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2SC3932
2SC3932
2SC3932
2SC3932
Silicon NPN epitaxial planer type
(0.425)
+0.1 +0.10
0.3Ð0.0 0.15Ð0.05
■ Features 3
1.25±0.10
2.1±0.1
● S-Mini type package, allowing downsizing of the equipment and
automatic insertion through the tape packing and the magazine
5û
1 2
packing.
0.2±0.1
(0.65) (0.65)
1.3±0.1
10û
Parameter Symbol Ratings Unit
Collector to base voltage VCBO 30 V
+0.2
0.9Ð0.1
0.9±0.1
Collector to emitter voltage VCEO 20 V
0 to 0.1
Emitter to base voltage VEBO 3 V
Collector current IC 50 mA 1:Base
Collector power dissipation PC 150 mW 2:Emitter EIAJ:SC–70
3:Collector SMini3-G1 Package
Junction temperature Tj 150 ˚C
Storage temperature Tstg –55 ~ +150 ˚C Marking symbol : R
*h Rank classification
FE
Rank T S
fT(MHz) 800 ~ 1400 1000 ~ 1600
Marking Symbol RT RS
425
Transistor 2SC3932
PC — Ta IC — VCE IC — I B
240 24 24
Ta=25˚C VCE=10V
Collector power dissipation PC (mW)
IB=300µA Ta=25˚C
200 20 20
160 16 16
200µA
120 12 12
150µA
80 8 8
100µA
40 4 50µA 4
0 0 0
0 20 40 60 80 100 120 140 160 0 6 12 18 0 100 200 300 400 500
Ambient temperature Ta (˚C) Collector to emitter voltage VCE (V) Base current IB (µA)
300
Base current IB (µA)
40 160
250
Ta=75˚C
200 30 120
25˚C
150 –25˚C
20 80
100
10 40
50
0 0 0
0 0.4 0.8 1.2 1.6 2.0 0 0.4 0.8 1.2 1.6 2.0 0.1 0.3 1 3 10 30 100
Base to emitter voltage VBE (V) Base to emitter voltage VBE (V) Collector current IC (mA)
2.0
10 1002
1.6
3 1000
1 800 1.2
Ta=75˚C
0.3 600
0.8
25˚C
0.1 400
–25˚C 0.4
0.03 200
0.01 0 0
0.1 0.3 1 3 10 30 100 – 0.1 – 0.3 –1 –3 –10 –30 –10 0.1 0.3 1 3 10 30 100
Collector current IC (mA) Emitter current IE (mA) Collector to emitter voltage VCE (V)
426
Transistor 2SC3932
Zrb — IE PG — IE NF — IE
120 40 12
VCB=10V VCB=10V VCB=10V
f=2MHz
Reverse transfer impedance Zrb (Ω)
f=100MHz f=100MHz
Ta=25˚C 35
100 Rg=50Ω 10 Rg=50kΩ
Ta=25˚C Ta=25˚C
30
60 20 6
15
40 4
10
20 2
5
0 0 0
– 0.1 – 0.3 –1 –3 –10 – 0.1 – 0.3 –1 –3 –10 –30 –100 – 0.1 – 0.3 –1 –3 –10 –30 –100
Emitter current IE (mA) Emitter current IE (mA) Emitter current IE (mA)
500 f=200MHz
IE=–5mA
–20 IE=–2mA – 0.8 32
300
600
f=900MHz
–5mA –2mA
–30 600 –1.2 24 500
500 f=900MHz
300 200 –2mA 600
–40 –1.6 IE=–5mA 16
900
–50 –2.0 8
–60 –2.4 0
0 10 20 30 40 50 –1.0 – 0.8 – 0.6 – 0.4 – 0.2 0 –60 –40 –20 0 20 40
Input conductance gib (mS) Reverse transfer conductance grb (mS) Forward transfer conductance gfb (mS)
bob — gob
12
yob=gob+jbob
VCE=10V 900
Output susceptance bob (mS)
10
600
8
IE=–2mA –5mA
6 500
4
300
2
f=200MHz
0
0 0.4 0.8 1.2 1.6 2.0
Output conductance gob (mS)
427
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Govern-
ment if any of the products or technologies described in this material and controlled under the
"Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative character-
istics and applied circuit examples of the products. It does not constitute the warranting of industrial
property, the granting of relative rights, or the granting of any license.
(3) The products described in this material are intended to be used for standard applications or gen-
eral electronic equipment (such as office equipment, communications equipment, measuring in-
struments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(4) The products and product specifications described in this material are subject to change without
notice for reasons of modification and/or improvement. At the final stage of your design, purchas-
ing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to
make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the guaranteed values, in particular those of maxi-
mum rating, the range of operating power supply voltage and heat radiation characteristics. Other-
wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, redundant design is recommended,
so that such equipment may not violate relevant laws or regulations because of the function of our
products.
(6) When using products for which dry packing is required, observe the conditions (including shelf life
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from our company.
2001 MAR