
Deionized water iii) Positioning system iv) Wire drive system. K3
Explain how the stratified wire works. Also discuss about the recent C103.2
20
developments in WEDM? K3
UNIT–III LASER BEAM MACHINING
Principle of working, equipment, Material removal rate, Process parameters, performance characterization,
Applications. Plasma Arc Machining – Principle of working, equipment, Material removal rate, Process
parameters, performance characterization, Applications. Electron Beam Machining - Principle of working,
equipment, Material removal rate, Process parameters, performance characterization, Applications. Electro
Chemical Machining – Principle of working, equipment, Material removal rate, Process parameters,
performance characterization, Applications.
PART-A (2-Marks)
S.N RBT
QUESTIONS CO
O LEVEL

1 What is Laser? C103.3 K1

2 State the principle of LBM. C103.3 K1

3 What are the characteristics of laser used in laser machining? C103.3 K2

4 Give the examples of i) solid state laser ii) gas laser. C103.3 K1

5 What are basic requirements of laser welding? C103.3 K2

6 What is solid state Laser? C103.3 K2

7 How does Laser melting works? C103.3 K1

8 What are the characteristics of Laser beam? C103.3 K1

9 What are the fundamentals of photons used in Laser? C103.3 K2

10 What are the advantages of Laser drilling? C103.3 K2

11 What are the emission lines? C103.3 K1

12 What are the characteristics of Laser used in Laser machining? C103.3 K1

13 What materials can be machined by using Laser Beam? C103.3 K1

14 What is the main industrial application of plasma cutting systems? C103.3 K2

15 What are the gases used in PAM? C103.3 K2

16 What are the types of plasma arc torches? C103.3 K1

17 Write about tool design in ECM? C103.3 K1

18 Explain economic aspects of ECM? C103.3 K1

19 What is theory of electron beam machining? C103.3 K2

20 What are Abrasives used in machining processes? C103.3 K1

PART-B (13- Marks Or 16-Marks or 8-Marks)

What are the various LASERS used in practice for machining and explain the C103.3
1 requirements of LASERS. K3
Compare the edge production in EBM and LBM. What are the factors influencing edge C103.3
2 for maintain in both the processes? K3

3 Differentiate between EBM and LBM considering at least five aspects? [ C103.3 K3
Describe the Laser Beam Machining equipment and Electron Beam Machining C103.3
4 equipment. i) Explain the production of laser beam and working principle of LBM? ii)
What are the applications of EBM process? K3

5 Explain the features of EBM unit. Explain the effect of increasing the accelerating C103.3 K3
potential on MRR.
 Explain the process of LBM and PAM with neat sketches. i) Discuss the process C103.3
6 parameters of EBM and their influence on Machining quality. ii) Explain the process
capabilities of PAM. K3
Explain the process of PAM with a neat sketch. With respect to principle, equipment C103.3
7
process parameter, advantages, disadvantages and applications K3
Discuss about the process capabilities of EBM and the process parameters of EBM in C103.3
8
improving machining quality K3
With the help of a neat diagram, explain plasma arc machining process mentioning C103.3
9
how heating of the work piece takes place in the process. K3
Explain the principle, construction and working of electron beam machining. Also how C103.3
10
a complex shape can be cut using EBM process. K3
Write short notes on: i. Process characteristics of EBM ii. Why vacuum is need and C103.3
11 what is its order in EBM process iii. What is spontaneous emission and what is laser?
iv. Advantages of laser K3
With the help of a neat diagram, explain plasma arc machining process mentioning C103.3
12
how heating of the work piece takes place in the process. K3
Explain the thermal features of Laser beam machining. Discuss the performance of C103.3
13
various types of Lasers. K3

14 Why is EBM carried out in vacuum? Explain the process with a neat sketch. C103.3 K3
Describe the principle of ECG and ECH. Discuss about the process parameters that C103.3
15
influences the ECM. List their applications and advantages. K3
Explain the ECM process. Explain how a replica of the tool is obtained. Mention the C103.3
16
advantages and applications K3
Explain the process of electrochemical machining with neat sketch and discuss about C103.3
influences of process parameters in machining output. a. Explain the chemistry
17
involved in the ECM process? b. Briefly discuss about the effect of high temperature
and pressure of electrolyte on the ECM process. K3
With suitable sketches, explain the need for the insulation in an ECM process. List the C103.3
18
advantages, disadvantages and applications for this process. K3
Briefly explain the following with respect to chemical machining: i) Characteristics of C103.3
19 cut peel maskants ii) Selection of maskants iii) Advantages of photoresist maskant iv)
Limitations of chemical machining. K3
Briefly discuss about electro chemical deburring process parameters of chemical C103.3
20
machining process that influence the performance of the machining? K3
UNIT– IV PROCESSING OF CERAMICS
Applications, characteristics, classification. Processing of particulate ceramics, Powder preparations,
consolidation, Drying, sintering, Hot compaction, Area of application , finishing of ceramics. Processing of
Composites: Composite Layers, Particulate and fiber reinforced composites, Elastomers, Reinforced plastics,
MMC, CMC, Polymer matrix composites.

PART-A (2-Marks)
S.N RBT
QUESTIONS CO
O LEVEL

1 What are common applications of ceramics? C103.4 K1

2 How are ceramic materials processed? C103.4 K1

3 What are composite materials? C103.4 K2

4 How are composite materials classified? C103.4 K1

5 What is the function of matrix materials? C103.4 K2

6 What are the type of composites based on the matrix materials? C103.4 K2

7 What are fibre reinforced plastics and its types? C103.4 K1

8 What is fibre reinforced metals? C103.4 K1

9 What are the advantages of composites? C103.4 K2

10 What are the limitation of composites? C103.4 K2

11 Mention the application of composites? C103.4 K1

12 What are metallic glasses? C103.4 K1

13 What are the types of metallic glasses? C103.4 K1

14 What are the properties of metallic glasses? C103.4 K2

15 What are the application of metallic glasses? C103.4 K2

16 What are ceramic materials? C103.4 K1

17 What are natural ceramic materials? C103.4 K1

18 What are bonded ceramics? C103.4 K1

19 What are the thermal properties of ceramics? C103.4 K2

20 What are the mechanical properties of ceramics? C103.4 K1

 PART-B (13- Marks Or 16-Marks or 8-Marks)

What are ceramic materials? What are some common properties and C103.4
1 applications of ceramic materials ? K3

2 What are different types of ceramics? Also write their properties. C103.4 K3

3 Classify composite material and explain them briefly. C103.4 K3

4 Discuss the applications, advantages and limitations of composites. C103.4 K3

What are the open mold processes for production of FRPs (Fiber reinforced C103.4
5
plastics) ? Explain each. K3

6 Enumerate the difference between the particle and Reinforced composites. C103.4 K2

7 What is ceramic material? Explain crystalline ceramics C103.4 K2

8 Discuss about the Glass micro structure and properties. C103.4 K2

9 What are the various methods of component manufacture of composites? C103.4 K2

10 Why are fiber glass reinforced composites used extensively? C103.4 K2

11 What is composite material? How is it classified? Give a short note C103.4 K2

12 Explain the Ceramic matrix composite. Discuss about their properties. C103.4 K3

13 Explain Metal matrix composite. Discuss about their properties. C103.4 K3

14 Explain carbon – carbon composites. Discuss about their properties. C103.4 K3

15 How the cermet manufactured? Give Examples C103.4 K3

16 What is the polymer? Explain the polymer matrix composite C103.4 K3

17 Explain briefly smart materials and their applications. C103.4 K3

Explain the properties and application of polymers, ceramics, and metals in C103.4 K3
18
MEMS applications.

19 Define Ceramics and explain processing techniques. C103.4 K3

20 How are polymers classified on the basis of their structure? C103.4 K3

UNIT– V FABRICATION OF MICROELECTRONIC DEVICES

Crystal growth and wafer preparation, Film Deposition oxidation, lithography, bonding and packaging,
reliability and yield, Printed Circuit boards, computer aided design in microelectronics, surface mount
technology, Integrated circuit economics. E-Manufacturing, nanotechnology, and micromachining, High
speed Machining

PART-A (2-Marks)
S.N RBT
QUESTIONS CO
O LEVEL

1 How is semiconductor material processed before its crystal growth? C103.5 K1

2 What is MEMS? What are its applications? C103.5 K1

3 What is wafer? C103.5 K2

4 How is crystal ingot converted to wafers? C103.5 K1

5 What are the unit processes involved in the fabrication of integrated circuits? C103.5 K2

6 What is the difference between pre-deposition and drive-in? C103.5 K2

7 Compare ion-implantation with diffusion. C103.5 K1

8 Define Film Deposition C103.5 K1

9 Define oxidation. C103.5 K2

10 Define diffusion. C103.5 K2

11 State the materials that are used as piezo resistors. C103.5 K1

12 What is a substrate? C103.5 K1

13 Why silicon is an ideal material for MEMS? C103.5 K1

14 Define dry etching. C103.5 K2

What is E-Manufacturing? nanotechnology, and micromachining, High speed C103.5
15
Machining K2

16 What do you understand about nano-technology? C103.5 K1

17 What is micromachining? C103.5 K1

18 What do you mean by scaling law in MEMS? C103.5 K1

19 What is micro-milling? C103.5 K2

20 What is the importance High speed Machining? C103.5 K1

 PART-B (13- Marks Or 16-Marks or 8-Marks)

1 Explain the different crystal growth techniques C103.5 K3

2 Compare and contrast MEMS technology and microelectronics. C103.5 K2

Discuss in detail the MEMS fabrication processes: C103.5
(i) Oxidation.
3 (ii) Etching. K2
Discuss in detail the MEMS fabrication processes : C103.5
4 (i) Photolithography.
(ii) Ion Implantation. K2

5 Explain Silicon compounds used in MEMS. C103.5 K3

6 Write short notes on Polymers and Packaging materials in MEMS. C103.5 K2

7 Explain crystal planes and orientations. C103.5 K3

8 Explain with diagram a typical diffusion system. C103.5 K3

What is epitaxial growth? Discuss the different techniques used to grow C103.5
9
epitaxial layer. K2

10 Explain with diagram a typical vapour phase epitaxial growth system. C103.5 K3
What are the different deposited layers used in fabrication process? Briefly C103.5
11
explain. K2

12 Explain LIGA Microfabrication Process C103.5 K3

13 Explain Electrochemical Fabrication (EFAB) process C103.5 K3

Explain a manipulative technique used in the area of C103.5
14
nanofabrication. K3

15 Describe the different types of nano-manufacturing methods. C103.5 K2

16 What are the various applications of nano-materials? C103.5 K2

17 With neat sketches explain the Carbon Nano-tubes and Structures C103.5 K3

18 Explain the various micro-machining processes and their applications. C103.5 K3

19 Describe the process of micro-fabrications. C103.5 K2

20 Explain the different Types of Carbon Nano-tubes C103.5 K3