2SC3932

You might also like

Download as pdf or txt
Download as pdf or txt
You are on page 1of 4

Transistor

2SC3932
Silicon NPN epitaxial planer type

For high-frequency amplification/oscillation/mixing


Unit: mm

(0.425)
+0.1 +0.10
0.3Ð0.0 0.15Ð0.05

■ Features 3

● High transition frequency fT.

1.25±0.10

2.1±0.1
● S-Mini type package, allowing downsizing of the equipment and
automatic insertion through the tape packing and the magazine


1 2
packing.

0.2±0.1
(0.65) (0.65)

1.3±0.1

■ Absolute Maximum Ratings (Ta=25˚C) 2.0±0.2

10û
Parameter Symbol Ratings Unit
Collector to base voltage VCBO 30 V

+0.2
0.9Ð0.1
0.9±0.1
Collector to emitter voltage VCEO 20 V

0 to 0.1
Emitter to base voltage VEBO 3 V
Collector current IC 50 mA 1:Base
Collector power dissipation PC 150 mW 2:Emitter EIAJ:SC–70
3:Collector SMini3-G1 Package
Junction temperature Tj 150 ˚C
Storage temperature Tstg –55 ~ +150 ˚C Marking symbol : R

■ Electrical Characteristics (Ta=25˚C)


Parameter Symbol Conditions min typ max Unit
Collector to base voltage VCBO IC = 100µA, IE = 0 30 V
Emitter to base voltage VEBO IE = 10µA, IC = 0 3 V
Forward current transfer ratio hFE VCB = 10V, IE = –2mA 25 250
Transition frequency fT* VCB = 10V, IE = –15mA, f = 200MHz 800 1600 MHz
Base to emitter voltage VBE VCB = 10V, IE = –2mA 0.72 V
Common emitter reverse transfer capacitance Cre VCE = 10V, IC = 1mA, f = 10.7MHz 1 1.5 pF
Common base reverse transfer capacitance Crb VCE = 6V, IC = 0, f = 1MHz 0.8 pF
Power gain PG VCB = 10V, IE = –1mA, f = 200MHz 20 dB

*h Rank classification
FE

Rank T S
fT(MHz) 800 ~ 1400 1000 ~ 1600
Marking Symbol RT RS

425
Transistor 2SC3932

PC — Ta IC — VCE IC — I B
240 24 24
Ta=25˚C VCE=10V
Collector power dissipation PC (mW)

IB=300µA Ta=25˚C
200 20 20

Collector current IC (mA)

Collector current IC (mA)


250µA

160 16 16
200µA

120 12 12
150µA

80 8 8
100µA

40 4 50µA 4

0 0 0
0 20 40 60 80 100 120 140 160 0 6 12 18 0 100 200 300 400 500
Ambient temperature Ta (˚C) Collector to emitter voltage VCE (V) Base current IB (µA)

IB — VBE IC — VBE hFE — IC


400 60 240
VCE=10V 25˚C VCE=10V VCE=10V
Ta=25˚C
350

Forward current transfer ratio hFE


50 200
Ta=75˚C –25˚C
Collector current IC (mA)

300
Base current IB (µA)

40 160
250
Ta=75˚C

200 30 120
25˚C

150 –25˚C
20 80

100

10 40
50

0 0 0
0 0.4 0.8 1.2 1.6 2.0 0 0.4 0.8 1.2 1.6 2.0 0.1 0.3 1 3 10 30 100
Base to emitter voltage VBE (V) Base to emitter voltage VBE (V) Collector current IC (mA)

VCE(sat) — IC fT — I E Cre — VCE


100 1600 2.4
Collector to emitter saturation voltage VCE(sat) (V)

Common emitter reverse transfer capacitance Cre (pF)

IC/IB=10 VCB=10V IC=1mA


Ta=25˚C f=10.7MHz
30 1400 Ta=25˚C
Transition frequency fT (MHz)

2.0

10 1002

1.6
3 1000

1 800 1.2

Ta=75˚C
0.3 600
0.8
25˚C
0.1 400
–25˚C 0.4
0.03 200

0.01 0 0
0.1 0.3 1 3 10 30 100 – 0.1 – 0.3 –1 –3 –10 –30 –10 0.1 0.3 1 3 10 30 100
Collector current IC (mA) Emitter current IE (mA) Collector to emitter voltage VCE (V)

426
Transistor 2SC3932

Zrb — IE PG — IE NF — IE
120 40 12
VCB=10V VCB=10V VCB=10V
f=2MHz
Reverse transfer impedance Zrb (Ω)

f=100MHz f=100MHz
Ta=25˚C 35
100 Rg=50Ω 10 Rg=50kΩ
Ta=25˚C Ta=25˚C
30

Noise figure NF (dB)


Power gain PG (dB)
80 8
25

60 20 6

15
40 4

10

20 2
5

0 0 0
– 0.1 – 0.3 –1 –3 –10 – 0.1 – 0.3 –1 –3 –10 –30 –100 – 0.1 – 0.3 –1 –3 –10 –30 –100
Emitter current IE (mA) Emitter current IE (mA) Emitter current IE (mA)

bib — gib brb — grb bfb — gfb


0 0 48
200
Reverse transfer susceptance brb (mS)

Forward transfer susceptance bfb (mS)


yib=gib+jbib yrb=grb+jbrb yfb=gfb+jbfb
VCB=10V VCB=10V VCB=10V
300
–10 – 0.4 40
Input susceptance bib (mS)

500 f=200MHz
IE=–5mA
–20 IE=–2mA – 0.8 32
300
600
f=900MHz
–5mA –2mA
–30 600 –1.2 24 500
500 f=900MHz
300 200 –2mA 600
–40 –1.6 IE=–5mA 16

900
–50 –2.0 8

–60 –2.4 0
0 10 20 30 40 50 –1.0 – 0.8 – 0.6 – 0.4 – 0.2 0 –60 –40 –20 0 20 40
Input conductance gib (mS) Reverse transfer conductance grb (mS) Forward transfer conductance gfb (mS)

bob — gob
12
yob=gob+jbob
VCE=10V 900
Output susceptance bob (mS)

10

600
8
IE=–2mA –5mA

6 500

4
300

2
f=200MHz

0
0 0.4 0.8 1.2 1.6 2.0
Output conductance gob (mS)

427
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Govern-
ment if any of the products or technologies described in this material and controlled under the
"Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative character-
istics and applied circuit examples of the products. It does not constitute the warranting of industrial
property, the granting of relative rights, or the granting of any license.
(3) The products described in this material are intended to be used for standard applications or gen-
eral electronic equipment (such as office equipment, communications equipment, measuring in-
struments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(4) The products and product specifications described in this material are subject to change without
notice for reasons of modification and/or improvement. At the final stage of your design, purchas-
ing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to
make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the guaranteed values, in particular those of maxi-
mum rating, the range of operating power supply voltage and heat radiation characteristics. Other-
wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, redundant design is recommended,
so that such equipment may not violate relevant laws or regulations because of the function of our
products.
(6) When using products for which dry packing is required, observe the conditions (including shelf life
and after-unpacking standby time) agreed upon when specification sheets are individually exchanged.
(7) No part of this material may be reprinted or reproduced by any means without written permission
from our company.

Please read the following notes before using the datasheets


A. These materials are intended as a reference to assist customers with the selection of Panasonic
semiconductor products best suited to their applications.
Due to modification or other reasons, any information contained in this material, such as available
product types, technical data, and so on, is subject to change without notice.
Customers are advised to contact our semiconductor sales office and obtain the latest information
before starting precise technical research and/or purchasing activities.
B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but
there is always the possibility that further rectifications will be required in the future. Therefore,
Panasonic will not assume any liability for any damages arising from any errors etc. that may ap-
pear in this material.
C. These materials are solely intended for a customer's individual use.
Therefore, without the prior written approval of Panasonic, any other use such as reproducing,
selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited.

2001 MAR

You might also like