Indian Institute of Technology Hyderabad

Kandi – 502 284, Sangareddy, Telangana, INDIA

Modeling and design of an integration

scheme of carbon fiber reinforced silicon
carbide composite panels to the metallic
bulkhead using suitable insulation and
fasteners
M. Ramji and Sai Sidhardh
Department of Mechanical and Aerospace Engineering, IIT Hyderabad

Interim Report submitted to the

Defence Metallurgical Research Laboratory, Hyderabad
by
Indian Institute of Technology, Hyderabad

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 Indian Institute of Technology Hyderabad
Kandi – 502 284, Sangareddy, Telangana, INDIA

Contact Details

Name Organization Email

Nitesh Singh(Student) IIT Hyderabad me22mtech14015@iith.ac.in

Professor M. Ramji (PI) IIT Hyderabad ramji_mano@mae.iith.ac.in

Dr. Sai Sidhardh(Co-PI) IIT Hyderabad sidhardh@mae.iith.ac.in

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Table of Contents

1. Inputs from DMRL

a. Configuration-1
b. Configuration-2
c. Configuration-3
d.Material Properties Input By DMRL
2. Methodology
3. Material Properties
4. Thermal Elastic Response of Configuration-1 without bolted joint
4.1 Boundary Conditions
4.2 Temperature
4.2.1 Analytical Validation of the Model by Thermal Circuit Analysis
4.2.2 Comparison of FEM and Analytical Model
4.3 Deformation
4.4 Reaction Force Estimate
4.5 Closure
5. Thermal Elastic Response of Configuration-1 with 4 Counter-Bore Bolted Joints
Table: Bolt Configuration Table
5.1 Temperature
5.2 Von Misses Stress in Bolts
6. Conclusions
7. Future Work
Appendix A: Thermal Elastic Response of Configuration-2 without bolted joint
A.1 Boundary Conditions
A.2 Temperature
A.3 Deformation
A.4 Reaction Force
A.5 Closure
References

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1. Inputs from DMRL

The following inputs regarding the loading and boundary conditions along with the geometry and
material properties were shared by DMRL during the previous meeting on 18-Aug-2023.

a. Configuration-1

Fig: Configuration-1

● The size of the C-SiC Panel is 100mm X 100mm X 4mm

● The size of the Inconel Panel is 100mm X 100mm X 4mm
● The upper surface temperature is maintained at 1200℃
● The lower surface temperature is maintained at 600℃
● The Inconel plate is constrained to move only in the lateral direction
● A uniform pressure of 1.5 MPa is applied across the base of the Inconel plate
● Sliding interaction between the plates is considered

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b. Configuration-2

Fig: Configuration-2

● The size of the C-SiC Panel is 100mm X 100mm X 4mm

● The size of the Aluminium panel is 100mm X 100mm X 4mm
● The upper surface temperature is maintained at 1200℃
● The lower surface temperature is maintained at 120℃
● The Aluminium plate is constrained to move only in the lateral direction
● A uniform pressure of 0.8 MPa is applied across the base of the Aluminium plate
● Sliding interaction between the plates is considered

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c. Configuration-3

Fig: Configuration-3

● The size of the C-SiC Panel is 100mm X 100 mm X 4mm

● The size of the Aluminium Panel is 100mm X 100mm X 4mm
● The upper surface temperature is maintained at 1200℃
● The lower surface temperature is maintained at 120℃
● The Aluminium plate is fixed from one end and allowed to move in another direction
● Normal load of 55 N is applied at the free end of the aluminium plate
● A uniform pressure of 0.8 MPa is applied across the base of Aluminium plate
● Sliding interaction between the plates is considered

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d.Material Properties Input By DMRL

Table: Temperature vs Thermal conductivity variation for C-SiC

Temperature(℃) Thermal conductivity (W/mK)

100 7.3
400 7.9
800 7.7
1200 10.8

F
ig: Thermal coefficient of expansion vs Temperature for C-SiC Fig: Young’s modulus vs Temperature for C-SiC

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2. Methodology
The finite element analysis (FEA) is carried out using commercial software Abaqus as this
approach facilitates a comprehensive simulation of the interplay between the thermal and
mechanical behavior of the Thermal Protection System (TPS). This is crucial for the design of
components being subjected to coupled thermal and mechanical loading conditions. This
integrated system allows for the nuanced analysis of intricate thermal responses and mechanical
deformations, which is particularly crucial in high-temperature environments. To improve the
accuracy of the FE simulations, the choice of an 8-noded coupled thermal-mechanical brick
element (C3D8T) with three degrees of freedom (translation in X, Y, and Z) for the unbolted
system, and a brick element (C3D8R) with reduced order integration to mitigate shear locking
effects for bolted joints, has been employed. These elements offer advantages such as accurate
representation of complex geometries, improved convergence, and finer meshing capabilities,
and they enable a detailed simulation of both thermal gradients and mechanical stresses.

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3. Material Properties
Table: Materials and its properties used in the current thermo-mechanical
Simulation

Thermal Thermal coefficient of

Young’s Modulus
Material conductivity expansion
(GPa)
(W/mK) (/K)

C-SiC 9 100 3×1 0−6❑

Saffil 1 0.45 320 8.3×1 0−6❑

Inconel 718 2 19 194 13.5×1 0−6❑

Aluminum 3 238 73 25.4×1 0−6❑

Zirconia
3.4 300 9×1 0−6❑
4
ceramic

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In the current assessment, the insulating material is chosen to be Saffil, a selection driven by its
exemplary insulating properties as extensively detailed in the preceding assessment report [1].
Saffil's thermal performance at a specific temperature has been established as a benchmark for
further exploration. Our focus in the upcoming stages of this evaluation will involve a
meticulous investigation into the material's response to varying temperatures. Zirconia ceramic
material for bolts is justified for its exceptional heat resistance capabilities which is crucial for
enduring high-temperature conditions

4. Thermal Elastic Response of Configuration-1 without

bolted joint

4.1 Boundary Conditions

Fig: schematic diagram of configuration-1

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Fig: FEM model of configuration-1 with Boundary Conditions Fig: Mesh model of configuration-1

Table: The boundary conditions applied for the thermal-mechanical simulation for
configuration-1
Boundary Conditions Value
Upper surface Temperature of C-SiC plate
1200℃
Bottom surface Temperature of Inconel
600℃
plate
Uniform pressure is applied across the base
1.5 MPa
of Inconel plate
Inconel plate is fixed longitudinally —

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4.2 Temperature

Fig: Temperature profile in Kelvin for configuration-1

In this thermal profile, the upper surface of the C-SiC (Carbon-Silicon Carbide) experiences a
temperature of 1473K (~1200℃), gradually decreasing across the thickness to 873K (~600 ℃) at
the base where it is bonded to Inconel. Due to the Inconel plate being fixed in lateral directions
(x-y plane) and its higher coefficient of thermal expansion as compared to both Saffil and C-SiC,
the Inconel plate undergoes a greater thermal expansion, inducing bending deformation. The
resultant differential expansion between the Inconel plate and the Saffil-C-SiC assembly leads to
an upward deflection or bowing of the C-SiC plate. In this analysis, the assumption is made that
the thermal resistance across the interface is negligible, implying an infinite thermal
conductance. The simulation model also incorporates a high conductance value, approximately
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1 0 W/m²K, emphasizing efficient heat transfer across the interface.

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4.2.1 Analytical Validation of the Model by Thermal Circuit Analysis

In this sub-section, one validates the predictions from the FE simulations, and thereby the FE
model, via comparison of the temperature field as predicted by the analytical model will be
carried out towards benchmarking the FE model. Towards this, an analytical model needs to be
developed for predicting the temperature profile across the thickness of the TPS using a simple
equivalent thermal circuit analysis. The nodal temperatures, T 1 and T 2 at the C-SiC and Saffil
interface and Saffil and Inconel interface are utilized in applying Fourier's law of conduction to
compute the temperature distribution at specific points. The mathematical expression of Fourier's
law, involving thermal conductance, nodal temperatures, and spatial gradients, is employed to
derive precise temperature profiles, capturing the thermal behavior of the system under
consideration.

Fig: Thermal Circuit Model

Δ x 1=4 mm , Δ x 2=16 mm∧Δ x 3=4 mm

⋅ ΔT
¿ ℱ law of heat conduction we know , Q =−K (1)
Δx

⋅ 5 W
Assuming Q =1.1×1 0 2
∧applying ∈the Δ x 1 section we will get
m K

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5 (1200−T 1)
1.1 ×1 0 =−9×
(−.004)

T 1=1424 K similarly applying∈the Δ x 2 section we will get

T 2=924 K

4.2.2 Comparison of FEM and Analytical Model

Fig: FEM model of the configuration - 1 with T 1 and T 2 are the nodal temperatures at the interface

Nodal point Analytical Temperature (K) FEM Temperature

(K)
1424 1423
T1

924 923
T2

Table: Temperature comparison table of Analytical and FEM model

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The analytical temperature at the point T 1 was determined to be 1424 K, while the Finite
Element Method (FEM) model yielded a temperature of 1423 K. Similarly, at the point T 2 the
analytical temperature was found to be 924 K, with the FEM model indicating 923 K. The
marginal differences observed between the analytical and FEM results can be attributed to the
inherent approximations and discretization involved in the FEM model

4.3 Deformation

Fig: Deformation profiles in Horizontal (X), Vertical (Y), and thickness ( Z) directions in mm

In the presented deformation profiles, the Inconel plate exhibits minimal deformation in the
horizontal direction, attributed to its lateral fixation. However, due to the higher coefficient of
thermal expansion of Saffil compared to C-SiC, the Saffil undergoes expansions of 0.57 mm and
0.518 mm in the horizontal and vertical directions, respectively. The resultant thermal expansion
of the Saffil and the Inconel plate induces deformation in the C-SiC plate along the thickness
direction, amounting to 0.873 mm. This deformation profile reflects the thermal-induced

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deformations and interactions among the constituent materials, demonstrating the complex
behavior of the composite structure under the specified thermal conditions

4.4 Reaction Force Estimate

Fig: Reaction force in Newton (N)

By imposing lateral boundary conditions on the Inconel plate, it generates a reaction force
resulting in significant thermal stresses. The magnitude of the reaction force, approaching 14 kN,
is attributed to the relatively high Young's modulus of Inconel, whose value is 194 GPa. This
higher modulus accentuates the resistance of Inconel to deformation, leading to substantial
reaction forces as it counteracts the thermal strains.

4.5 Closure
In conclusion, a detailed FE simulation for the thermo-mechanical response of the TPS material
system has been carried out. Additionally, the FE model has been validated with analytical

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results for temperature prediction via thermal circuit analysis. This study has been reported here
for one configuration shared by DMRL. However, the same has been repeated for other
configurations which are presented in Appendix A. The minimal horizontal displacement in the

Inconel plate, due to its lateral fixation, stands in contrast to the significant expansions
experienced by the Saffil (insulator), resulting in consequential displacements in the C-SiC plate.
The observed thermal stresses on the Inconel plate, marked by a substantial reaction force of
approximately 14 kN, underscore the material's high Young's modulus and its robust resistance
to deformation.

5. Thermal Elastic Response of Configuration-1 with

4 Counter-Bore Bolted Joints

Table: Bolt Configuration Table

Material Head Diameter (mm) Thickness (mm) Length (mm)

Zirconia ceramic M6 Bolt 5 12 4 20

Fig: FEM Mesh model of double-headed zirconia ceramic bolt

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Fig: FEM model of configuration-1 with bolted joints with specified boundary conditions

Fig: FEM model with Boundary Conditions in XYZ Fig: FEM Mesh model with bolted joints

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5.1 Temperature

Fig: Temperature profile in Kelvin for configuration-1 with bolted joints

In this thermal analysis, the upper surface of the C-SiC plate experiences a temperature gradient,
ranging from 1473K (~1200℃) at the top to 869K (~600℃) at the base where it interfaces with
Aluminium. The lateral boundary condition of the Inconel plate, coupled with its higher
coefficient of thermal expansion compared to Saffil and C-SiC, results in pronounced thermal
expansion and subsequent bending deformation. Additionally, the temperature-induced
deformation leads to a loss of contact between the upper surface of the C-SiC plate and the Saffil
layer, emphasizing the complex thermal interactions and structural response in the analyzed
system.

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5.2 Von Misses Stress in Bolts

Fig: S33 and S13 represent the principal stress (MPa) and shear stress (MPa) in the Z direction
and XY plane

In the stress distribution analysis, the principal stress along the Z direction reaches a critical
value of 1.9 GPa, and the shear stress attains 0.7 GPa, surpassing the failure strength of the
ceramic bolt, which is within the range of 30-70 MPa. Consequently, the bolt experiences failure
induced by both normal and shear stresses, underscoring the importance of stress analysis in
evaluating the structural integrity of the ceramic bolt under applied thermal loads.

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6. Conclusions

In this work a study on the thermo-elastic responses of various configurations provided by

DMRL, comparing both unbolted and bolted systems has been carried out. In the unbolted
scenario, configuration 1's Inconel plate exhibited a notably higher reaction force than the
Aluminum plate, indicating Inconel's greater resistance to deformation due to its higher Young's
modulus. Moreover, in configurations 1 and 2, Saffil and C-SiC plates showed consistent
deformation along horizontal and vertical directions, with configuration 2's aluminum plate
experiencing more deformation along the thickness direction due to its higher thermal coefficient
of expansion.

Now, in the four-bolted system for configuration 1, the principal and shear stress magnitude in
the bolt exceed the critical failure strength of the bolt. This indicates that the applied load or
thermal effects in configuration 1 are causing stresses in the bolts that surpass their material's
failure strength, posing a potential risk of bolt failure.

7. Future Work
● To investigate the thermo-elastic response of diverse fastening mechanisms, including
countersink, counterbore, and micro bolt with varying head thickness and length
● To find the optimum diameter, number of bolts, and optimum fastening scheme to sustain
the thermo-mechanical load it is experiencing
● To evaluate the ability of the selected fastening configuration(s) to withstand prescribed
thermo-mechanical loads

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Appendix A: Thermal Elastic Response of Configuration-

2 without bolted joint

A.1 Boundary Conditions

Fig: schematic diagram of configuration-1

Fig: FEM model of configuration-2 with Boundary Conditions Fig: Mesh model of configuration-
2

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Table: The boundary conditions applied for the thermo-mechanical simulation for
configuration-2

Boundary Conditions Value

Upper surface Temperature of C-SiC plate

1200℃

Bottom surface Temperature of

120℃
Aluminium Plate

Uniform pressure applied across the base 0.8 MPa

of the Aluminium plate

Aluminium Plate is fixed longitudinally ___

A.2 Temperature

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Fig: Temperature profile in Kelvin for configuration-2

In this configuration, the upper surface of the C-SiC (Carbon-Silicon Carbide) experiences a
temperature of 1473K (1200℃), at some nodal point the temperature is approximately 1505K
(1232℃) due to localization of thermal contact between the C-SiC plate and the insulator.
Further, the temperature gradually decreases across the thickness to 393 K (120 ℃) at the base
where it is bonded to Aluminium. Due to the lateral boundary conditions on the Aluminium plate
and its higher coefficient of thermal expansion compared to Saffil and C-SiC, the Aluminium
plate undergoes greater thermal expansion, exhibiting pronounced bending deformation. The
resultant differential expansion between the Aluminium plate and the Saffil-C-SiC assembly
leads to an upward deflection or bowing of the C-SiC plate

A.3 Deformation

Fig: Deformation profile in Horizontal (X), Vertical (Y) and thickness (Z) direction in mm

In the presented deformation profile, the Aluminium plate exhibits minimal deformation in the
horizontal direction, owing to it being fixed in lateral directions. However, due to a higher
coefficient of thermal expansion of Saffil compared to C-SiC, the Saffil undergoes expansions of
0.609 mm and 0.533 mm in the horizontal and vertical directions, respectively. The resultant

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thermal expansion of the Saffil and the Aluminium plate induces a displacement in the C-SiC
plate along the thickness direction, amounting to 1.454 mm. This deformation profile reflects the

thermal-induced deformations and interactions among the constituent materials, demonstrating

the complex behavior of the composite structure under the specified thermal conditions

A.4 Reaction Force

Fig: Reaction force in Newton (N)

The sideways fixed support of the Aluminum plate causes a reaction force, mainly because of the
thermal stresses. The observed force, around 1.6 kN, is linked to Aluminum's relatively low
Young's modulus, which is 73 GPa. This lower modulus means that Aluminum can deform more
when it expands due to heat, resulting in a lower reaction force.

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A.5 Closure
In summary, the displacement profile offers a detailed look into how the composite structure
responds to thermal conditions. The Aluminium plate, firmly secured on one side, exhibits
minimal horizontal movements. However, the higher thermal expansion of Saffil, compared to
C-SiC, leads to significant expansions and subsequent deformation in the C-SiC plate. This
intricate interplay highlights the complex behavior of the composite structure under thermal

stress. Furthermore, the lateral locking of the Aluminium plate results in a reaction force on
account of the thermal stresses. The observed force of approximately 1.6 kN arises due to the
Aluminum's lower Young's modulus, allowing greater deformation in response to thermal
expansion and underscoring its adaptability to thermal loads.

References
1. Vinh Tung Le, Ngoc San Ha, Nam Seo Goo, and Jae Young Kim. Insulation system using
high-temperature fibrous insulation materials. Heat Transfer Engineering, 40(17-
18):1523–1538,2019.
2. JN Sweet, EP Roth, and MJIJoT Moss. Thermal conductivity of inconel 718 and 304
stainless steel. International journal of thermophysics, 8:593–606,1987.
High temp
metal.(https://www.hightempmetals.com/techdata/hitempInconel718data.php).
3. AJC Wilson. The thermal expansion of aluminium from 0 to 650 c. Proceedings of the
Physical Society, 53(3):235, 1941.
JB Ferguson, Hugo F Lopez, Kyu Cho, and Chang-Soo Kim. Temperature effects on the
tensile properties of precipitation-hardened al-mg-cu-si alloys.Metals, 6(3):43, 2016
4. https://www.machinedesign.com/archive/article/21816973/the-nuts-and-bolts-of-
ceramic-fasteners
https://www.extreme-bolt.com/ceramic-zirconia-washers.html
5. https://in.misumi-ec.com/vona2/detail/221000551231/?HissuCode=CSHSMT-SUS-M6-
16#linkto-00000247391

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